(12) United States Patent (10) Patent No.: US 8,390,999 B2 Neal Et Al
Total Page:16
File Type:pdf, Size:1020Kb
US008390999B2 (12) United States Patent (10) Patent No.: US 8,390,999 B2 Neal et al. (45) Date of Patent: Mar. 5, 2013 (54) COOLING ACOMPUTING DEVICE (58) Field of Classification Search .................. 361/694, 361/695, 687, 697, 679.48-679.51; 454/184: (75) Inventors: Thomas Neal, Cupertino, CA (US); 312/236: 415/206: 257/718–719; 174/16.3 Robert Throop, Cupertino, CA (US); See application file for complete search history. Ken Robertson, Cupertino, CA (US) (56) References Cited (73) Assignee: listershird Development, L.P., U.S. PATENT DOCUMENTS s 5,936,836 A * 8/1999 Scholder ....................... 361/695 - r 6,002.586 A * 12/1999 Chen et al. ..... ... 361.695 (*) Notice: Subject to any disclaimer, the term of this 6,113,485 A * 9/2000 Marquis et al. ... ... 454,184 patent is extended or adjusted under 35 6,130,820 A * 10/2000 Konstad et al. ............... 361/695 U.S.C. 154(b) by 1252 days. 2005/0276015 A1* 12/2005 Wong ............. ... 361,687 2007/01175O2 A1* 5, 2007 Kim .............................. 454,139 (21) Appl. No.: 11/584,126 * cited by examiner (22) Filed: Oct. 20, 2006 Primary Examiner — Zachary M Pape (65) Prior Publication Data (57) ABSTRACT Various technologies for cooling a computer system are US 2008/OO94795 A1 Apr. 24, 2008 described. In accordance with one described embodiment, a (51) Int. Cl fanassembly system for a computer comprises a fan operable iosk 7/20 (2006.01) for cooling the computer and a fan duct coupled with the fan. F28F 7/00 (2006.015 The fan duct comprises a number of attaching features. The HOIL23/34 (2006.015 fan is Suspended at least one component of the computer. FO4D 29/54 (200 6,015 Moreover, the suspended fan enables air to flow between the (52) U.S. Cl 361 f679 49. 361/679.5: 361/695: fan and the component (e.g., a heatsink) to facilitate cooling 36/607.5/1865,802.25718.74/63 of the component. 415/206 17 Claims, 11 Drawing Sheets U.S. Patent Mar. 5, 2013 Sheet 1 of 11 US 8,390,999 B2 U.S. Patent Mar. 5, 2013 Sheet 2 of 11 US 8,390,999 B2 U.S. Patent Mar. 5, 2013 Sheet 3 of 11 US 8,390,999 B2 U.S. Patent Mar. 5, 2013 Sheet 4 of 11 US 8,390,999 B2 U.S. Patent Mar. 5, 2013 Sheet 5 of 11 US 8,390,999 B2 U.S. Patent Mar. 5, 2013 Sheet 6 of 11 US 8,390,999 B2 U.S. Patent Mar. 5, 2013 Sheet 7 of 11 US 8,390,999 B2 U.S. Patent Mar. 5, 2013 Sheet 8 of 11 US 8,390,999 B2 9002 90047~ U.S. Patent Mar. 5, 2013 Sheet 9 of 11 US 8,390,999 B2 s7 s U.S. Patent Mar. 5, 2013 Sheet 10 of 11 US 8,390,999 B2 U.S. Patent Mar. 5, 2013 Sheet 11 of 11 US 8,390,999 B2 US 8,390,999 B2 1. 2 COOLING ACOMPUTING DEVICE second set of feet attachments located on a side panel of the computer, in accordance with a particular embodiment. BACKGROUND DETAILED DESCRIPTION OF THE DRAWINGS Due to the advancement in the computer industry, comput- 5 ing devices (e.g., personal computers) have been getting Reference will now be made in detail to embodiments of Smaller in size and at the same time generating more heat. As the present claimed Subject matter, examples of which are a result, effective cooling for computing devices is becoming illustrated in the accompanying drawings. While the claimed increasingly important. This is especially true for Small form subject matter will be described in conjunction with these factor (SFF) computers. In general, SFF computers refer to a 10 embodiments, it will be understood that they are not intended to limit the claimed subject matter to these embodiments. On class of computers that use motherboards significantly the contrary, the claimed Subject matter is intended to cover smaller than the standard Advanced Technology Extended alternatives, modifications and equivalents, which may be (ATX) sized motherboards. By using smaller motherboards, included within the spirit and scope of the claimed subject such as micro-ATX motherboards, the overall form factor of 15 matter as defined by the appended claims. Furthermore, in the a computer can be reduced. following detailed description of the present claimed subject Because the small size of SFF computers introduces addi matter, numerous specific details are set forth in order to tional constraints, traditional cooling systems are unable to provide a thorough understanding of the present claimed provide adequate cooling for SFF computers. Thus, maintain subject matter. However, it will be evident to one of ordinary ing a SFF computer being operated under a working tempera- 20 skill in the art that the present claimed subject matter may be ture is challenging. For example, since the