COMPUTEX 2017 to Lead the ICT Shows with Innovations
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Rog Guide Product
NO. gaming laptop ROG 1brand worldwide PRODUCT GUIDE March - May 2021 Powered by the latest Ryzen™ 5000 Series CPUs & GeForce RTX™ 30 Series GPUs ROG STRIX STRIX 15/17 ROG Zephyrus g15 ROG STRIX G15/17 ROG Zephyrus g14 ROG XG Mobile ROG Zephyrus duo 15 se ROG flow x13 More games than any other platform NO. gaming laptop REPUBLIC OF THE ROG 1brand worldwide GAMERS LEGACY For those who dare CONTINUES ROG R&D engineers are hardcore gamers, too. We know gaming, and we are constantly striving to Welcome to Republic of Gamers. It’s a proving ground for the elite — a place where players and teams gather develop products that gamers need. Our goal: give gamers the ultimate gaming hardware. to celebrate camaraderie and gaming excellence. There’s no room for mediocrity or weakness here. This is a call for those who dare venture, defy convention, and rebel against conformity. You rise up to challenges, and are not afraid to stare failure in the face, time and time again. You stand by your instincts, as well as alongside comrades in need. Republic of Gamers is for those who dare seek the impossible because ‘hard’ isn’t enough. ROG is the Choice of Champions. If you dare, put on your game face and Join the Republic. DECEMBER 2007 JUNE 2011 APRIL 2012 JANUARY 2014 JULY 2014 New Product Line New Product Line New Product Line New Product Line New Product Line Gaming Notbooks G1/G2 Gaming Desktop CG8565 Xonar Phoebus Audio Card ROG Gladius Gaming Mouse Swift PG Series Monitor JULY 2006 Launched Commando, New Product Line New Product Line New Mini ITX -
Graphics Card Support List
Graphics card support list Device Name Chipset ASUS GTXTITAN-6GD5 NVIDIA GeForce GTX TITAN ZOTAC GTX980 NVIDIA GeForce GTX980 ASUS GTX980-4GD5 NVIDIA GeForce GTX980 MSI GTX980-4GD5 NVIDIA GeForce GTX980 Gigabyte GV-N980D5-4GD-B NVIDIA GeForce GTX980 MSI GTX970 GAMING 4G GOLDEN EDITION NVIDIA GeForce GTX970 Gigabyte GV-N970IXOC-4GD NVIDIA GeForce GTX970 ASUS GTX780TI-3GD5 NVIDIA GeForce GTX780Ti ASUS GTX770-DC2OC-2GD5 NVIDIA GeForce GTX770 ASUS GTX760-DC2OC-2GD5 NVIDIA GeForce GTX760 ASUS GTX750TI-OC-2GD5 NVIDIA GeForce GTX750Ti ASUS ENGTX560-Ti-DCII/2D1-1GD5/1G NVIDIA GeForce GTX560Ti Gigabyte GV-NTITAN-6GD-B NVIDIA GeForce GTX TITAN Gigabyte GV-N78TWF3-3GD NVIDIA GeForce GTX780Ti Gigabyte GV-N780WF3-3GD NVIDIA GeForce GTX780 Gigabyte GV-N760OC-4GD NVIDIA GeForce GTX760 Gigabyte GV-N75TOC-2GI NVIDIA GeForce GTX750Ti MSI NTITAN-6GD5 NVIDIA GeForce GTX TITAN MSI GTX 780Ti 3GD5 NVIDIA GeForce GTX780Ti MSI N780-3GD5 NVIDIA GeForce GTX780 MSI N770-2GD5/OC NVIDIA GeForce GTX770 MSI N760-2GD5 NVIDIA GeForce GTX760 MSI N750 TF 1GD5/OC NVIDIA GeForce GTX750 MSI GTX680-2GB/DDR5 NVIDIA GeForce GTX680 MSI N660Ti-PE-2GD5-OC/2G-DDR5 NVIDIA GeForce GTX660Ti MSI N680GTX Twin Frozr 2GD5/OC NVIDIA GeForce GTX680 GIGABYTE GV-N670OC-2GD NVIDIA GeForce GTX670 GIGABYTE GV-N650OC-1GI/1G-DDR5 NVIDIA GeForce GTX650 GIGABYTE GV-N590D5-3GD-B NVIDIA GeForce GTX590 MSI N580GTX-M2D15D5/1.5G NVIDIA GeForce GTX580 MSI N465GTX-M2D1G-B NVIDIA GeForce GTX465 LEADTEK GTX275/896M-DDR3 NVIDIA GeForce GTX275 LEADTEK PX8800 GTX TDH NVIDIA GeForce 8800GTX GIGABYTE GV-N26-896H-B -
Manual, Chapter 1 and 2 Contains the Introduction of the Motherboard and Step-By-Step Installation Guides
