PC/104 and Small Form Factors Buyer’S Guide
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FPGA 18,752 Les U
EM7N Data Sheet - 2009-02-16 EM7N - Embedded System Module s n with Pentium® III n Embedded System Module with: o i n ULP Pentium® III / 933 MHz t n ULV Celeron® / up to 650 MHz n FPGA 18,752 LEs u n Up to 512 MB DRAM, 128 MB NAND Flash l n Dual Fast Ethernet (front) n o Dual UART (front) n Graphics, 2 USB 1.1, (E)IDE, 2 CAN bus S n Individual programmable I/O functions in FPGA n Stackable with PCI-104 d e The EM7N is a complete embedded single-board Codec connection for AC'97 audio. In the same d computer for use on any carrier board in different flexible way, additional functionality such as industrial environments. The final application serial interfaces, CAN bus controllers, protocol d consists either of a stand-alone EM7N, the EM7N converters, touch controller etc. can also be with an application-specific carrier card and/or realized in the FPGA to the needs of the individual e with additional plugged PCI-104 modules. application. Before system boot-up, the FPGA is The EM7N is an ideal computing platform for embedded loaded from boot Flash. Updates of the FPGA contents b industrial PCs, offering the whole world of Windows® can be made inside the boot Flash during operation and Linux based software, e.g. for infotainment and are available after a re-boot of the system. applications. m For a first evaluation of the functions of the EM7N it It is controlled by an Ultra-Low Power Pentium® III at is strongly recommended to use the EK5N ESM™ starter E 933 MHz or an Ultra-Low Voltage Celeron® processor up kit. -
2018 Annual Report on Form 10-K
2018 ANNUAL REPORT ON FORM 10-K MARCH 2019 DEAR SHAREHOLDERS: From the industry’s first 1GHz CPU to the world’s first GPU delivering a teraflop of computing power, AMD has always stood for pushing the boundaries of what is possible. A few years ago, we made several big bets to accelerate our pace of innovation, strengthen our execution, and enable AMD to deliver a leadership portfolio of computing and graphics processors capable of increasing our share of the $75 billion high-performance computing market. In 2018, we saw those bets begin to pay off as we delivered our second straight year of greater than 20% annual revenue growth and significantly improved our gross margin and profitability from the previous year. REVENUE GROSS MARGIN % R&D INVESTMENT EXPENSE/REVENUE % $ Billions $ Billions $6.5B 38% $1.43B 34% $5.3B 34% 33% $4.3B $1.20B 23% $1.01B 31% 2016 2017 2018 2016 2017 2018 2016 2017 2018 2016 2017 2018 Added $2.2B in revenue Significantly improved gross Increased R&D by more than Significant improvement over the last 2 years margin over last 2 years based 40% over the last 2 years in OPEX leverage on new product portfolio Our newest Ryzen™, EPYC™ and datacenter GPU products contributed more than $1.2 billion of revenue in 2018 and helped us gain share across our priority markets. In 2018, we added 3.9% points of desktop processor unit share, 5.3% points of notebook processor unit share and met our goal of exiting the year with mid-single digit server processor market share. -
J7F3 Mini-ITX Motherboard Series
Mainboard Diagram J7F3 Mini-ITX Motherboard Series -SiS 741CX Northbridge + SiS 964 Southbridge Chipsets -Support Socket-462 AMD Geode NX processor -Support Front Side Bus 133MHz -Single Channel DDR2 400 Memory DIMM -Support 2 Serial ATA Devices with RAID 0, 1 -Support 2xAD Connector With Expansion Daughter-boards -Ethernet LAN Supported -AC’97 6 Channel Audio CODEC -VIA VT6307S IEEE1394a Controller for J7F3E -17 x 17CM Mini-ITX Form Factor Features and Benefits Support Socket 462 AMD Geode™ NX Processor The AMD Geode™ NX processor family gives product designers a wide range of options in low-power, high-performance processors. Based on Mobile AMD