Actions Semiconductor Co., Ltd. Form 20-F Filed 2013-04-25
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Wind River Vxworks Platforms 3.8
Wind River VxWorks Platforms 3.8 The market for secure, intelligent, Table of Contents Build System ................................ 24 connected devices is constantly expand- Command-Line Project Platforms Available in ing. Embedded devices are becoming and Build System .......................... 24 VxWorks Edition .................................2 more complex to meet market demands. Workbench Debugger .................. 24 New in VxWorks Platforms 3.8 ............2 Internet connectivity allows new levels of VxWorks Simulator ....................... 24 remote management but also calls for VxWorks Platforms Features ...............3 Workbench VxWorks Source increased levels of security. VxWorks Real-Time Operating Build Configuration ...................... 25 System ...........................................3 More powerful processors are being VxWorks 6.x Kernel Compatibility .............................3 considered to drive intelligence and Configurator ................................. 25 higher functionality into devices. Because State-of-the-Art Memory Host Shell ..................................... 25 Protection ..................................3 real-time and performance requirements Kernel Shell .................................. 25 are nonnegotiable, manufacturers are VxBus Framework ......................4 Run-Time Analysis Tools ............... 26 cautious about incorporating new Core Dump File Generation technologies into proven systems. To and Analysis ...............................4 System Viewer ........................ -
Vxworks Architecture Supplement, 6.2
VxWorks Architecture Supplement VxWorks® ARCHITECTURE SUPPLEMENT 6.2 Copyright © 2005 Wind River Systems, Inc. All rights reserved. No part of this publication may be reproduced or transmitted in any form or by any means without the prior written permission of Wind River Systems, Inc. Wind River, the Wind River logo, Tornado, and VxWorks are registered trademarks of Wind River Systems, Inc. Any third-party trademarks referenced are the property of their respective owners. For further information regarding Wind River trademarks, please see: http://www.windriver.com/company/terms/trademark.html This product may include software licensed to Wind River by third parties. Relevant notices (if any) are provided in your product installation at the following location: installDir/product_name/3rd_party_licensor_notice.pdf. Wind River may refer to third-party documentation by listing publications or providing links to third-party Web sites for informational purposes. Wind River accepts no responsibility for the information provided in such third-party documentation. Corporate Headquarters Wind River Systems, Inc. 500 Wind River Way Alameda, CA 94501-1153 U.S.A. toll free (U.S.): (800) 545-WIND telephone: (510) 748-4100 facsimile: (510) 749-2010 For additional contact information, please visit the Wind River URL: http://www.windriver.com For information on how to contact Customer Support, please visit the following URL: http://www.windriver.com/support VxWorks Architecture Supplement, 6.2 11 Oct 05 Part #: DOC-15660-ND-00 Contents 1 Introduction -
MIPS IV Instruction Set
MIPS IV Instruction Set Revision 3.2 September, 1995 Charles Price MIPS Technologies, Inc. All Right Reserved RESTRICTED RIGHTS LEGEND Use, duplication, or disclosure of the technical data contained in this document by the Government is subject to restrictions as set forth in subdivision (c) (1) (ii) of the Rights in Technical Data and Computer Software clause at DFARS 52.227-7013 and / or in similar or successor clauses in the FAR, or in the DOD or NASA FAR Supplement. Unpublished rights reserved under the Copyright Laws of the United States. Contractor / manufacturer is MIPS Technologies, Inc., 2011 N. Shoreline Blvd., Mountain View, CA 94039-7311. R2000, R3000, R6000, R4000, R4400, R4200, R8000, R4300 and R10000 are trademarks of MIPS Technologies, Inc. MIPS and R3000 are registered trademarks of MIPS Technologies, Inc. The information in this document is preliminary and subject to change without notice. MIPS Technologies, Inc. (MTI) reserves the right to change any portion of the product described herein to improve function or design. MTI does not assume liability arising out of the application or use of any product or circuit described herein. Information on MIPS products is available electronically: (a) Through the World Wide Web. Point your WWW client to: http://www.mips.com (b) Through ftp from the internet site “sgigate.sgi.com”. Login as “ftp” or “anonymous” and then cd to the directory “pub/doc”. (c) Through an automated FAX service: Inside the USA toll free: (800) 446-6477 (800-IGO-MIPS) Outside the USA: (415) 688-4321 (call from a FAX machine) MIPS Technologies, Inc. -