Version 1.0 Published June 2018 Copyright©2018 ASRock INC. All rights reserved. Copyright Notice: No part of this documentation may be reproduced, transcribed, transmitted, or translated in any language, in any form or by any means, except duplication of documentation by the purchaser for backup purpose, without written consent of ASRock Inc. Products and corporate names appearing in this documentation may or may not be registered trademarks or copyrights of their respective companies, and are used only for identification or explanation and to the owners’ benefit, without intent to infringe. Disclaimer: Specifications and information contained in this documentation are furnished for informational use only and subject to change without notice, and should not be constructed as a commitment by ASRock. ASRock assumes no responsibility for any errors or omissions that may appear in this documentation. With respect to the contents of this documentation, ASRock does not provide warranty of any kind, either expressed or implied, including but not limited to the implied warranties or conditions of merchantability or fitness for a particular purpose. In no event shall ASRock, its directors, officers, employees, or agents be liable for any indirect, special, incidental, or consequential damages (including damages for loss of profits, loss of business, loss of data, interruption of business and the like), even if ASRock has been advised of the possibility of such damages arising from any defect or error in the documentation or product. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. -
View Annual Report
2007 ANNUAL REPORT TSE:2303 NYSE:UMC Corporate Information Spokesperson Fab 8C ADR Depositary and Registrar Chitung Liu No.6 Li-Hsin 3rd Rd., Hsinchu Science Citibank, N.A. Chief Financial Officer Park, Hsinchu, Taiwan 30078, R.O.C. Depositary Receipt Services 886 (2) 2700 6999 886 (3) 578 2258 14F, 388 Greenwich Street, [email protected] New York, NY 10013, U.S.A. Fab 8D 1 (877) 248 4237 (Toll-free) Deputy Spokesperson(s) No.8 Li-Hsin 3rd Rd., Hsinchu Science Stockholder Service Representatives are Sandy Yen Park, Hsinchu, Taiwan 30078, R.O.C. available Monday through Friday, The Chairman and CEO Office 886 (3) 578 2258 8:30a.m. to 6:00p.m., Eastern Time. Senior Manager http://wwss.citissb.com/adr/www/ 886 (2) 2700 6999 Fab 8E [email protected] [email protected] No.17 Li-Hsin Rd., Hsinchu Science Park, Hsinchu, Taiwan 30078, R.O.C. ADR Exchange Marketplace Bowen Huang 886 (3) 578 2258 New York Stock Exchange, Inc. Finance Division 11 Wall Street Senior Manager Fab 8F New York, NY 10005, U.S.A. 886 (2) 2700 6999 No.3 Li-Hsin 6th Rd., Hsinchu Science 1 (212) 656 3000 [email protected] Park, Hsinchu, Taiwan 30078, R.O.C. www.nyse.com 886 (3) 578 2258 Ticker/Search Code: UMC Headquarters No.3 Li-Hsin 2nd Rd., Hsinchu Science Fab 8S Exchangeable Bond Exchange Park, Hsinchu, Taiwan 30078, R.O.C. No.16 Creation 1st Rd., Hsinchu Science Marketplace 886 (3) 578 2258 Park, Hsinchu, Taiwan 30077, R.O.C. -
Media Alert – Intel at Computex Taipei 2009
