Processor list for android

Continue List of qualcomm Snapdragon chips, qualcomm SnapdragonGeneral informationLaunched2007; 13 Years Ago (2007)Developed By The Project of Qualifier and ClassificationAcction Mobile SoC and 2-in-1 PCMicroarchitectureARM11, Cortex-A5, Cortex-A77, Cortex-A55, Cortex-A57, Cortex-A57, Cortex- A72, Cortex-A75, Cortex-A75, Cortex-A75, Cortex-A75, Cortex-A76, Cortex-A75, Cortex-A75, Cortex-A75, Cortex-A75, Cortex-A75, Cortex-A77, Scorpion, Krait, KryoInstruction setARMv6, ARMv7-A, ARMv8-APhysical specificationsCores1, 2, 4, 6, or 8 This Snapdragon list is a family of mobile systems on a chip (SoC) made by qualcomm for use in smartphones, tablets, laptops, PC 2-in-1, smart watches and smart devices. Snapdragon S1 Model Number Fab ProcessorA GPU DSP Memory Technology Modem Connection Availability Selection MSM7225 1 65 Nm 1 Core to 528 MHz ARM11 (ARMv6): 16K-16K L1, No L2 Software provides 2D support (HVGA) hexagonal DRSP5 320 MHz Up to 5 MP camera LPDDR Single Channel 166 MHz (1.33 GB/s) UMTS (HSPA); GSM (GPRS, EDGE) Bluetooth 2.0/2.1 (external BTS4025); 802.11b/g/n (external WCN1314); gpsOne Gen 7; USB 2.0 2007 MSM7625 (1× Rev. A, 1×EV-DO Rev. A); UMTS; GSM MSM7227- 1 core to 800 MHz ARM11 (ARMv6): 16K-16K L1, 256K L2 Adreno 200 226 MHz (FWVGA) Up to 8MP Camera LPDDR Single-Channel 166 MHz (1.33 GB/s) GSM Bluetooth 2.0/2.1 (external BTS4025); 802.11b/g/n (external WCN1312); gpsOne Gen 7; USB 2.0 2008 MSM7627 GSM MSM7225A 45 Nm 1 core to 800 MHz Cortex-A5 (ARMv7): 32K-32K L1, 256K L2 Adreno 200 245 MHz (HVGA) Hexagonal SDSP5 350 MHz Up 5MP Camera LPDDR Single Channel 200 MHz (1.6 GB/s) UMTS (HSDPA, HSUPA, W-CDMA), MBMS; GSM Bluetooth 4.0 (external WCN2243); 802.11b/g/n (external AR6003/5, WCN1314); gpsOne Gen 7; USB 2.0 No4 2011 MSM7625A (1×RTT, 1×EV-DO Rel.0/Rev.A/Rev.B, 1×EV-DO MC Rev.A); UMTS, MMMS; GSM MSM7227A 1 core to 1 GHz Cortex-A5 (ARMv7): 32K-32K L1, 256K L2 Adreno 200 245 MHz (FWVGA) Up to 8 MP cameras UMTS, MBMS; GSM MSM7627A-1 CDMA2000/UMTS, MBMS; GSM MSM7225AB 1 x 2 x 3 MTH: up to 7.2 Mbps, MBMS; GSM SD8250 65 Nm 1 Core to 1 GHz Scorpio (ARMv7): 32K-32K L1, 256K L2 Adreno 200 226 MHz (WXGA) Hexagonal SDSP6 600 MHz to 12 MP camera LPDDR ODANOCHAN 400 MHz UMTS, MBSP6 MHz to 12MP camera LPDDR single-channel 400 MHzTS UMMS; GSM Bluetooth 2.0/2.1 (external BTS4025); 802.11b/g/n (external AR6003); gpsOne Gen 7; USB 2.0 4 2008 (SD8650) CDMA2000/UMTS, MBMS; GSM Snapdragon S2 Model Room Fab Processor (ARMv7) GPU DSP Memory Technology Modem Connection Availability Selection MSM7230 45 Nm 1 Core to 800 MHz: Scorpio 32K-32K L1, 256K L2 Adreno 205 266 MHz (XGA) Hexagon DSP5 256 MHz Up to 12 MP camera LPDDR2 Bichannel 333 MHz (5.3 GB/s) GSM (GPRS, EDGE) Bluetooth 4.0 (external WCN2243) or Bluetooth 3.0 (external qTR8x00); 802.11b/g/n (external WCN1314); Gen 8 с ГЛОНАСС; USB 2.0 2 2010 MSM7630 (1×Adv, 1×EV-DO Rel.0/Rev.A/Rev.B, 1×EV-DO Mc Rev.A, SV-DO); УМТС, МБМС; GSM AP-8055, 1 ядро до 1,4 ГГц Скорпиона: 32K-32K L1, 384K L2 - MSM8255-1 ядро до 1 ГГц Скорпион: 32K-32K L1, 384K L2 UMTS, MBMS; GSM MSM8655( CDMA2000/UMTS, MBMS; GSM MSM8255T 1 ядро до 1,5 ГГц Скорпион: 32K-32K L1, 384K L2 UMTS, MBMS; GSM MSM8655T( CDMA2000/UMTS, MBMS; GSM Snapdragon S3 Модель номер Fab процессор (ARMv7) GPU DSP технология памяти Модем Связь Выборка доступности AP-8060 45 нм 2 ядра до 1,7 ГГц Скорпион: 512KB L2 Adreno 220 26 шестимерный шестиугольник МГц (WXGA) «DSP6 400 МГц» до 16-МГц камеры LPDDR2 Одноканальный 333 МГц (2,67 ГБ/с) - Bluetooth 4.0 (внешний WCN2243); 802.11b/g/n (внешний WCN1314); gpsOne Gen 8 с ГЛОНАСС; USB 2.0 2011 MSM8260(HSDPA, HSUPA, HSPA, W-CDMA), MBMS; GSM (GPRS, EDGE) 3 2010 MSM8660(1×1) CDMA2000 (1×Adv, No 5×EV-DO Rel.0/Rev.A/Rev.B, 1×EV-DO MC Rev.A); УМТС, МБМС; GSM Snapdragon S4 серии Snapdragon S4 предлагается в трех моделях; S4 Play для бюджетных устройств и устройств начального уровня, S4 Plus для устройств среднего класса и S4 Pro для устройств высокого класса. Он был запущен в 2012 году. Snapdragon S4 сменили Snapdragon 200/400 серии (S4 Play) и 600/800 серии (S4 Plus и S4 Pro) Snapdragon S4 Play Модель номер Fab процессор (ARMv7) GPU DSP технология памяти Модем Связь Выборка доступности MSM8225 2 ядра до 1,2 ГГц Cortex-A5: 2x 32K-32K L1, 512K L2 Adreno 203 320 МГц (FWVGA) Шестиугольник До 8 МП камеры LPDDR2 Одноканальный 300 МГц UMTS (HSPA); GSM (GPRS, EDGE) Bluetooth 3.0 (внешний); 802,11b/g/n 2,4 ГГц (внешний); GPS: Изат Ген 7; USB 2.0 1H 2012 MSM8625 (1×Rev.A, 1×EV-DO Rev.A/B); УМТС; GSM Snapdragon S4 Plus Модель номер Fab процессор (ARMv7) GPU DSP технология памяти Модем Связь Выборка доступности MSM8227 28 нм 2 ядра до 1 ГГц Krait: 4 '4 КБ L0, 16-16 КБ Л1, 1 МБ L2 Adreno 305 320 МГц (FWVGA / 720p) Шестиугольник ЗДСП6 LPDDR2 Одноканальный 400 МГц UMTS (DC- HSPA, TD-SCDMA); GSM (GPRS, EDGE) Bluetooth 4.0; 802.11b/g/n (2.4/5 ГГц); GPS: Изат Gen8A; USB 2.0 2H 2012 MSM8627(1×Rev.A, 1×EV-DO Rev.A/B, SVDO-DB); УМТС; Ядра GSM AP-8030 2 ядра до 1,2 ГГц Krait: 4'4 КБ L0, 16'16 КБ L1, 1 МБ L2 Adreno 305 400 МГц (qHD / 1080p) До 13,5 МП камеры LPDDR2 Одноканальный 533 МГц - 3 2012 MSM82307 UMTS; GSM MSM8630(CDMA/UMTS); Режим мира GSM MSM8930 (LTE FDD/TDD Cat 3, SVLTE-DB, EGAL; CDMA/UMTS; GSM) АТС8060А 2 ядра до 1,5 ГГц Крайт: 4'4 КБ L0, 16'16 КБ L1, 1 МБ L2 Adreno 225 400 МГц (WUXGA / 1080p) До 20 МП камеры LPDDR2 Двухканальный 500 МГц - 2H 2012 MSM8260A GSM NO1 2012 MSM8660A GSM MSM8960 (LTE Cat 3) Snapdragon S4 Pro Модель номер Fab процессор (ARMv7) GPU ISP Memory Modem Connectivity Sampling MsM8260A Pro 28 nm LP 2 cores to 1.7 GHz Krait 300: 4'4 KB L0, 16'16 KB L1, 1MB L2 Adreno 320 400 MHz (WUXGA / 1080p) Hexagonal DRS6 Up to 20 MP LPDDR2 Two-channel 500 MHz UMTS (DC-HSPA, TD-SCDMA); GSM (GPRS, EDGE) Bluetooth 4.0; 802.11b/g/n (2.4/5 GHz); GPS: Izat Gen8A; РЕЖИМ мира USB 2.0 MSM8960T (LTE FDD/TDD Cat 3, SVLTE-DB, EGAL; CDMA: 1× Adv., 1× EV-DO Rev. A/B; UMTS; GSM) 2 2012 MSM8960T Pro (MSM8960AB) Natural Language Processor and Contextual Processor No.3 2013 AP-8064, 4 cores to 1.5 GHz Krait: 4'4 KB L0, 16'16 KB L1, 2MB L2 Adreno 320 400 MHz (HIG / 1080p) LPDDR2 Dual Channel 533 MHz (ARMv7) External 2012 Snapdragon 200 Series Snapdragon 200 (2013) Model Room Fab Processor (ARMv7) DSP Memory Technology ISP Modem Availability 45 Nm LP 4 cores to 1.4 GHz Cortex-A5 Adreno 203 400 MHz (up to 540p) Hexagon DSP5 Up to 8MP Camera LPDDR2 Single Channel 333 MHz Gobi 3G (UMTS: HSPA; GSM: GPRS/EDGE) Bluetooth 4.1; 802.11b/g/n 2.4 GHz; GPS: Izat Gen8B; USB 2.0 2013 MSM8625'12' Gobi 3G (CDMA: 1×Rev.A, 1×EV-DO Rev.A/B; UMTS; GSM) MSM8210 (MSM8210) 28 Nm LP 2 cores to 1.2 GHz Cortex-A7 Adreno 302 400 MHz (up to 720p) Hexagon SDSP6 Gobi 3G (UMTS; GSM) 2013 MSM8610 GSM) MSM8212 (12) 4 cores to 1.2 GHz Cortex-A7 Gobi 3G (UMTS; GSM) MSM8612 Gobi 3G (CDMA/UMTS; GSM) qualcomm 205, Snapdragon 208, 210 and 212 (2014-17) The Snapdragon 208 and Snapdragon 210 were announced on September 9, 2014. Snapdragon 212 was announced on July 28, 2015. The mobile platform qualcomm 205 formally falls under the Mobile Platform brand, but practically is Snapdragon 208 with the modem X5 LTE. This was announced on March 20, 2017. Model Number Fab Processor (ARMv7) GPU DSP Memory Technology Modem Connectivity Fast Charging Availability Selection MSM8905 (205) 28 nm LP 2 cores to 1.1 GHz Cortex-A7 Adreno 304 (W XGA / 3720p) Hexagon 536 Up to 3 MP camera LPDDR2/3 Single Channel 384 MHz X5 LTE (Cat 4: download up to 150 Mbps, download up to 50 Mbps) Bluetooth 4.1, Bluetooth 4.1, BLE, 802.11n (2.4 GHz) 2017 MSM8208 (208) Up to 5 MP camera LPDDR2/3 Single Channel 400 MHz Gobi 3G (multimoded CDMA/UMTS: download up to 42 Mbps; GSM) 2.0 2014 MSM8909 (210) 4 cores to 1.1 GHz Cortex-A7 Up to 8 MP camera LPDDR2/3 Single-channel 533 MHz X5 LTE MS July 9, 2019 4 cores to 1.3 GHz Cortex-A7 2015 .215 (2019) were announced. It is a toned version of the Snapdragon 425 and is primarily optimized for Android Go Edition devices. Model Number Fab Processor (ARMv8) GPU DSP ISP Memory Модемная связь Быстрая зарядка Выборка доступности (M215) 28 нм LP 4 ядра до 1,3 ГГц Cortex-A53 Adreno 308 (HD) Шестиугольник До 13 МП камеры / 8 МП двойной LPDDR3 Одноканальный 672 МГц 3 ГБ X5 LTE (Cat 4: скачать до 150 Мбит/с, загрузите до 50 Мбит/с) Bluetooth 4.2, NFC, 802.11ac Wi-Fi, Beidou, GPS, ГЛОНАСС, USB 2.0 1.0 No3 2019 Snapdragon 400 серии Snapdragon 400 Серии начального уровня SoC предназначен для бюджетных устройств. Он является преемником Snapdragon S4 Play. Snapdragon 400 (2013) Модель номер Fab процессор (ARMv7) GPU DSP Технология памяти Модем Подключение Быстрая зарядка Выборка доступности AP'8026 23 28 Нм LP 4 ядра до 1,2 ГГц Cortex-A7: 32 КБ L1, 512 КБ L2 Adreno 305 400 МГц Шестиугольник ЗДСП6 До 13,5 МП камеры LPDDR2/3 Одноканальный 533 МГц - Bluetooth 4.0, 802.11 b/g/n, Интегрированный Изат GNSS 1.0 4 2013 MSM8226 Гоби 3G (UMTS: HSPA' до 21 Мбит/с; GSM: GPRS/EDGE) MSM8626[23] Gobi 3G (CDMA/UMTS) MSM8926[23] Gobi 4G (LTE Cat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s) APQ8028[23] 4 cores up to 1.6 GHz Cortex-A7: 32 KB L1, 512 KB L2 - MSM8228[23] Gobi 3G (UMTS) MSM8628[23] Gobi 3G (CDMA/UMTS) MSM8928[23] Gobi 4G (LTE Cat 4) MSM8230[23] 2 cores up to 1.2 GHz Krait 200: 32 KB L1, 1 MB L2 LPDDR2 Single-channel 533 MHz Gobi 3G (UMTS) MSM8630[23] Gobi 3G (CDMA/UMTS) MSM8930[23] Gobi 4G (LTE Cat 4) MSM8930AA[23] 2 cores up to 1.4 GHz Krait 300: 32 KB L1, 1 MB L2 Gobi 4G (LTE Cat 4) APQ8030AB[23] 2 cores up to 1.7 GHz Krait 300 : 32 КБ L1, 1 МБ L2 - MSM8230AB Гоби 3G (UMTS) MSM8630AB (LTE Cat 4) Snapdragon 410, 412 и 415 (2014/15) Snapdragon 410 был анонсирован 9 декабря 2013 года. Это была первая 64-битная мобильная система компании на чипе и впервые изготовленная в Китае по МРОТ. Snapdragon 412 был анонсирован 28 июля 2015 года. Snapdragon 415 и более старый Snapdragon 425 (позже отменены) были анонсированы 18 февраля 2015 года. [26] Model number Fab CPU (ARMv8) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability APQ8016 (410) 28 nm (SMIC) 4 cores up to 1.2 GHz Cortex-A53 Adreno 306 450 MHz (WUXGA / 1920×1200 + 720p external display) Hexagon QDSP6 V5 Up to 13.5 MP camera LPDDR2/3 Single-channel 32-bit 533 MHz (4.2 GB/s) - Bluetooth 4.0, 802.11n, NFC, GPS, GLONASS, BeiDou 2.0 1H 2014 MSM8916 (410)[27] X5 LTE (Cat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s) MSM8916 v2 (412)[28] 4 cores up to 1.4 GHz Cortex-A53 LPDDR2/3 Single-channel 32-bit 600 MHz (4.8 GB/s) 2H 2015 MSM8929 (415)[29] 28 nm LP 8 cores up to 1.4 GHz Cortex-A53 Adreno 405 (HD @60fps) Hexagon V50 Up to 13 MP camera LPDDR3 Single-channel 667 MHz Bluetooth 4.1 + BLE Bluetooth , 802.11ac (2.4/5.0 ГГц) Многопользовательский MIMO (MU-MIMO) Wi-Fi, Gen8C Lite GPS Snapdragon 425, 427, 430 и 435 (2015/16) Snapdragon 425, 427, 430 и 435 совместимы с пин-кодом и программным обеспечением; программное обеспечение, совместимое с Snapdragon 429, 439, 450, 625, 626 и 632. Snapdragon 430 был анонсирован 15 сентября 2015 года. Новый Snapdragon 425 и Snapdragon 435 были анонсированы 11 февраля 2016 года. Snapdragon 427 был анонсирован 18 октября 2016 года. [32] [33] Model number Fab CPU (ARMv8) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability MSM8917 (425)[34] 28 nm LP 4 cores up to 1.4 GHz Cortex-A53 Adreno 308 (HD @60fps) Hexagon 536 Up to 16 MP camera LPDDR3 Single-channel 667 MHz X6 LTE (download: Cat 4, up to 150 Mbit/s; upload: Cat 5, up to 75 Mbit/s) Bluetooth v4.1, 802.11ac with Multi-User MIMO (MU-MIMO), IZat Gen8C 2.0 Q3 2016 MSM8920 (427)[35] X9 LTE (download: Cat 7, up to 300 Mbit/s; upload: Cat 13, up to 150 Mbit/s) 3.0 Q1 2017 MSM8937 (430)[36] 8 cores up to 1.4 GHz Cortex-A53 Adreno 505 (FHD / 1080p) Up to 21 MP camera LPDDR3 Single-channel 800 MHz X6 LTE Q2 2016 MSM8940 (435)[37] X9 LTE Q4 2016 Snapdragon 429 , 439 и 450 (2017/18) Snapdragon 450 был анонсирован 28 июня 2017 года. Пин-код и программное обеспечение, совместимые с Snapdragon 625, 626 и 632; программное обеспечение, совместимое с Snapdragon 425, 427, 429, 430, 435 и 439. Snapdragon 429 и 439 были анонсированы 26 июня 2018 года. Snapdragon 429 и 439 пин-код и совместимость программного обеспечения; программное обеспечение, совместимое с Snapdragon 425, 427, 430, 435, 450, 625, 626 и 632. Model number Fab CPU (ARMv8) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability SDM429 [40] 12 nm FinFET 4 cores up to 1.95 GHz Cortex-A53 Adreno 504 (HD / HD+) Hexagon 536 Up to 16 MP camera / 8 MP dual LPDDR3 X6 LTE (download: Cat 4, up to 150 Mbit/s; upload: Cat 5, up to 75 Mbit/s) Bluetooth 5, 802.11ac Wi-Fi up to 364 Mbit/s, USB 2.0 3.0 Q3 2018 SDM439 [41] 4 + 4 cores (1.95 GHz + 1.45 GHz Cortex-A53)[42] Adreno 505 (Full HD / Full HD+) Up to 21 MP camera / 8 MP dual SDM450 [43] 14 nm LPP 8 cores up to 1.8 GHz Cortex- A53 Adreno 506 600 MHz (WUXGA / Full HD / Full HD+) Hexagon 546 Up to 21 MP camera / 13 MP dual LPDDR3 Single-channel 933 MHz X9 LTE (download : Кошка 7, до 300 Мбит/с; загрузка: Cat 13, до 150 Mbit/s) Bluetooth 4.1, 802.11ac Wi-Fi до 433 Mbit/s, USB 3.0 No3 2017 Snapdragon 460 (2020) Snapdragon 460 был анонсирован 20 января 2020 года при поддержке NavIC. Это первая модель Snapdragon 400, которая включает архитектуру Kryo. Модель номер Fab процессора (ARMv8) GPU DSP Технология памяти Модем Подключение Быстрая зарядка Выборка доступности SM4250-AA (460) 8 ГГц Kryo 240 Золото - Кортекс-A73 производные 1,8 ГГц Kryo 240 Серебро - Cortex-A53 производные) Adreno 610 (до полного HD) Шестиугольник 683 Spectra 340 камера / 16 МП двойной с MFNR / SL) LPDDR3 до 933 МГц / LPDDR4X до 1866 МГц X11 LTE (Cat 13: скачать до 390 Мбит / с, загрузить до 150 Мбит / с) Bluetooth 5.1, Wi-Fi 802.11a/b/g/n, 802.11ax-ready, 802.11ac Wave 2, NavIC, USB C 3.0 No1 2020 Snapdragon 600 серии Snapdragon 600 (2013) Snapdragon 600 был анонсирован 8 января 2013 года. В отличие от более поздних моделей серии 600, Snapdragon 600 считался высококачественной SoC, похожей на Snapdragon 800, и был прямым преемником обоих Snapdragon S4 Plus и S4 Pro. Display Controller: MDP 4. 