Beam Scanning Annular Slot-Ring Antenna Array with Via-Fence for Wireless Power Transfer

Total Page:16

File Type:pdf, Size:1020Kb

Beam Scanning Annular Slot-Ring Antenna Array with Via-Fence for Wireless Power Transfer Received: 11 November 2019 Revised: 15 January 2020 Accepted: 15 January 2020 DOI: 10.1002/mmce.22178 RESEARCH ARTICLE Beam scanning annular slot-ring antenna array with via-fence for wireless power transfer Laxmikant Minz | Seong-Ook Park Department of Electrical Engineering, Korea Advanced Institute of Science and Abstract Technology, Daejeon, South Korea Wireless power transfer has been the field of research for many decades, and with technological advancement and increase in wireless mobile devices, the Correspondence Laxmikant Minz, Department of Electrical future of wireless power transfer technology is very promising. The major Engineering requirement of wireless power transfer is an efficient and compact antenna Korea Advanced Institute of Science and array with high gain and flawless scanning performance. In this article, a 4 × 8 Technology, Daejeon, South Korea. Email: [email protected] element array is proposed with a gain of 18 dB and scanning capability of ±45 in azimuth and elevation plane at 5.8 GHz. The overall size of the array is Funding information 100 mm × 200 mm. The element separation in the array is only 0.48 λ. There National Research Foundation of Korea (NRF), Grant/Award Number: was strong mutual coupling due to smaller separation, which has been mini- 2019R1A2B5B01069407 mized with the application of via-fence around the antenna element. A dual feed circularly polarized annular slot-ring antenna is proposed and analyzed with via-fence to develop an array of 4 × 8 elements. The antenna array reflec- tion coefficient obtained is less than 20 dB for different scan angles and the gain of the array obtained is also within 2 dB for ±45 scan angles. KEYWORDS annular slot-ring, beam scanning, mutual coupling, MWPT, stripline feeding, via-fence 1 | INTRODUCTION RF power conversion efficiency to beam focusing and multidevice charging, an efficient transmitter antenna Microwave wireless power transfer (MWPT) is a peren- array design is a prime component for the overall MWPT nial technology, initially demonstrated by Tesla in 1891 system. and since then there has been an extensive research in In this article, we present a circularly polarized (CP), this domain. For mobile devices like smartphones, the efficient, and compact wide-angle beam-steering 4 × 8 best accomplishment engineered so far is inductive antenna array design for long-range MWPT system. charging. Wireless inductive chargers are commercially There are different challenges in design of a beam- available, where wire tethering is gone but the device is steering antenna array for MWPT. First is the mutual still required to be in close bound to the charging pad for coupling, which affects impedance matching, reflection its charging. Research on long-range wireless power coefficient, radiation pattern, gain, steering angle with transfer1 is progressing and currently focusing on instal- relative phase shift, and so on. The coupling between ele- lation of multiple charging panels with a controlling base ments varies the antenna characteristics and prohibits station for charging multiple mobile/portable electronics compactness. Various research works have been con- devices over a range of 5 to 20 m, Figure 1. Applications ducted to study the mutual coupling effect in an array of MWPT are extending to RFIDs, IoTs, and even to and various techniques have been proposed to reduce the power lines.2 Among the various challenges from DC-to- mutual coupling.3-5 Parasitic patches and parasitic Int J RF Microw Comput Aided Eng. 2020;30:e22178. wileyonlinelibrary.com/journal/mmce © 2020 Wiley Periodicals, Inc. 1of15 https://doi.org/10.1002/mmce.22178 2of15 MINZ AND PARK MWPT21-23 has steering capability of ±30 , ±39 , and ±40, respectively. Beam-steering capability depends on antenna element size and array element separation. A small element size annular slot-ring antenna is opted for the antenna array design as it has smaller size compared to conventional rectangular patch antennas and disk patch antenna. Moreover, due to simple construction slot-ring microstrip antenna can be easily integrated with RF components of the MWPT system. There is a size con- straint of 25 mm × 25 mm (0.48 λ × 0.48 λ) for single ele- ment due to the MPWT system in hand and the designed slot-ring antenna adjusted well in the limited area. Lastly, efficiency of the antenna is important for MWPT system. Low reflection coefficient and low dielec- tric loss are essential for radiation efficiency, whereas low polarization mismatch and high gain can minimize path loss and improve power transmission efficiency. Polariza- tion mismatch can be avoided with circular polarized antenna array. The designed