Media Alert – Intel at Computex Taipei 2009 Intel Unveils and Showcases Technologies Innovation at Computex Taipei 2009 WHAT: Intel is hosting a series of events to unveil and showcase its latest technologies innovation for mobility, ultra-mobility, digital enterprise and applications at Computex Taipei from June 2 -6, 2009. Intel’s activities at Computex 2009 will kick-off with a keynote by Sean Maloney, Intel’s Executive Vice President and Chief Sales and Marketing Officer, at the 3F Plenary Hall of Taipei International Convention Center (TICC) on Tuesday, June 2. Intel will be exhibiting its all encompassing product platforms at the Taipei World Trade Center (TWTC) Nangang Exhibition Hall from June 2 -6. In addition, Intel’s WiMAX demo booth is located at TWTC Hall 1 where the “WiMAX Expo” will be held from June 2-6. DATES: Computex 2009: Tue-Fri., June 2-5, 2009 (9:30-18:00) Sat, June 6, 2009 (9:30-16:00) WiMAX Expo: Tue-Fri, June 2-5, 2009 (9:30-18:00) Sat, June 6, 2009 (9:30-16:00) WHERE: Intel Exhibition Showcase at Computex Booth M806 4/F, Taipei World Trade Center Nangang Exhibition Hall (TWTC Nangang) (Address: No.1, Jingmao 2nd Rd., Nangang District, Taipei City, Taiwan) Intel WiMAX booth at WiMAX Expo: Booth A610 Taipei World Trade Center (TWTC) Hall 1 (Address: No. 5, Hsin-yi Rd., Sec. 5, Hsin-yi District, Taipei City, Taiwan) Intel Hosted Events Please refer to below details and contact your local PR representative for RSVP. PRESS ACTIVITIES: Computex Keynote: Sean Maloney June 2, 2009, 14:00-15:00 3F Plenary Hall, Taipei International Convention Center (TICC) (Address: No. -
K10n78hsli-Wifi / K10n78hsli-1394
K10N78hSLI-WiFi / K10N78hSLI-1394 User Manual Version 1.0 Published April 2008 Copyright©2008 ASRock INC. All rights reserved. 1 Copyright Notice: No part of this manual may be reproduced, transcribed, transmitted, or translated in any language, in any form or by any means, except duplication of documentation by the purchaser for backup purpose, without written consent of ASRock Inc. Products and corporate names appearing in this manual may or may not be regis- tered trademarks or copyrights of their respective companies, and are used only for identification or explanation and to the owners’ benefit, without intent to infringe. Disclaimer: Specifications and information contained in this manual are furnished for informa- tional use only and subject to change without notice, and should not be constructed as a commitment by ASRock. ASRock assumes no responsibility for any errors or omissions that may appear in this manual. With respect to the contents of this manual, ASRock does not provide warranty of any kind, either expressed or implied, including but not limited to the implied warran- ties or conditions of merchantability or fitness for a particular purpose. In no event shall ASRock, its directors, officers, employees, or agents be liable for any indirect, special, incidental, or consequential damages (including damages for loss of profits, loss of business, loss of data, interruption of business and the like), even if ASRock has been advised of the possibility of such damages arising from any defect or error in the manual or product. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. -
K10N78-1394.Pdf