2 RGB planes, 2 VIG planes, 1080p Model number Fab CPU (ARMv7) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability APQ8064-1AA (DEB/FLO) Advertised as S4 Pro 28 nm LP 4 cores up to 1.5 GHz Krait 300: 4+4 KB L0, 16+16 KB L1, 2 MB L2 Adreno 320 400 MHz (QXGA / 1080p) Hexagon QDSP6 V4 500 MHz Up to 21 MP camera DDR3L-1600 (12.8 GB/sec) External Bluetooth 4.0, 802.11a/b/g/n/ac (2.4/5 GHz), IZat Gen8A 1.0 Q1 2013 APQ8064M [47] 4 cores up to 1.7 GHz Krait 300: 4+4 KB L0, 16+16 KB L1, 2 MB L2 LPDDR3 Dual-channel 32-bit 533 MHz APQ8064T [47] LPDDR3 Dual-channel 32-bit 600 MHz APQ8064AB [47] 4 cores up to 1.9 GHz Krait 300 : 4'4 КБ L0, 16'16 КБ L1, 2 МБ L2 Adreno 320 450 МГц (ХГА / 1080p) Snapdragon 610, 615 и 616 (2014/15) Snapdragon 610 и Snapdragon 615 были объявлены 24 февраля 2014 года. Snapdragon 615 был первым окта-ядром SoC. Начиная с Snapdragon 610, серия 600 является линейкой SoC среднего класса, в отличие от оригинального Snapdragon 600, который был высококачественной моделью. Аппаратное HEVC/H.265 расшифровать ускорение 49 Snapdragon 616 было объявлено 31 июля 2015 года. [50] Model number Fab CPU (ARMv8) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability MSM8936 (610)[51] 28 nm LP 4 cores 1.7 GHz Cortex-A53 Adreno 405 550 MHz (2560×1600 / Quad HD / WQXGA) Hexagon V50 700 MHz Up to 21 MP camera LPDDR3 Single-Channel 800 MHz (6.4 GB/s) X5 LTE (Cat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s) Bluetooth 4.0, Qualcomm VIVE 802.11ac NFC, GPS, GLONASS, BeiDou 2.0 Q3 2014 MSM8939 (615)[52] 4 + 4 cores (1.5 GHz + 1.0 GHz Cortex-A53) Q3 2014 MSM8939 v2 (616)[53] 4 + 4 cores (1.7 GHz + 1.2 GHz Cortex-A53) Q3 2015 Snapdragon 617, 625 and 626 (2015/16) The Snapdragon 617 was announced on September 15 , 2015. The Snapdragon 625 был анонсирован 11 февраля 2016 года. The Snapdragon 626 был анонсирован 18 октября 2016 года. Snapdragon 625, 626, 632 и 450 совместимы с пин-кодом и программным обеспечением; программное обеспечение, совместимое с Snapdragon 425, 427, 429, 430, 435 и 439. Модель номер Fab процессора (ARMv8) GPU DSP Технология памяти Модем Подключение Быстрая зарядка Выборка доступности MSM8952 (617) 28 Нм LP 4 4 ядра (1,5 ГГц и 1,2 ГГц Cortex-A53) 405 550 МГц (FHD / 1080p) Шестиугольник 546 До 21 МП камеры LPDDR3 Одноканальный 933 МГц (7,5 ГБ/с) X8 LTE (Cat 7: скачать до 300 Мбит/с, загрузить до 100 Мбит/с) Bluetooth 4.1, VIVE 1-stream 802.11n/ac Wi-Fi, I-At Gen8C; USB 2.0 3.0 No4 2015 MSM8953 (625) 14 Нм LPP 8 ядер до 2,0 ГГц Cortex-A53 Adreno 506 650 МГц (FHD / 1080p) До 24 МП камеры / 13 MP двойной X9 LTE (скачать: Cat 7, до 300 Мбит/с; загрузка: Cat 13, до 150 Мбит/с) Bluetooth 4.1, NFC, VIVE 1-stream 802.11n/ac Wi-Fi, Итат Gen8C; USB 3.0 No2 2016 MSM8953 Pro (626) 8 ядер до 2,2 ГГц Cortex-A53 Bluetooth 4.1, NFC, VIVE 1-stream 802.11n/ac MU-MIMO Wi-Fi, I't Gen8C; 18 февраля 2015 года были анонсированы USB 3.0 No4 2016 Snapdragon 650 (618), 652 (620) и 653 (2015/16) Snapdragon 618 и Snapdragon 620. С тех пор они были переименованы в Snapdragon 650 и Snapdragon 652 соответственно. Snapdragon 653 был анонсирован 18 октября 2016 года. [32] Модель номер Fab процессора (ARMv8) GPU DSP Технология памяти Модем Связь Быстрая зарядка Выборка доступности MSM8956 (650) Четырехъядерный HD / 2560x1600) Шестиугольник V56 До 21 МП камеры / 13 MP двойной LPDDR3 Двойной канал 32-битный 933 МГц (14,9 ГБ/с) X8 LTE (Cat 7: скачать до 300 Мбит/ с, загрузить до 100 Мбит / с) Bluetooth Smart 4.1, VIVE 1-поток 802.11ac Wi-Fi, Изат Gen8C GNSS; USB 2.0 3.0 1 2016 MSM8976 (652) 76 Pro (653) - 4 ядра (1,95 ГГц Cortex-A72 - 1,44 ГГц Cortex-A53) X9 LTE (загрузка: Cat 7, до 300 Мбит/с; загрузить: Cat 13, до 150 Мбит/с) 4 квартал 2016 г. Snapdragon 630, 636 и 660 (2017) Snapdragon 630, 636 и 660 совместимы. Snapdragon 630 и Snapdragon 660 были анонсированы 8 мая 2017 года. The Snapdragon 636 был анонсирован 17 октября 2017 года. [64] Model Number Fab CPU (ARMv8) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability SDM630 [65] 14 nm LPP 4 + 4 cores (2.2 GHz + 1.8 GHz Cortex-A53)[66] [67] Adreno 508 (QXGA / Full HD / 1920x1200) Hexagon 642 Spectra 160 (Up to 24 MP camera / 13 MP dual) LPDDR4 Dual-channel 1333 MHz X12 LTE (download: Cat 12, up to 600 Mbit/s; upload: Cat 13, up to 150 Mbit/s) Bluetooth 5, NFC, 802.11ac Wi-Fi up to 433 Mbit/s, USB 3.1 4.0 Q2 2017 SDM636 [68] 4 + 4 cores (1.8 GHz Kryo 260 Gold – Cortex-A73 derivative + 1.6 GHz Kryo 260 Silver – Cortex-A53 derivative) Adreno 509 (FHD+) Hexagon 680 Spectra 160 (Up to 24 MP camera / 16 MP dual) Q4 2017 SDM660 [69] 4 + 4 cores (2.2 GHz Kryo 260 Gold – Cortex-A73 derivative + 1.84 GHz Kryo 260 Silver – Cortex-A53 derivative) Adreno 512 (WQXGA / Quad HD / 2560x1600) Spectra 160 (48 MP single camera / 16 MP at 30fps Dual Camera С LPDDR4 Двухканальный 1866 МГц Bluetooth 5, NFC, 802.11ac Wi-Fi до 867 Мбит/с, USB 3.1 q2 2017 Snapdragon 632 и 670 (2018) Snapdragon 632 был анонсирован 26 июня 2018 года. Пин и программное обеспечение, совместимые с Snapdragon 625, 626 и 450; программное обеспечение, совместимое с Snapdragon 425, 427, 429, 430, 435 и 439. Snapdragon 670 был анонсирован 8 августа 2018 года. Пин-код и программное обеспечение, совместимые с Snapdragon 710. Model Number Fab CPU (ARMv8) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability SDM632 [71] 14 nm LPP 4 + 4 cores (1.8 GHz Kryo 250 Gold – Cortex-A73 derivative + 1.8 GHz Kryo 250 Silver – Cortex-A53 derivative)[42] Adreno 506 (Full HD / Full HD+ / 1920x1200) Hexagon 546 Up to 40 MP camera / 13 MP at 30fps Dual Camera with MFNR/ZSL LPDDR3 X9 LTE (download: Cat 7, up to 300 Mbit/s; upload: Cat 13, up to 150 Mbit/s) Bluetooth 5, NFC, 802.11ac Wi-Fi up to 364 Mbit/s, USB 3.0 3.0 Q3 2018 SDM670 [72] 10 nm LPP 2 + 6 cores (2.0 GHz Kryo 360 Gold – Cortex-A75 derivative + 1.7 GHz Kryo 360 Silver – Cortex-A55 derivative)[73] Adreno 615 (FHD+ / 2560x1600 , Внешний до 4K) Шестиугольник 685 Spectra 250 (192 MP одной камеры / 16 МП на 30fps Двойная камера с MFNR / SL) LPDDR4X Двойной канал 1866 МГц X12 LTE (загрузка: Cat 12, до 600 Mbit/s; загрузить: Cat 13, до 150 Мбит/с) Bluetooth 5, NFC, 802.11ac Wi-Fi до 867 Мбит/с, USB 3.1 4 '3 2018 Snapdragon 662, 665 и 675 (2019/20) Snapdragon 675 был анонсирован 22 октября 2018 года. Snapdragon 665 был анонсирован 9 апреля 2019 года. [75] Snapdragon 662 был анонсирован 20 января 2020 года при поддержке NavIC. [44] Model Number Fab CPU (ARMv8) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability SM6115 (662)[77] 11 nm LPP 4 + 4 cores (2.0 GHz Kryo 260 Gold – Cortex-A73 derivative + 1.8 GHz Kryo 260 Silver – Cortex-A53 derivative) Adreno 610 (Full HD+ / 2520x1080) Hexagon 683 Spectra 340T (192 MP camera / 16 MP dual with MFNR/ZSL) LPDDR3 up to 933 MHz / LPDDR4X up to 1866 MHz X11 LTE (Cat 13: download up to 390 Mbit/s, upload up to 150 Mbit/s) Bluetooth 5.1, NFC, Wi-Fi 802.11a/b/g/n, 802.11ax-ready, 802.11ac Wave 2,NavIC, USB 3.1 3.0 Q1 2020 SM6125 (665)[78] Hexagon 686 Spectra 165 (48 MP single camera / 16 MP at 30fps Dual Camera with MFNR/ZSL) LPDDR3/LPDDR4XDual‑channelup to 1866 MHz X12 LTE (download : Кошка 12, до 600 Мбит/с; загрузка: Cat 13, до 150 Mbit/s) Bluetooth 5, NFC, 802.11ac Wi-Fi, USB 3.1 q2 2019 SM6150 (675) 2 х 6 ядер (2,0 ГГц Kryo 460 Gold - Cortex-A76 производные 1,7 ГГц Kryo 460 Silver - Cortex-A55) / 2520x1080, Внешний до 4K) Шестиугольник 685 Spectra 250L (192 MP одной камеры / 16 МП на 30fps Двойная камера с MFNR / sL) LPDDR4X Двойной канал 1866 МГц Bluetooth 5, NFC, 802.11ac Wi-Fi 867 Mbit/s, USB 3.1 4 1 2019 Snapdragon 690 5G (2020) Snapdragon 690 был анонсирован 16 июня 2020 года. Модель номер Fab процессора (ARMv8) GPU DSP технология памяти модема подключения Быстрая зарядка Выборка доступности SM6350 (690) 0,0 ГГц Kryo 560 Gold - производная Cortex-A77 1,7 ГГц Kryo 560 Silver - производная Cortex-A55) Adreno 619L (Полный HD-@120Hz) шестиугольник 692 Spectra 355L (192 МП одной камеры / 16 МП на 30fps Двойная камера с MFNR / ЗСЛ) LPDDR4X Двойной канал 16-битный (32-битный), 18 66 МГц (14,9 ГБ/с) Внутренний X51 5G/LTE (5G NR Sub-6: загрузка до 2,5 Гбит/с, загрузка: до 900 Мбит/с; LTE: скачать Cat 18, до 1200 Mbit/s, загрузить Cat 18, до 210 Mbit/s) Bluetooth 5.1, NFC, Wi-Fi 6 готовы (802.11ax/ac волна 2/n/g/b/a) 4 '2 2020 Snapdragon 700 серии 27 февраля 2018 года, Квалком представил Snapdragon 700 Мобильная платформа серии. Snapdragon 710 и 712 (2018/19) The Snapdragon 710 был анонсирован 23 мая 2018 года. Пин и программное обеспечение, совместимые с Snapdragon 670. Snapdragon 712 был анонсирован 6 февраля 2019 года. [85] Model Number Fab CPU (ARMv8) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability SDM710 [86] 10 nm LPP 2 + 6 cores (2.2 GHz Kryo 360 Gold – Cortex-A75 derivative + 1.7 GHz Kryo 360 Silver – Cortex-A55 derivative) Adreno 616 (Quad HD+) Hexagon 685 Spectra 250 (192 MP single camera / 16 MP at 30fps Dual Camera with MFNR/ZSL) LPDDR4X up to 8 GB, Dual-channel 16-bit (32-bit), 1866 MHz (14.9 GB/s) X15 LTE (download: Cat 15, up to 800 Mbit/s; upload: Cat 13, up to 150 Mbit/s) Bluetooth 5.0, NFC, 802.11a/b/g/n/ac 2x2 (MU-MIMO) Wi-Fi up to 867 Mbit/s, GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, USB 3.1 4 Q2 2018 SDM712 [87] 2 + 6 cores (2.3 GHz Kryo 360 Gold – Cortex-A75 derivative + 1.7 GHz Kryo 360 Silver – Cortex-A55 derivative) 4+[88] Q1 2019 Snapdragon 720G and 730/730G/732G (2019/20) The Snapdragon 730 and 730G were announced on April 9 , 2019. [75] Snapdragon 720G был анонсирован 20 января 2020 года. Snapdragon 732G был анонсирован 31 августа 2020 года. [90] Model Number Fab CPU (ARMv8) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability SM7125 (720G)[91] 8 nm LPP (Samsung) 2 + 6 cores (2.3 GHz Kryo 465 Gold – Cortex-A76 derivative + 1.8 GHz Kryo 465 Silver – Cortex-A55 derivative) Adreno 618 (Full HD+) Hexagon 692 Spectra 350L (192 MP single camera / 16 MP at 30fps Dual Camera with MFNR/ZSL) LPDDR4X up to 8 GB, Dual-channel 16-bit (32-bit), 1866 MHz (14.9 GB/s) X15 LTE (download: Cat 15, up to 800 Mbit/s; upload: Cat 13, up to 150 Mbit/s) Bluetooth 5.1, NFC, NavIC, 802.11a/b/g/n/ac/ax 2x2 (MU-MIMO) Wi-Fi GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, USB 3.1 4 Q1 2020 SM7150-AA (730)[92] ,SM7150-AB (730G) производная 1,8 ГГц Kryo 470 Silver - Cortex-A55 производная) Adreno 618 (Квад HD / 3360x1440) Шестиугольник 688 Spectra 350 с ускорителем CV (192 MP одной камеры / 22 MP на 30fps Двойная камера с MFNR / SL) Bluetooth 5.0, NFC, 802.11a/b/g/n/ac/ax 2x2 (MU-MIMO) Wi-Fi до 867 Mbit/s, GPS, ГЛОНАСС, Beidou, Галилео, SBAS, USB 3.1 4 '2 2019 SM7150-AC (732G)o 470 Gold - производная Cortex-A76 - 1,8 ГГц Kryo 470 Silver - производная