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Intelligent Systems and Platforms Transforming the Industrial Cloud Era
Intelligent Systems and Platforms Transforming the Industrial Cloud Era With innovative technologies from cloud computing (industrial server, video server), edge computing (fanless, slim & portable devices), to high performance embedded systems. Advantech transforms embedded systems into intelligent systems with smart, secure, energy-saving features, built with Industrial Cloud Services and professional Overview System Design-To-Order Services (System DTOS). Advantech’s intelligent systems are designed to target vertical markets in intelligent transportation, factory automation/machine automation, cloud infrastructure, intelligent video application. Industrial Server & Storage Industrial Cloud Intelligent Vision Systems Intelligent Video Systems Intelligent Systems Data Acquisition Modules Intelligent Transportation Systems 0-4 Star Products Intelligent Video Solution DVP-7011UHE DVP-7011MHE DVP-7017HE DVP-5311D Overview 1-ch H.264 4K HDMI 2.0 PCIe 1-ch Full HD H.264 M.2 Video 1-ch Full HD H.264 Mini PCIe Video (DVI-DVI), Control and Video Capture Card with SDK Capture Card with SDK Video Capture Card with SDK Data Transmission Extender • 1-channel 4K HDMI 2.0 video input with • 1 channel HDMI/DVI-D/DVI-A/YPbPr • 1 channel SDI channel video inputs with • Supports High Resolution 1920x1200 @ H.264 software compression channel video inputs with H.264 software H.264 software compression 60Hz WUXGA compression • 60/50 fps (NTSC/PAL) at up to • 30/25 fps (NTSC/PAL) at up to full HD • Zero pixel loss with TMDS signal correction 4096 x 2160p -
SEP8253 User Manual
SEP8253 User Manual Revision 0.2 May 16, 2019 Copyright © 2019 by Trenton Systems, Inc. All rights reserved. PREFACE The information in this user’s manual has been carefully reviewed and is believed to be accurate. Trenton Systems assumes no responsibility for any inaccuracies that may be contained in this document, and makes no commitment to update or to keep current the information in this manual, or to notify any person or organization of the updates. Please Note: For the most up-to-date version of this manual, please visit our website at: www.trentonsystems.com. Trenton Systems, Inc. reserves the right to make changes to the product described in this manual at any time and without notice. This product, including software and documentation, is the property of Trenton Systems and/or its licensors, and is supplied only under a license. Any use or reproduction of this product is not allowed, except as expressly permitted by the terms of said license. IN NO EVENT WILL TRENTON SYSTEMS, INC. BE LIABLE FOR DIRECT, INDIRECT, SPECIAL, INCIDENTAL, SPECULATIVE OR CONSEQUENTIAL DAMAGES ARISING FROM THE USE OR INABILITY TO USE THIS PRODUCT OR DOCUMENTATION, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. IN PARTICULAR, TRENTON SYSTEMS, INC. SHALL NOT HAVE LIABILITY FOR ANY HARDWARE, SOFTWARE, OR DATA STORED OR USED WITH THE PRODUCT, INCLUDING THE COSTS OF REPAIRING, REPLACING, INTEGRATING, INSTALLING OR RECOVERING SUCH HARDWARE, SOFTWARE, OR DATA. Contact Information Trenton Systems, Inc. 1725 MacLeod Drive Lawrenceville, GA 30043 (770) 287-3100 [email protected] [email protected] [email protected] www.trentonsystems.com 2 INTRODUCTION Warranty The following is an abbreviated version of Trenton Systems’ warranty policy for High Density Embedded Computing (HDEC®) products. -
System Builder's Guide for D-Series
Matrox® Display Wall Mura™ IPX Series • D-Series™ System Builder’s Guide 20315-101-0110 2021.07.28 www.matrox.com/video Contents Product overview .....................................................................................................................................................4 Hardware summary – Mura IPX Series.....................................................................................................................................................................4 MURAIPXI-E4SF/MURAIPXI-E4SHF ...............................................................................................................................................4 