K10N78-1394 / K10N78 User Manual Version 1.1 Published August 2008 Copyright©2008 ASRock INC. All rights reserved. 1 Copyright Notice: No part of this manual may be reproduced, transcribed, transmitted, or translated in any language, in any form or by any means, except duplication of documentation by the purchaser for backup purpose, without written consent of ASRock Inc. Products and corporate names appearing in this manual may or may not be regis- tered trademarks or copyrights of their respective companies, and are used only for identification or explanation and to the owners’ benefit, without intent to infringe. Disclaimer: Specifications and information contained in this manual are furnished for informa- tional use only and subject to change without notice, and should not be constructed as a commitment by ASRock. ASRock assumes no responsibility for any errors or omissions that may appear in this manual. With respect to the contents of this manual, ASRock does not provide warranty of any kind, either expressed or implied, including but not limited to the implied warran- ties or conditions of merchantability or fitness for a particular purpose. In no event shall ASRock, its directors, officers, employees, or agents be liable for any indirect, special, incidental, or consequential damages (including damages for loss of profits, loss of business, loss of data, interruption of business and the like), even if ASRock has been advised of the possibility of such damages arising from any defect or error in the manual or product. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. -
A Closer Look at Future Tech at COMPUTEX a Closer Look at Future
www.ComputexTaipei.com.tw Day3 Show Daily AI takes center stage Page 2 Microsoft Forum Page 5 Procurement Meetings Page 12 Product Highlights Page 18 AA closercloser looklook atat futurefuture Avita Ad_232x83_v2op.pdf 1 25/5/17 12:40techtech pm atat COMPUTEXCOMPUTEX C M Y CM MY CY CMY K Organizers: Publisher: Publication Sponsor: Come visit out booth @ 4th floor #M0120 Taipei Nangang Exhibition Center, Hall 1 台北南港展覽館1館 / 4F雲端展場 MicroBladeTM /SuperBlade® )JHIFTU%FOTJUZt)JHI1FSGPSNBODFt)JHI&óDJFODZt$PTU&òFDUJWF &OUFSQSJTF %BUB$FOUFS 8FC )1$BOE$MPVE$PNQVUJOH4PMVUJPOT Intel® Xeon® processor Scalable family 6U MicroBlade™ 8U SuperBlade® Up to Nodes Up to Nodes 3U MicroBlade™ 4U SuperBlade® Up to Nodes Up to Nodes Advantages: t4VQQPSUTVQUPMBUFTU85%1*OUFM¥9FPO¥QSPDFTTPS4DBMBCMFGBNJMZ$16T t(&UIFSOFU &%3 ( *OöOJ#BOE BOE*OUFM¥0NOJ1BUI ( BWBJMBCMF t6BOE.IPUTXBQNVMe supported; diverse SAS3/SATA3 drive bay models t8 / / SFEVOEBOU5JUBOJVN-FWFM FóDJFOU QPXFSTVQQMJFTTVQQPSUFE t##1¥#BUUFSZ#BDLVQ1PXFSPQUJPOT t3FEöTI3&45GVM"1*TBOE4VQFSNJDSP34%FOBCMFEWJB$..NBOBHFNFOUNPEVMF t'SFF"JS$PPMJOHEFTJHOTEFMJWFSMPXFTU16& Visit Us at Taipei Nangang Exhibition Center, Hall 1 Intel Inside®. Booth #M0120 Intel, the Intel logo, Xeon, and Xeon Inside are trademarks or registered trademarks of Intel Powerful Productivity Outside. Corporation in the U.S. and/or other countries. Computex 2017_ad.indd 4 5/23/2017 2:50:34 PM CPX CONFERENCE CPX Conference spotlights the latest strategies of some of the biggest names in tech today, including IBM, NVIDIA, Advantech, ARM and NXP Semiconductors rtificial intelligence stepped into center stage on the second day of COMPUTEX A on Wednesday, as top executives from the world’s tech leaders shared insights into what their companies are doing to win in the world of machine intelligence technology, deep learning AI takes center stage and the internet of things. -
R.C.S. Luxembourg B-104.413