Cortex-A55) шестиугольник 688 (3,6 TOPS) FastConnect 6200; Bluetooth 5.1; 802.11a/b/g/n/ac/ax (Wi-Fi 6) 2x2 (MU-MIMO), NFC, NavIC, GPS, ГЛОНАСС, Beidou, Galileo, ЗСС, SBAS, USB 3.1 No3 2020 Snapdragon 750G и 765/765G/768G 5G (2020) Львиный зев 5G 765 и 765G были анонсированы 4 декабря 2019 г. в качестве первых SoCs компании с интегрированным 5G-модемом и первых 700 серий SoCs для поддержки водителей GPU с помощью Play Store. Snapdragon 768G был анонсирован 10 мая 2020 года. Snapdragon 750G был анонсирован 22 сентября 2020 года. Модель номер Fab процессор (ARMv8) GPU DSP Технология памяти Модем Подключение Быстрая зарядка Выборка доступности SM7225 (750G) 6 ядер (2,2 ГГц Kryo 570 Gold - производная Cortex-A77 и 1,8 ГГц Kryo 570 Silver - производная Cortex-A55) Adreno 619 (Полный HD-@120Hz) Шестиугольник 694 Spectra 355L (192 МП одной камеры / 16/32 MP на 30fps двойной камеры с MFNR / SL) LPDDR4X, Двухканальные 16-битные (32-битные), 2133 МГц (17 ГБ/с) Внутренние X52 5G/LTE (5G: скачать до 3,7 Гбит/с, загрузка: до 1,6 Гбит/с; LTE: скачать Cat 18, до 1200 Mbit/s, загрузить Cat 18, до 210 Mbit/s) FastConnect 6200; Bluetooth 5.1; 802.11a/b/g/n/ac/ax (Wi-Fi 6) 2x2 (MU-MIMO), NFC, NavIC, GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, USB 3.1 4+ Q4 2020 SM7250-AA (765)[100] 7 nm LPP EUV (Samsung) 1 + 1 + 6 cores (2.3 GHz Kryo 475 Prime – Cortex-A76 derivative + 2.2 GHz Kryo 475 Gold – Cortex-A76 derivative + 1.8 GHz Kryo 475 Silver – Cortex-A55 derivative) Adreno 620 (Quad HD+, 700 GFLOPS) Hexagon 696 (5.4 TOPS) Spectra 355 (192 MP single camera / 22 MP at 30fps Dual Camera with MFNR/ZSL) Bluetooth 5.0, NFC, 802.11a/b/g/n/ac/ax 2x2 (MU-MIMO) Wi-Fi up to 867 Mbit/s, GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, USB 3.1 Q1 2020 SM7250-AB (765G)[101] 1 + 1 + 6 cores (2.4 GHz Kryo 475 Prime – Cortex-A76 derivative + 2.2 GHz Kryo 475 Gold – Cortex-A76 derivative + 1.8 GHz Kryo 475 Silver – Cortex-A55 derivative) SM7250-AC (768G)[102] 1 + 1 + 6 cores (2.8 GHz Kryo 475 Prime – Cortex-A76 derivative + 2.2 GHz Kryo 475 Gold – Cortex-A76 derivative + 1.8 GHz Kryo 475 Серебро - Кортекс-A55 производные) Bluetooth 5.2, NFC, 802.11a/b/g/n/ac/ax 2x2 (MU-MIMO) Wi-Fi до 867 Mbit/s, GPS, ГЛОНАСС, Beidou, Галилео, ЗСС, SBAS, USB 3.1 No2 2020 Snapdragon 800 серии A Snapdragon 802 чип, 8092, для использования в Smart TVs, it was previously announced by Kvalcomm. They later confirmed that it would not be released because the demand for processors in this market is less than expected. The Snapdragon 800, 801 and 805 (2013/14) Snapdragon 800 was announced on January 8, 2013. support eMMC 4.5 4 KiB and 4 KiB L0 cache, 16 KiB and 16 KiB L1 cache and 2 MiB L2 H.264 cache, VP8 UHD/30fps encodes/decodes up to 21 megapixels, stereoscopic 3D image signal processor (HDRI Support) Adreno 330 GPU USB 2.0 and 3.0 Fast Charge 2.0 Snapdragon 801 was announced on February 24, 2014. Notable features: support for eMMC 5.0 h.265 HD/30fps, decoding DSDA 104, was announced on November 20, 2013. Support dynamic tessellation Adreno 420 GPU Improvement support H.265 : UHD/30fps hardware decoding 108p 120fps coding and decoding Full support Direct3D Level 11'2 and OpenCL 1.2 Up to 55 megapixels, Megapixel Model Room Fab Processor (ARMv7) GPU DSP Memory Modem Technology Connecting Fast Charging Selection Availability AP-8 074AA (800) 28 nm HPm 4 cores to 2.26 GHz Krait 400 Adreno 330 450 MHz (2160p ) Hexagon 4 NDSP6 V5 600 MHz Up to 21 MP LPDDR3 Two-channel 32-bit 800 MHz (12.8 GB/s) - Bluetooth 4.0; 802.11n/ac (2.4/5 GHz); IZat Gen8B 2.0 Q2 2013[46] MSM8274AA (800)[109] Gobi 3G (UMTS) MSM8674AA (800)[109] Gobi 3G (CDMA/UMTS) MSM8974AA (800)[109] Gobi 4G (LTE Cat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s) MSM8974AA v3 (801)[106] Gobi 4G (LTE Cat 4) Q3 2014 APQ8074AB v3 (801)[106] 4 cores up to 2.36 GHz Krait 400 Adreno 330 578 MHz[110] (2160p) LPDDR3 Dual-channel 32-bit 933 MHz (14.9 GB/s) - Q4 2013 MSM8274AB (800)[109] Gobi 3G (UMTS) Q4 2013[111] MSM8674AB v3 (801)[106] Gobi 3G (CDMA/UMTS) Q2 2013[46] MSM8974AB v3 (801)[106][112] Gobi 4G (LTE Cat 4) Q4 2013 MSM8274AC v3 (801)[106] 4 cores up to 2.45 GHz[113] Krait 400[114] Gobi 3G (UMTS) Q2 2014[46] MSM8974AC v3 (801)[106] Gobi 4G (LTE Cat 4) Q1 2014[46] APQ8084 (805)[115] 4 cores up to 2.7 GHz Krait 450 Adreno 420 600 MHz (2160p) Hexagon V50 800 MHz Up to 55 MP Camera LPDDR3 Two-channel 64-bit 800 MHz (25.6 GB/s) External Bluetooth 4.1; 802.11n/ac (2.4/5 GHz); On April 7, 2014, I's Gen8B No.1 2014 Snapdragon 808 and 810 (2015) were announced. Notably, the Snapdragon 808 differs from its predecessor (805): ARMv8-A 64-bit architecture (with global task planning) Adreno 418 GPU with Vulkan 1.0 IsP support to 21 MP 20 nm Snapdragon 8 10 notable features above its lower end (808): The 120 cluster processor with Cortex-A57 is a quad-core Adreno 430 processor with Vulkan 1.0 14-bit dual-provider to 55 MP H.264, H.265 UHD/30fps coding and decoding 4K core display support Model Room Fab Processor (ARMv8) Memory technology DSP Modem Connectivity Fast Charging Availability Selection MSM8992 (808) 117 x 121 20 nm (TSMC) 2 - 4 cores (1.82 GHz Cortex-A57 ) 1.44 GHz Cortex-A53) Hz Hexagon V56 800 MHz Up 21 MP camera LPDDR3 Two-channel 32-bit 933 MHz (14.9 GB/s) X10 LTE (Cat 9: download up to 450 Mbps, download up to 50 Mbps) 802.11ac; Due to Gen8C 2.0 2014 (810) MSM8994 (810) Cortex-A57 - 1.5 GHz Cortex-A53) - Adreno 430 600 MHz Up 55 MP Camera LPDDR4 Double Channel 3 The 2-bit 16 MHz (25.6GB/s) MSM8994v2 (127) Adreno 430 630 MHz 820 and 821 (2016) The Snapdragon 820 was announced at Mobile World Congress in March 2015, with the first phones with soC, released in early 2016. The Snapdragon 821 was announced in July 2016. The 821 provides a 10% improvement in performance compared to the 820 due to the faster clock processor, but otherwise has similar features, with the qualifier stating that the 821 is designed to complement rather than replace the 820. Notable features about its predecessor (Snapdragon 808 and 810): The processor has a custom Kryo quad-core processor to the core : L1: 32'32 KB, L2: 2 MB and 1 MB 129 GPU has Adreno 530 GPU with Vulkan 1.0 DirectX 12, OpenCL 2.0, OpenGL ES 3.2 DSP features hexagon 680 DSP 1st Generation AI Engine Hexagon eXtensions All-Ways Aware™ Low Power Hub Island Neural Processing Engine (NPE) Halide and TensorFlow Support H.264, H.265 UHD/30fps coding H.264, H.265 10-bit, VP9 UHD/60fps decryption provider features Kvalcom Spectre™ provider with dual 14-bit providers 28 MP at 30fps of a single camera; 25 MP at 30fps of the same chamber with SL; 13 MP Двойная камера с видео захвата: До 4K Ultra HD HEVC видео захвата 30FPS Воспроизведение видео: До 4K Ultra HD 10-битный HEVC воспроизведение видео 1080p@ 240 FPS пропускная способность: 1.2GP/sec SOC имеет 14 нм FinFET процесс eMMC 5.1/UFS 2.0 Быстрая зарядка 3.0 поддержка рекламы с внешним чипом Модель номер Fab процессор (ARMv8) GPU DSP технология памяти Модем Подключение Быстрая зарядка Выборка доступности MSM8996 Lite (820) ) 2 ядра (1,804 ГГц и 1,363 ГГц Kryo) Adreno 530 510 МГц (407,4 GFLOPS) шестиугольник 680 МГц 1 ГГц Спектра (до 28 МП камеры / 13 МП двойной) LPDDR4 четырехканальный 16-битный (64-битный) 1333 МГц (21,3 ГБ/с) X12 LTE (загрузка : Кошка 12, до 600 Мбит/с; 3x20 МГц CA; 64-ЗАМ; 4x4 MIMO на 1C. загрузка : Cat 13, up to 150 Mbit/s; 2x20 MHz CA; 64-ZAM.) Bluetooth 4.1; 802.11ac/ad; Izat Gen8C 3.0 1 2016 MSM8996 (820) GHz Kryo) Adreno 530 624 MHz (498.5 GFLOPS) LPDDR4 four-channel 16-bit (64-bit) 1866 MHz (1866 MHz 29.8 GB/s) 4 2015 MSM8996 Pro-AB (821) 2 cores (2,342 GHz) The Adreno 530 653 MHz (519.2 GFLOPS) Snapdragon 835 and 845 (2017/18) Snapdragon 835 was announced on November 17, 2016. Notable features later than its predecessor (821). The processor has a Samsung 10nm FinFET Low Power Early Manufacturing, 3 Billion Transistors 4 Kryo 280 Gold (ARM Cortex-A73-based) L1 cache: 64 kB L2 cache: 2MB 4 Kryo 280 Silver (ARM Cortex-A53-based) LPLPDDR4X dual channel, double-channel, up to 1866 MHz GPU has Adreno 540 graphics with Vulkan 1.1 support, DirectX 12 (function level 12'1), OpenCL 2.0 and OpenGL ES 3.2 quad-core GPU 710/670 MHz with 512 ALUs, 16 TMP and 12 ROP 138 mHz: 727.04 GFLOP, 11.36 GTexels/s and 8.52 Gppixels/s and 670 MHz: 686.08 GFLOPs, 10.72 GTexels/s and 8.08 GFLOPs, 10.72 GTexels/s and 8.08 GFLOPs, 10.72 GTexels/s and 8.08 GFLOPs, 10.72 GTexels/s and 8.08 GFLOPs, 10.72 GTexels/s and 8.08 GFLOPs 10.72 GTexels/s and 8.08 GFLOPs 04 GPixels/s qualcom th-Sync (Variable Refresh Rate) and Adreno Foveation (Foveated Rendering) - DSP has hexagonal 682 DSP 2nd Generation AI Engine Hexagon Vector eXtensions All-Ways Aware™ Low Power Hub Island Neural Processor (NPE) Halide and TensorFlow support H.264, H.265, VP9 UHD/ 30fps coding and UHD/60fps 10-bit decoding high-dynamic video support ranges (HDR10)/Ultra HD Premium (decoding only) DSD and 32-bit/384kHz PC M audio support with WCD9341 codec isP features: Kvalcom Spectre™ 180 ISP with double 14-bit 30fps: Up to 32 MP 32 MP on 30fps of one camera; 25 MP at 30fps of the same chamber with SL; 16 MP Dual Camera with Video Capture: Up to 4K Ultra HD Video Capture 30FPS Video Playback Video: Up to 4K Ultra HD Video Play Codec Support: H.265 (HEVC), H.264 (AVC), VP9 Modem and Wireless Snap Xdragon Xdragon16 LTE Modem Downlink: LTE Cat 16 to 1 Gbps, 4 x 20 MHz carrier aggregation, up to 256-GOM Uplink: LTE Cat 13 to 150 Mbps, Kvalcomm® Snapdragon™ Loading (2 x 20 MHz carrier aggregation, up to 64-MAM, uplink data compression) 802.11a/b/g/n/ac/ad Wi-Fi Bluetooth 5.0 SOC has 10 nm FinFET LPE (Samsung) Die size: 72.3mm2 2.1, SD 3.0 (UHS-I) DisplayPort, HDMI 2.0, USB Type-C 3.1 with USB Energy qualcom Fast Charging 4 139 Snapdragon 845 was announced on December 7, 2017. Notable features of Snapdragon 845: 142 processor has Samsung 10nm FinFET Low-Power Plus manufacturing 4 Kryo 385 Gold (ARM Cortex-A75 based) L 1 cache: 64 KB 64KB L2 cache: 256KB 4 Cryo 385 Silver (ARM Cortex-A55 based) DynamI with 2 MiB L3 cache 3 MiB system cache for processor, GPU, DSP... The GPU has Adreno 630 graphics with Vulkan 1.1 support, DirectX 12 (level 12'1), OpenCL 2.0, OpenGL ES 3.2 and DxNexted Reality (XR) Dual-Core GPU with 512 ALUs, 24 TMU and 16 ROP (by 512 ALU, 16 TMU and 12 ROP) 727.04 GFLOPs, 17.04 GTexels /s and 11.36 GPixels/s (138) Inside out Room-Scale 6DoF at the same time and mapping (SLAM) Advanced Visual Inertial Oometry (VIO) and Adreno Foveation support for for и гибридный log-Gamma (HLG) DisplayPort, HDMI 2.0, USB Type-C 3.1 с USB Power Delivery DSP оснащен шестиугольником 685 3-го поколения AI engine с более чем 3 трлн операций в секунду (TOPS) Hexagon Vector eXtensions All-Ways Aware™ Hub низкой мощности острова Нейронный процессор (NPE) Caffe, Caffe2, Поддержка Halide и TensorFlow 4K Ultra HD - 60 FPS, 2x 2400x2400 - 120 FPS (VR) Может записывать 240 FPS в 1080p и 480 FPS в 720p (Медленное движение) 10-битный цвет глубина (кодирование и расшифровка) на H.264, H.265 и VP9 BT.2020 поддержка на DSP и GPU функции провайдера: Квалком Спектр™ 280 провайдер с двойной 14-битных провайдеров 192 MP одной камеры; 48 МП одной камеры с MFNR; 32 МП при 30fps одной камере с MFNR/ SL; 16 МП при 60fps одной камере с MFNR/ SL; 16 MP at 30fps Dual Camera with MFNR/ZSL Modem and Wireless features Downlink: 5x20 MHz carrier aggregation, up to 256-QAM, up to 4x4 MIMO on three carriers[144] Uplink: 2x20 MHz carrier aggregation, up to 64-QAM Bluetooth enhancements Ultra-low power wireless earbuds Direct audio and aptX HD quality stereo broadcast to multiple wireless speakers Wi-Fi ad 60 GHz with external Module[144] Improve GPS support : Glonass, Beidou, Galileo, QZSS and SBAS[144] System on a chip features 10 nm FinFET LPP (Samsung) Die size: 94 mm²[138] Secure Vault (SPU) [146][147] Qualcomm Quick Charge 4+ Model number Fab CPU (ARMv8) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability MSM8998 (835)[148] 10 nm FinFET LPE (Samsung) 4 + 4 cores (2.45 GHz + 1.9 GHz Kryo 280) Adreno 540 710/670 MHz (737/686 GFLOPS) Hexagon 682 Spectra 180 (Up to 32 MP camera / 16 MP dual) LPDDR4X Dual-channel 32-bit (64-bit) 1866 MHz (29.8 GB/ s) X16 LTE (загрузка: Cat 16, до 1000 Mbit/s; 4x20 МГц CA; 256-ЗАМ; 4x4 MIMO на 2C. загрузка: Cat 13, до 150 Mbit/s) Bluetooth 5; 802.11a/b/g/n/ac/ad