Comparison of AMD Chipsets
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2004 Gamers' Hardware Upgrade Guide
Ace’s Hardware 2004 Gamers’ Hardware Upgrade Guide 2004 Gamers’ Hardware Upgrade Guide By Johan De Gelas – January 2004 Introduction Last week, we showed you a preview of the Athlon 64 3400+. Today, we'll investigate this new CPU as an upgrade to an existing system. How much performance do you gain when upgrading? What about the other features aside from performance, such as Cool'n'Quiet and more thermal and mechanical safety? As always, we start with a base system to be upgraded. This time around, our base system is equipped with an Athlon XP 2100+, as previous polls among our readers show that the faster versions of the Athlon XP "Palomino" were very popular in the early days of 2003. Now in 2004, Palomino is getting a little long in the tooth, so it's interesting to know whether or not an upgrade may be worthwhile. Our old system also contains a GeForce Ti 4200 and 512 MB of DDR266 (PC2100) memory. We will upgrade the CPU (to the Athlon 4 3400+) and memory (to DDR400 CAS 2) and compare that upgrade with one that simply upgrades the video card. As mentioned previously, we've done this before in many of our Gamer's Upgrade Guides. However, the gaming industry is not sitting still, and we are moving from hybrid DirectX 7/8 games to DirectX 8/9 games, which - as you will see - behave quite differently. The games you'll see tested in detail today are Halo 1.03, Return to Castle Wolfenstein: Enemy Territory, and X²- The Threat. -
GPTPU: Accelerating Applications Using Edge Tensor Processing Units Kuan-Chieh Hsu and Hung-Wei Tseng University of California, Riverside {Khsu037, Htseng}@Ucr.Edu
GPTPU: Accelerating Applications using Edge Tensor Processing Units Kuan-Chieh Hsu and Hung-Wei Tseng University of California, Riverside {khsu037, htseng}@ucr.edu This paper is a pre-print of a paper in the 2021 SC, the Interna- Two decades ago, graphics processing units (GPUs) were just tional Conference for High Performance Computing, Networking, domain-specific accelerators used for shading and rendering. But Storage and Analysis. Please refer to the conference proceedings intensive research into high-performance algorithms, architectures, for the most complete version. systems, and compilers [3–12] and the availability of frameworks like CUDA [13] and OpenCL [14], have revolutionized GPUs and ABSTRACT transformed them into high-performance, general-purpose vector Neural network (NN) accelerators have been integrated into a wide- processors. We expect a similar revolution to take place with NN spectrum of computer systems to accommodate the rapidly growing accelerators—a revolution that will create general-purpose matrix demands for artificial intelligence (AI) and machine learning (ML) processors for a broader spectrum of applications. However, de- applications. NN accelerators share the idea of providing native mocratizing these NN accelerators for non-AI/ML workloads will hardware support for operations on multidimensional tensor data. require the system framework and the programmer to tackle the Therefore, NN accelerators are theoretically tensor processors that following issues: can improve system performance for any problem that uses ten- (1) The microarchitectures and instructions of NN accelerators sors as inputs/outputs. Unfortunately, commercially available NN are optimized for NN workloads, instead of general matrix/tensor accelerators only expose computation capabilities through AI/ML- algebra. -
Thermal Interface Material Comparison: Thermal Pads Vs