Athlon™ processor technology, AMD NX processors deliver superior computing performance for applications including thin-client, point-of-sale terminals, kiosks, high-end printers, and home media systems. AMD Geode Solutions have received new model numbers to better reflect total performance beyond just megahertz. This presentation of attributes gives designers greater understanding of the capabilities of AMD Geode Solutions. SiS 741CX Northbridge Chipset and SiS964 Southbridge Chipset The SiS741CX chipset can be combined with three different AMD Geode NX processors, including the AMD Geode™ NX 1250@6W processor*, AMD Geode™ NX 1500@6W processor** and AMD Geode™ NX 1750@14W processor***, enabling development of a wider variety of products for different market segments. The SiS741CX chipset supports the AMD Geode NX processor family, DDR266 front side bus, as well as high-speed DDR333 DRAM. Furthermore, the SiS741CX chipset incorporates SiS's revolutionary HyperStreaming™ Technology, which provides multiple divided pipelines for data, allows data to be sent concurrently, and separates data for easier memory retrieval, resulting in a remarkable reduction in latency versus traditional chipsets. -
FA143 Modulstandards
Modulstandards im Vergleich Möglichkeiten und technische Limits der verschiedenen Aufsteck-Boards 1 Seit knapp 2 Jahrzehnten sind Aufsteckmodule verfügbar, die über standardisierte Schnittstellen an ein Doch was bedeuten diese Abkürzungen, Base-Board kontaktiert werden können. Die eindeu- welche Schnittstellen verbergen sich tigen Vorteile bescheren diesen Modulen eine immer dahinter und wo haben diese Konzepte stärker wachsende Nachfrage: Geringere Entwick- Ihre Vorteile im Vergleich zu anderen? lungszeit und -kosten, Verfügbarkeit, Skalierbarkeit von Performance und Preis, die Austauschbarkeit zwischen unterschiedlichen Anbietern und die Reduzierung von Risiken durch das Verwenden von zertifizierten Modulen Nachfolgend werden die geläufigen Abkürzungen rund sind Gründe, sich für Plug-On Boards zu entscheiden. um das Thema Plug-On Modul-Lösungen und Begriffe inkl. deren Schnittstellen und deren Möglichkeiten Die Anforderungen hinsichtlich Größe, Preis, Verfüg- näher erklärt. barkeit und die rasch voranschreitenden Chip-Tech- nologien stellen die Anbieter von Systemlösungen vor Package on a Package (PoP) Herausforderungen, die jedoch durch die Verwendung von Aufsteck-Modulen sehr gut managebar sind. Sind Ein „Package on a Package“ stapelt Einzel-Packages während der Designphase Anforderungen an Perfor- in Form von kleinen bestückten Platinen vertikal über- mance, Schnittstellen, Abmessungen, aber auch z.B. einander, welche durch Ball-Grid-Arrays miteinander Temperaturbereich und Störaussendung definiert, kann verbunden werden. Sozusagen -
Iei's Amd Embedded Solution
* Issue Date: 1st June, 2006 * Design and specifications are subject to change without prior notice. IEI’S AMD EMBEDDED SOLUTION LX/GX Embedded Series Headquarters America-United States China IEI Technology Corp. IEI Technology USA Corp. Armorlink SH Corp. TEL : +886-2-86916798 FAX : +886-2-66160028 TEL : +1-562-690-6677 FAX : +1-562-690-0898 TEL : +86-21-54429000 FAX : +86-21-54429100 [email protected] www.ieiworld.com [email protected] www.usa.ieiworld.com [email protected] www.ieiworld.com.cn No. 29, Jhongsing Rd.,Sijhih City, 515 N. Puente St., Brea, CA 92821 No.515, Shenfu Road, Minhang District, Shanghai, China Taipei County, 221, Taiwan www.ieiworld.com IEI Technology Corp. www.ieiworld.com IEI’s AMD Embedded Solution Vision of AMD - IEI Alliance When IEI meets AMD... Single Board Computer Geode™ Connectivity y LX u LX800 Design Services Family EXPERT OF AMD’S FULL-LINE EMBEDDED SOLUTIONS Manufacturing Services Geode™ Customer-Centric y GX u GX466 Family ABOUT IEI ABOUT AMD Communication Partnership y A Leading Industrial Computing