annular slot-ring antenna is CPusing dual feed offset with 90 phase shift. The annu- lar slot-ring antenna is fed through proximity coupling. FIGURE 1 Long-range multipanel wireless charging scheme The advantage of using proximity-coupled feed is that it inherently blocks harmonics. The harmonic signal gener- meander line,6,7 soft or hard surfaces, defected ground ated by rectifying circuit could interfere with other sig- structure,8 bandgap structure,9-11 metamaterial,12 and nals and reduce the rectenna efficiency in MWPT system. electromagnetic three-dimensional (3D) wall13 are a few The designed CP annular slot-ring microstrip antenna techniques proposed in the literature to reduce mutual element operates at 5.8 GHz. The gain of the 4 × 8 array coupling by blocking or minimizing surface current flow. (200 mm × 100 mm) obtained is as high as 18 dB. In this These techniques are in common practice and easier to article, the annular slot-ring antenna design and perfor- fabricate (if planar); however, they are complex to com- mance is described in Section 2. Mutual coupling in slot- prehend and design. In addition, they often consume ring antenna and effect of coupling while forming array more time than antenna element design. Here we pro- is presented in Section 3. The proposed annular slot-ring posed a via-fence structure to minimize mutual coupling antenna with via-fence characteristics and results are between antenna elements. The proposed via-fence is a presented in Section 4. A single and double via-fence simple structure with multiple vias of diameter and sepa- analysis is presented in Section 5. Then the 4 × 8 array ration as small as possible as per fabrication limitation, model of annular slot-ring design with via fence using described in subsequent sections. Similar decoupling cav- unit cell approach is presented with fabricated array ity structures, made up of metal ring boundary shorted result in Section 6. with vias, were found to be simple in fabrication and effective to reduce mutual coupling.14-17 Antennas with via loading have been used in earlier research for gain 2 | ANNULAR SLOT-RING and bandwidth enhancement;18,19 we applied them here ANTENNA for mutual coupling reduction and to improve closely spaced antenna array performance. An annular slot-ring microstrip antenna has various ben- Second, the critical factor of an array panel employed efits. First, a slot-ring antenna is smaller and has an easy for MWPT system is its beam-steering capability. The construction than other planar or nonplanar anten- beam-steering ability of the array is required to be a max- nas.24,25 In terms of construction, the slot-ring size is imum of ±45 because a ±45 steering would be sufficient apparently not affected by the dielectric permittivity, to direct the high gain beam toward a device in any loca- which is a unique phenomenon compared with micro- tion over the confined space as in Figure 1. A wide-angle strip patch antenna, where structure fields diffuse beam-steering antenna array can be obtained either with through both substrate and free space, and the dielectric wide-beam antenna or with wide-angle impedance constant directly affect the patch dimension. The size of matching.20 Recent work on antenna array for the slot entirely depends on fundamental operating MINZ AND PARK 3of15 frequency. The fundamental operating frequency of the slot-ring antenna is simulated using commercial software slot-ring is the frequency for which mean circumference (CST MWS), and the simulated s-parameter results are of the slot-ring is equal to wavelength (λ). It can be for- shown in Figure 3. 26 mulated as : The simulated results in Figure 3 show that both S11 and S22 have good matching at 5.8 GHz and the S21 ð Þ kra =1 1 (or S12) is below 20 dB, indicating that two ports are iso- lated enough to operate antenna for dual linear polariza- 2π where k = λ is the wave number and ra is the average of tion as well as circular polarization if the phase outer and inner radius of slot-ring. A stripline feed slot- difference between two ports is 90 . The circular polar- ring antenna is shown in Figure 2. Top layer consists of a ized matching performance is also shown in Figure 3 by metallic layer with a slot-ring on it. The slot-ring is feed a plot with label S11 [1, 0] + S22 [1, 90], highlighting that through proximity coupling using a stripline feed, shown signals at port 1 and port 2 are of the same amplitude in shades. The symmetric structure of the ring makes it and the port 2 phase is shifted by 90 . The radiation pat- easier to get circular polarization. In Figure 2, two stri- tern of the designed slot-ring antenna for linear polariza- pline feeds are utilized to obtain a circular polarized or a tion (port 1 or port 2) and circular polarization is shown dual linear polarized antenna by mere control of phase in Figure 4. The gain of slot-ring is 6.9 dB. between two feeds.