Thermal Interface Material Comparison: Thermal Pads vs. Thermal Grease Publication # 26951 Revision: 3.00 Issue Date: April 2004 © 2004 Advanced Micro Devices, Inc. All rights reserved. The contents of this document are provided in connection with Advanced Micro Devices, Inc. (“AMD”) products. AMD makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. No license, whether express, implied, arising by estoppel, or otherwise, to any intellectual property rights are granted by this publication. Except as set forth in AMD’s Standard Terms and Conditions of Sale, AMD assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. AMD’s products are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or in any other application in which the failure of AMD’s product could create a situation where personal injury, death, or severe property or environmental damage may occur. AMD reserves the right to discontinue or make changes to its products at any time without notice. Trademarks AMD, the AMD Arrow logo, AMD Athlon, AMD Duron, AMD Opteron and combinations thereof, are trademarks of Advanced Micro Devices, Inc. Other product names used in this publication are for identification purposes only and may be trademarks of their respective companies. -
Amd Filed: February 24, 2009 (Period: December 27, 2008)
FORM 10-K ADVANCED MICRO DEVICES INC - amd Filed: February 24, 2009 (period: December 27, 2008) Annual report which provides a comprehensive overview of the company for the past year Table of Contents 10-K - FORM 10-K PART I ITEM 1. 1 PART I ITEM 1. BUSINESS ITEM 1A. RISK FACTORS ITEM 1B. UNRESOLVED STAFF COMMENTS ITEM 2. PROPERTIES ITEM 3. LEGAL PROCEEDINGS ITEM 4. SUBMISSION OF MATTERS TO A VOTE OF SECURITY HOLDERS PART II ITEM 5. MARKET FOR REGISTRANT S COMMON EQUITY, RELATED STOCKHOLDER MATTERS AND ISSUER PURCHASES OF EQUITY SECURITIES ITEM 6. SELECTED FINANCIAL DATA ITEM 7. MANAGEMENT S DISCUSSION AND ANALYSIS OF FINANCIAL CONDITION AND RESULTS OF OPERATIONS ITEM 7A. QUANTITATIVE AND QUALITATIVE DISCLOSURE ABOUT MARKET RISK ITEM 8. FINANCIAL STATEMENTS AND SUPPLEMENTARY DATA ITEM 9. CHANGES IN AND DISAGREEMENTS WITH ACCOUNTANTS ON ACCOUNTING AND FINANCIAL DISCLOSURE ITEM 9A. CONTROLS AND PROCEDURES ITEM 9B. OTHER INFORMATION PART III ITEM 10. DIRECTORS, EXECUTIVE OFFICERS AND CORPORATE GOVERNANCE ITEM 11. EXECUTIVE COMPENSATION ITEM 12. SECURITY OWNERSHIP OF CERTAIN BENEFICIAL OWNERS AND MANAGEMENT AND RELATED STOCKHOLDER MATTERS ITEM 13. CERTAIN RELATIONSHIPS AND RELATED TRANSACTIONS AND DIRECTOR INDEPENDENCE ITEM 14. PRINCIPAL ACCOUNTANT FEES AND SERVICES PART IV ITEM 15. EXHIBITS, FINANCIAL STATEMENT SCHEDULES SIGNATURES EX-10.5(A) (OUTSIDE DIRECTOR EQUITY COMPENSATION POLICY) EX-10.19 (SEPARATION AGREEMENT AND GENERAL RELEASE) EX-21 (LIST OF AMD SUBSIDIARIES) EX-23.A (CONSENT OF ERNST YOUNG LLP - ADVANCED MICRO DEVICES) EX-23.B -
2021 User Guide
i Pro Fortran Linux Absoft Pro Fortran User Guide Absoft Fortran Linux Fortran User Guide 5119 Highland Road, PMB 398 Waterford, MI 48327 U.S.A. Tel (248) 220-1190 Fax (248) 220-1194 [email protected] All rights reserved. No part of this publication may be reproduced or used in any form by any means, without the prior written permission of Absoft Corporation. THE INFORMATION CONTAINED IN THIS PUBLICATION IS BELIEVED TO BE ACCURATE AND RELIABLE. HOWEVER, ABSOFT CORPORATION MAKES NO REPRESENTATION OF WARRANTIES WITH RESPECT TO THE PROGRAM MATERIAL DESCRIBED HEREIN AND SPECIFICALLY DISCLAIMS ANY IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE. FURTHER, ABSOFT RESERVES THE RIGHT TO REVISE THE PROGRAM MATERIAL AND MAKE CHANGES THEREIN FROM TIME TO TIME WITHOUT OBLIGATION TO NOTIFY THE PURCHASER OF THE REVISION OR CHANGES. IN NO EVENT SHALL ABSOFT BE LIABLE FOR ANY INCIDENTAL, INDIRECT, SPECIAL OR CONSEQUENTIAL DAMAGES ARISING OUT OF THE PURCHASER'S USE OF THE PROGRAM MATERIAL. U.S. GOVERNMENT RESTRICTED RIGHTS — The software and documentation are provided with RESTRICTED RIGHTS. Use, duplication, or disclosure by the Government is subject to restrictions set forth in subparagraph (c) (1) (ii) of the Rights in Technical Data and Computer Software clause at 252.227-7013. The contractor is Absoft Corporation, 2111 Cass Lake Rd. Ste 102, Keego Harbor, Michigan 48320. ABSOFT CORPORATION AND ITS LICENSOR(S) MAKE NO WARRANTIES, EXPRESS OR IMPLIED, INCLUDING WITHOUT LIMITATION THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE, REGARDING THE SOFTWARE. ABSOFT AND ITS LICENSOR(S) DO NOT WARRANT, GUARANTEE OR MAKE ANY REPRESENTATIONS REGARDING THE USE OR THE RESULTS OF THE USE OF THE SOFTWARE IN TERMS OF ITS CORRECTNESS, ACCURACY, RELIABILITY, CURRENTNESS, OR OTHERWISE. -
