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The Oklahoma Computer Equipment Recovery Act: a Summary of the 2014 Manufacturer Annual Reports
The Oklahoma Computer Equipment Recovery Act: A Summary of the 2014 Manufacturer Annual Reports 6/23/2015 Oklahoma Department of Environmental Quality Melissa Adler-McKibben Submitted To: The Governor, the President Pro Tempore of the Senate, and the Speaker of the House of Representatives [1] Introduction The Oklahoma Computer Equipment Recovery Act (“Act”), 27A O.S. § 2-11-601 et seq ., was signed into law on May 12, 2008 and became effective on January 1, 2009. The Act requires manufacturers, as defined in 27A O.S. § 2-11-603, to submit annual reports to the Oklahoma Department of Environmental Quality (“DEQ”) no later than March 1 st of each year that include: 1. A summary of the recovery program implemented by the manufacturer during the previous calendar year, specifically describing the methods of recovery implemented by the manufacturer; 2. The weight of covered devices collected and recovered during the previous calendar year; 3. The location and dates of any electronic waste collection events during the previous calendar year, if any, and the location of collection sites if any; and 4. Certification that the collection and recovery of covered devices complies with the provisions of Section 9 of the Act. 1 The Act requires DEQ to summarize the recovery program in a report for the Governor, the President Pro Tempore of the Senate, and the Speaker of the House of Representatives. Background The Act was created as part of an ongoing, nationwide effort, embraced and supported by the computer industry, to establish convenient and environmentally sound collection, recycling, and reuse of electronics that have reached the end of their useful lives. -
(Form Factor), Btx (Form Factor), Computer Form
0NB8RPHZLWIR » Book » Motherboard Form Factors: Atx, at (Form Factor), Btx (Form Factor), Computer Form... Read eBook Online MOTHERBOARD FORM FACTORS: ATX, AT (FORM FACTOR), BTX (FORM FACTOR), COMPUTER FORM FACTOR, COM EXPRESS, COREEXPRESS, DIAMOND SYSTEMS CORPORATION, To read Motherboard Form Factors: Atx, at (Form Factor), Btx (Form Factor), Computer Form Factor, Com Express, Coreexpress, Diamond Systems Corporation, PDF, please refer to the hyperlink beneath and download the document or gain access to other information which might be have conjunction with MOTHERBOARD FORM FACTORS: ATX, AT (FORM FACTOR), BTX (FORM FACTOR), COMPUTER FORM FACTOR, COM EXPRESS, COREEXPRESS, DIAMOND SYSTEMS CORPORATION, book. Download PDF Motherboard Form Factors: Atx, at (Form Factor), Btx (Form Factor), Computer Form Factor, Com Express, Coreexpress, Diamond Systems Corporation, Authored by Source Wikipedia Released at 2016 Filesize: 2.04 MB Reviews A really awesome pdf with perfect and lucid reasons. Yes, it is actually engage in, continue to an interesting and amazing literature. I am effortlessly will get a delight of studying a published pdf. -- Shaniya Stamm Extremely helpful to all of group of people. It really is loaded with wisdom and knowledge I am just delighted to inform you that this is actually the best pdf we have read within my personal existence and might be he very best publication for possibly. -- Lon Jerde This publication is amazing. it absolutely was writtern very completely and helpful. Its been printed in an remarkably straightforward way and it is simply after i finished reading through this ebook through which in fact altered me, change the way i think. -- Jodie Schneider TERMS | DMCA EGV2GBDX9VA8 » PDF » Motherboard Form Factors: Atx, at (Form Factor), Btx (Form Factor), Computer Form.. -
Questions and Answers Report Version 4 RFP 30431 # Question