components within practiced without these embodiment specific details a SFF computer are tightly packed because of its size, less In contrast to conventional cooling systems, embodiments space is left for air to flow through. Traditional cooling sys of the present invention meet the needs of SFF computers. tems not configured to function within a SFF environment Embodiments enable a SFF computer to be effectively cooled may not be able to effectively direct air flow in the more 25 despite its apparent relative paucity of airflow pathways. Fur confined space. ther, some embodiments enable a SFF computer to be effec Moreover, traditional cooling systems generate significant tively cooled while operating in different orientations. In amounts of noise. As SFF computers are often placed in further embodiments, a fan is securely Suspended over a proximity to a user (e.g., placed on a desk), the noise issue chipset heat sink of the computer and is not prone to excessive renders traditional cooling systems unsuitable. 30 vibrations that cause noise. As a result, the SFF computer is cooled in a relatively noise-free manner. Furthermore, in order to meet various business demands, it FIGS. 1A and 1B illustrate a computer 106 with and with is often desired that a SFF computer is designed to be oper out a fan assembly system, in accordance with a particular able under different orientations. In one example, a user may embodiment. With reference to FIG. 1A, the fan assembly place a SFF computer horizontally on his or her desk. In 35 system resides within housing 105 of computer 106 and com another example, a user may place a SFF computer vertically prises a fan duct 100 (e.g., a generally Y-shaped fan duct) and on a wall. Unfortunately, conventional cooling systems often a fan 102. It is appreciated that the fan duct 100 can be a cannot adapt to different orientations and can only properly generally Y-shaped fan duct, a generally U-shaped fan duct, function when a SFF computer is situated in a default orien or a generally U-shaped fan duct. The fan 102 is operable for tation. 40 cooling the computer 106. In some embodiments, the fan 102 is coupled with the fan duct 100. In one particular embodi BRIEF DESCRIPTION OF THE DRAWINGS ment, the fan 102 is situated substantially apart from side panels of computer 106, which helps to contain and minimize FIGS. 1A and 1B illustrate a computer with and without a the noise produced by fan 102. In one example, the fan duct fanassembly system, in accordance with a particular embodi- 45 100 and the fan 102 are located within a centralized position ment. of the housing 105 and not touching any of the side panels of FIG. 2 illustrates a perspective view of the top surface of computer 106. Also, in one particular embodiment, a proces the fan duct, in accordance with a particular embodiment. Sor having lower power consumption (e.g., a notebook pro FIG. 3 illustrates a perspective view of the bottom surface cessor) is utilized to reduce the amount of heat generated by of the fan duct, in accordance with a particular embodiment. 50 computer 106. FIG. 4 illustrates a number of vents and airflow pathways In one embodiment, the fan assembly system is suspended that facilitate cooling of a computer situated in a horizontal over a component, Such as a chipset heatsink, that resides position, in accordance with a particular embodiment. within the housing 105. FIG.1B provides an illustration of the FIGS. 5A and 5B illustrate additional vents and airflow components that are located under the fan assembly system pathways that facilitate cooling of computer situated in a 55 (i.e., fan assembly has been removed to better illustrate com Vertical position, in accordance with a particular embodi ponents that could be beneath the fan). An embodiment of the ment. heatsink 107 is shown in FIG. 1B. The fan assembly system, FIG. 6 illustrates additional vents situated on the rear por when attached, is suspending over heatsink 107. In one tion of a computer that provides additional airflow pathways, example, the Suspended fan assembly system does not come in accordance with a particular embodiment. 60 in contact with heatsink 107. In one embodiment, air flow is FIG. 7 illustrates a side view of one particular airflow provided by fan 102 and directed through the space between pattern through computer, in accordance with a particular the suspended fan assembly system and the heatsink 107 to embodiment. facilitate cooling of heatsink 107. FIGS. 8A and 8B jointly illustrate a computer having a fan In one example, the fan duct 100 (e.g., a generally assembly, in accordance with a particular embodiment.