Recommended publications
  • Full-Wave Analysis and Characterization of Via Grounding Techniques Used to Isolate Striplines for Embedded Passive Interconnects
    Full-wave Analysis and Characterization of Via Grounding Techniques Used To Isolate Striplines For Embedded Passive Interconnects Jerry Aguirre 1, Paul Garland 1, Tim Mobley 2, Marcos Vargas 3, Paula Lucchini 3, Nathan Roberts 3, Mikaya Lumori 3, Ernie Kim 3 1Kyocera America, Inc., 8611 Balboa, San Diego, CA, USA 92111 2Dupont Electronic Technologies, 14 TW Alexander Dr., Research Triangle Park, NC 27709 3University of San Diego 5998 Alcala Park, San Diego, CA 92110 Phone: 858-576-2691; Fax: 858-573-0159; email: [email protected] Abstract: Multilayer electronic packages commonly use striplines as electrical interconnects between various RF and microwave devices, including embedded passives, in MCMs. It is a generally accepted practice in multilayer packages to use vias to ground the top and bottom metal planes of the stripline structure in order to improve the isolation between critical stripline interconnects. In this paper, full-wave electromagnetic solvers and measurements are used to characterize the isolation between two parallel striplines in Dupont 943 LTCC substrates of various thicknesses. A via fence of varying via number and via pitch is placed between the striplines. As substrate thickness increases, isolation between striplines decreases. As compared to having no via fence, it is shown that via fences with increasingly tighter via pitches increasingly improve isolation for the near-end cross coupling. However, for the far- end coupling, the introduction of a via fence can actually significantly increase coupling and thus degrade isolation between striplines. Keywords: LTCC, Striplines, RF Via, Coupling, Isolation A leading material technology for MCMs and I. Introduction packages requiring embedded passive capability is Low Temperature Co-fired Ceramic (LTCC).
    [Show full text]
  • Experimental Verification of the Use of Metal Filled Via Hole Fences for Crosstalk Control of Microstrip Lines in LTCC Packages
    r Experimental Verification of the Use of Metal Filled Via Hole Fences for Crosstalk Control of Microstrip Lines in LTCC Packages George E. Ponchak, Donghoon Chun, Jong-Gwan Yook, and Linda P. B. Katehi Paper Submitted to the IEEE Transactions on Advanced Packaging Corresponding author: George E. Ponchak NASA Glenn Research Center 21000 Brookpark Rd., MS 54/5 Cleveland, OH 44135 Tel: 216-433-3504 Fax: 216-433-8705 Email: [email protected], gov Donghoon Chun University of Michigan 1301 Beal Ave. 3240 EECS Building Ann Arbor, MI 48109-2122 Jong-Gwan Yook Dept. of Information and Communications Kwangdu Institute of Science and Technology Kwang-Ju, Book-Ku O-ryong-dong, Korea 500-712 Linda P. B. Katehi University of Michigan 1301 Beal Avenue 3240 EECS Building Ann Arbor, M148109-2122 Experimental Verification of the Use of Metal Filled Via Hole Fences for Crosstalk Control of Microstrip Lines in LTCC Packages George E. Ponchak, Donghoon Chun, Jong-Gwan Yook, and Linda P. B. Katehi Abstract- Coupling between microstrip lines in dense RF packages is a common problem that degrades circuit performance_ Prior 3D- FEM electromagnetic simulations have shown that metal filled via hole fences between two adjacent mlcrostrip lines actually increases coupling between the lines; however, if the top of the via posts are connected by a metal strip, coupling is reduced. In this paper, experimental verification of the 3D-FEM simulations is demonstrated for commercially fabricated LTCC packages. Index Terms- microstrip, coupling, crosstalk, microwave transmission lines I. INTRODUCTION RF systems being planned today integrate more functions in smaller packages that musl cost less than those currently being used do.