User's Manual User's Manual
User’s Manual (English Edition) Intel Pentium 4 Socket 478 CPU AMD Athlon/ Duron/Athlon XP Socket 462 CPU AMD Athlon 64 Socket 754 CPU ZM-WB2 Gold * Please read before installation http://www.zalman.co.kr http://www.zalmanusa.com 1. Features 1) Gold plated pure copper base maximizes cooling performance and prevents CPU blocks from galvanic corrosion 2) Intel Pentium 4 (Socket 478), AMD Athlon/Duron/Athlon XP (Socket 462),Athlon 64 (Socket 754) compatible design for broad compatibility. 3) Three types of compression fitting are offered for use with water tubes (8X10mm,8X11mm,10X13mm) * Zalman Tech. Co., Ltd. is not responsible for any damage resulting from CPU OVERCLOCKING. 2. Specifications Part No Part name Q’ ty Weight (g) Use 1 CPU block 1 447.0 CPU mountimg 2 Hand screw 2 8.0 Clip mountimg 3 Thermal grease 1 1.8 Apply to cpu core 4 Clip 1 9.6 CPU block mountimg 5 User’s manual 1 6 Clip supports 2 8.2 Socket 478 7 Clip supports A 2 5.0 Socket 462 8 Clip supports B 2 5.0 Socket 462 9 Bolts 4 0.8 Clip supports, A, B-type 10 Paper washer 1 set 7, 8 mountimg 11 Nipple 2 6.2 Socket 754 mountimg 12 Back plate 60.0 Socket 754 mountimg Fitting to 13 Fitting 3 set 8 x 10mm, 8 x 11mm, 10 x 13mm tubes NOTE 1) The maximum weight for the cooler is specified as 450g/450g/300g for socket 478/754/462 respectively. Special care should be taken when moving a computer equipped with a cooler which exceeds the relevant weight limit. -
System Management BIOS (SMBIOS) Reference 6 Specification
1 2 Document Number: DSP0134 3 Date: 2011-01-26 4 Version: 2.7.1 5 System Management BIOS (SMBIOS) Reference 6 Specification 7 Document Type: Specification 8 Document Status: DMTF Standard 9 Document Language: en-US 10 System Management BIOS (SMBIOS) Reference Specification DSP0134 11 Copyright Notice 12 Copyright © 2000, 2002, 2004–2011 Distributed Management Task Force, Inc. (DMTF). All rights 13 reserved. 14 DMTF is a not-for-profit association of industry members dedicated to promoting enterprise and systems 15 management and interoperability. Members and non-members may reproduce DMTF specifications and 16 documents, provided that correct attribution is given. As DMTF specifications may be revised from time to 17 time, the particular version and release date should always be noted. 18 Implementation of certain elements of this standard or proposed standard may be subject to third party 19 patent rights, including provisional patent rights (herein "patent rights"). DMTF makes no representations 20 to users of the standard as to the existence of such rights, and is not responsible to recognize, disclose, 21 or identify any or all such third party patent right, owners or claimants, nor for any incomplete or 22 inaccurate identification or disclosure of such rights, owners or claimants. DMTF shall have no liability to 23 any party, in any manner or circumstance, under any legal theory whatsoever, for failure to recognize, 24 disclose, or identify any such third party patent rights, or for such party’s reliance on the standard or 25 incorporation -
Quad-Core Catamount and R&D in Multi-Core Lightweight Kernels