Using Virtualization to Implement a Scalable Trusted Execution Environment in Secure Socs
Using Virtualization to Implement a Scalable Trusted Execution Environment in Secure SoCs Document Number: MD00993 Revision 01.00 December 3, 2012 Unpublished rights (if any) reserved under the copyright laws of the United States of America and other countries. This document contains information that is proprietary to MIPS Tech, LLC, a Wave Computing company (“MIPS”) and MIPS’ affiliates as applicable. Any copying, reproducing, modifying or use of this information (in whole or in part) that is not expressly permitted in writing by MIPS or MIPS’ affiliates as applicable or an authorized third party is strictly prohibited. At a minimum, this information is protected under unfair competition and copyright laws. Violations thereof may result in criminal penalties and fines. Any document provided in source format (i.e., in a modifiable form such as in FrameMaker or Microsoft Word format) is subject to use and distribution restrictions that are independent of and supplemental to any and all confidentiality restrictions. UNDER NO CIRCUMSTANCES MAY A DOCUMENT PROVIDED IN SOURCE FORMAT BE DISTRIBUTED TO A THIRD PARTY IN SOURCE FORMAT WITHOUT THE EXPRESS WRITTEN PERMISSION OF MIPS (AND MIPS’ AFFILIATES AS APPLICABLE) reserve the right to change the information contained in this document to improve function, design or otherwise. MIPS and MIPS’ affiliates do not assume any liability arising out of the application or use of this information, or of any error or omission in such information. Any warranties, whether express, statutory, implied or otherwise, including but not limited to the implied warranties of merchantability or fitness for a particular purpose, are excluded. Except as expressly provided in any written license agreement from MIPS or an authorized third party, the furnishing of this document does not give recipient any license to any intellectual property rights, including any patent rights, that cover the information in this document. -
RISC-V Geneology
RISC-V Geneology Tony Chen David A. Patterson Electrical Engineering and Computer Sciences University of California at Berkeley Technical Report No. UCB/EECS-2016-6 http://www.eecs.berkeley.edu/Pubs/TechRpts/2016/EECS-2016-6.html January 24, 2016 Copyright © 2016, by the author(s). All rights reserved. Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. To copy otherwise, to republish, to post on servers or to redistribute to lists, requires prior specific permission. Introduction RISC-V is an open instruction set designed along RISC principles developed originally at UC Berkeley1 and is now set to become an open industry standard under the governance of the RISC-V Foundation (www.riscv.org). Since the instruction set architecture (ISA) is unrestricted, organizations can share implementations as well as open source compilers and operating systems. Designed for use in custom systems on a chip, RISC-V consists of a base set of instructions called RV32I along with optional extensions for multiply and divide (RV32M), atomic operations (RV32A), single-precision floating point (RV32F), and double-precision floating point (RV32D). The base and these four extensions are collectively called RV32G. This report discusses the historical precedents of RV32G. We look at 18 prior instruction set architectures, chosen primarily from earlier UC Berkeley RISC architectures and major proprietary RISC instruction sets. Among the 122 instructions in RV32G: ● 6 instructions do not have precedents among the selected instruction sets, ● 98 instructions of the 116 with precedents appear in at least three different instruction sets. -
Endodontics • Infection Control @Septodont USA Contact Your Septodont Rep