Questions and Answers Report Version 4 RFP 30431 # Question Response 1 In general: are the Yes these are obligatory and define the minimum requirements obligatory or requirements. Bidders can exceed these. target criteria? Please note that some have been listed as optional (i.e. not obligatory). 2 “The Processor shall be scalable It is foreseen that there will be three potential base from E3825 to Intel i7” this models: means we can offer different • Atom processor or equivalent in a “signage” models with different computer form factor that would be the size of a Processors? It’s not possible to VESA mount computer that is DIN rail mountable. provide a mainboard which can Important that it has four RS232 DB9 port. This would use Atom CPU and Core-I CPU be a small “simple” version; and • The larger DIN rail as well as 19” computer shall be based on the same processor (i7 or equivalent), chipset, motherboard and basic I/O that could include options outlined in the specification (scalable with the options and size). It is indicated in the specification when the requirement applies to the 19” only. 3 All of the requirements are See answer to question 1. obligatory for both mechanical versions (Din-Rail and 19”)? 4 The range of processors is very Intel i7-3555LU supports Windows XP SP3. Some wide. The new i7 processor manufacturers offering this processor are also offering does not support use of drivers for other components contained within a windows XP. computer with this processor and chipset. 5 Could you please be more This is up to the bidders to propose. -
Tws2502 2U Motherboard Rackmount Workstation
TWS2502 2U MOTHERBOARD RACKMOUNT WORKSTATION Trenton Systems’ legendary performance and longevity now costs less! FEATURES • Dual processor computing power in a compact package • Low total cost of ownership • Standardized base configuration means low lead time • Motherboard supports a wide variety of Intel® Xeon® processors • Accomodates up to 8 hot swap, front access 3.5” HDD/SSDs • Short chassis depth for added deployment flexibility • Assembled, validated and configured in the USA Trenton TWS2502 Rackmount Workstation (Shown with and without front dust cover) TWS2502 OVERVIEW: The TWS2502 is ideal for applications that require dual-processor performance and reliability provided by Intel® Xeon® E5-2600 v3 series processors, while maintaining a modest worksta- tion-class price point. The TWS2502 workstation’s standard ATX form factor, combined with a commerical, off the shelf chassis and motherboard solution keeps cost low while not compromising system performance and maintaining a competitive feature set. Eight, front-facing hot-swappable 3.5” hard disk carriers, with 2 additional internal 2.5” drive bays make configuring the TWS2502 for various storage applications easy and the 6 half-height PCIe option card slots allow for additional deployment flexibility when utilizing COTS expansion cards. The TWS2502 is built on a standard, 19” rackmount computer form factor, allowing easy component rack configuration while the compact 22.5” external depth measurement ensures the TWS2502 will easily adapt to your deployment constraints. TWS2502 CHASSIS LAYOUT CONFIGURATION: 19.0” 48.26cm Front View with and without dust cover 22.5” 57.15cm 3.5” 8.89cm Rear View Top View Side View with upper cover removed TRENTON RACKMOUNT WORKSTATION: TWS2502 MODEL DESCRIPTION TWS2502 This rackmount workstation features a long-life ATX motherboard with a base configuration featuring dual Intel® Xeon® E5-2620v3 (Haswell-EP) processors to deliver workstation performance with long life and exceptional value. -
Sustainable Electronics Vision Report
1 Vision for Sustainable Electronics Page 2 ______________________________________________________________________________________________________________________________ Vision for Sustainable Electronics July 2015 NOTE: This is a discussion draft (NOT YET FOR PUBLIC RELEASE), for which we are seeking comments, edits, and feedback from experts from industry, academia, government and NGO’s. Please send us any feedback by October 1, 2015, to: [email protected] Thank-you. Barbara Kyle and Ted Smith, ETBC Electronics TakeBack Coalition 4200 Park Blvd. #228, Oakland, CA 94602 www.electronicstakeback.org Vision for Sustainable Electronics Page 3 ______________________________________________________________________________________________________________________________ Contents Executive Summary Page 2 Why do we need a vision for sustainable electronics? Page 4 It’s time for new strategies for sustainability in electronics Page 7 What are the current impacts from the lifecycle of electronics Page 9 - 24 products? • Hazards and harm • Destruction of communities and resources • Wasted natural resources: energy and water. • Wasteful inputs. High resource churn of virgin materials, many of which are scarce. • Wasteful outputs. • Sweatshop working conditions. • A business model that makes