R.C.S. Luxembourg B-104.413 Audited Annual Report as at 31 January 2018 No subscription can be accepted on the basis of the financial reports. Subscriptions are only valid if they are made on the basis of the latest published prospectus accompanied by the latest annual report and the most recent semi-annual report, if published thereafter. DB Platinum Table of contents Page Management and Administration 3 Directors’ Report 5 Independent Auditor’s Report 14 Statement of Net Assets 17 Key Figures as at 31 January 2018 21 Statement of Operations and Changes in Net Assets 26 Statistics 30 Statement of Investments DB Platinum Commodity Euro 37 DB Platinum CROCI Branchen Stars 38 DB Platinum Commodity USD 40 DB Platinum CROCI World 41 DB Platinum PWM CROCI Multi Fund 45 DB Platinum CROCI Sectors Fund 46 DB Platinum CROCI Global Dividends 48 DB Platinum CROCI US Dividends 51 DB Platinum Chilton Diversified 53 DB Platinum Ivory Optimal 55 DB Platinum CROCI World ESG 57 DB Platinum Chilton European Equities 60 DB Platinum MCP Terra Grove Pan Asia 62 DB Platinum MidOcean Absolute Return Credit 63 Notes to the Financial Statements 68 Information to Shareholders (unaudited) 164 DB Platinum Management and Administration Registered Office DB Platinum 11-13, boulevard de la Foire L-1528 Luxembourg Grand-Duchy of Luxembourg Board of Directors - Alexander McKenna (chairman of the Board of Directors), Head of Product Platform Engineering, Deutsche Asset Management (UK) Limited, Winchester House, 1 Great Winchester Street, London EC2N 2DB, United Kingdom. - Freddy Brausch, Independent director, Linklaters LLP, 35, avenue John F. -
Z590 Pro4.Pdf
Version 1.0 Published February 2021 Copyright©2021 ASRock INC. All rights reserved. Copyright Notice: No part of this documentation may be reproduced, transcribed, transmitted, or translated in any language, in any form or by any means, except duplication of documentation by the purchaser for backup purpose, without written consent of ASRock Inc. Products and corporate names appearing in this documentation may or may not be registered trademarks or copyrights of their respective companies, and are used only for identification or explanation and to the owners’ benefit, without intent to infringe. Disclaimer: Specifications and information contained in this documentation are furnished for informational use only and subject to change without notice, and should not be constructed as a commitment by ASRock. ASRock assumes no responsibility for any errors or omissions that may appear in this documentation. With respect to the contents of this documentation, ASRock does not provide warranty of any kind, either expressed or implied, including but not limited to the implied warranties or conditions of merchantability or fitness for a particular purpose. In no event shall ASRock, its directors, officers, employees, or agents be liable for any indirect, special, incidental, or consequential damages (including damages for loss of profits, loss of business, loss of data, interruption of business and the like), even if ASRock has been advised of the possibility of such damages arising from any defect or error in the documentation or product. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. -
COST to COST CORRSAIR 2590 106-107, Meghdoot Building, Nehru Place TRANSCEND I-3---4290 2GB--700 4GB--1142