    [Show full text]
  • New Broadband Common-Mode Filtering Structures Embedded in Differential Coplanar Waveguides for DC to 40 Ghz Signal Transmission Yujie He
    Rose-Hulman Institute of Technology Rose-Hulman Scholar Graduate Theses - Electrical and Computer Graduate Theses Engineering 5-2018 New Broadband Common-Mode Filtering Structures Embedded in Differential Coplanar Waveguides for DC to 40 GHz Signal Transmission Yujie He Follow this and additional works at: https://scholar.rose-hulman.edu/electrical_grad_theses Part of the Electrical and Computer Engineering Commons Recommended Citation He, Yujie, "New Broadband Common-Mode Filtering Structures Embedded in Differential Coplanar Waveguides for DC to 40 GHz Signal Transmission" (2018). Graduate Theses - Electrical and Computer Engineering. 11. https://scholar.rose-hulman.edu/electrical_grad_theses/11 This Thesis is brought to you for free and open access by the Graduate Theses at Rose-Hulman Scholar. It has been accepted for inclusion in Graduate Theses - Electrical and Computer Engineering by an authorized administrator of Rose-Hulman Scholar. For more information, please contact [email protected]. New Broadband Common-Mode Filtering Structures Embedded in Differential Coplanar Waveguides for DC to 40 GHz Signal Transmission A Thesis Submitted to the Faculty of Rose-Hulman Institute of Technology by Yujie He In Partial Fulfillment of the Requirements for the Degree of Master of Science in Electrical Engineering May 2018 © Yujie He i ABSTRACT He, Yujie M.S.E.E. Rose-Hulman Institute of Technology May 2018 New Broadband Common-Mode Filtering Structures Embedded in Differential Coplanar Waveguides for DC to 40 GHz Signal Transmission Thesis Advisor: Dr. Edward Wheeler Coplanar waveguides (CPWs) provide effective transmission with low dispersion into the millimeter-wave frequencies. For high-speed signaling, differential transmission lines display an enhanced immunity to outside interference and are less likely to interfere with other signals, when compared to single-ended transmission lines.
    [Show full text]
  • Lower Dielectric Loss and Multi-Layer Realization Have Given LTCC an Edge in the Realization of Wide-Range of Embedded Passive Components
    AN ABSTRACT OF THE THESIS OF Gaurav Bhargava for the degree of Master of Science in Electrical and Computer Engineering presented on March 25, 2005. Title: Via-Only Microwave/Millimeter Wave Bandpass Filters for LTCC Applications Abstract approved: Redacted for Privacy Raghu K. Settaluri With an increasing number of wireless applications at microwave frequencies, the frequency spectrum is becoming quite crowded. Due to this congestion, the current state of technology is leading towards upper microwave and millimeter wave spectra as they also offer other distinct advantages such as larger bandwidth and smaller component footprint. Low temperature co-fired ceramic (LTCC) has become an enabling technology for a variety of wireless applications at microwave frequencies, as it provides cost- effective, high-density solutions suitable for high-volume production. With the advent of new materials and improved processing techniques, wide range of high quality multi- layered embedded passive components is viable in this technology. Multi chip module (MCM) technology, low-temperature co-fired ceramic (LTCC) has gained extensive popularity over recent years. Interesting features such as tunable dielectric properties, lower dielectric loss and multi-layer realization have given LTCC an edge in the realization of wide-range of embedded passive components. The existing passive component topologies realized in planar configurations such as multi-layered microstnp and stripline offer effective implementation in LTCC for frequencies up to 20 GHz. Conventionally, for frequencies beyond 20 GHz, conducting waveguide based passive components have distinct advantages over planar counterparts in terms of better insertion losses, lower tolerance sensitivities and availability of wide range of analytical techniques.