problems worse (that thwarts sustainability efforts) The New Vision for Sustainable Electronics Must Offer Solutions Page 24 to Current Impacts and Problems Principles for Sustainable Electronics Page 27 The Sustainability Matrix Page 29 Detailed Vision Goals Across Product Lifecycle Conclusions Page 38 Next steps Page 41 Glossary of terms Page 47 Vision for Sustainable Electronics Page 2 ______________________________________________________________________________________________________________________________ Executive summary Definitely not green. In spite of all of the hype about “Clean Tech” branding, it’s easy to see that the electronics industry has a long way to go to become a “green” industry, if that’s even possible. -
BCIS 1305 Business Computer Applications
BCIS 1305 Business Computer Applications BCIS 1305 Business Computer Applications San Jacinto College This course was developed from generally available open educational resources (OER) in use at multiple institutions, drawing mostly from a primary work curated by the Extended Learning Institute (ELI) at Northern Virginia Community College (NOVA), but also including additional open works from various sources as noted in attributions on each page of materials. Cover Image: “Keyboard” by John Ward from https://flic.kr/p/tFuRZ licensed under a Creative Commons Attribution License. BCIS 1305 Business Computer Applications by Extended Learning Institute (ELI) at NOVA is licensed under a Creative Commons Attribution 4.0 International License, except where otherwise noted. CONTENTS Module 1: Introduction to Computers ..........................................................................................1 • Reading: File systems ....................................................................................................................................... 1 • Reading: Basic Computer Skills ........................................................................................................................ 1 • Reading: Computer Concepts ........................................................................................................................... 1 • Tutorials: Computer Basics................................................................................................................................ 1 Module 2: Computer -
ETX Carrier Board Series
ETX Carrier Board Series EAP-EX92 ETX Carrier Board EAP-EX61 Half-size PISA-bus ETX Carrier Board Features Features • Accepts Avalue’s & 3rd Party’s ETX CPU Module • Half Size PISA Bus Single Board Computer Form Factor • VGA / LVDS / Audio / TV-out Interface • Accepts Avalue’s & 3rd Party’s ETX CPU Module • Optional Built-in Touch Screen I/F • VGA / LVDS / Audio / TV-out Interface • 1 Mini PCI, 1 CF, 4 COM, 8 USB • 1 CF, 1 DOC, 2 COM, 4 USB System System 4 PCI • Form Factor Special Form Factor • Form Factor Half Size CPU Card • CPU Module Socket 4 x 100-pin connectors • CPU Module Socket 4 x 100-pin connectors • I/O Chip Winbond W83977EG-AW • SSD One M-Systems DiskOnChip, Type I/II CF socket • SSD Type I/II CF socket • Expansion 1 Mini PCI I/O • MIO 2 x EIDE, 1 x FDD/LPT, 1 x RS-232, Built-in Touch Screen (Optional) 1 x RS-232/422/485, 1 x K/B & Mouse • Chipset PenMount DMC9000 • IrDA Connector 5 x 1, pitch 2.0 mm header • Touch Screen Interface With 9-pin 2 mm box header (can be selected to • USB Connector Two 5 x 2, pitch 2.54 mm headers support 4 x USB support 4/5/8-wire touch screen) Connectors I/O • External Connector PS/2 K/B & Mouse (Mini-DIN), RJ-45, COM 1 (DB-9), • MIO 2 x EIDE, 1 x LPT, 3 x RS-232, 1 x RS-232/422/485, & VGA (DB-15) 1 x K/B & Mouse • IrDA Connector 5 x 1, pitch 2.54 mm header • LVDS Connector One HIROSE DF13-40DP-1.25V • USB Connector Two double deck USB connectors support 4 USB, two • TV-out Connector One 8 x 2, pitch 2.54 mm header (with Audio) single deck USB connectors support 2 USB and • Audio Connector -
PPC3-12-413 Intel® Atom™ E3800 12.1-Inch Panel PC with PC104 Expansion