A partnered publicationFor Dental with Dental Sales Professionals Sales Pro • www.dentalsalespro.com June, 2010 For Dental Sales Professionals April 2013 Selling opportunities around implants Many implants are sold direct, but there are still opportunities for dealer reps Alcohol Free. Fragrance Free. Worry Free. Introducing NEW Sani-Cloth® AF3. Protecting your patients has never been easier! • Ideal for use around patients and staff Fragrance free formulation. No harsh odors. NEW! • Quat-based disinfection against TB, HIV, HBV and HCV Effective against 44 microorganisms in 3 minutes. • Perfect for equipment and other hard surfaces sensitive to alcohol Compatible with most healthcare equipment. Providing solutions for your customers is as easy as AF3! FREE sample at pdipdi.com/AF3 © 2013 PDI. SELLTO WIN! Win a 32GB Apple® iPad mini when you sell $5000 in any combination of: • OraVerse® (Phentolamine Mesylate) • Biodentine® (15 & 5 Pack) • N’Durance® Dimer Core • N’Durance® Universal Composite • N’Durance® Cristal Composite • N’Durance® Dimer Flow Orders effective 1/1/13 - 6/30/13 Contact your Septodont Rep! Photo courtesy of Apple® Inc. •Utilize this opportunity to build your business, while helping dentists innovate their’s. Please allow 4-8 weeks for delivery. Sales of Biodentine, OraVerse and the following N’Durance products only: Dimer Core, Universal Composite and Dimer Flow will be accumulated from January 1, 2013-June 30, 2013. N’Durance Dimer Core, N’Durance Universal Composite, N’Durance Cristal, N’Durance Dimer Flow, OraVerse and Biodentine are all registered trademarks of Septodont Inc. Not to be combined with any other Septodont offer. Apple® is a registered trademark of Apple Inc. -
Computer Architectures an Overview
Computer Architectures An Overview PDF generated using the open source mwlib toolkit. See http://code.pediapress.com/ for more information. PDF generated at: Sat, 25 Feb 2012 22:35:32 UTC Contents Articles Microarchitecture 1 x86 7 PowerPC 23 IBM POWER 33 MIPS architecture 39 SPARC 57 ARM architecture 65 DEC Alpha 80 AlphaStation 92 AlphaServer 95 Very long instruction word 103 Instruction-level parallelism 107 Explicitly parallel instruction computing 108 References Article Sources and Contributors 111 Image Sources, Licenses and Contributors 113 Article Licenses License 114 Microarchitecture 1 Microarchitecture In computer engineering, microarchitecture (sometimes abbreviated to µarch or uarch), also called computer organization, is the way a given instruction set architecture (ISA) is implemented on a processor. A given ISA may be implemented with different microarchitectures.[1] Implementations might vary due to different goals of a given design or due to shifts in technology.[2] Computer architecture is the combination of microarchitecture and instruction set design. Relation to instruction set architecture The ISA is roughly the same as the programming model of a processor as seen by an assembly language programmer or compiler writer. The ISA includes the execution model, processor registers, address and data formats among other things. The Intel Core microarchitecture microarchitecture includes the constituent parts of the processor and how these interconnect and interoperate to implement the ISA. The microarchitecture of a machine is usually represented as (more or less detailed) diagrams that describe the interconnections of the various microarchitectural elements of the machine, which may be everything from single gates and registers, to complete arithmetic logic units (ALU)s and even larger elements. -
MIPS SDE 6.X Programmers' Guide
TECHNOLOGIES MIPS® SDE 6.x Programmers’ Guide Document Number: MD00428 Revision 1.17 April 4, 2007 MIPS Technologies, Inc 1225 Charleston Road Mountain View,CA94043-1353 Copyright © 1995-2007 MIPS Technologies, Inc. All rights reserved. Copyright © 1995-2007 MIPS Technologies, Inc. All rights reserved. Unpublished rights (if any) reserved under the copyright laws of the United States of America and other countries. This document contains information that is proprietary to MIPS Technologies, Inc. (‘‘MIPS Technologies’’). Any copying, reproducing, modifying or use of this information (in whole or in part) that is not expressly permitted in writing by MIPS Technologies or an authorized third party is strictly prohibited. At a