Quad-core Catamount and R&D in Multi-core Lightweight Kernels Salishan Conference on High-Speed Computing Gleneden Beach, Oregon April 21-24, 2008 Kevin Pedretti Senior Member of Technical Staff Scalable System Software, Dept. 1423 [email protected] SAND Number: 2008-1725A Sandia is a multiprogram laboratory operated by Sandia Corporation, a Lockheed Martin Company, for the United States Department of Energy's National Nuclear Security Administration under contract DE-AC04-94AL85000. Outline • Introduction • Quad-core Catamount LWK results • Open-source LWK • Research directions • Conclusion Going on Four Decades of UNIX Operating System = Collection of software and APIs Users care about environment, not implementation details LWK is about getting details right for scalability LWK Overview Basic Architecture Memory Management … … Policy n 1 n N tio tio Page 3 Page 3 Maker ca ca i l Libc.a Libc.a (PCT) pp ppli Page 2 Page 2 A libmpi.a A libmpi.a Page 1 Page 1 Policy Enforcer/HAL (QK) Page 0 Page 0 Privileged Hardware Physical Application Memory Virtual • POSIX-like environment Memory • Inverted resource management • Very low noise OS noise/jitter • Straight-forward network stack (e.g., no pinning) • Simplicity leads to reliability Nov 2007 Top500 Top 10 System Lightweight Kernel Compute Processors: Timeline 82% run a LWK 1990 – Sandia/UNM OS (SUNMOS), nCube-2 1991 – Linux 0.02 1993 – SUNMOS ported to Intel Paragon (1800 nodes) 1993 – SUNMOS experience used to design Puma First implementation of Portals communication architecture 1994 -
Thermal and Electrical Specification of AMD Semprontm Processors
Thermal and Electrical Specification of AMD SempronTM Processors Thermal and Electrical Specification of AMD SempronTM Processors 27 September 2004 Page 1/5 Thermal and Electrical Specification of AMD SempronTM Processors ©2004 Advanced Micro Devices Inc. All rights reserved. The contents of this document are provided in connection with Advanced Micro Devices, Inc. (“AMD”) products and are for information purposes only. AMD makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. No license, whether express, implied, arising by estoppels or otherwise, to any intellectual property rights are granted by this publication. Except as set forth in AMD’s Standard Terms and Conditions of Sale, AMD assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. AMD MAKES NO REPRESENTATIONS OR WARRANTIES WITH RESPECT TO THE CONTENTS HEREOF AND ASSUMES NO RESPONSIBILITY FOR ANY INACCURACIES, ERRORS OR OMISSIONS THAT MAY APPEAR IN THIS INFORMATION. AMD SPECIFICALLY DISCLAIMS ANY IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE. IN NO EVENT WILL AMD BE LIABLE TO ANY PERSON FOR ANY DIRECT, INDIRECT, SPECIAL OR OTHER CONSEQUENTIAL DAMAGES ARISING FROM THE USE OF ANY INFORMATION CONTAINED HEREIN OR FOR THE PERFORMANCE OR OPERATION OF ANY PERSON’S SYSTEM, INCLUDING, WITHOUT LIMITATION, ANY LOST PROFITS, BUSINESS INTERRUPTION, DAMAGE TO OR DESTRUCTION OF PROPERTY, OR LOSS OF PROGRAMS OR OTHER DATA, EVEN IF AMD IS EXPRESSLY ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. -
PCSA Oct 2001
Understanding CPU Upgrades In theory, one way to t seems that every time a new software product is released the system require- ments are increased - everything from the hard drive capacity and CPU speed increase the performance of a Ito the required RAM. One of the apparently obvious ways to gain a speed PC with little effort is to increase is by upgrading the CPU. But such an upgrade isn’t always cost effective and in some cases simply increasing the available RAM can help considerably to upgrade the CPU. Surely it boost the apparent speed of the PC. Sometimes though the best (and maybe only) option is to upgrade the CPU, although this can be a more involved process than it can’t be that difficult? might at first seem due to socket/motherboard incompatibilities, differing CPU and Actually there’s lots to think RAM speed requirements, cooling problems and inevitably assorted knock-on effects causing the upgrade to be anything but cost