Wave 2 (MU-MIMO); GPS, GLONASS, Beidou, Galileo, QZSS, SBAS 4.0 Q2 2017[149] SDM845 [142] 10 nmFinFET LPP (Samsung) 4 + 4 cores (2.8 GHz Kryo 385 Gold+ 1.8 GHz Kryo 385 Silver) Adreno 630 710 MHz (737 GFLOPS) Hexagon 685 (3 TOPs) Spectra 280 (192 MP single camera / 16 MP at 30fps Dual Camera with MFNR/ZSL) LPDDR4X Quad-channel 16-bit (64-bit) 1866 MHz (29.9 GB/s) X20 LTE (download: Cat 18, up to 1200 Mbit/s; 5x20 MHz CA; 256-QAM; 4x4 MIMO on 3C. upload: Cat 13, up to 150 Mbit/s; 2x20 MHz CA; 64-QAM) Bluetooth 5; 802.11a/b/g/n/ac/ad Wave 2 (MU-MIMO); GPS, ГЛОНАСС, Beidou, Galileo, SSS, SBAS 4 1 2018 Snapdragon 855 и 855 (2019) Snapdragon 855 был анонсирован 5 декабря 2018 года. [150] Snapdragon 855 — первый чипсет FinFET от компании. Известные особенности по своему предшественнику (845): 7 нм (N7 TSMC) процесс Die размер: 73 мм2 152 Поддержка до 16 ГБ LPDDR4X 2133 МГц поддержки 4x 16-битный автобус памяти, (34.13 GB/s) NVM Express 2x 3.0 (1x для внешнего 5G модема) функции процессора Prime (Cortex-A76-based), up 2.84 GHz. Premier core with 512 KB pL2 3 Kryo 485 Gold (Cortex-A76-based), up 2.42 GHz. Performance cores with 256 KB pL2 each 4 Kryo 485 Silver (Cortex-A55 basis), up 1.8 GHz. Efficiency cores with 128 KB pL2 each DynamI with 2 MB sL3 cache 3MB system cache GPU features Adreno 640 GPU with Vulkan 1.1 Three-core GPU 585 MHz with 768 ALUs, 36 TMU and 28 ROP (in addition to 512 ALU, 24 TMU and 16 ROP) 1853.3 FP16 GFLOPs, 28.1 double-line GTexels/s, 9.4 GPixels/s and 300 GB/s effective HDR memory bandwidth games (10-bit color depth, Rec. 2020) 120 fps game improvement on hardware accelerated H.265 and VP9 HDR audio playback support code HDR10, HDR10, HLG and Dolby Vision Volumetric VR video playback video playback 8K 360 VR playback quarterly updates of the GPU driver through the Google Play Store Android GPU Inspector Tool AI engine with more than 7 trillion operations per second (TOPS) quaal hexagon vector accelerator with hexgon vector eXtensions qualcom hexagon Tensor accelerator (HTA) Voice Assistant All the Way To Know™ Hub Cafe , Caffe2, Support Halide and TensorFlow Vector/Scalar compared to the hexagon 680: doubled the vector blocks HVX and increased the large-scale performance of the provider: The SpecTram 380 with a dual 14-bit CV provider and hardware accelerator for computer vision 192 MPa with a single camera; 48 MP at 30 fps of the same chamber with MFNR/ SL; 22 MP at 30 fps dual camera with MFNR/SL HEIF photo capture support Tri-core hardware CV features, including object detection and tracking, and stereo depth processing Advanced HDR solution including zzHDR improvement and 3-excerpt quad-color array (KKFA) HDR 4K 60 FPS HDR video with real-time segmentation of objects (portrait mode, background swap) has HDR10, HDR10 and HLG with portrait mode (bokeh), 10-bit color depth and rec. 2020 цветовой гаммой До 1.32 Gpixel/s.157 Форматы захвата видео: HDR10, HLG Video Codec Support: H.265 (HEVC), H.264 (AVC), HLG, HDR10, HDR10, H.265 (HEVC), H.264 (AVC), HLG, HDR10, HDR10, HDR10, VP8, VP9 Модем и беспроводные функции: 158 Внутренний X24 LTE Модем Скачать: 2000 Mbit/s DL (Cat. 20), 7x20 МГц CA, 256-ЗАМ, 4x4 MIMO Загрузка: 316 Mbit/s UL (Cat 20) , 3x20 МГц CA, 256-ЗАМ Внешний Snapdragon X50 (5G Модем): 5000 Мбит/с DL Квалкомм Wi-Fi 6-готовая мобильная платформа: Wi-Fi Стандарты: 802.11ax-готов, 802.11ac Волна 2, 802.11a/b/g, 802.11n Спектральные полосы Wi-Fi: 2,4 ГГц, 5 ГГц использование канала: 20/40/80 МГц MIMO Конфигурация: 2x2 (2-поток) - MU-MIMO- Двойная полоса одновременных (DBS) Ключевые характеристики: 8x8 звучание (до 2x улучшение по сравнению с 4x4 звучание устройств) , Target Wakeup Time up to 67% better energy efficiency, latest safety with WPA3 qualifier 60 GHz Wi-Fi платформы Wi-Fi Стандарты: 802.11ad, 802.11ay Wi-Fi Spectral Band: 60 ГГц Пиковая скорость: 10 10 The Snapdragon 855 was announced on July 15, 2019. [159] Model number Fab CPU (ARMv8) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability SM8150 (855)[160] 7 nm (TSMC N7) Kryo 485 1 + 3 + 4 cores (2.84 GHz + 2.42 GHz + 1.80 GHz) Adreno 640 585 MHz (954.7 GFLOPS) Hexagon 690 (7 TOPs) Spectra 380 (192 MP single camera / 22 MP at 30fps dual camera with MFNR/ZSL) LPDDR4X Quad-channel 16-bit (64-bit) 2133 MHz (34.13 GB/s) Internal: X24 LTE (Cat 20: download up to 2 Gbit/s, 7x20MHz CA, 256-QAM, 4x4 MIMO on 5C. Upload up to 316 Mbit/s, 3x20MHz CA, 256-QAM) + External: X50 5G[161] (5G only: download up to 5 Gbit/s) Bluetooth 5; 802.11a/b/g/n/ac/ad/ay/ax-ready; GPS, GLONASS, Beidou, Galileo, SSS, SBAS; USB 3.1, UFS 3.0 4 1 2019 SM8150-AC (855) 1,80 ГГц) Adreno 640 (675 МГц (1037GFLOPS) 3 2019 Snapdragon 865 и 865 5G (2020) Snapdragon 865 был анонсирован 4 декабря, 2019 год. Заметные особенности по меньшей мере, чем у его предшественника (855): процесс поддержки второго поколения 7 Нм (N7P TSMC) Поддержка до 16 ГБ LPDDR5 2750 МГц или LPDDR4X 2133 МГц поддерживают 4x 16-битный автобус памяти, (или 34,13 ГБ/с) NVM Express 2x 3.0 (1x для внешнего 5G модема) процессор имеет 1 Kryo 585 Prime (cortex-A77 на основе), до 2,84 ГГц (3,1 ГГц за 865 ГГц). Основное ядро с 512 KB pL2 3 Kryo 585 Gold (Cortex-A77 на основе), до 2,42 ГГц. Производительность ядер с 256 KB pL2 каждый 4 Kryo 585 Серебряный (Cortex-A55 основе) , to 1.8 GHz. Efficiency cores with 128 KB pL2 each DynamI with 4 MB sL3, 25% improved performance and 25% energy efficiency improvement 3MB system-level cache GPU function 165 Adreno 650 GPU with Vulkan 1 support. 1 50% more ALUs and ROPs 25% faster graphics visualization and 35% more energy efficiency quarterly driver updates via Google Play Store Android GPU Inspector Tool (155) Desktop Forward Rendering DSP has a hexagon 698 5th generation AI engine, capable of performing 15 trillion operations per second (TOPS) quad-core Hexagon Tensor Accelerator (HTA) Bandwidth Compression Function: Speck 480 with dual 14-bit CV provider and hardware accelerator for computer vision 200 MP of a single camera; 64 MP at 30 fps of the same chamber with MFNR/ SL; 25 MP with 30 fps dual camera with MFNR/SL 8K 30 FPS formats and 4K 120 FPS HDR video up to 2 Gpixel/s Video Capture Formats: Dolby Vision, HDR10, HDR10, HEVC Video Codec support: Dolby Vision, H.265 (HEVC), HDR10, HLG, HDR10, H.264 (AVC), VP8, VP9 New features to improve noise reduction and local contrast improvements Modem and wireless features: External lte Modem modes: NSA, SA, TDD, FDD 5G mmWave: 800 MHz bandwidth, 8 media, 2×2 MIMO 5G sub-6 GHz: 200 MHz bandwidth, 4×4 MIMO 5G NR Sub-6 download mmWave: 7000 Mbit/s DL 5G NR Sub-6 and mmWave upload: 3000 Mbit/s UL LTE download: 2500 DL (Cat. 24), 7x20 МГц CA, CA, 4x4 MIMO LTE download: 316 Mbit/s UL (Cat 22), 3x20 MHz CA, 256-2pm Dynamic Spectrum Exchange (DSS) Kvalcomm Wi-Fi 6-ready mobile platform: FastConnect 6800 Wi-Fi standards: 802.11ax-ready, 802.11ac Wave 2, 802.11a/b/g, 802.11n Spectral Wi-Fi Ranges: 2.4 GHz, 5 GHz and Channel Use: 20/40/80 MHz MIMO Configuration: 2x2 (2 Spacial Stream) - MU-MIMO - Double Band Simultaneous (DBS) Key Features: 8x8 (up to 2x improvement over 4x4 devices), Wake Time 67% Better Energy Efficiency, Latest Security with WPA3 Qualcom 60 GHz Wi-Fi Mobile Platform Wi-Fi Standards: 802.11ad, 802.11ay Wi-Fi Spectral Band: 60 GHz Peak Speed: 10 Gbit/s Other Features: Secure Processor (SPU) with Integrated Double SIM Backup Support Snapdragon 865 Was Announced July 8 , 2020. Model Number Fab Processor (ARMv8) GPU DSP Memory Technology Modem Connection Fast Charging Selection Availability SM8250 (865) 3 and 4 Cores (2.84 GHz and 2.42 GHz and 1.80 GHz) Adreno 650 587 MHz (1250 GFLOPS) Hexagon 698 (15 TOPs) Spectra 480 LP DDR5 four-channel 16-bit (64-bit) 2750 MHz (44GB/s) or 16-bit (64-bit) 16-bit 2 133 MHz (33.4 GB/s) Domestic: noExternal: X55 5G/LTE (5G: download up to 7.5 Gbps, download up to 3 Gbps; LTE Cat 22: Download up to 2.5 Gbps, download up to .316 Gbit/s) FastConnect 6800; Bluetooth 5.1; 802.11a/b/g/n/ac/ax (Wi-Fi 6) to 1.774 Gbit/s; 802.11ad/ay 60GHz Wi-Fi up to 10GB/s; GPS, GLONASS, Beidou, Galileo, SSS, SBAS; USB 3.1 5 1 2020 SM8250-AB (865) Cryo 585 1 3 4 Cores (3.3 1 GHz 2.42 GHz and 1.80 GHz) Adreno 650 645 MHz (1375 GFLOPS) FastConnect 6900; Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) to 3.6 Gbit/s; 802.11ad/ay 60GHz Wi-Fi up to 10GB/s; GPS, GLONASS, Beidou, Galileo, SSS, SBAS; USB 3.1 No 3 2020 Computing platforms for Windows 10 PC Snapdragon 835, 850, 7c, 8c, 8cx and 8cx Gen 2 Mobile PC platform Snapdragon 835 for Windows 10 PC was announced on December 5, 2017. The Snapdragon 850 mobile computing platform for Windows 10 PCs was announced on June 4, 2018. In fact, it's an over-the-top version of the Snapdragon 845. The Snapdragon 8cx PC computing platform for Windows 10 PCs was announced on December 6, 2018. Notable features over 855: 10MB L3 cache 8x 16-bit memory bus, (68.26 GB/s) NVM Express 4x Snapdragon 7c Computing Platform and Snapdragon 8c Computing Platform for Windows 10 PC were announced on December 5, 2019. The Snapdragon 8cx Gen 2 5G compute platform for Windows 10 PCs was announced on September 3, 2020. Model Number Fab Processor (ARMv8) GPU DSP Memory Technology Modem Connection Fast Charging Availability Selection MSM8998 (835) Samsung) 4 and 4 Cores (2.6 GHz and 1.9 GHz Kryo 280) Adreno 540 710/670 MHz (737/686 Hexagon 682 Spectra 180 (up to 32 MP camera / 16 MP dual) LPDDR4X Dual Channel 32-bit (64-bit) 1866 MHz (29.8 GB/s) X16 LTE (download: Cat 16, up to 1000 Mbps; 4x20 MHz CA; 256-cum; 4x4 MIMO at 2C. download: Cat 13, up to 150 Mbit/s) Bluetooth 5; 802.11a/b/g/n/ac/ad Wave 2 (MU-MIMO); GPS, ГЛОНАСС, Beidou, Галилео, ЗСС, SBAS 4.0 No2 2018 SDM850 (176) 10 нмFinFET LPP (Samsung) 4 и 4 ядра (2,95 ГГц Kryo 385 Золото 1,8 ГГц Kryo 385 Серебро) Adreno 630 710 МГц (737 GFLOPS) Шестиугольник 685 (3 TOPs) Spectra 280 (192 MP однокамерная / 16 МП на 30fps Двойная камера с MFNR / SL) LPDDR4X четырехканальный 16-битный (64-битный) 1866 МГц (29,9 ГБ/с) X20 LTE (загрузка: Cat 18, до 1200 МБит / с; 5x20 МГц; 256-ЗАМ; 4x4 MIMO на 3C. загрузка: Cat 13, до 150 Мбит/с; 2x20 МГц CA; 64-ЗАМ) Bluetooth 5; 802.11a/b/g/n/ac/ad Wave 2 (MU-MIMO); GPS, GLONASS, Beidou, Galileo, SSS, SBAS 4 3 2018 7c 177 8 nm Kryo 468 to 2.4 GHz Adreno 618 hexagon 692 Spectra 255 (up to 32 MP camera / 16 MP Double) LPDDR4X Double Channel 16-bit (32-bit) 2133 MHz X15 LTE (download: Cat 15, up to 800 Mbps; download: Cat 13, up to 150M Bluetooth 5 It 802.11a/b/g/n/ac/ad/ax; GPS, GLONASS, Beidou, Galileo, SSS, SBAS, NavIC; USB 3.1; eMMC 5.1, UFS 3.0 2020 8c 7 nm (TSMC N7) Kryo 490 4 and 4 Cores (2.45 GHz and 1.80 GHz) Aenodr 675 Hexagon 690 (990 GHz) Adr 675xa Gongon 690 (990 TOPs) Spectra 390 (192 MP single- camera/ 22 MP on 30fps dual camera with MFNR/SL) LPDDR4X four-channel 16-bit (64-bit) 2133 MHz Internal: X24 LTE (Cat 20: download up to 2 Gbit/s, download 7x20 MHz CA, 256-PM, 4x4 MGIMO at 5C. Download up to 316 Mbps, 3x20 MHz CA, 256-CUM) - External: X55 5G/LTE (5G: download up to 7 Gbit/s, download up to 3 Gbit/s; LTE Cat 22: download up to 2.5 Gbps, download up to 316 Mbps) Bluetooth 5; 802.11a/b/g/n/ac/ad; GPS, GLONASS, Beidou, Galileo, SSS, SBAS; USB 3.1; UFS 3.0, NVMe SSD 4 2020 8cx Kryo 495 4 and 4 Cores (2.84 GHz and 1.80 GHz) Adreno 680 (1842.5 GFLOPs) LPDDR 4X Octa 16-bit (128-bit) 2133 MHz (68.26 GB/s) 3 2019 8cx Gen 2 (180) Kryo 495 4 and 4 Adreno 690 Bluetooth 5.1 cores; 802.11a/b/g/n/ac/ax (Wi-Fi 6) 2x2 (MU-MIMO), NFC, GPS, GLONASS, Beidou, Galileo, SSS, SBAS, USB 3.1; UFS 3.0. NVMe SSD No.3 2020 Microsoft S-1 and S'2 Microsoft S'1 was announced on October 2, 2019. Together with Microsoft, it was developed exclusively for Microsoft Surface Pro X. Technically, it is a Snapdragon 8cx SoC with a faster core of the Adreno 685 processor, providing a performance of 2100 GFLOPs. On October 1, 2020, Microsoft S-2 was announced. Model Room Fab CPU (ARMv8) GPU DSP Memory Technology Modem Connection Fast Charging Availability Selection Microsoft S'1 7 nm (TSMC N7) Kryo 495 4 and 4 Core (3 GHz 1.80 GHz) Adreno 685 (2100 GFLOPs) Hexagon 690 Spectra 390 (192 MP single camera / 22 MP on 30fps dual camera with MFNR / AFL) LPDDR4X Octa-channel 16-bit 2133 MHz (68.26 GB/s) Internal: X24 LTE (Cat 20: download up to 2 Gbps, 7x20 MHz CA, 256-CUM, 4x4 MIMO at 5C. Download up to 316 Mbps, 3x20 MHz CA, 