minimum, this information is protected under unfair competition and copyright laws. Violations thereof may result in criminal penalties and fines. Anydocument provided in source format (i.e., in a modifiable form such as in FrameMaker or Microsoft Word format) is subject to use and distribution restrictions that are independent of and supplemental to anyand all confidentiality restrictions. UNDER NO CIRCUMSTANCES MAYADOCUMENT PROVIDED IN SOURCE FORMATBEDISTRIBUTED TOATHIRD PARTY IN SOURCE FORMATWITHOUT THE EXPRESS WRITTEN PERMISSION OF MIPS TECHNOLOGIES, INC. MIPS Technologies reserves the right to change the information contained in this document to improve function, design or otherwise. MIPS Technologies does not assume anyliability arising out of the application or use of this information, or of anyerror or omission in such information. Anywarranties, whether express, statutory,implied or otherwise, including but not limited to the implied warranties of merchantability or fitness for a particular purpose, are excluded. Except as expressly provided in anywritten license agreement from MIPS Technologies or an authorized third party,the furnishing of this document does not give recipient anylicense to anyintellectual property rights, including anypatent rights, that coverthe information in this document. -
Wind River General Purpose Platform Vxworks® Edition PRODUCT NOTE
Wind River General Purpose Platform VxWorks® Edition PRODUCT NOTE Wind River General Purpose Platform, VxWorks Edition (version The real-time operating system: 3.0) unifi es a robust real-time operating system, a powerful ® Integrated Development Environment (IDE), fl exible middleware VxWorks 6.0 solutions, training to jump-start your development, and VxWorks is the most established and most widely deployed device Professional Services when you need them to extend your software operating system. Its performance, scalability, and capabilities. footprint make more than 300 million devices worldwide run faster s 02 and more reliably. fy 05 WIND RIVER GENERAL PURPOSE PLATFORM 3.0, The next generation of VxWorks adds powerful new features and VXWORKS EDITION COMPONENTS: a focus on openness, performance, reliability and interoperability. VxWorks 6.0 A new release of Wind River’s industry-leading real-time With VxWorks 6.0 companies can: operating system. • Optimize developer productivity through open standards Wind River Workbench 2.2 • Increase reliability through MMU-based memory protection A new release of Wind River’s fully integrated IDE. • Accelerate time-to-market through enhanced error management Middleware • Seamlessly migrate existing VxWorks-based IP and other Powerful capabilities to support fl ash fi le systems, distributed existing IP, including open source message passing and shared backplane memory. • Continue to deliver products that rely on the core attributes of VxWorks, including high performance, reliability, determinism, low latency and scalability IDE Complementary solution elements include an integrated development environment (Wind River Workbench), broad middleware availability, broad processor and Board Support Package (BSP) availability, Wind River Services support, legions of experienced VxWorks developers and an expansive ecosystem Middleware Distributed Messaging* of tools, hardware, middleware and application providers. -
Low-Power High Performance Computing
Low-Power High Performance Computing Panagiotis Kritikakos August 16, 2011 MSc in High Performance Computing The University of Edinburgh Year of Presentation: 2011 Abstract The emerging development of computer systems to be used for HPC require a change in the architecture for processors. New design approaches and technologies need to be embraced by the HPC community for making a case for new approaches in system design for making it possible to be used for Exascale Supercomputers within the next two decades, as well as to reduce the CO2 emissions of supercomputers and scientific clusters, leading to greener computing. Power is listed as one of the most important issues and constraint for future Exascale systems. In this project we build a hybrid cluster, investigating, measuring and evaluating the performance of low-power CPUs, such as Intel Atom and ARM (Marvell 88F6281) against commodity Intel Xeon CPU that can be found within standard HPC and data-center clusters. Three main factors are considered: computational performance and efficiency, power efficiency and porting effort. Contents 1 Introduction 1 1.1 Report organisation . 2 2 Background 3 2.1 RISC versus CISC . 3 2.2 HPC Architectures . 4 2.2.1 System architectures . 4 2.2.2 Memory architectures . 5 2.3 Power issues in modern HPC systems . 9 2.4 Energy and application efficiency . 10 3 Literature review 12 3.1 Green500 . 12 3.2 Supercomputing in Small Spaces (SSS) . 12 3.3 The AppleTV Cluster . 13 3.4 Sony Playstation 3 Cluster . 13 3.5 Microsoft XBox Cluster . 14 3.6 IBM BlueGene/Q . -