Solution Provider A Leading Global Provider of Innovative Microprocessor IEI Technology Corp. is a leading industrial computing platform Solutions provider. IEI follows the requirements of the RoHS Directive Advanced Micro Devices (AMD) is a leading global provider on a worldwide basis so that customers can start to work for of innovative microprocessor solutions for computing, their long-term projects. IEI supplies hundreds of industrial communications and consumer electronics markets. Founded computer boards, systems and peripherals in thousands of in 1969, AMD is dedicated to delivering superior computing customer applications and supports OEM/ODM service to solutions based on customer needs that empower users worldwide. -
AMD Geode™ NX Processors BIOS Considerations Application Note
AMD Geode™ NX Processors BIOS Considerations Application Note PID: 32483 Rev: A Issue Date: October 2004 © 2004 Advanced Micro Devices, Inc. All rights reserved. The contents of this document are provided in connection with Advanced Micro Devices, Inc. (“AMD”) products. AMD makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. No license, whether express, implied, arising by estoppel or otherwise, to any intellectual property rights is granted by this publication. Except as set forth in AMD’s Standard Terms and Conditions of Sale, AMD assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of mer- chantability, fitness for a particular purpose, or infringement of any intellectual property right. AMD’s products are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or in any other application in which the failure of AMD’s product could create a situation where personal injury, death, or severe property or environmental damage may occur. AMD reserves the right to discontinue or make changes to its products at any time without notice. Contacts www.amd.com Trademarks AMD, the AMD Arrow logo, AMD Athlon, AMD PowerNow!, and combinations thereof, and Geode are trademarks of Advanced Micro Devices, Inc. Microsoft and Windows are registered trademarks of Microsoft Corporation. -
AMD in Embedded: Proven Leadership and Solutions
AMD in Embedded: Proven Leadership and Solutions A long history of high-performance low-power solutions for embedded applications For over two decades AMD has been a leader in the embedded market: in the early 1990’s with the introduction of the Am386 and Am486 and their adoption in embedded designs, and followed in 1995 with the introduction of the Am5x86 processor. The AM5x86 processor was one of the fastest and most universally-compatible upgrade paths for users of 486 systems when it was introduced. AMD continued to expand their E86 (Embedded x86) product family in the late 90’s with the release of the Élan™SC520 microcontroller for data communications, telecommunications, and information appliance markets. The ÉlanSC520 microcontroller extended the options available to embedded systems designers by providing fifth-generation x86 performance and was designed to run both 16-bit and 32-bit software. The AMD embedded group grew significantly in early 2000 with the acquisition of Alchemy Semiconductor for its Alchemy line of MIPS processors for the hand-held and portable media player markets. In order to augment its existing line of embedded x86 processor products, AMD also purchased the AMD Geode™ business in August 2003 which was originally part of National Semiconductor. During the second quarter of 2004, AMD launched the new low- power AMD Geode™ NX processors which were based on the AMD-K7™ Thoroughbred architecture with speeds up to 1.4 GHz. These AMD Geode NX processors offered a high performance option in the AMD Geode product line that was still sufficiently low power to be designed into fan-less applications. -
Em B Ed D Ed So Lu Tio