256-APM) Bluetooth 5; 802.11a/b/g/n/ac/ad; GPS, GLONASS, Beidou, Galileo, SSS, SBAS; USB 3.1; UFS 3.0, NVMe SSD 4 3 2019 Microsoft S'2 Kryo 495 4 and 4 CoreS Adreno 690 3 3 2020 Hardware Codex supported See. : The Hexagon Wearable Wearable Platform Snapdragon Wear series processor zualcomm Snapdragon Wear 2100 is designed for smart watches. It is available in both connected (4G/LTE and 3G) and connected (Bluetooth and Wi-Fi) versions. LG Watch Style uses this processor. The Snapdragon Wear 2500 was announced on June 26, 2018. Snapdragon Wear 3100 was announced on September 10, 2018. Snapdragon Wear 4100 and 4100 were announced on June 30, 2020. The difference between the two models is that the CC1110 is included in the 4100. Model number Fab CPU GPU DSP Memory technology Modem Connectivity Sampling Availability Wear 1100 x 188 28 nm LP 1 core to 1.2 GHz Cortex-A7 (ARMv7) Fixed function GPU LPDDR2 Integrated 2G/3G/LTE (Cat 1, up to 10/5 Mbit/s) Bluetooth 4.1; 802.11a/b/g/n/ac; GPS, GLONASS, Galileo, BeiDou No2 2 2016 (ARMv7) Wear 1200 1 core to 1.3 GHz Cortex-A7 (ARMv7) Integrated 2G/LTE (Cat M1, up to 300/350 kbps) Bluetooth 4.2; 802.11a/b/g/n/ac; GPS, GLONASS, Galileo, BeiDou (2 2017) MSM8909w (wear 2100,193), 2500 and 3100 and 3105) 4 cores to 1.2 GHz Cortex-A7 (ARMv7) Adreno 30 Hexagon LP DDR3 400 MHz (800 MT/s) X5 2G/3G/LTE (Cat 4, up to 150/50 Mbps) Bluetooth 4.1; 802.11b/g/n; NFC; GPS, GLONASS, Galileo, BeiDou 1 2016 SDM429w (wear 4100 and 4100)) 12 nm 4 cores to 1.7 GHz Cortex-A53 (ARMv8-A) Adreno 504 Six HSP6 V56 LPDDR3 750 MHz X5 2G/3G/LTE (Cat 4, up to 150/50 Mbit/s) Bluetooth 5.0; 802.11a/b/g/n; NFC; GPS; On January 6, 2014, glonass, Galileo, BeiDou 2 2020 and 820A Snapdragon 602A were announced. January 6, 2016 was announced Snapdragon 820A. Model number Fab CPU GPU Memory Technology Modem Connection Selection availability 8064-AU (602A) 28 nm LP 4 cores to 1.5 G GHz Krait 300 (ARMv7) Adreno 320 (2048x1536 - 1080p external display) Hexagle V40 600 MHz LPDDR3 Two-channel 32-bit 533 MHz External Gobi 9x15 (LTE: FDD/TDD Cat 3; CDMA: EV-DOrB/rA; 1x; UMTS: TD-SCDMA, DC-HSPA/HSPA; GSM: EDGE/GPRS) Bluetooth 4.1 and BLE; VIVE qualifier (802.11n/ac) 1 2014 MSM8996AU (820A) cores up to 2.1 GHz Kryo (ARMv8) Adreno 530 Hexagle 680 1 GHz LPDR4 X12 LTE (download: Cat 12, up to 600 Mbps; download: Cat 13, up to 150 Mbps) Bluetooth 4.1; 802.11ac/ad; Izat Gen8C Built-in Platforms Snapdragon 410E, 600E, 810 и 820E The Snapdragon 410E Embedded и Snapdragon 600E Embedded были анонсированы 28 сентября 2016 года. [204] Snapdragon 800 для Embedded The Snapdragon 810 для Embedded The Snapdragon 820E Embedded был анонсирован 21 февраля 2018 года. Модель номер Fab CPU GPU DSP Технология Modem Connectivity Sampling доступность AP-8016E (410E) 28 нм LP 4 ядра до 1,2 ГГц Cortex-A53 (ARMv8) Adreno 306 Шестиугольник ЗДСП6 V5 691 МГц До 13 МП камеры LPDDR2/3 Одноканальный 32-битный 533 МГц (4,2 ГБ/с) нет Bluetooth 4.0, 802.11n, GPS AP-8064E (600E) 4 ядра до 1,5 ГГц Krait 300 (ARMv7) Adreno 320 400 МГц Шестиугольник ЗДСП6 V4 500 МГц До 21 МП камеры DDR3/DDR3L Двойной канал 533 МГц Bluetooth 4,0, 802.11a/b/g/n/ac (2.4/5 ГГц), I'a Gen8A AP-8074 (800)it 400 (ARMv7) Adreno 330 Шестиугольник ЗДСП6 V5 До 55 МП камеры LPDDR3 Двухканальный 32-битный 800 МГц (12,8 ГБ/с) Bluetooth 4.1; 802.11n/ac (2,4 и 5 ГГц); Изат Gen8B; NFC, Gigabit Ethernet, HDMI, DisplayPort, SATA, SDIO, UART, I2C, GPIOs и JTAG; USB 3.0/2.0 AP-8094 (810) 210 Нм (TSMC) 4 и 4 ядра (2,0 ГГц Cortex-A57 ) 1,55 ГГц Cortex-A53; ARMv8) Adreno 430 650 МГц шестиугольник V56 800 МГц До 55 МП камеры LPDDR4 Двухканальный 32-битный 1600 МГц (25,6 ГБ/с) Bluetooth 4.1; 802.11ac; Изат Gen8C AP-8096 (820E) 14 нм FinFET LPP (Samsung) 2 и 2 ядра (2,15 ГГц и 1,593 ГГц Kryo; ARMv8) Adreno 530 Шестиугольник 680 825 МГц До 28 МП камеры LPDDR4 четырехканальный 16-битный (64-битный) 1866 МГц (29,8 ГБ/с) Bluetooth 4.1; 802.11ac/ad; 11 апреля 2018 г. была анонсирована платформа Izat Gen8C Vision Intelligence Platform. [213] Платформа «Квалкомм Vision Intelligence Platform» создана для создания мощных визуальных вычислений и передовых вычислений для машинного обучения для широкого спектра устройств IoT. Model number Fab CPU (ARMv8) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability QCS603 [215] 10 nm LPP 2 + 2 cores (1.6 GHz Kryo 360 Gold + 1.7 GHz Kryo 360 Silver) Adreno 615 (Quad HD + 4K Ultra HD external display) Hexagon 685 Spectra 270 (Up to 24 MP camera / 16 MP dual) LPDDR4X 16-bit 1866 MHz none Bluetooth 5.0, NFC, 802.11a/b/g/n/ac 1x1 (MU-MIMO) Wi-Fi up to 433 Mbit/s, GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, USB 3.1 4+ QCS605 [216] 8 cores up to 2.5 GHz Kryo 300 Spectra 270 (Up to 32 MP camera / 16 MP dual) Bluetooth 5.0, NFC, 802.11a/b/g/n/ac 2x2 (MU-MIMO) Wi-Fi up to 867 Mbit/s 14 июня 2017 г. было объявлено о создании GPS , ГЛОНАСС, Beidou, Galileo, SBAS, USB 3.1 Home Hub и smart Audio платформ qualcomm 212, 624 и Smart Audio Platform (AP-8009 и AP-8017). 9 января 2018 г. были анонсированы домашний концентратор «Квалкомм 212» (AP-8009) и домашний концентратор «Квалкомм 624» (AP-8053). ККС400 was announced on March 19, 2019. Model number Fab processor GPU DSP Technology Audio Memory Modem Connection Selection Availability AP-8009 1.3 GHz Cortex-A7 (ARMv7) Adreno 304 (HD) Hexagon 536 To 16 MP Camera LPDDR2/3 Single Channel 533 MHz ni Bluetooth 4.2, BLE 802.11a/b/g/n/ac (2.4/5 GHz) Wi-Fi AP-8017 Cores to 1.4 GHz Cortex-A53 (ARMv8) Adreno 308 (Full HD) LPDDR3 Single Channel 667 MHz AP-8053 (SDA624) Hz Cortex-A53 (ARMv8) Adreno 506 (Adreno 506) (Adreno 506) Full HD) Hexagon 546 Up to 24 MP camera / 13 MP dual LPDDR3 x 203 227 Dual-core processor no 2x hexagon V66 12x audio channels supported by Bluetooth 5.1; 802.11ax- ready, 802.11ac, 4x4 (MIMO); Sigby/15.4 1 2019S404228 quad-core processor 205 Adreno 506 (Full HD) 2307 32x Audio channels supported the platforms eXtended Reality (XR) Snapdragon XR1 and XR2 in May 2018, The company announced the creation of the Snapdragon XR1 platform, its first specially built SoC for augmented reality, virtual reality and mixed reality. In addition, the company announced that HTC Vive, Pico, Meta and Vuzix will announce consumer products with XR1 by the end of 2018. The Snapdragon XR2 5G platform was announced on December 5, 2019. Model number Fab processor (ARMv8) GPU DSP memory technology tracking the availability of the XR1 sample ? Cryo Adreno Hexagon Spectra LPDDR4X? 3DoF and 6DoF head and tracking controller? «1 2019 XR2 »234»? Kryo Adreno Hexagon Spectra LPDDR4X? ? No. 1 2020 Bluetooth SoC Platforms After the acquisition of CSR in 2015, Kvalcom designs ultra-low-power Bluetooth SoCs under CSR, KCA and KKK brands for wireless headphones and headphones. The company has worked with both Amazon and Google on a reference design to help manufacturers develop headsets with alexa, Google Assistant and Google Fast Pair support. At CES 2018, the company announced the creation of the K5100 series. On January 28, 2020, the KK304x and KK514x SoCs were published as Bluetooth 5.2 certified Bluetooth SIG. On March 25, 2020, it was officially announced that BLE Audio was officially created. The Kvalcomm KC300x Series of Bluetooth Audio SoCs Model Room Fab CPU DSP Technology Power Consumption Support DAC Output / Digital Microphone Entry Sampling availability xC3001 243 RISC processor app (up to 8 0 MHz) Single Core Kvalcomm® Kalimba™ DSP (up to 80 MHz) Bluetooth 5.0 Dual Bluetooth TrueWireless mode™ Stereo cVc™™ mono audio/ 2-microphone CC3002 TrueWireless™ Stereo aptX™ Classic/HD/LL cVc™ audio cC3003™ audio Stereo / 1-microphone K K3004 246 Stereo / 2-microphone KK3005 247 aptX™ Classic /HD/LL cVc™ audio series qualcomm KK30xx аудио SoCs Модель номер Fab CPU Bluetooth Технологии поддержки энергопотребления DAC выход / Цифровой микрофон ввода цифровой помощник активации Выборка доступности хC3020 248 Двойной процессор 32-битного приложения (до 80 МГц) Одноядерный Квалкомм® Калимба™ DSP (до 120 МГц) Bluetooth 5.0 Bluetooth Низкий датчик энергии концентратор, Двойной режим Bluetooth Bluetooth Скорость: 2 Мбит / с aptX™ Классический / HD / LL TrueWireless™ Стерео Плюс cVc™ аудио No 6mA (2DP потокового) Моно / 2-микрофон Кнопка нажмите H1 2017 хC3021 1-микрофонНЫЙ cVc3024™ аудио Google Fast Pair Stereo / 2-микрофонный cC3026™ Классический/HD/LL TrueWireless™ Stereo Plus cVc™ аудио Mono / 2-mic QCC3 aptX™ Классический/HD/LL TrueWireless™ Стерео Плюс cVc™ аудио Стерео / 1-микрофон ХК30™™34 микрофонный процессор 32-битного приложения (до 80 МГц) Одноядерный процессор qualcomm® Kalimba™ DSP (до 120 МГц) Bluetooth 5.2.238 , Bluetooth Низкий концентратор датчика энергии, Bluetooth Низкая энергия, Двойной режим Bluetooth Bluetooth Скорость: 2 Мбит / с aptX™ Классический / HD TrueWireless™ Зеркальное ANC (FeedForward / Обратная связь и гибридные) cVc™ аудио Google Fast Pair <5 мА Стерео / 2-микрофон Кнопка нажмите H1 2020 < КК3046C510x Серия Bluetooth аудио SoCs Модель номер Fab CPU DSP Bluetooth Технологии поддержки энергопотребления Цифровой помощник активации Выборка доступности QC5120 256 Двойной процессор приложения ядра 32-битный (до 80 МГц) Двойное ядро Квалкомм® Калимба™ DSP (до 120 МГц) Bluetooth 5,0 Bluetooth Низкая энергия, Bluetooth Низкий концентратор датчика энергии, Двойной режим Bluetooth Bluetooth Скорость: 2 Мбит / с aptX™ Классический / HD / LL eXtension программы TrueWireless™ Стерео Плюс ANC (FeedForward / Обратная связь и гибридные) cVc™ аудио Google Быстрая пара No 6mA (2DP потокового) , 1 Digital MIC cVc Button press Qualcomm® Voice Activation H1 2018 QCC5121[257] QCC5124[258] QCC5125[259] Single core Qualcomm® Kalimba™ DSP (Up to 120 MHz) aptX™ Classic/HD/LL eXtension program TrueWireless™ Stereo Plus ANC (FeedForward/Feedback) cVc™ audio Google Fast Pair ~10mA (2DP streaming) ~10mA HFP Narrow Band, 1 Digital MIC cVc Button press QCC5141[260] Dual core 32-bit application processor (Up to 80 MHz) Dual core Qualcomm® Kalimba™ DSP (Up to 120 MHz) Bluetooth 5.2[238][239]BLE Audio, Bluetooth Low Energy sensor hub, Bluetooth Low Energy, Dual-mode Bluetooth Speed: 2 Mbit/s aptX™ Adaptive eXtension program TrueWireless™ Mirroring ANC (FeedForward/Feedback) cVc™ audio Google Fast Pair ~5mA A2DP stream Button press Qualcomm® Voice Activation H1 2020 QCC5144[261] Related pages Qualcomm Adreno Qualcomm Hexagon Qualcomm Snapdragon LTE modem Devices using Qualcomm Snapdragon systems-on-chip See also Comparison of ARMv8-A cores Comparison of ARMv7-A cores Similar platforms A-Series APUs and by AMD-Series AllWinner Action Semiconductor Amlogic Atom and Intel Ax Core by Apple Exynos by Samsung i.MX by Freescale Semiconductor InfoTM Leadcore Technology K3Vx/Kirin by HiSilicon MStar Semiconductors MTxxxx and Helio by MediaTekTek NovaThor by ST-Ericsson Nufront OCTEON by Cavium OMAP by Texas Tools R-Car from Renesas RK3xxx by Rockchip SC by Spreadtrum Tegra by Nvidia VideoCore by Broadcom Imageon by ATI (Now AMD) Links to S1 Processor Specifications (PDF). Qualcomm. Archive (PDF) from the original dated May 14, 2018. Received on June 30, 2018. Spice Stellar Xtacy Mi-352, Android Murah Seharga 700 Ribuan. teknofun.net archive from the original dated January 9, 2015. LG Optimus L3 II. Archive from the original dated February 3, 2014. Received on November 15, 2013. Archive copy (PDF). Archive (PDF) from the original dated February 23, 2017. Received June 28, 2015.CS1 maint: archived copy as title (link) - b 1X Advanced (PDF). Archive (PDF) from the original January 4, 2014. Received on February 26, 2014. Center of documents of Kvalcomm (PDF). Qualcomm. Archive (PDF) from the original on October 5, 2012. Received on February 2, 2016. b c d e f h i j k l n o p r Snapdragon S4, S3, S2 and S1. Qualcomm. Archive from the original on June 30, 2018. Received on June 30, 2018. b Kvalcom announces the next generation of Snapdragon Mobile Chipset Family. Qualcomm. February 15, 2011. Archive from the original on March 6, 2012. Received on January 29, 2012. BlackBerry No.30 - processor. Blackberry. Blackberry. Archive from the original dated February 2, 2014. Received on October 3, 2013. Snapdragon S4 Pro MSM8960DT RISC Multi-Core App Processor with Modem. PDAdb.net archive from the original dated August 4, 2013. Received on December 19, 2013. Snapdragon S4 Pro AP-8064 RISC