    [Show full text]
  • The Use of Metal Filled Via Holes for Improving Isolation in LTCC RF and Wireless Multichip Packages
    The Use of Metal Filled Via Holes for Improving Isolation in LTCC RF and Wireless Multichip Packages George E. Ponchak, Donghoon Chun, Jong- Gwan Yook, Linda P. B. Katehi Abstract--LTCC MCMs for RF and wireless systems often use metal filled via holes to improve isolation between the stripline and microstrip interconnects. In this paper, results from a 3D-FEM electromagnetic characterization of microstrip and stripline interconnects with metal filled via fences for isolation are presented. It is shown that placement of a via hole fence closer than three times the substrate height to the transmission lines increases radiation and coupling. Radiation loss and reflections are increased when a short via fence is used in areas suspected of having high radiation. Also, via posts should not be separated by more than three times the substrate height for low radiation loss, coupling, and suppression of higher order modes in a package. Index Terms---microstrip, stripline, coupling, crosstalk, MCM, microwave transmission lines I. INTRODUCTION RF and wireless package designs must become smaller to satisfy the demands of the commercial and government markets. Simultaneously, the package must house data processing, biasing, and memory circuits in addition to the RF circuits to reduce the overall system size and complexity. Even more ambitious systems being developed by NASA include microelectromechanical (MEM) gyroscopes, active pixel sensors, and other micromachined scientific instruments with the already mentioned electronic circuits to create entire systems in a package. While the size of the package is being reduced and the complexity increased, the cost must also be reduced. To achieve these utopian goals, many MultiChip Module (MCM) technologies have been proposed [1-5], but Low Temperature Cofired Ceramic (LTCC) may be the ideal packaging technology.
    [Show full text]
  • Millimeter Wave Substrate Integrated Waveguide Antennas: Design and Fabrication Analysis M
    View metadata, citation and similar papers at core.ac.uk brought to you by CORE provided by Kent Academic Repository 1 Millimeter Wave Substrate Integrated Waveguide Antennas: Design and Fabrication Analysis M. Henry, IEEE, C. E. Free, B. S. Izqueirdo, J.C. Batchelor, and P. Young. This is an accepted pre-published version of this paper. © 2009 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. The link to this paper on IEEE Xplore® is http://dx.doi.org/10.1109/TADVP.2008.2011284 The DOI is: 10.1109/TADVP.2008.2011284 2 Millimeter Wave Substrate Integrated Waveguide Antennas: Design and Fabrication Analysis M. Henry, IEEE, C. E. Free, B. S. Izqueirdo, J.C. Batchelor, and P. Young Abstract— The paper presents a new concept in antenna design, whereby a photo-imageable thick-film process is used to integrate a waveguide antenna within a multilayer structure. This has yielded a very compact, high performance antenna working at high millimeter-wave (mm-wave) frequencies, with a high degree of repeatability and reliability in antenna construction. Theoretical and experimental results for 70 GHz mm-wave integrated antennas, fabricated using the new technique, are presented. The antennas were formed from miniature slotted waveguide arrays using up to 18 layers of photo-imageable material. To enhance the electrical performance a novel folded waveguide array was also investigated.