MURAIPXI-E2MF/MURAIPXI-E2MHF ...........................................................................................................................................5 MURAIPXI-D2MF/MURAIPXI-D2MHF..................................................................................................................................................6 MURAIPXI-E4JF/MURAIPXI-E4JHF ................................................................................................................................................7 MURAIPXI-D4JF/MURAIPXI-D4JHF ..............................................................................................................................................8 Hardware summary – Matrox D-Series ....................................................................................................................................................................9 -
Investigations of Various HPC Benchmarks to Determine Supercomputer Performance Efficiency and Balance
Investigations of Various HPC Benchmarks to Determine Supercomputer Performance Efficiency and Balance Wilson Lisan August 24, 2018 MSc in High Performance Computing The University of Edinburgh Year of Presentation: 2018 Abstract This dissertation project is based on participation in the Student Cluster Competition (SCC) at the International Supercomputing Conference (ISC) 2018 in Frankfurt, Germany as part of a four-member Team EPCC from The University of Edinburgh. There are two main projects which are the team-based project and a personal project. The team-based project focuses on the optimisations and tweaks of the HPL, HPCG, and HPCC benchmarks to meet the competition requirements. At the competition, Team EPCC suffered with hardware issues that shaped the cluster into an asymmetrical system with mixed hardware. Unthinkable and extreme methods were carried out to tune the performance and successfully drove the cluster back to its ideal performance. The personal project focuses on testing the SCC benchmarks to evaluate the performance efficiency and system balance at several HPC systems. HPCG fraction of peak over HPL ratio was used to determine the system performance efficiency from its peak and actual performance. It was analysed through HPCC benchmark that the fraction of peak ratio could determine the memory and network balance over the processor or GPU raw performance as well as the possibility of the memory or network bottleneck part. Contents Chapter 1 Introduction .............................................................................................. -
Lista Sockets.Xlsx
Data de Processadores Socket Número de pinos lançamento compatíveis Socket 0 168 1989 486 DX 486 DX 486 DX2 Socket 1 169 ND 486 SX 486 SX2 486 DX 486 DX2 486 SX Socket 2 238 ND 486 SX2 Pentium Overdrive 486 DX 486 DX2 486 DX4 486 SX Socket 3 237 ND 486 SX2 Pentium Overdrive 5x86 Socket 4 273 março de 1993 Pentium-60 e Pentium-66 Pentium-75 até o Pentium- Socket 5 320 março de 1994 120 486 DX 486 DX2 486 DX4 Socket 6 235 nunca lançado 486 SX 486 SX2 Pentium Overdrive 5x86 Socket 463 463 1994 Nx586 Pentium-75 até o Pentium- 200 Pentium MMX K5 Socket 7 321 junho de 1995 K6 6x86 6x86MX MII Slot 1 Pentium II SC242 Pentium III (Cartucho) 242 maio de 1997 Celeron SEPP (Cartucho) K6-2 Socket Super 7 321 maio de 1998 K6-III Celeron (Socket 370) Pentium III FC-PGA Socket 370 370 agosto de 1998 Cyrix III C3 Slot A 242 junho de 1999 Athlon (Cartucho) Socket 462 Athlon (Socket 462) Socket A Athlon XP 453 junho de 2000 Athlon MP Duron Sempron (Socket 462) Socket 423 423 novembro de 2000 Pentium 4 (Socket 423) PGA423 Socket 478 Pentium 4 (Socket 478) mPGA478B Celeron (Socket 478) 478 agosto de 2001 Celeron D (Socket 478) Pentium 4 Extreme Edition (Socket 478) Athlon 64 (Socket 754) Socket 754 754 setembro de 2003 Sempron (Socket 754) Socket 940 940 setembro de 2003 Athlon 64 FX (Socket 940) Athlon 64 (Socket 939) Athlon 64 FX (Socket 939) Socket 939 939 junho de 2004 Athlon 64 X2 (Socket 939) Sempron (Socket 939) LGA775 Pentium 4 (LGA775) Pentium 4 Extreme Edition Socket T (LGA775) Pentium D Pentium Extreme Edition Celeron D (LGA 775) 775 agosto de -