Multi-Core App Processor. PDAdb.net archive from the original dated December 15, 2013. Received on February 27, 2012. - b c d e f Snapdragon 200 processor. Qualcomm. October 2, 2018. Archive from the original on June 30, 2018. Received on June 30, 2018. a b c d Amaresh, Atithya (June 20, 2013). The intros new Snapdragon 200 dual and quad core chips. EFYTimes.com. EFY Group. Archive from the original on October 23, 2013. Received on June 22, 2013. The qualifier represents Snapdragon 210 and 208 processors. Qualcomm. Archive from the original on February 25, 2016. Received on February 19, 2016. - b Snapdragon 412 and 212 processors announced. Qualcomm. July 28, 2015. Archive from the original on February 25, 2016. Received on February 18, 2016. The kvalcomm 205 mobile platform, designed to connect 4G LTE to more people in more time. Qualcomm. March 20, 2017. Archive from the original on March 20, 2017. Received on March 20, 2017. ^ 205 Mobile Platform. Qualcomm. Archive from the original on March 20, 2017. Received on March 20, 2017. Snapdragon 208 processor. Qualcomm. Archive from the original dated March 3, 2016. Received on February 18, 2016. Snapdragon 210 processor. Qualcomm. Archive from the original on February 16, 2016. Received on February 18, 2016. Snapdragon 212 Mobile Platform. Qualcomm. Archive from the original on June 30, 2018. Received on June 30, 2018. The new mobile platform Kvalcomm 215 raises the bar for mass-market devices. Qualcomm. Archive from the original june 8, 2020. Received on July 18, 2020. The mobile platform Kvalcomm 215. Qualcomm. Archive from the original on May 7, 2020. Received on July 18, 2020. - b c d e f g h i j k l m n o p Snapdragon 400 Processor. Qualcomm. Archive from the original on November 26, 2016. Received on November 17, 2016. qualcomm technologies are introducing the Snapdragon 410 chipset with the world's integrated 4G LTE mode for large-scale smartphones. December 9, 2013. Archive from the original on December 10, 2013. Received on December 9, 2013. MROT reaches a historic production landmark. Qualcomm. December 17, 2014. Archive from the original july 4, 2020. Received on April 18, 2020. b 4 new Snapdragon processors by 4G LTE and multimedia to new heights. Qualcomm. February 18, 2015. Archive from the original on April 23, 2015. Received on February 26, 2015. Snapdragon 410 processor. Qualcomm. Archive from the original on June 30, 2015. Received on June 28, 2015. Snapdragon 412 processor. Qualcomm. Archive from the original on February 25, 2016. Received on February 18, 2016. Snapdragon 415 processor. Qualcomm. Archive from the original on June 30, 2015. Received on June 28, 2015. The Snapdragon 617 and 430 create mid-level high-end features. Qualcomm. Archive from the original on October 2, 2015. Received on September 16, 2015. Introduction of Snapdragon 625, 435 and 425 processors. Qualcomm. February 11, 2016. Archive from the original on February 16, 2016. Received on February 18, 2016. b New Snapdragon 653, 626, 427 processors are performance-oriented and connected. Qualcomm. October 18, 2016. Archive from the original dated November 15, 2016. Received on November 15, 2016. b zimmerman, Stephen (October 17, 2016). Introducing the qualcomm Snapdragon 653, 626 and 427: The qualifier announces the successors of the popular Mid-range SoCs. Developers XDA. Archive from the original on October 18, 2016. Received on October 17, 2016. Snapdragon 425 processor. Qualcomm. Archive from the original on June 30, 2015. Received on June 28, 2015. Snapdragon 427 Mobile Platform. Qualcomm. Archive from the original on October 30, 2016. Received on November 15, 2016. Snapdragon 430 mobile platform. Qualcomm. Archive from the original on October 2, 2015. Extracted On September 16, Snapdragon 435 Mobile Platform. Qualcomm. Archive from the original on February 16, 2016. Received on February 13, 2016. The mobile platform qualcomm Snapdragon 450 to provide 14nm FinFET process, enhanced dual camera support and fast lte connection for mid-range smartphones and tablets. Qualcomm. Archive from the original dated July 7, 2017. Received on June 29, 2017. b Introduction Snapdragon 632, 439 and 429 to enhance the mobile experience, superior performance. Qualcomm. Archive from the original on June 27, 2018. Received on June 27, 2018. Snapdragon 429 Mobile Platform. Qualcomm. Archive from the original on June 27, 2018. Received on June 27, 2018. Snapdragon 439 Mobile Platform. Qualcomm. Archive from the original on June 27, 2018. Received on June 27, 2018. a b qualifier announces Snapdragon 632, 439 and 429 - Expanding low middle level. anandtech.com. Archive from the original dated June 27, 2018. Received on June 27, 2018. Snapdragon 450 Mobile Platform. Qualcomm. Archive from the original dated July 7, 2017. Received on June 29, 2017. b c Kvalcom launches three new Mobile Snapdragon platforms to meet current demand for 4G smartphones. Qualcomm. Archive from the original on January 21, 2020. Received on January 21, 2020. Snapdragon 460 mobile platform. Qualcomm. Archive from the original on February 25, 2020. Received on January 21, 2020. a b c d e f Las Vegas. The qualifier announces the next generation of Snapdragon Premium Mobile Processors. Qualcomm. Archive from the original on December 26, 2013. Received on December 19, 2013. - b c Snapdragon 600 processor. Qualcomm. October 2, 2018. Archive from the original on December 23, 2017. Received on February 23, 2018. Barcelona (February 24, 2014). Kvalcomm Technologies announces the world's first commercial 64-bit Octa-Core chipset with integrated 5 Mode Global LTE. Qualcomm. Archive from the original dated April 4, 2014. Received on April 8, 2014. Snapdragon 610 and 615: The qualifier continues its 64-bit Warpath with 4/8th Cortex A53 samples. Anandtech. Archive from the original dated April 4, 2014. Received on April 8, 2014. The Snapdragon 616 processor debuts with a Huawei smartphone. Qualcomm. Archive from the original on February 25, 2016. Received on February 18, 2016. Snapdragon 610 processor. Qualcomm. Archive from the original dated November 4, 2016. Received on November 16, 2016. Snapdragon 615 processor. Qualcomm. October 2, 2018. Archive from the original dated March 3, 2016. Received on February 18, 2016. Snapdragon 616 processor. Qualcomm. Archive from the original dated March 18, 2016. Received on February 18, 2016. Introduction Snapdragon 625 and 435. Qualcomm. Archive from the original on February 16, 2016. Received on February 18, 2016. Snapdragon 653, 626 processors focus on advanced performance. Qualcomm. Archive from the original on November 15, Received on November 15, 2016. Snapdragon 617 processor. Qualcomm. Archive from the original on October 2, 2015. Received on September 16, 2015. Snapdragon 625 mobile platform. Qualcomm. Archive from the original on February 16, 2016. Received on February 18, 2016. Snapdragon 626 mobile platform. Qualcomm. Archive from the original on June 27, 2018. Received on June 30, 2018. Level snapdragon 600 processors are repositioned to reflect advanced performance. Qualcomm. Archive from the original on December 22, 2015. Received on December 17, 2015. Snapdragon 650 mobile platform. Qualcomm. Archive from the original on December 22, 2015. Received on December 17, 2015. Snapdragon 652 mobile platform. Qualcomm. Archive from the original on December 22, 2015. Received on December 17, 2015. Snapdragon 653 mobile platform. Qualcomm. Archive from the original dated November 15, 2016. Received on November 15, 2016. The Kvalcomm Snapdragon 660 and 630 Mobile Platforms Drive Advanced Photography, Advanced Gaming, Integrated Communication and Machine Learning. Qualcomm. Archive from the original on May 9, 2017. Received on May 12, 2017. The qualcomm Snapdragon 636 mobile platform delivers significant performance, gaming and display technology. Qualcomm. Archive from the original on October 17, 2017. Received on October 17, 2017. Snapdragon 630 mobile platform. Qualcomm. Archive from the original on June 21, 2018. Received on June 21, 2018. The qualifier announces the Snapdragon 660 and 630 Mobile Platforms: Better Connection, Camera, and Compute at 14nm. anandtech.com archive from the original dated July 20, 2018. Received on July 20, 2018. Snapdragon 660 and 630: Mehr Power and Akku, Fast Charging 4 and Bluetooth 5. winfuture.de archive from the original dated July 20, 2018. Received on July 20, 2018. Snapdragon 636 mobile platform. Qualcomm. Archive from the original on June 30, 2018. Received on June 30, 2018. Snapdragon 660 mobile platform. Qualcomm. Archive from the original on June 21, 2018. Received on June 21, 2018. Introduce the Snapdragon 670 for superior performance, camera capabilities, and AI technology. Qualcomm. Archive from the original dated August 8, 2018. Received on August 8, 2018. Snapdragon 632 Mobile Platform. Qualcomm. Archive from the original on June 27, 2018. Received on June 27, 2018. Snapdragon 670 mobile platform. Qualcomm. Archive from the original dated August 8, 2018. Received on August 8, 2018. The qualifier announces the Snapdragon 670 Mobile Platform. xda-developers. August 8, 2018. Archive from the original dated August 8, 2018. Received on August 8, 2018. The mobile platform qualcomm Snapdragon 675 brings outstanding games with advanced AI and advanced camera performance to consumers in early 2019. Qualcomm. Archive from the original on October 23, 2018. Received on October 23, 2018. a b qualcomm lets you amazing Experience with the new snapdragon 730, 730G and 665 mobile platforms for high- and mid-range global devices. Qualcomm. Archive from the original on April 12, 2019. Received on April 12, 2019. Introducing the Snapdragon 665 for a high-imperative mobile experience through camera, gaming and AI. Qualcomm. Archive from the original on April 12, 2019. Received on April 12, 2019. Snapdragon 662 Mobile Platform. Qualcomm. Archive from the original on February 22, 2020. Received on January 21, 2020. Snapdragon 665 Mobile Platform. Qualcomm. Archive from the original on April 12, 2019. Received on April 12, 2019. Snapdragon 675 mobile platform. Qualcomm. Archive from the original on October 23, 2018. Received on October 23, 2018. The qualifier announces the Snapdragon 675 - 11nm Mid-range Cortex A76 basis. anandtech.com archive from the original dated October 23, 2018. Received on October 23, 2018. The qualifier announces the first 5G Snapdragon 6-series mobile platform. Qualcomm. Archive from the original on June 17, 2020. Received on June 18, 2020. Snapdragon 690 5G Mobile Platform. Qualcomm. Archive from the original on June 17, 2020. Received on June 17, 2020. The qualifier introduces a new series of Snapdragon 700 mobile platforms. Qualcomm. Archive from the original dated February 27, 2018. Received on February 27, 2018. More premium features on more device experience: How the Snapdragon 710 can enhance the mobile experience. Qualcomm. Archive from the original on May 24, 2018. Received on May 24, 2018. Snapdragon 712: Performance Enhancement provides premium features in games and beyond. Qualcomm. Archive from the original dated February 7, 2019. Received on February 7, 2019. Snapdragon 710 mobile platform. Qualcomm. Archive from the original on May 24, 2018. Received on May 24, 2018. Snapdragon 712 Mobile Platform. Qualcomm. Archive from the original on February 9, 2019. Received on February 7, 2019. Snapdragon 712 Mobile Platform. Qualcomm. January 22, 2019. Archive from the original on February 9, 2019. Received on May 27, 2019. The Snapdragon 730 and 730G provide a powerful gaming and leading AI industry. Qualcomm. Archive from the original on April 12, 2019. Received on April 12, 2019. The qualifier announces the Snapdragon 732G to improve high-level mobile gaming. Qualcomm. Received on August 31, 2020. Snapdragon 720G Mobile Platform. Qualcomm. Archive from the original on March 11, 2020. Received on January 21, 2020. Snapdragon 730 mobile platform. Qualcomm. Archive from the original on April 13, 2019. Received on April 12, 2019. Snapdragon 730G Mobile Platform. Qualcomm. Archive from the original on April 13, 2019. Received on April 12, 2019. Snapdragon 732G Mobile Platform. Qualcomm. Received on August 31, 2020. Kvalcomm is expanding its