    [Show full text]
  • Characterization and Reduction of Line-To-Line Crosstalk on Printed Circuit Boards
    Characterization and reduction of line-to-line crosstalk on printed circuit boards by Joshua Adam Welch B.S., Kansas State University, 2016 A THESIS submitted in partial fulfillment of the requirements for the degree MASTER OF SCIENCE Department of Electrical and Computer Engineering College of Engineering KANSAS STATE UNIVERSITY Manhattan, Kansas 2018 Approved by: Major Professor Dr. William B. Kuhn Copyright © Joshua Welch 2018. Notice: This manuscript has been authored using funds under the Honeywell Federal Manufacturing & Technologies under Contract No. DE-NA-0002839 with the U.S. Department of Energy. The United States Government retains and the publisher, by accepting the article for publication, acknowledges that the United States Government retains a nonexclusive, paid-up, irrevocable, world-wide license to publish or reproduce the published form of this manuscript, or allow others to do so, for United States Government purposes. Abstract An important concern for high speed circuit designs is that of crosstalk and electromagnetic interference. In PCB board-level designs, crosstalk at microwave frequencies may result from imperfections in shielding of PCB interconnects or more generally transmission lines. Several studies have been done to characterize and improve the isolation between PCB transmission lines for both digital and RF circuits. For example, previous studies in the microwave region have examined the effect that line type, line length, and separation have on crosstalk and suggest that without full shielding, the upper limit of isolation is on the order of 60dB for traditional board-level lines [1]. In order to more fully characterize crosstalk and improve isolation above 60 dB, this thesis studies signal-to-ground-plane separation, considers advanced line types, and examines the effect of 3D shielding.
    [Show full text]
  • Reviewing, Investigating Diversity Microwave Filters
    University of Bradford eThesis This thesis is hosted in Bradford Scholars – The University of Bradford Open Access repository. Visit the repository for full metadata or to contact the repository team © University of Bradford. This work is licenced for reuse under a Creative Commons Licence. DESIGN, MODELLING AND IMPLEMENTATION OF SEVERAL MULTI-STANDARD HIGH PERFORMANCE SINGLE-WIDEBAND AND MULTI-WIDEBAND MICROWAVE PLANAR FILTERS Y. X. TU PhD UNIVERSITY OF BRADFORD 2016 DESIGN, MODELLING AND IMPLEMENTATION OF SEVERAL MULTI-STANDARD HIGH PERFORMANCE SINGLE-WIDEBAND AND MULTI-WIDEBAND MICROWAVE PLANAR FILTERS Y. X. TU Ph. D. 2016 DESIGN, MODELLING AND IMPLEMENTATION OF SEVERAL MULTI-STANDARD HIGH PERFORMANCE SINGLE-WIDEBAND AND MULTI-WIDEBAND MICROWAVE PLANAR FILTERS Analysis, Simulation and Measurements of Multi-Standard Uniplanar High Performance Asymmetric Stepped Impedance Resonator Single / Dual-Wideband Filters With Wide Stopband And Triple-Wideband / Quadruple-Wideband / Quint-Wideband Filters YUXIANG TU BSc, MSc Submitted for the degree of Doctor of Philosophy School of Engineering and Informatics University of Bradford 2016 DESIGN, MODELLING AND IMPLEMENTATION OF SEVERAL MULTI-STANDARD HIGH PERFORMANCE SINGLE-WIDEBAND AND MULTI-WIDEBAND MICROWAVE PLANAR FILTERS Analysis, Simulation and Measurements of Multi-Standard Uniplanar High Performance Asymmetric Stepped Impedance Resonator Single / Dual-Wideband Filters With Wide Stopband And Triple-Wideband / Quadruple-Wideband / Quint- Wideband Filters Keywords: Microwave Planar Filters, Asymmetric Stepped Impedance Resonator (ASIR), Multi- standard, Single-wideband, Dual-wideband, Triple-wideband, Quadruple-wideband, quint-wideband filters, Wide Stopband, Wireless Communication. Abstract The objectives of this work are to review, investigate and model the microwave planar filters of the modern wireless communication system. The recent main stream of microwave filters are classified and discussed separately.