PPC3-12-413 Intel® Atom™ E3800 12.1-inch Panel PC with PC104 Expansion Features Compact LCD Panel • 12.1-inch TN LCD panel with resistive touchscreen • Brightness up to 500 nits (cd/m2) • 1024 x 768 resolution Performance for Industrial IoT Applications • Intel® Atom™ E3800 Processor • Up to 8 GB DDR3L System Memory • Time Coordinated Computing Rugged Design for Demanding Environments • -10ºC to +70ºC Operating Temperature Range • EBX Single Board Computer Form Factor Fast Graphics at High Resolutions • Intel® Gen7 Graphics Engine • Multiple Displays Supported • Full-HD and 3D Graphics Acceleration Secure and Trusted Data • Intel Security Engine • Cryptographic Acceleration Connectivity and I/O for Embedded Systems • 2x Ethernet • 7x USB 2.0 • 48x GPIO with Event Sense • 4x Serial Ports (RS232/422/485) • 1x LPT Expansion Options • PC/104-Plus (PC/104 and PCI-104) • 2x MiniCard Sockets • 1x mSATA Socket (shared with MiniCard) Product Description The PPC3-12-413 from WINSYSTEMS utilizes the E3800 family of Atom™ processors from Intel® to provide low power and high performance in a compact 12.1-inch Panel PC. Designed for harsh environments and reliability, the design includes fanless operating temperature ranges from -10ºC to +70ºC. WINSYSTEMS offers the PPC3-12-413 in multi-core options to fit a variety of application requirements. Scalable performance includes a choice of dual or quad-core processors with up to 8GB of DDR3L memory and PC/104-Plus connectors. This industrial Panel PC is a full-featured embedded system with a variety of on-board I/O options. Two additional display interfaces (MiniDisplayPort, and VGA) allow support for concurrent video output with the LVDS interface to the 12.1-inch LCD panel. -
It Is Smart Only If It Sustainable
IT IS SMART ONLY IF IT IS SUSTAINABLE Environmentally Friendly Business Strategies as a Source of Creating Bigger Value Pool and Reducing Negative Environmental Impacts By Mohammad Tashfeen Khan July 24, 2016 A Major Paper submitted to the Faculty of Environmental Studies in partial fulfillment of the requirements for the Degree of Master in Environmental Studies, York University, Toronto Ontario, Canada Dr. Ellie Perkins (Superviser) __________________________________________ Mohammad Tashfeen Khan (MES Candidate) ___________________________________________ IT IS SMART ONLY IF IT IS SUSTAINABLE IT IS SMART ONLY IF IT IS SUSTAINABLE “We have met the enemy and he is us”. Walt Kelly “We cannot “Modern command technology owes Nature except ecology an by obeying her.” apology.” Francis Bacon Alan M. Eddison “Earth provides enough to satisfy every man's needs, but not every man's greed.” Mahatma Gandhi Major Paper MES 2016 Mohammad Tashfeen Khan (212984142) i IT IS SMART ONLY IF IT IS SUSTAINABLE Contents Chapter 1: Introduction: Starting with a Concluding Point ............................................................................................. 1 1.1 Environmental Sustainability ................................................................................................................................ 1 1.2 The Smartphone Dilemma .................................................................................................................................... 3 Chapter 2: Methodological Approach ............................................................................................................................ -
Motherboard Components Details Pdf
Motherboard components details pdf Continue The main printed circuit board (PCB) for computing devices for other purposes, see Motherboard (disambiguation). A motherboard for a desktop personal computer showing the typical components and interfaces that are on the motherboard. This model corresponds to the microATX form factor, the overall motherboard layout used in many desktops. The motherboard (also called the main board, main printing board, system board, skirting board, plank, logic board and mobo) is the main printing board (PCB) in general computers and other expandable systems. It holds and allows you to communicate between many of the most important electronic components of the system, such as the CPU (processor) and memory, and provides connectors for other peripherals. Unlike a backplan, the motherboard typically contains significant subsystems such as a central processor, chipset I/O and memory controllers, interface connectors, and other components integrated for general use. Motherboard means, in particular, a PCB with expansion capabilities. As the name suggests, this board is often referred to as the mother of all the components attached to it, which often include peripherals, interface maps, and daughters: sound cards, graphics cards, network maps, hard drives, and other forms of permanent storage; TV tuner cards, cards providing additional USB or FireWire slots; and a host of other custom components. Dell Precision T3600 System Motherboard, used in professional CAD workstations. Manufactured in 2012 in a similar way, the term mainboard describes a single- board device and without additional extensions or features such as control boards in laser printers, televisions, washing machines, mobile phones and other built-in systems with disabilities. -