mobile leadership, bringing 5G experiences to more time-consuming users around the world. Qualcomm. Archive from the original on 4, 2019. Received on December 4, 2019. Shilov, Anton. A qualifier to update the smartphone GPU Driver every quarter, develops a GPU inspector tool. www.anandtech.com. Archive from the original on March 27, 2020. Received on May 11, 2020. The qualifier addresses the growing demand for 5G by announcing a new Snapdragon 768G mobile platform. Qualcomm. Archive from the original on May 21, 2020. Received on May 11, 2020. The qualifier is adding a new 5G mobile platform to the Snapdragon 7-Series. Qualcomm. Received on September 22, 2020. Snapdragon 750G 5G Mobile Platform. Qualcomm. Received on September 22, 2020. Snapdragon 765 5G Mobile Platform. Qualcomm. Archive from the original dated December 4, 2019. Received on December 4, 2019. Snapdragon 765G 5G Mobile Platform. Qualcomm. Archive from the original dated December 4, 2019. Received on December 4, 2019. Snapdragon 768G 5G Mobile Platform. Qualcomm. Archive from the original on May 11, 2020. Received on May 11, 2020. Snapdragon 802 processor update. Qualcomm. February 15, 2014. Archive from the original on June 30, 2015. b c Shimpi, Anand Lal. The difference between Snapdragon 800 and 801: Clearing confusion. Archive from the original on June 15, 2018. Received on June 15, 2018. The Snapdragon 801 processor is a smooth step up from the Snapdragon 800 processor. Qualcomm. February 23, 2014. Archive from the original on March 16, 2014. Received on April 8, 2014. b c d e f g Snapdragon 801. Qualcomm. Archive from the original on June 30, 2018. Received on June 30, 2018. Kvalcomm Technology announces the next generation of Snapdragon 805 Ultra HD processor. Qualcomm. Archive from the original on February 25, 2016. Received on February 19, 2016. b c SnapDragon 835 : 25% d'autonomie en plus? The processers are HardWare.fr. Archive from the original on June 13, 2018. Received on June 13, 2018. - b c d e Snapdragon 800 processor. Qualcomm. Archive from the original on September 15, 2015. Received on September 27, 2015. The difference between Snapdragon 800 and 801: Clearing confusion. AnandTech. Archive from the original on April 5, 2014. Received on April 8, 2014. Ismumi Mi3. AnandTech. September 5, 2013. Archive from the original on September 6, 2013. Received on September 5, 2013. Saanakorn, Nuttida. Sony announces the new flagship Xperia No. 2 phone and tablet on MWC (en) snapdragon processors from qualcomm. Qualcomm. Archive from the original on March 2, 2014. Received on February 26, 2014. Joshua (February 24, 2014). Samsung Announces Galaxy S5: Initial Thoughts. Anand Tech. Archive from the original on October 26, 2014. Received on October 20, 2014. MSM8974AC processor. Third- party media. November 15, 2013. Archive from the original dated March 22, 2014. Received on April 8, 2014. Snapdragon 805 processor. Qualcomm. Archive from the original on June 30, 2015. Get 28, 2015. The qualifier announces the final connected computing of snapdragon 810 and 808 processors of the next generation. Qualcomm. Archive from the original dated March 4, 2016. Received on February 19, 2016. b Snapdragon 808 processor. Qualcomm. Archive from the original on October 12, 2015. Received on September 26, 2015. The qualifier announces its support for the Vulkan API on the GPU Adreno 530. Qualcomm. Archive from the original on October 31, 2016. Received on September 19, 2016. Learn Snapdragon 808 with X10 LTE - Kvalcomm. Archive from the original dated March 29, 2016. Received on April 12, 2016. b Snapdragon 810 processor. Qualcomm. Archive from the original on June 30, 2015. Received on June 28, 2015. a b Snapdragon 808/810 from qualcomm. Archive from the original dated April 8, 2014. Received on April 7, 2014. Andrey Frumusanu and Jan Katress. LG Announces G4: 5.5-inch ED with Snapdragon 808. anandtech.com archive from the original dated June 30, 2015. Received on June 28, 2015. Adreno 420 kvalcomm. notebookcheck.net archive from the original dated June 30, 2015. Received on June 28, 2015. The qualifier expands LTE capabilities in the Snapdragon 810 to add a Category 9 Aggregation carrier - Kvalcomm. Qualcomm. Archive from the original on June 30, 2015. Received on June 28, 2015. Devices with Snapdragon 810 and 808 come in H1 next year. Archive from the original on October 1, 2014. Received on September 29, 2014. Ho, Joshua; Andrey Frumusan (February 12, 2015). Understanding qualcomm's Snapdragon 810: Performance preview. Anandtech. Archive from the original dated March 2, 2015. Received on March 1, 2015. I'd like to see Ho, Joshua. Snapdragon 810 v2 and v2.1 comparison: More memory bandwidth, higher hours. www.anandtech.com archive from the original dated December 2, 2019. Received on June 16, 2019. b Qualifier announces Snapdragon 820 with Kryo processor. GSMArena.com archive from the original dated July 16, 2015. Received on July 15, 2015. - b First Snapdragon 820 powered smartphone announced at CES Archive January 5, 2017, by Wayback Machine - Qualcomm.com, January 5, 2016 - Le Max Pro becomes the world's first SD820 smartphone, which was launched on January 5, 2017, at Wayback Machine - GSM Arena, February 23, 2016 - b Snapdragon 821 is based on the success of the processor 820 - Qualcomm.com, July 11, 2016 - Introduction of fast charging 3.0. Qualcomm.com archive from the original dated September 26, 2015. Received on September 16, 2015. b Snapdragon 820 Mobile Platform. Qualcomm. Archive from the original dated February 22, 2018. Received on February 23, 2018. b Snapdragon 821 Mobile Platform. Qualcomm. Archive from the original on June 30, 2018. Received on June 30, 2018. a b zimmerman, Stephen (October 18, 2016). Look at what has changed from the Snapdragon 820 to the Snapdragon 821 to Google Pixel phones. Xda Archive from the original on October 21, 2016. Received on October 18, 2016. Stephen zimmerman (July 24, 2017). Xiaomi Mi Note 2 XDA Review: a capable flagship and solid first step on the world stage. Developers XDA. Archive from the original dated July 24, 2017. Received on August 3, 2017. Get small, go big: Meet the next-generation Snapdragon 835. Qualcomm. November 17, 2016. Archive from the original dated November 18, 2016. Received on November 17, 2016. a b c d e f Frumusan, Andrew. Samsung Galaxy S9 and S9 review: Exynos and Snapdragon at 960fps. www.anandtech.com. Archive from the original june 8, 2020. Received on May 25, 2019. The qualifier announces the Snapdragon 835 and fully fits the specification of Fast Charging 4. ExtremeTech. November 17, 2016. Archive from the original dated November 18, 2016. Received on November 18, 2016. b Qualifier launches technological innovation with advances in the always connected PC and its next-generation Mobile Snapdragon platform. Qualcomm. Archive from the original on June 27, 2018. Received on June 30, 2018. Snapdragon 845: Innovative and intelligent mobility experiences start here. Qualcomm. December 7, 2017. Archive from the original dated December 7, 2017. Received on December 7, 2017. b c Snapdragon 845 Mobile Platform. Qualcomm. Archive from the original dated December 7, 2017. Received on December 6, 2017. Bruno Ferreira (December 6, 2017). The qualifier lifts the veil on the Snapdragon 845 SoC. Technology report. Archive from the original dated December 10, 2017. Received on December 9, 2017. b c d Product Short Snapdragon 845 (PDF). Qualcomm. 2018. Archive (PDF) from the original dated June 12, 2018. Received on June 12, 2018. Smith, Andrew Frumusan, Ryan. Performance preview of Snapdragon 845: Installation of the scene for the flagship Android 2018. Archive from the original on June 11, 2018. Received on June 12, 2018. The secure Snapdragon 845 processor protects your data. xda-developers. December 6, 2017. Archive from the original on June 17, 2018. Received on June 17, 2018. How can the Snapdragon 845 protect smartphone data like storage?. Qualcomm. Archive from the original on June 17, 2018. Received on June 17, 2018. Snapdragon 835 Mobile Platform. Qualcomm. Archive from the original dated September 17, 2018. Received on February 20, 2018. Report: Samsung has exclusive rights to the Snapdragon 835 before the launch of the Galaxy S8. Trusted Revie. January 24, 2017. Archive from the original dated February 23, 2017. Received on February 22, 2017. The qualifier announces the new flagship mobile platform Snapdragon 855 - the new decade of 5G, AI and XR. Qualcomm. December 5, 2018. Archive from the original dated December 6, 2018. Received on December 6, 2018. Snapdragon 855: Premier mobile platform for the new decade of 5G, AI and XR. Qualcomm. December 5, 2018. Archive from the original on December 7, Received on December 6, 2018. Frumusan, Andrei. Samsung Galaxy S10 Snapdragon and Exynos Review: Almost perfect, but so flawed. www.anandtech.com. Archive from the original june 8, 2020. Received on May 25, 2019. Snapdragon 855 qualifier: Review of its processor, GPU, isp and DSP. xda-developers. December 5, 2018. Archive from the original dated December 6, 2018. Received on December 6, 2018. Andrey Gruber (July 8, 2019). Mobile GPU power and performance. High performance graphics. Qualcomm. Archive from the original dated July 20, 2019. Received on July 20, 2019. And b Shilov, Anton. A qualifier to update the smartphone GPU Driver every quarter, develops a GPU inspector tool. www.anandtech.com. Archive from the original on March 27, 2020. Received on March 27, 2020. Frumusan, Andrei. Snapdragon 855 Pre-Dive: Going Into Details of the 2019 Flagship Android SoC. www.anandtech.com archive from the original dated January 27, 2019. Received on January 27, 2019. 01net. Snapdragon 855 : tout ce que que vous devez savoir sur le nouveau monstre de qualcomm. 01net (in French). Archive from the original dated December 6, 2018. Received on January 28, 2019. Snapdragon 855 Mobile Platform Product Brief (PDF). Archive (PDF) from the original January 27, 2019. Received on January 27, 2019. Snapdragon 855 Plus Mobile Platform announces the qualifier. July 15, 2019. Archive from the original july 4, 2020. Received on July 18, 2020. Snapdragon 855 Mobile Platform. Qualcomm. Archive from the original on December 7, 2018. Received on December 6, 2018. Snapdragon X50 5G Modem. Qualcomm. Archive from the original on August 10, 2019. Received August 11, 2019. Snapdragon 855 mobile platform. Qualcomm. Archive from the original june 1, 2020. Received on July 18, 2020. The qualifier represents the world's most advanced 5G mobile platform. Qualcomm. December 4, 2019. Archive from the original dated December 4, 2019. Received on December 4, 2019. Andrey Frumusan (December 4, 2019). The qualifier announces Snapdragon 865 and 765 (G): 5G for all in 2020, all the details. www.anandtech.com. Anandtech. Archive from the original on March 6, 2020. Received on January 31, 2020. Andrey Frumusan (December 4, 2019). The qualifier announces Snapdragon 865 and 765 (G): 5G for all in 2020, all details (page 2). www.anandtech.com. Anandtech. Archive from the original on March 6, 2020. Received on January 31, 2020. The qualifier announces the Snapdragon 865 Plus 5G Mobile Platform. Qualcomm. July 8, 2020. Archive from the original dated July 9, 2020. Received on July 9, 2020. Snapdragon 865 5G Mobile Platform. Qualcomm. Archive from the original dated December 4, 2019. Received on December 4, 2019. b Snapdragon X55 5G Modem. Qualcomm. Archive from the original dated August 17, 2019. Received August 11, 2019. Snapdragon 865 5G Mobile Platform. Qualcomm. July 8, 2020. Received on July 8, 2020. Snapdragon 850 Mobile Computing Platform for Windows 10 PC announces a qualifier. Qualcomm. June 4, 2018. Archive from the original on June 13, 2018. Received on June 5, 2018. The qualifier represents the world's first 7-nanometer PC platform. Qualcomm. December 6, 2018. Archive from the original on December 7, 2018. Received on December 6, 2018. Snapdragon 8cx: The most extreme Snapdragon. Ever. Qualcomm. December 6, 2018. Archive from the original on December 7, 2018. Received on December 6, 2018. Snapdragon Powered Always On, Always Connected PC Portfolio Expansion disrupts entry, mainstream, and premium mobile PCs industry. Qualcomm. December 