Introduction Aux Systèmes Informatiques Introduction Générale
Introduction aux systèmes informatiques Introduction générale Michel Salomon IUT de Belfort-Montbéliard Département d’informatique Michel Salomon Intro. aux sys. info. 1 / 53 Objectifs et organisation Objectifs 1 Savoir utiliser un (des) système(s) informatique(s) ; 2 en appréhender le fonctionnement Organisation Module en deux parties 1 Système d’exploitation (7 sem. - M. Fouzi) 2 Fonctionnement interne d’un ordinateur (6 sem. - M. Salomon) Modalités de Contrôle des Connaissances Chaque partie comptera pour 50% de la note du module Au moins 2 contrôles dans cette partie Michel Salomon Intro. aux sys. info. 2 / 53 L’informatique : un domaine complexe en constante évolution Décrire ce qu’est un ordinateur n’est pas aisé Grande variété d’ordinateurs Netbook Tablette tactile etc. Super-ordinateur Rapidité des évolutions technologiques Illustration par la Loi de Moore (1975) Postulait initialement le doublement du nombre de transistors des microprocesseurs tous les 2 ans ; entre 1971 et 2001 doublement tous les 1,96 années ; “relativement” exacte jusqu’en 2012, depuis ralentissement (phénomène quantique : effet tunnel → limite de miniaturisation) ; version plus commune : doublement d’une grandeur (puissance, capacité, etc.) tous les 18 à 24 mois Michel Salomon Intro. aux sys. info. 3 / 53 L’informatique : un domaine complexe en constante évolution On approche des limites de la technologie actuelle des semi-conducteurs Michel Salomon Intro. aux sys. info. 4 / 53 L’informatique : un domaine complexe en constante évolution Pourquoi réduire la finesse de gravure ? Une gravure plus fine permet d’augmenter la densité des transistors Une même micro-architecture (même nombre de transistors) → implémentée par un “Die” (support physique) plus petit Une même taille de “Die” (plus de transistors disponibles) → implémenter une micro-architecture plus performante Michel Salomon Intro. -
Computer Organization and Assembly Language CSC-210 Laboratory
Department of Computer Science CSC-210 Computer Organization and Assembly Language Laboratory Manual, 3rd Edition/2017 Computer Organization and Assembly Language CSC-210 Laboratory Manual 3rd Edition 2017/2018 Name: Number: ٍ :Section Department: 1 Department of Computer Science CSC-210 Computer Organization and Assembly Language Laboratory Manual, 3rd Edition/2017 Table of Contents Lab (1): Computer Anatomy ....................................................................................................... 4 Objectives ............................................................................................................................... 4 What is a Computer? ............................................................................................................... 4 System ..................................................................................................................................... 4 1. Motherboard ............................................................................................................. 5 2. Central Processing Unit (CPU) ...................................................................................... 6 3. Memory .................................................................................................................... 6 4. Video Adapter ............................................................................................................ 7 5. Operating System ...................................................................................................... -
Modeling Many-Core Processor Interconnect Scalability for the Evolving Performance, Power and Area Relation NIVERSITEIT VAN David Smelt —U June 9, 2018 NFORMATICA I
