matched Thermal Coefficient of Expansion (TCE) materials, • Thin film deposition, e.g. for micro manufacturing of while producing extremely flat/distortion free components. thin membranes, or conducting layers • Various bonding technologies also possible with • Glass-Glass • Silicon-Metal other materials • Glass-Silicon • Glass-Oxide (SiNOx) • Silicon-Silicon • Glass-Metal Applications • Electronic packaging (encapsulation of chips) • Shadow masks for structured coatings • Flow sensors • Temperature sensors Micro Gear • Sensor housing MEMS & Microsystems Fabrication Optilux Fluidic Lens • Inkjet print heads Flowcell Close-up Sensors and Electronics Semiconductor Applications Embedding Fluids – Fluidic Lens Invenios develops and produces different components for Broad Scope Invenios offers a novel Ambient Temperature Bonding (ABT) Invenios has immense multifaceted expertise in high volume sensorial and electronic applications using a special etch- custom semiconductor packaging design and sub compo- process that allows the encapsulation of inorganic, organic, ® With complete foundry services, we serve a broad range ing technology. We primarily use Foturan glass for these nent design. Our capabilities include: of micro manufacturing applications where extremely close or biological fluids inside complex microfluidic devices. The products, but have experience and access to many other microchip tolerances, greatly reduced cost-of-packaging, applications of this process makes possible: glass types. Together we will work out an individual solution • Design and fabrication of high volume precision and compressed time-to-market are paramount. Vertically • Creation of fluidic lenses on wafer level corresponding with your specific requirements in functional- substrates for IC, LED & photonic device packaging integrated from raw materials to finished products with all ity and design. Do you have a special request? • Encapsulation of biological cells inside hermetically • Custom wafer scale interposers for 3D packaging production processing in-house, Invenios provides a com- sealed and controlled cavities for further testing provide improved density, while addressing electrical plete array of products, process technologies, and services What advantages does glass offer for sensors and electronics? and thermal constraints that enable cost effective next generation integrated nano/ • Production of extremely flat substrates (since • Excellent temperature stability micro-systems. there is no heat warp propagation) • Custom, high volume, active thermal management • High electrical isolation solutions • Bonding lines as thin as 1 micron Expertise • High chemical stability • IC, LED, photonic package designers can significantly • Bonding in and around electronic packages We are particularly skillful at producing micro-fabricated Technological abilities improve electrical, thermal and optical performance components that require extremely precise details in glass • Adding electrical vias during the bonding process using our design, materials processing and custom • Generating various structures in glass e.g. holes and glass-ceramic substrates. Our capabilities include 2D and equipment development capabilities Hermetic sealed lenses fabricated at the wafer scale using 3D structuring, bonding a range of substrates at room tem- and meanders Liquid Lens Technology will solve many of the image quality perature, integrating electrical leads and encapsulating fluids problems caused by the shrinking of cameras into smart- in micro-fabricated parts. phone form factors. Supports Auto-Focus and OIS in both picture and video modes: Microreactors • Specifically designed to compensate handshake in the 0.1Hz~10Hz range Microreaction technology is an • Silent innovative alternative to the large- scale production in the chemical • Focus range supports from 1 cm to infinity industry. Glass is an excellent • Easy to integrate material for components in micro-reaction technology Glass-to-Glass ABT Bonding Ultra-Precision Machining because of its unique properties and advantages: Left: T-Mixer, Right: Split and Recombine Reactor Ambient Temperature Bonding Glass Press Molding Ambient Temperature Bonding (ATB), our newest innovation, Technical Advantages: Because of: Invenios has recently expanded its capability to include ultra- provides a unique and unparalleled method to bond several precision machining and glass press molding. The equipment materials, such as glass-to-glass, glass-to-silicon, and glass- • Good control of chemical reactions • Individual channel designs is capable of micro-milling and micro-grinding with nano- to-metal, without the use of adhesives or high temperatures. • Efficient heat exchange • Excellent surface/volume ratio meter scale accuracy. It is ideally suited to generate mold With ATB the temperature of the bulk substrate does not masters for hot-embossing sub-micron structures in glass • Excellent for analysis purposes • Optically transparent material increase even one degree Celsius above room temperature. wafers. This process allows for sub-10 nanometer RA surface • Usable under high pressure • High mechanical stability With this patent pending method, the Invenios group finish on 3D parts, including MEMS/micro fluidic components enables customers to embed fluids, bio-coatings, and living • Usable for aggressive and hazardous chemicals • High chemical resistance and glass micro optics. The 5-axis machine can shape many cells in transparent cavities of custom manufactured chips. • Usable in wide temperature range • High temperature resistance substrates including glass, silicon, quartz, sapphire, steel or It is also possible to bond materials with matched or miss- other metal composites. We offer special glasses: Foturan, Borofloat, B270
Invenios is an enterprise specializing in the manufacture of products made of glass for microtechnological applications. Invenios combines the innovative A Technology Platform for Micro Innovation knowledge of the fast-growing field of microtechnology with the experience of the traditional glass technology.
Glass offers a large variety of possibilities. Due to its outstanding properties glass plays an important role in microtechnology. Invenios offers you not only components and complete system solutions but also various special glasses in INVENIOS designs, develops, and manufactures standard and individual sizes. microfluidics, MEMS, and 3D microstructures. The FOTURAN: photostructurable glass, company also engineers exclusive processes and BOROFLOAT, PYREX: silicon bondable glasses, custom production equipment that is required B270: colourless, high-transmission crownglass, to manufacture this range of products. Invenios has AF45, D263: borosilicate glasses, thin glasses a fully capable microfluidics/MEMS foundry that offers high performance, cost effective solutions for Wafers both established and emerging companies. Unlike Standard sizes: 3 in / 75 mm; 4 in / 100 mm; 5 in / 125 mm; 6in / 150 mm; traditional microsystems foundries, Invenios delivers 8 in / 200mm a complete production cycle, which includes design Squared Substrates review, process development, manufacturing, and Standard sizes: 50x50 mm², 100x100 mm²,125 x 125 mm², 150x150 mm²; testing within an ISO 9001 environment to support a Services broad range of micron and sub-micron level products.
Invenios offers comprehensive services in the field of microsystems technology. Using glass based materials we develop and manufacture individualized Invenios Europe GmbH solutions for our customers. With know-how and creativity, we help you on your way to an optimal product: from design idea to the prototype to Ampèrestr. 7-11 mass production. 63225 Langen (Hessen)
With our technologies we can support you in the following areas: Germany • Design of micro fluidic components +49 6103 200 15 20 | Tel • Manufacturing of e-beam and metal masks for exposure of photo sensitive materials (e.g. Foturan®, photo resists) +49 6103 200 15 22 | Fax • Manufacturing of customized products with micro structures Web site: www.invenios.com out of glass Email: [email protected] • Metallization of glass and other surfaces • Hydrophobization und hydrophilization of surfaces • Thermal diffusion bonding of glass with glass or other materials Invenios • Grinding and polishing of glass and ceramic surfaces 320 North Nopal Street
• Cutting of micro structured chips with a wafer saw Santa Barbara, CA 93103
USA
+1.805.962.3333 | Tel
+1.805.962.3334 | Fax
Web site: www.invenios.com
Email: [email protected] Clean Room Processing Quality Control Inspection