Smartphone Sustainability Assessment Using Multi-Criteria Analysis and Consumer Survey
DEGREE PROJECT IN ENVIRONMENTAL ENGINEERING, SECOND CYCLE, 30 CREDITS STOCKHOLM, SWEDEN 2017 Smartphone sustainability assessment using multi-criteria analysis and consumer survey JANIS GEDUSEVS KTH ROYAL INSTITUTE OF TECHNOLOGY SCHOOL OF ARCHITECTURE AND THE BUILT ENVIRONMENT DEGREE PROJECT IN THE BUILT ENVIRONMENT, SECOND CYCLE, 30 CREDITS STOCKHOLM, SWEDEN 2017 Smartphone sustainability assessment using multi-criteria analysis and consumer survey JANIS GEDUSEVS Supervisor PhD.Rajib Sinha Examiner Monika Olsson Supervisor at Tech Buddy AB Tahero Nori Degree Project in Environmental Engineering KTH Royal Institute of Technology School of Architecture and Built Environment Department of Sustainable Development, Environmental Science and Engineering SE-100 44 Stockholm, Sweden Acknowledgements I would like to thank Tahero Nori for hosting and supervising my graduation internship at Techbuddy AB. Also I would like to express my gratitude to PhD. Rajib Sinha and Monika Olsson for supervising and counselling my graduation internship. Finally, I would like to express my gratitude to all of my friends and family for support during my studies at KTH Royal Institute of Technology Stockholm. 1 Abstract Sustainability is a fairly new emerging business concept for manufacturing industry and this this thesis will specifically focus on smartphone sustainability. In 2015 there were 1.86 billion smartphone users and it is estimated to increase to 2.87 billion in 2020. Currently the average lifetime of a smartphone is 21 months and according to Consumer Technology Association the technical life expectancy of a smartphone is 4.7 years. The European Commission approximated that from 17–20 kg of electronic waste is produced per person per year and that smartphones are contributors for increase of electronic waste. -
Sustainable Electronics Roadmap
EPA/600/R-13/285 | November 2013 www.epa.gov Sustainable Electronics Roadmap Office of Research and Development National Risk Management Research Laboratory Sustainable Technology Division Cincinnati, OH 45268 i EPA/600/R-13/285 November 2013 Sustainable Electronics Roadmap Sustainable Electronics Forum October 15-18, 2012 The Johnson Foundation at Wingspread Racine, WI by Jennifer McCulley, PhD. Scientific Consulting Group, Inc. Endalkachew Sahle-Demessie, Ph.D. U.S. Environmental Protection Agency National Risk Management Research Laboratory Cincinnati, Ohio 45268 Sustainable Technology Division National Risk Management Research Laboratory Office of Research and Development U.S. Environmental Protection Agency Cincinnati, OH 45268 Disclaimer The U.S. Environmental Protection Agency (EPA), through the Office of Research and Development, in collaboration with the Green Electronics Council and The Johnson Foundation at Wingspread organized the Sustainable Electronics Forum that was facilitated by the Scientific Consulting Group, Inc. EPA Contract number EP-W-07-078. This document has been subjected to the Agency’s peer and administrative review and has been approved for publication. Any opinions expressed in this report are those of the authors and forum participants, and do not necessarily reflect the views of the Agency; therefore, no official endorsement should be inferred. Any mention of trade names or commercial products does not constitute endorsement or recommendation for use. iii Acknowledgement The Organizing Committee wishes to acknowledge everyone who participated in this Forum, especially our sponsoring organizations and facilitators. The committee also wishes to express its appreciation to Jennifer McCulley and Susie Warner of Scientific Consultant Group, Inc., who were Work Assignment and Project Officers for organizing the Forum through the EPA Contract number EP-W-07-078.