EK01 Data Sheet - 2004-11-26 EK01 - ESM Starter Kit with s n Pentium® III n Computing module ESM EM02: o - ULP Pentium® III / 933MHz or Celeron® / i 400MHz t - 512MB SDRAM, CompactFlash slot - Graphics, Gigabit Ethernet, USB 1.1 (front) u - COM, keyboard/mouse, (E)IDE, floppy (rear) l n Carrier card EC01 (ATX-compatible format): o - 1 ESM slot, 3 PCI slots - USB 2.0, COM, IDE, floppy connector S n Accessories: - External PSU, PCI-104 adapter d e Embedded System Modules are complete computers on a controlled by an Ultra-Low Power Pentium® III with d module. A final ESM-based embedded application 933MHz or an Ultra-Low Voltage Celeron® Processor with consists either of a stand-alone ESM (the power supply 400MHz. It provides 16KB L1 and 512KB/256KB L2 cache. d connection being sufficient to operate the module), an The EM02 uses the Intel® 815G chip set, including ESM with an application-specific carrier card and/or graphics. It provides one VGA connector, one USB 1.1 e an ESM with additionally plugged PCI-104 modules. connector Type A and one Gigabit Ethernet interface at The EK01 is a ready-to-use starter kit that allows the front panel. It also provides 512MB of DRAM and a b evaluation of the functions of the EM02 Embedded CompactFlash slot on board. As an alternative to System Module. The kit consists of the standard CPU onboard USB, legacy I/O is routed to the carrier board module, DRAM memory, the carrier card with I/O via the J2 system connector of the EM02. -
AMD Geode™ GX Processor/CS5535 Companion Device Geoderom Porting Guide © 2006 Advanced Micro Devices, Inc
AMD Geode™ GX Processor/ CS5535 Companion Device GeodeROM Porting Guide April 2006 Publication ID: 32430C AMD Geode™ GX Processor/CS5535 Companion Device GeodeROM Porting Guide © 2006 Advanced Micro Devices, Inc. All rights reserved. The contents of this document are provided in connection with Advanced Micro Devices, Inc. (“AMD”) products. AMD makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. No license, whether express, implied, arising by estoppel or otherwise, to any intellectual property rights is granted by this publication. Except as set forth in AMD’s Standard Terms and Conditions of Sale, AMD assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of mer- chantability, fitness for a particular purpose, or infringement of any intellectual property right. AMD’s products are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or in any other application in which the failure of AMD’s product could create a situation where personal injury, death, or severe property or environmental damage may occur. AMD reserves the right to discontinue or make changes to its products at any time without notice. Trademarks AMD, the AMD Arrow logo, and combinations thereof, and Geode, GeodeLink, Virtual System Architecture, and XpressGRAPHICS are trademarks of Advanced Micro Devices, Inc. -
Industrial Embedded Systems
RSC #2 @ www.industrial-embedded.com/rsc RSC #3 @ www.industrial-embedded.com/rsc www.industrial-embedded.com VOLUME 1 • NUMBER 1 OCTOBER 20 05 COMPUTING COLUMNS TECHNOLOGY 7 Foreword Thinking 48 Modern interfaces in light of embedded computer integration A fresh start to getting things done By Andreas Geh, DIGITAL-LOGIC AG By Don Dingee 54 Embedded compute models help contain costs 8 Industrial Europe By Ernest Godsey, MEN Micro Q & A with Ulrich Gerhmann, CEO, and Norbert Hauser, 57 Product Profiles VP of Marketing, Kontron EMEA HUMAN INTERFACE By Stefan Baginski TECHNOLOGY 10 Market Pulse 80 Converging functionality in embedded industrial control IEEE 802.15.4 and ZigBee By Melissa Jones, Ultimodule By Bonnie Crutcher 84 Using software-configurable processors in biometric 98 The Final Word applications It’s all about choices By Philip Weaver, Stretch, and Fred Palma, A4 Vision By Jerry Gipper 87 Product Profiles SENSORS/CONTROL FEATURES TECHNOLOGY NETWORKING 88 Combining a hardware neural network with a powerful SPECIAL: Standards automotive MCU for powertrain applications 16 Opening gates with TCP-to-CANopen By Dr. Paul Neil, Axeon By Holger Zeltwanger, CAN in Automation APPLICATION 20 Performance, implementation, and applications of 90 Open architecture PAC technology drives undersea remotely Ethernet Powerlink operated vehicles By Frank Foerster and Bill Seitz, IXXAT By Chris Ward, C&M Group TECHNOLOGY 91 Product Profiles 12 Ultra-wideband communication for low-power wireless STORAGE body area networks TECHNOLOGY By Bart Van Poucke -