BACHELOR INFORMATICA MSTERDAM A Modeling many-core processor interconnect scalability for the evolving performance, power and area relation NIVERSITEIT VAN David Smelt —U June 9, 2018 NFORMATICA I Supervisor(s): drs. T.R. Walstra Signed: Abstract Novel chip technologies continue to face power and thermal limits accompanied by the evolving performance, power and area relation. CPU architectures are moving towards ever-increasing core counts to sustain compute performance growth. The imminent many-core era necessitates an efficient and scalable interconnection network. This thesis elaborates on the underlying causes for compelled energy efficiency and its impacts on microarchitecture evolution. Scalability of various interconnect topologies is evaluated; pragmatically by means of x86 benchmarks and theoretically by means of synthetic traffic. Performance scalability statistics for both existing Intel x86 interconnects and alternative topologies are obtained by means of Sniper and gem5/Garnet2.0 simulations. Power and area models are obtained through McPAT for Sniper simulations and through DSENT for detailed gem5/Garnet2.0 NoC simulations. Garnet2.0 is extended for modeling of NoC power consumption and area with DSENT. For three existing Intel x86 CPU architectures, microarchitectural details pertaining to scalability and interconnects are laid out. This illustrates the evolution of Intel’s x86 CPU interconnection net- works, from bus to increasingly more scalable point-to-point interconnects. Scalability of performance, power and area in select Intel x86 processors is examined with the Sniper x86 computer architecture simulator. Interconnect scalability of various bus, ring (NoC) and mesh (NoC) topologies in the sim- ulated Haswell architecture is compared by means of Sniper’s results, which include a power and area model by McPAT. -
Unstructured Computations on Emerging Architectures
Unstructured Computations on Emerging Architectures Dissertation by Mohammed A. Al Farhan In Partial Fulfillment of the Requirements For the Degree of Doctor of Philosophy King Abdullah University of Science and Technology Thuwal, Kingdom of Saudi Arabia May 2019 2 EXAMINATION COMMITTEE PAGE The dissertation of M. A. Al Farhan is approved by the examination committee Dissertation Committee: David E. Keyes, Chair Professor, King Abdullah University of Science and Technology Edmond Chow Associate Professor, Georgia Institute of Technology Mikhail Moshkov Professor, King Abdullah University of Science and Technology Markus Hadwiger Associate Professor, King Abdullah University of Science and Technology Hakan Bagci Associate Professor, King Abdullah University of Science and Technology 3 ©May 2019 Mohammed A. Al Farhan All Rights Reserved 4 ABSTRACT Unstructured Computations on Emerging Architectures Mohammed A. Al Farhan his dissertation describes detailed performance engineering and optimization Tof an unstructured computational aerodynamics software system with irregu- lar memory accesses on various multi- and many-core emerging high performance computing scalable architectures, which are expected to be the building blocks of energy-austere exascale systems, and on which algorithmic- and architecture-oriented optimizations are essential for achieving worthy performance. We investigate several state-of-the-practice shared-memory optimization techniques applied to key kernels for the important problem class of unstructured meshes. We illustrate -
TUF X299 MARK 2 Specifications Summary
TUF X299 MARK 2 Motherboard E12906 First Edition June 2017 Copyright© 2017 ASUSTeK COMPUTER INC. All Rights Reserved. No part of this manual, including the products and software described in it, may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language in any form or by any means, except documentation kept by the purchaser for backup purposes, without the express written permission of ASUSTeK COMPUTER INC. (“ASUS”). Product warranty or service will not be extended if: (1) the product is repaired, modified or altered, unless such repair, modification of alteration is authorized in writing by ASUS; or (2) the serial number of the product is defaced or missing. ASUS PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED, INCLUDING BUT NOT LIMITED TO THE IMPLIED WARRANTIES OR CONDITIONS OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. IN NO EVENT SHALL ASUS, ITS DIRECTORS, OFFICERS, EMPLOYEES OR AGENTS BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES (INCLUDING DAMAGES FOR LOSS OF PROFITS, LOSS OF BUSINESS, LOSS OF USE OR DATA, INTERRUPTION OF BUSINESS AND THE LIKE), EVEN IF ASUS HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES ARISING FROM ANY DEFECT OR ERROR IN THIS MANUAL OR PRODUCT. SPECIFICATIONS AND INFORMATION CONTAINED IN THIS MANUAL ARE FURNISHED FOR INFORMATIONAL USE ONLY, AND ARE SUBJECT TO CHANGE AT ANY TIME WITHOUT NOTICE, AND SHOULD NOT BE CONSTRUED AS A COMMITMENT BY ASUS. ASUS ASSUMES NO RESPONSIBILITY OR LIABILITY FOR ANY ERRORS OR INACCURACIES THAT MAY APPEAR IN THIS MANUAL, INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT. -