DUAL CORE DDR3 3.0GHZ-- COST TO COST CORRSAIR 2590 106-107, Meghdoot Building, Nehru Place TRANSCEND I-3---4290 2GB--700 4GB--1142 Rate List Date: 8/27/2011 FREE USB MOUSE (MOSERBAER) WITH ANY LED/LCD MONITOR 35 GIGABYTE / ASUS G41 2325 71 DDR2-2GB simmtronics (5 YEAR) 928 110 NVIDEA 9500GS/512/HDMI/DVI/V 2900 36 INTEL DX 58 OG SATA/USB 3 10500 72 DDR 3 KINGSTON 2GB 738 111 NVIDEA 9600/DDR3/512 HYPER 2750 CPU INTEL 37 GIGABYTE H55M-D2H 3900 73 DDR1 512MB HYNIX LAPTOP 714 112 XFX/ZOTAC 210 NVIDIA 1GB DD 1900 1 INTEL DUAL CORE 3.06 ASK 38 GIGABYTE P55-US3L 6350 74 DDR1 1GB HYNIX LAPTOP 1323 113 ATI 6870 1GB DDR5 SAPPHIRE 9800 2 INTEL (I-5 /2310) ASK 39 INTEL G43RK (OEM) 2750 75 DDR2 2GB TRANSCEND/KINGST 1100 114 ATI 5670 1GB DDR3 SAPPHIRE 3333 3 INTEL (I-5 /2500K) 9740 40 INTEL DG41 WV (BOX) 2675 76 DDR1 1GB HYNIX 976 115 5670 1GB DDR3 SAPPHIRE 3333 4 INTEL (I-5 /2500) 9190 41 INTEL H55TC (OEM) 3950 77 DDR2 1GBTRANS/KING LAPTOP 714 116 5450 1GB DDR3 SAPPHIRE 1900 5 INTEL (I-7 /2600) 13400 42 GIGABYTE X58A-USB3 (1366) 10700 78 DDR2 2GB KINGSTON LAPTOP 1200 117 NVIDEA 9300GE /512MB 1800 6 INTEL I-7/960 4 CORE 8 MB CAS 13700 43 GIGABYTE /ASUS H55M 3600 79 DDR 3 4GB TRANSCEND (1333) 1142 118 NVIDEA 9600GS 768MB (192BIT 3000 7 INTEL I-3 540/3.06GHZ 4290 44 INTEL H55TC BOX 4050 80 DDR2 2GB TRANSCEND LAPTO 1100 119 AGP ATI 9200 1200 8 INTEL CORE 2 QUAD 2.66 GHZ ASK 45 ASUS G41 COMBO 2400 81 DDR3 GSKILL 4GB 1333 1200 120 PCI-E ATI X200SE 1250 9 INTEL CORE 2 DUO 2.93 GHZ 4990 82 DDR1 512MB HYNIX 428 10 INTEL (I-5 /2400) 8240 83 4GB TWINMOS DDR3 1333 -
COMPUTEX TAIPEI 2020 Postponed Till September Delivering 5G & Netcom, Smart Solutions, Gaming and Startups
COMPUTEX TAIPEI 2020 Postponed Till September Delivering 5G & Netcom, Smart Solutions, Gaming and Startups The pandemic novel Coronavirus (COVID-19) have already infected more than 300,000 people over 167 countries at time of notification. This has severely impacted economic, trade, transportation, tourism and many industries. The Director General Mr. Enoch Du of the Taipei Computer Association (TCA) and Secretary General Mr. Walter Yeh of the Taiwan External Trade Development Council (TAITRA) as the co-organizers of COMPUTEX TAIPEI, jointly announces the postponement of original scheduled COMPUTEX TAIPEI during 2nd ~ 6th June till 28th ~ 30th September 2020 at Taipei Nangang Exhibition Center, Hall 2. The decision was made under the priority of the health and safety of all participants, as well as the exhibition outcome. In order to continuously provide services to exhibitors and buyers whilst placing the health and safety as priority, the COMPUTEX 2020 Special Edition in September will present key topics such as 5G and Netcom, Smart Solutions, Gaming and Startups (InnoVEX). According to McKinsey's latest epidemic report, the coronavirus outbreak in China and East Asia will be contained at the beginning of the second quarter, and the epidemic may also be reduced in Europe and the United States by June. The organizers of COMPUTEX TAIPEI will strengthen efforts to invite international buyers to visit Taiwan and attend COMPUTEX TAIPEI. Exhibitors who continue to support COMPUTEX TAIPEI, organizers have established the COMPUTEX online exhibition, inviting international buyers to participate in video procurement conferences, and invite domestic and overseas well-known companies to organize online product launching conferences.