    [Show full text]
  • Design and Development of a Novel Stripline Fast Faraday Cup to Measure Ion Beam Profile A
    9th Int. Beam Instrum. Conf. IBIC2020, Santos, Brazil JACoW Publishing ISBN: 978-3-95450-222-6 ISSN: 2673-5350 doi:10.18429/JACoW-IBIC2020-THPP21 DESIGN AND DEVELOPMENT OF A NOVEL STRIPLINE FAST FARADAY CUP TO MEASURE ION BEAM PROFILE A. Sharma1†, R. K. Gangwar, Indian Institute of Technology (ISM), Dhanbad, India B. K. Sahu, Inter-University Accelerator Centre, New Delhi, India 1also at Inter-University Accelerator Centre, New Delhi, India Abstract interaction hole and used for very high current, high energy beam species, the proposed design is provid- Present day heavy ion accelerators use bunched ion ed with larger beam interaction hole to cater even for low beams of sub-nanosecond time scale for beam accelera- beam currents produced at IUAC which are of the order tion. In order to monitor the longitudinal beam bunch to 10-100 nA. Extensive studies on via fencing suggested profile, Fast Faraday Cups (FFC) are employed. Owing to [4-7] for suppression of spurious modes in stripline ge- the advent of microstrip technology and its fabrication ometry using ground-to-ground stitching via filled with process, planar structures have become easier to fabricate. copper / metalized rods has been extended for the present A novel planar design using the same is developed with a case as well. special provision for mounting edge launch connectors through a microstripline feed, followed by a microstrip to stripline transition to again a microstrip structure in the beam interaction hole. The entire structure is symmetrical and bidirectional with 50 Ω transmission lines. An exper- imental study on via placement around central stripline has also been conducted to not only ensure the field con- tainment around the strip but also for bandwidth en- hancement.
    [Show full text]
  • Astudy on the Effects of Ground Via Fences
    A Study On The Effects Of Ground Via Fences, Embedded Patterned Layer, And Metal Surface Roughness On Conductor Backed Coplanar Waveguide Item Type text; Electronic Dissertation Authors Sain, Arghya Publisher The University of Arizona. Rights Copyright © is held by the author. Digital access to this material is made possible by the University Libraries, University of Arizona. Further transmission, reproduction or presentation (such as public display or performance) of protected items is prohibited except with permission of the author. Download date 05/10/2021 15:19:06 Link to Item http://hdl.handle.net/10150/593602 A STUDY ON THE EFFECTS OF GROUND VIA FENCES, EMBEDDED PATTERNED LAYER, AND METAL SURFACE ROUGHNESS ON CONDUCTOR BACKED COPLANAR WAVEGUIDE By Arghya Sain Copyright © Arghya Sain 2015 A Dissertation Submitted to the Faculty of the DEPARTMENT OF ELECTRICAL AND COMPUTER ENGINEERING In Partial Fulfillment of the Requirements For the Degree of DOCTOR OF PHILOSOPHY In the Graduate College The University of ARIZONA 2015 THE UNIVERSITY OF ARIZONA GRADUATE COLLEGE As members of the Dissertation Committee, we certify that we have read the dissertation prepared by Arghya Sain, titled A Study on the Effects of Ground Via Fences, Embedded Patterned Layer, and Metal Surface Roughness on Conductor Backed Coplanar Waveguide and recommend that it be accepted as fulfilling the dissertation requirement for the Degree of Doctor of Philosophy. Date: 10/19/2015 Kathleen L. Melde, Ph.D. Date: 10/19/2015 Hao Xin, Ph.D. Date: 10/19/2015 Janet M. Roveda, Ph.D. Final approval and acceptance of this dissertation is contingent upon the candidate’s submission of the final copies of the dissertation to the graduate college.