Supermicro Superstorage Server SSG-6049P-E1CR36L 4U DP 36Xlff LSI 3008 RED PSU
Supermicro SuperStorage Server SSG-6049P-E1CR36L 4U DP 36xLFF LSI 3008 RED PSU Kod producenta: SSG-6049P-E1CR36L Chassis Form Factor Rack 4U CPU Socket LGA 3647 (Socket P) # of CPU's 2 Supported CPU's Intel Xeon Scalable Processors Max CPU TDP 205 W Chipset Intel C624 Memory Type DDR4 ECC 3DS LRDIMM DDR4 ECC RDIMM Memory Frequency 2666 MHz 2400 MHz 2133 MHz # of DIMM's 16 Max Memory Size 2048 GB Integrated Graphics Aspeed AST2500 # of 3.5 hot-swap bays 36 Backplanes SATA3/SAS3 # of PCIe x16 3.0 3 # of PCIe x8 3.0 4 # of USB Ports 4 x USB 3.0 (rear) 1 x USB 3.0 Type A # of SATA Ports 10 # of SAS Ports 8 Storage Controllers 8 x AHCI iSATA 6Gb/s 2 x sSATA 6Gb/s LSI 3008 12Gb/s AOC Integrated RAID 0,1,5,10 # of Serial Ports 1 x Fast UART 16550 (rear) 1 x Fast UART 16550 (header) # of 10GbE LAN Ports 2 x Base-T Network Controllers Intel x722 Port 10 Gigabit Base-T Intel x557 Port 10 Gigabit Base-T Integrated BMC IPMI 2.0 KVM-over-LAN Virtual Media over LAN IPMI Dedicated RJ45 PHY BMC chip Aspeed AST2500 TPM 1 x TPM 1.2 20-pin Header Power Supply Redundant PSU Wattage 1200W PSU Certification 80+ Titanium Chassis Dimensions 437 x 178 x 699mm Uwagi PCI-Express Slots Configuration: 3x PCI-E 3.0 x16 slots 4x PCI-E 3.0 x8 slots Slot 2 & 3 occupied by controller and JBOD Copyright ©2021 www.superstorage.pl Expansion| środa, Port 29 wrzesień 2021 Strona: 1 / 3 Poniżej prezentujemy szczegółowy opis techniczny oferowanego produktu: UWAGA !!! Oferowany produkt to platforma serwerowa służąca do budowy swojej własnej konfiguracji serwera (nie zawiera CPU, RAM czy HDD). -
Advantech SKY Series Industrial Server Solutions
Regional Service & Customization Centers China Kunshan Taiwan Taipei Netherlands Eindhoven Poland Warsaw USA Milpitas, CA 86-512-5777-5666 886-2-2792-7818 31-40-267-7000 00800-2426-8080 1-408-519-3898 Worldwide Offices Asia Asia Europe Americas Advantech SKY Series Taiwan Japan Netherlands North America Toll Free 0800-777-111 Toll Free 0800-500-1055 Eindhoven 31-40-267-7000 Toll Free 1-888-576-9668 Taipei & IoT Campus 886-2-2792-7818 Tokyo 81-3-6802-1021 Breda 31-76-523-3100 Cincinnati 1-513-742-8895 Taichung 886-4-2372-5058 Osaka 81-6-6267-1887 Milpitas 1-408-519-3898 Industrial Server Solutions Kaohsiung 886-7-392-3600 Nagoya 81-0800-500-1055 Germany Irvine 1-949-420-2500 Nogata 81-949-22-2890 Toll Free 00800-2426-8080/81 Ottawa 1-815-433-5100 China Munich 49-89-12599-0 GPU Server Toll Free 800-810-0345 Korea Düsseldorf 49-2103-97-855-0 Brazil High-Performance, Reliable, and Flexible Beijing 86-10-6298-4346 080-363-9494/5 Toll Free Toll Free 0800-770-5355 IoT Server Shanghai 86-21-3632-1616 82-2-3660-9255 Seoul France São Paulo 55-11-5592-5367 Shenzhen 86-755-8212-4222 Paris 33-1-4119-4666 Carrier-grade Server with Product Longevity Support Chengdu 86-28-8545-0198 Singapore Hong Kong 852-2720-5118 Singapore 65-6442-1000 Mexico Italy Toll Free 1-800-467-2415 Multi-node Server Malaysia Milan 39-02-9544-961 Mexico City 52-55-6275-2727 Kuala Lumpur 60-3-7725-4188 Server Board Penang 60-4-537-9188 UK Newcastle 44-0-191-262-4844 Middle East and Africa Server Chassis London 44-0-870-493-1433 Thailand Israel 072-2410527 Bangkok 66-02-2488306-9 Turkey 90-212-222-0422 Application Case Spain Vietnam Madrid 34-91-668-86-76 Solution Ready Platform Hanoi 84-24-3399-1155 Sweden Indonesia Stockholm 46-0-864-60-500 Jakarta 62-21-751-1939 Poland Australia Warsaw 48-22-31-51-100 Toll Free 1300-308-531 Melbourne 61-3-9797-0100 Russia Moscow 8-800-555-01-50 India St.