The Next Major Advance in Chip-Level Design Productivity
The Next Major Advance in Chip-Level Synopsys EDA Interoperability Developers’ Forum Design Productivity Santa Clara, CA st [email protected] October 21 , 2004 The Next Major Advance in Chip-Level Design Productivity A. Richard Newton University of California, Berkeley Synopsys EDA Interoperability Developers’ Forum Santa Clara, CA October 21st, 2004 Fundamental Drivers of Future Chip Designs (1) (2) (3) (4) Silicon Scaling Rising Design Growing Complexity Increased System Requires Concurrency Drives Drives Chip Cost Drives Software-Based Multiple Processor Capacity Programmability Solutions Architectures SoC Becomes A “Sea Of Processors” SoC Programmable Software-Centric Sea-of-Processors Platforms Design Design Source: Chris Rowen, Tensilica Page 1 The Next Major Advance in Chip-Level Synopsys EDA Interoperability Developers’ Forum Design Productivity Santa Clara, CA st [email protected] October 21 , 2004 Key Points The future mainstream building-block of electronic system-level design will present a (configurable) clocked synchronous Von Neumann programmer’s model to the system-level application developer (ASIP or TSP) The majority of large silicon systems will consist of many such processors, connected in an asynchronous network These processors may be integrated on a single chip (CMP) and/or as a (possibly very large) collection of chips These conclusions lead to a number of critical design-technology research challenges and new business opportunities Fundamental Drivers of Future Chip Designs (1) (2) Silicon Scaling -
ADVANCED MICRO DEVICES, INC. (Exact Name of Registrant As Specified in Its Charter)
UNITED STATES SECURITIES AND EXCHANGE COMMISSION Washington, D.C. 20549 FORM 8-K CURRENT REPORT Pursuant to Section 13 or 15(d) of the Securities Exchange Act of 1934 July 20, 2006 Date of Report (Date of earliest event reported) ADVANCED MICRO DEVICES, INC. (Exact name of registrant as specified in its charter) Delaware 001-07882 94-1692300 (State of Incorporation) (Commission File Number) (IRS Employer Identification Number) One AMD Place P.O. Box 3453 Sunnyvale, California 94088-3453 (Address of principal executive offices) (Zip Code) (408) 749-4000 (Registrant’s telephone number, including area code) N/A (Former Name or Former Address, if Changed Since Last Report) Check the appropriate box below if the Form 8-K filing is intended to simultaneously satisfy the filing obligation of the registrant under any of the following provisions: ¨ Written communications pursuant to Rule 425 under the Securities Act (17 CFR 230.425) ¨ Soliciting material pursuant to Rule 14a-12 under the Exchange Act (17 CFR 240.14a-12) ¨ Pre-commencement communications pursuant to Rule 14d-2(b) under the Exchange Act (17 CFR 240.14d-2(b)) ¨ Pre-commencement communications pursuant to Rule 13e-4(c) under the Exchange Act (17 CFR 240.13e-4(c)) Item 2.02. Results of Operations and Financial Condition Item 7.01. Regulation FD Disclosure The information in this Report, including the Exhibit 99.1 attached hereto, is furnished pursuant to Item 2.02 and Item 7.01 of this Form 8-K. Consequently, it is not deemed “filed” for the purposes of Section 18 of the Securities and Exchange Act of 1934, or otherwise subject to the liabilities of that section.