5, 2019. Archive from the original on December 6, 2019. Received on December 6, 2019. The qualifier drives the 5G PC Ecosystem expansion with the next-generation computing platform, powered by new 2-in-1 laptops from OEMs including Acer in 2020. Qualcomm. September 3, 2020. Snapdragon 835 Mobile PC PLATFORM. Qualcomm. Archive from the original on June 30, 2018. Received on June 30, 2018. Snapdragon 850 Mobile Computing Platform. Qualcomm. Archive from the original on June 5, 2018. Received on June 5, 2018. Snapdragon 7c Computing platform. Qualcomm. Archive from the original on December 6, 2019. Received on December 6, 2019. Snapdragon 8c Computing platform. Qualcomm. Archive from the original on December 6, 2019. Received on December 6, 2019. Snapdragon 8cx Computing Platform. Qualcomm. Archive from the original on December 7, 2018. Received on December 6, 2018. Snapdragon 8cx Gen 2 5G computing platform. Qualcomm. Received on September 3, 2020. Surface Pro X: Cristiano Amon shares how qualcomm and Microsoft have over-interrupted mobile computing. Qualcomm. October 2, 2019. Archive from the original on December 6, 2019. Received on December 6, 2019. Everything we know about Microsoft's custom processor is inside the Surface Pro X. Tom's hardware. October 2, 2019. Received on October 4, 2019. The Pro X surface is getting better: Kvalcomm and Microsoft continue to redefine mobile computing. Qualcomm. October 1, 2020. LG Watch Style Wearable with Snapdragon Wear 2100 - Kvalcomm. Archive from the original on April 20, 2017. Received on April 19, 2017. The qualifier helps accelerate the 4G Kid Watch segment with the Snapdragon Wear 2500 Kvalcomm platform. Qualcomm. Archive from the original on June 27, 2018. Received on June 27, 2018. The qualcomm Snapdragon Wear 3100 platform supports the new ultra-low power system architecture for next-generation smartwatches. Qualcomm. Archive from the original from September 11, 2018. Received on September 10, 2018. The qualifier Snapdragon-wearing 4100 platforms include new and enhanced custom capabilities to fuel accelerated growth Devices. Qualcomm. June 30, 2020. Archive from the original July 2, July, Received on June 30, 2020. Snapdragon Wear 1100 Processor. Archive from the original dated September 10, 2017. Received on September 10, 2017. Snapdragon Wear 1100 Product Brief (PDF). Archive (PDF) from the original dated August 17, 2017. Received on August 16, 2017. Snapdragon Wear 1200 Processor. Archive from the original dated September 10, 2017. Received on September 10, 2017. Snapdragon Wear 1200 Product Brief (PDF). Archive (PDF) from the original dated August 17, 2017. Received on August 17, 2017. MSM8909w Processor. Qualcomm. Archive from the original dated July 22, 2018. Received on July 21, 2018. Snapdragon Wear 2100 Processor. Qualcomm. Archive from the original dated April 9, 2017. Received on April 19, 2017. Snapdragon Wear 2500 Platform. Qualcomm. Archive from the original dated July 22, 2018. Received on July 21, 2018. Snapdragon Wear 3100 Platform. Qualcomm. Archive from the original from September 11, 2018. Received on September 10, 2018. Snapdragon Wear 2100 Product Brief (PDF). Archive (PDF) from the original June 11, 2017. Received on August 16, 2017. Snapdragon Wear 4100 Platform. Qualcomm. June 24, 2020. Archive from the original june 30, 2020. Received on June 30, 2020. Snapdragon Wear 4100 Platform Product Brief (PDF). Archive (PDF) from the original July 1, 2020. CES 2016: The future of connected cars. Qualcomm. Archive from the original on February 24, 2018. Received on February 23, 2018. The qualifier introduces Snapdragon automotive solutions for in-car infotainment. Qualcomm. Archive from the original on November 8, 2014. Received on April 8, 2014. Snapdragon 820 Automotive Processors will debut at CES 2016. Qualcomm. Archive from the original on February 24, 2018. Received on February 23, 2018. Snapdragon 602A. Qualcomm. Archive from the original on February 1, 2018. Received on February 19, 2018. Snapdragon 820A. Qualcomm. October 2, 2018. Archive from the original on February 24, 2018. Received on February 23, 2018. Snapdragon 600E and 410E processors help IoT manufacturers design, build and scale. Qualcomm. Archive from the original on February 24, 2018. Received on February 23, 2018. The Snapdragon 600E and 410E qualifiers are designed for embedded computing, Internet of Things applications are now widely available. Qualcomm. Archive from the original on February 24, 2018. Received on February 23, 2018. The qualifier is expanding its built-in computing portfolio and bringing its premium processors to advanced IoT applications. Qualcomm. February 21, 2018. Archive from the original on February 24, 2018. Received on February 23, 2018. Snapdragon 410E Built-in Platform. Qualcomm. October 2, 2018. Archive from the original on February 1, 2018. Received on February 23, 2018. Snapdragon 600E Built-in Platform. Qualcomm. Archive from the original on February 24, 2018. Get 23, 2018. Snapdragon 800 processor for built-in. Qualcomm. Archive from the original on June 30, 2018. Received on June 30, 2018. Snapdragon 810 Processor for built-in. Qualcomm. Archive from the original on February 24, 2018. Received on February 23, 2018. Snapdragon 820E Built-in Platform. Qualcomm. Archive from the original on February 24, 2018. Received on February 23, 2018. Kvalcomm Vision Intelligence Platform. Qualcomm. Archive from the original dated July 21, 2018. Received on July 21, 2018. The qualifier represents a Vision Intelligence platform specifically designed for IoT devices that are on the latest advances in camera, artificial intelligence and computer vision. Qualcomm. Archive from the original dated July 21, 2018. Received on July 21, 2018. Made for IoT: Meet the Kvalcomm Vision Intelligence Platform. Qualcomm. Archive from the original dated July 21, 2018. Received on July 21, 2018. Kvalcomm KK603 SoC. Qualcomm. Archive from the original on August 1, 2018. Received on July 21, 2018. KK605 SoC qualifier. Qualcomm. Archive from the original on August 1, 2018. Received on July 21, 2018. b with kvalcomm Smart Audio Platform. Qualcomm. Archive from the original on February 24, 2018. Received on February 23, 2018. The qualifier announces a highly flexible smart speaker platform with a unique combination of voice support and multi-comical streaming capability. Qualcomm. Archive from the original on February 24, 2018. Received on February 23, 2018. Kvalcomm 212 Main Platform Hub. Qualcomm. Archive from the original dated July 21, 2018. Received on July 21, 2018. The home hub platform kvalcomm 624. Qualcomm. Archive from the original dated July 21, 2018. Received on July 21, 2018. Kvalcomm announces new Home Hub platforms that support Android things to bring Google's assistant into households around the world. Qualcomm. Archive from the original on February 24, 2018. Received on February 23, 2018. Kvalcom launches new high-integration SOC with AI support and a special smart Speaker Platform to help stimulate the evolution of smart Audio. Qualcomm. March 19, 2019. Archive from the original on May 16, 2020. Received on May 11, 2019. AP-8009 processor. Qualcomm. Archive from the original dated July 21, 2018. Received on July 21, 2018. SDA212 SOM. Qualcomm. Archive from the original on February 24, 2018. Received on February 23, 2018. AP-8053 processor. Qualcomm. Archive from the original dated July 21, 2018. Received on July 21, 2018. SDA624 SOM. Qualcomm. Archive from the original on February 24, 2018. Received on February 23, 2018. KKS403. Qualcomm. February 20, 2019. Archive from the original dated July 11, 2019. Received on May 11, 2019. KKS404. Qualcomm. February 20, 2019. Archive from the original dated July 11, 2019. Received on May 11, 2019. KKS405. Qualcomm. February 20, 2019. Archive from the original on May 2, 2020. 2019 - KKS407. Qualcomm. February 20, 2019. Archive from the original dated July 11, 2019. Received on May 11, 2019. Smith, Ryan. The qualifier announces the XR1 Platform: Dedicated SoC for VR/XR headsets, coming in late 2018. www.anandtech.com archive from the original dated October 14, 2019. Received on May 19, 2019. I'qualcomm Technologies announces the world's first 5G XR platform. Qualcomm. Archive from the original on December 6, 2019. Received on December 6, 2019. Snapdragon XR1 platform. Qualcomm. October 2, 2018. Archive from the original on April 30, 2020. Received on May 19, 2019. Платформа Snapdragon XR2 5G. Qualcomm. Archive from the original on December 6, 2019. Received on December 6, 2019. In Amazon.com, the qualifier put the Alexa assistant in more headphones. Reuters. October 23, 2018. Archive from the original dated October 4, 2019. Received on May 19, 2019. Lee, Abner (May 9, 2019). Google's qualifier works to help create faster pairing and assistant headphones. 9to5Google. archive from the original dated July 11, 2019. Received on May 19, 2019. The qualifier wants to triple the time it's listening to Bluetooth headphones. Control Android. January 8, 2018. Archive from the original dated December 5, 2019. Received on May 19, 2019. b c Launch Studio - D046352 Listing Details. launchstudio.bluetooth.com. Archive from the original January 29, 2020. Received on January 29, 2020. b c Launch Studio - D046351 Listing Details. launchstudio.bluetooth.com. Archive from the original January 29, 2020. Received on January 29, 2020. LE Audio: A new era of Bluetooth audio sharing. Qualcomm. January 27, 2020. Archive from the original january 29, 2020. Received on January 29, 2020. The new ultra-low power Bluetooth audio SOCs from the qualifier improve the truly wireless sound. Qualcomm. March 25, 2020. Archive from the original on March 27, 2020. Received on March 27, 2020. New audio technology helps bring out the best in truly wireless headphones. Qualcomm. March 25, 2020. Archive from the original on March 27, 2020. Received on March 27, 2020. KK3001. Qualcomm. October 2, 2018. Archive from the original dated July 11, 2019. Received on May 19, 2019. KK3002. Qualcomm. October 2, 2018. Archive from the original dated July 11, 2019. Received on May 19, 2019. KK3003. Qualcomm. October 2, 2018. Archive from the original dated July 11, 2019. Received on May 19, 2019. KK3004. Qualcomm. October 2, 2018. Archive from the original dated July 11, 2019. Received on May 19, 2019. KK3005. Qualcomm. October 2, 2018. Archive from the original dated July 11, 2019. Received on May 19, 2019. KK3020. Qualcomm. October 2, 2018. Archive from the original on May 24, 2020. Received on May 19, 2019. KK3021. Qualcomm. October 2, 2018. Archive from the original dated July 11, 2019. Received on May 19, 2019. KK3024. Qualcomm. October 2, 2018. Archive from the original July 11, 2019. Received on May 19, 2019. KK3026. Qualcomm. October 2, 2018. Archive from the original january 15, 2020. Received on May 19, 2019. KK3031. Qualcomm. October 2, 2018. Archive from the original on March 27, 2020. Received on May 19, 2019. KK3034. Qualcomm. October 2, 2018. Archive from the original on March 27, 2020. Received on May 19, 2019. KK3040 Entry-level trueWireless Bluetooth audio BGA Soc. Qualcomm. March 17, 2020. Archive from the original on March 27, 2020. Received on March 27, 2020. KK3046 Mid-Level TrueWireless Bluetooth Audio WLCSP. Qualcomm. March 19, 2020. Archive from the original on March 27, 2020. Received on March 27, 2020. KC5120. Qualcomm. October 2, 2018. Archive from the original dated July 11, 2019. Received on May 19, 2019. KC5121. Qualcomm. October 2, 2018. Archive from the original on March 27, 2020. Received on May 19, 2019. KC5124. Qualcomm. October 2, 2018. Archive from the original january 29, 2020. Received on May 19, 2019. KC5125. Qualcomm. October 2, 2018. Archive from the original january 29, 2020. Received on May 19, 2019. Chipset KK5141 Premium Level WLCSP Package for TrueWireless earbuds. Qualcomm. March 19, 2020. Archive from the original on March 27, 2020. Received on March 27, 2020. CHIPS5144 Chipset Premium BGA Package for TrueWireless Earbuds. Qualcomm. March 19, 2020. Archive from the original on March 27, 2020. Received on March 27, 2020. External Links Official Website, product page derived from

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