    [Show full text]
  • Substrate Integrated Waveguide Circuits and Systems
    Substrate Integrated Waveguide Circuits and Systems Nathan Alexander Smith Department of Electrical & Computer Engineering McGill University Montréal, Québec, Canada May 2010 A thesis submitted to McGill University in partial fulfillment of the requirements for the degree of Master of Engineering. © 2010 Nathan Alexander Smith Library and Archives Bibliothèque et Canada Archives Canada Published Heritage Direction du Branch Patrimoine de l’édition 395 Wellington Street 395, rue Wellington Ottawa ON K1A 0N4 Ottawa ON K1A 0N4 Canada Canada Your file Votre référence ISBN: 978-0-494-68457-3 Our file Notre référence ISBN: 978-0-494-68457-3 NOTICE: AVIS: The author has granted a non- L’auteur a accordé une licence non exclusive exclusive license allowing Library and permettant à la Bibliothèque et Archives Archives Canada to reproduce, Canada de reproduire, publier, archiver, publish, archive, preserve, conserve, sauvegarder, conserver, transmettre au public communicate to the public by par télécommunication ou par l’Internet, prêter, telecommunication or on the Internet, distribuer et vendre des thèses partout dans le loan, distribute and sell theses monde, à des fins commerciales ou autres, sur worldwide, for commercial or non- support microforme, papier, électronique et/ou commercial purposes, in microform, autres formats. paper, electronic and/or any other formats. The author retains copyright L’auteur conserve la propriété du droit d’auteur ownership and moral rights in this et des droits moraux qui protège cette thèse. Ni thesis. Neither the thesis nor la thèse ni des extraits substantiels de celle-ci substantial extracts from it may be ne doivent être imprimés ou autrement printed or otherwise reproduced reproduits sans son autorisation.
    [Show full text]
  • Modeling, Design, Fabrication and Characterization of Miniaturized Passives and Integrated Em Shields in 3D Rf Packages
    MODELING, DESIGN, FABRICATION AND CHARACTERIZATION OF MINIATURIZED PASSIVES AND INTEGRATED EM SHIELDS IN 3D RF PACKAGES A Dissertation Presented to The Academic Faculty by Srikrishna Sitaraman In Partial Fulfillment of the Requirements for the Degree Doctor of Philosophy in the School of Electrical and Computer Engineering Georgia Institute of Technology DECEMBER 2015 Copyright© 2015 by SRIKRISHNA SITARAMAN MODELING, DESIGN, FABRICATION AND CHARACTERIZATION OF MINIATURIZED PASSIVES AND INTEGRATED EM SHIELDS IN 3D RF PACKAGES Approved by: Dr. Rao R. Tummala, Advisor Dr. Peter J. Hesketh School of Electrical and Computer School of Mechanical Engineering Engineering Georgia Institute of Technology Georgia Institute of Technology Dr. John Papapolymerou Dr. Markondeya Raj Pulugurtha School of Electrical and Computer School of Electrical and Computer Engineering Engineering Georgia Institute of Technology Georgia Institute of Technology Dr. Andrew F Peterson School of Electrical and Computer Engineering Georgia Institute of Technology Date Approved: August 18, 2015 Dedicated to my parents, sister, and fiancée. ACKNOWLEDGEMENTS I would like to thank and express my sincere gratitude to my advisor Prof. Rao Tummala for giving me the opportunity to work on a leading edge project at the Georgia Tech 3D systems packaging research center. He has been a constant source of inspiration. His vision and advice has greatly helped in shaping my thesis. I am extremely grateful for having been mentored and advised by Prof. Tummala. I would also like to thank my mentor Dr. Raj for his invaluable support and mentorship over the years. His technical depth has helped guide me every step of the way. I have learnt much more than I could have ever hoped for.
    [Show full text]