effective. Also, it is worth about. remembering that just because the replacement CPU has, for example, double the clock rate of the old unit doesn’t necessarily mean that the new one will increase the By Phil Morris processing performance of the PC in question by anything like 100%. Technical Writer This article looks at some of the options for upgrading the CPUs in existing systems. It is extremely unlikely that recent processors like AMD’s Duron (and forthcoming Hammer) and Intel’s Pentium 4 and Itanium will require upgrading for some time, so I will omit those in the context of this article. -
Amd Athlon Ii X2 270 Manual
Amd Athlon Ii X2 270 Manual Specifications. Please visit AMD Athlon II X2 215 (rev. C3) and AMD Athlon II X2 270 pages for more detailed specifications. Review, Differences, Benchmarks, Specifications, Comments Athlon II X2 270. CPUBoss recommends the AMD Athlon II X2 270 based on its. See full details. Specifications. Please visit AMD Athlon II X2 270 and AMD Athlon II X2 280 pages for more detailed specifications of both. Far Cry 4 on AMD Athlon x2 340(Dual Core) 4GB RAM HD 6570 PC Specifications. Specifications. Please visit AMD Athlon II X2 270 and AMD FX-6300 pages for more detailed specifications of both. AMD Athlon II x2 260 (3.2GHz) Although the specifications of this cpu list 74C as the max temp, i prefer to stick to the old "65C max" rule-of-thumb for amd cpus. Amd Athlon Ii X2 270 Manual Read/Download AMD Athlon II X2 270u. 2 GHz, Dual core. Front view of AMD Athlon II X2 270u. 5.9 Out of 10. VS Review, Differences, Benchmarks, Specifications, Comments. Photos of the AMD Athlon II X2 270 Black Edition from the KitGuru Price Comparison Engine. Specifications. Please visit AMD Athlon II X2 270 and AMD FX-4300 pages for more detailed specifications of both. SPECIFICATIONS : Model : AMD Athlon II X2 270. CPU Clock Speed : 3.4 GHz. Core : 2. Total L2 Cache : 2 MB Sockets : Socket AM2+,Socket AM3 Supported. up vote -5 down vote favorite. These are my specifications: AMD Athlon II x2 270 CPU, AMD 760g GPU, 4GB RAM. grand-theft-auto-5. -
AMD Multi-Core Processors Providing Multiple Benefits for the Future
hard hat area | white paper AMD Multi-Core Processors Providing Multiple Benefits For The Future y now you probably have heard of variations this year. In 2007 the chipmakers (page 50). This month, we’ll focus on what dual- and multi-core processors. expect to introduce several multi-core AMD has planned for 2006 and beyond. B Both AMD and Intel released chips, beginning with quad-core offerings. dual-core chips in 2005, and both have We discussed Intel’s multi-core proces- Dual-Core Chips plans to release dozens more dual-core chip sors in the January 2006 issue of CPU In April 2005, AMD released its first dual-core chip aimed at the server and workstation market, the Opteron proces- Direct Connect Architecture vs. sor. There are several Opteron dual-core Legacy Systems 90nm processors ranging in clock speeds from 1.6GHz to 2.4GHz. Direct Connect Architecture lives up to its name by providing a for the past few years in its single-core chips. direct connection between the processor, the memory But now AMD has extended the use of Direct Connect Architecture to controller, and the I/O area to improve overall system connect the cores on a dual- or multi-core chip die and to connect each performance. AMD has used Direct Connect Architecture core to its memory controller. ▲ With multi-core architecture, each core on the chip has its own memory con- When using a dual-processor x86 legacy architecture, troller, which significantly improves memory performance. Using Direct Connect however, two processors then have to share the same Architecture to make a connection with the memory controller eliminates most memory control hub, which creates bottlenecks in data bottlenecks and makes multitasking easier.