Proaptiv: Efficient Performance on a Fully-Synthesizable Core
proAptiv: Efficient Performance on a Fully-Synthesizable Core 28 August 2012 Ranganathan “Suds” Sudhakar Chief Architect 1 © 2012 MIPS Technologies, Inc. All rights reserved. Aptiv Family Highlights Three new cores optimized for embedded markets 2 © 2012 MIPS Technologies, Inc. All rights reserved. Aptiv Core Portfolio Classic MIPS Products Aptiv™ Generation Family Single-Threaded 1 to 6 core configs, Area Optimized Hi-speed FPU and MP version L2 cache controller 1074K Series 74K Series Out of Order Dual issue Family Multi-Threaded MP version Power Optimized 1 to 4 core configs, 1004K 2-level MT/FPU and Series L2 cache controller 34K Series 24K/24KE Multi-threading Series 9-stage pipeline 8-stage pipeline Family DSP-Accelerated M14K/c MCU (cacheless) or Energy Optimized M4K/4KE Series Series MPU (caches/TLBs) with real-time/security Code compression 4 stage pipeline 5 stage pipeline 3 © 2012 MIPS Technologies, Inc. All rights reserved. What is a “Soft” Core? Fully synthesizable “package” . Design data • RTL • Configurator – MP/MT, FPU, Trace/Debug, cache/TLB/SPRAM/buffer sizes, bus widths . Physical design support • Reference floorplans, Synthesis + Place-and-Route scripts • DFT/Scan, Timing and Power Analysis scripts . Simulation models • Bus Functional Models and compliance checkers • Instruction accurate simulators, Cycle exact simulators . Verification collateral • Architectural Verification Test suites, core diagnostics • Sample testbench, build and run scripts . Documentation • ISA manuals, global configuration register tables, memory maps, boot procedures • Implementer’s Guide, Integrator’s Guide, Hardware/Software User manuals Available separately . FPGA development boards . EJTAG/debug probes . OS components, libraries, software toolchains (compiler, libraries, JITs, codecs) 4 © 2012 MIPS Technologies, Inc. -
Actions ATJ2135 Product Datasheet Latest Version: 1.1
Actions ATJ2135 Product Datasheet Latest Version: 1.1 DEC 2006 ATJ2135 PRODUCT DATASHEET Declaration Circuit diagrams and other information relating to products of Actions Semiconductor Company, Ltd. (“Actions”) are included as a means of illustrating typical applications. Consequently, complete information sufficient for construction is not necessarily given. Although the information has been examined and is believed to be accurate, Actions makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and disclaims any responsibility for inaccuracies. Information in this document is provided solely to enable use of Actions’ products. The information presented in this document does not form part of any quotation or contract of sale. Actions assumes no liability whatsoever, including infringement of any patent or copyright, for sale and use of Actions’ products, except as expressed in Actions’ Terms and Conditions of Sale for. All sales of any Actions products are conditional on your agreement of the terms and conditions of recently dated version of Actions’ Terms and Conditions of Sale agreement Dated before the date of your order. This information does not convey to the purchaser of the described semiconductor devices any licenses under any patent rights, copyright, trademark rights, rights in trade secrets and/or know how, or any other intellectual property rights of Actions or others, however denominated, whether by express or implied representation, by estoppel, or otherwise. Information Documented here relates solely to Actions products described herein supersedes, as of the release date of this publication, all previously published data and specifications relating to such products provided by Actions or by any other person purporting to distribute such information.