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MICRO.Tec 2003 Applications - Trends - Visions © 2008 AGI-Information Management Consultants May be used for personal purporses only or by Proceedings libraries associated to dandelon.com network. MICRO.tec 2003 Applications - Trends - Visions 2nd VDE World Microtechnologies Congress October 13-15, 2003 International Congress Centre, Munich, Germany Organized by VDE Association for Electrical, Electronic & Information Technologies Sponsored by EUREL, IEE, VDI/VDE-IT, VDMA, ZVEI m vw i VDE IT Convention of National Soctitiis at Eltctrical Engine«ri of Europe Zentralverband X/DAA A ElektrotechnikElektrotechnik-- 1und Elektronikindustrie e.V. UB/TIB Hannover 89 VDE VERLAG GMBH • Berlin • Offenbach Contents Plenary Session I PL 1.1 Opportunities of Micro Systems Technology in Life Siences, Communication and Control 17 N. F. de Rooij, University of Neuchatel and EPFL, Switzerland PL 1.2 A Micro/Nanotechnology Approach for Probe Based Data Storage 25 Peter Vettiger, T. Albrecht, M. Despont, U. Drechsler, U. Diirig, B. Gotsmann, D. Jobin, W. Haberle, M. A. Lantz, H. Rothuizen, R. Stutz, D. Wiesmann, G.K. Binnig, P. Bachtold, G. Cherubini, A. Dholakia, Ch. Hagleitner, T. Loeliger, H. Pozidis, E. Eleftheriou, IBM Research, Zurich Research Laboratory, Riischlikon, Switzerland Plenary Session II PL 2.1 Trends in System Integration Technologies 29 H. Reichl, M. J. Wolf. R. Aschenbrenner, Fraunhofer Institute, Berlin, Germany PL 2.2 Industrial Manufacturing of Microsystems 37 E. Westkamper, Fraunhofer Institute, Stuttgart, Germany Technical Session 1 - Micro- and Nano Fabrication 1.1 Keynote Micro- and IMano-Powder-Technologies for Advancend Ceramic Micro-Components . 45 J. HauRelt, Forschungszentrum Karlsruhe, Germany 1.2 Non-reactive and Reactive Ion Etching Processes for Patterning Magnetic MEMS Components 51 M. Balke, H. Liithje, G. Brauer, Fraunhofer Institute, Braunschweig; T. Budde, H. H. Gatzen, Hannover University, Germany 1.3 Ensuring Reliability and Repeatability in Deep X-Ray LIGA Process - State of Standardization 53 P. Meyer, L. Hahn, J. Schulz, K. Bade, A. Janssen, R. Thelen, Forschungszentrum Karlsruhe, Germany; J. Lange, Precision Engineering AG, Schaffhausen, Swizerland; M. Arendt, ANKA GmbH, Karlsruhe, Germany 1.4 Investigatipn and First Results of uECM Processing of Microstructures for Micro Moulds 59 A. Schoth, R. Forster, W. Menz, Albert Ludwig University Freiburg, Germany Technical Session 2 - Microfluidic Systems I 2.1 Keynote Micro-Liquid Handling Devices for Biochemical Analysis 67 R. Miyake, Hitachi Ltd., Ibaraki, Japan 5 2.2 Highly Parallel Droplet Release in a Nanoliter Dispenser 73 0. Gutmann, R. Kuehlewein, R. Niekrawietz, C. Steinert, B. de Heij, M. Daub, R. Zengerle, IMTEK University of Freiburg, Germany 2.3 Micromachined ESI Nozzle for On-Chip Application 77 A. Rudzinski, T. Muiler, A. Neyer, University of Dortmund; W. Nigge, M. Schilling, R. Hergenroder, Institute of Spectrochemistry and Applied Spectroscopy, Dortmund, Germany 2.4 Plastic Capillary Systems for Biomedical Research and Diagnosis 81 D. Herrmann, A. E. Guber, M. Heckele, P. Henzi, A. Muslija, R. Truckenmiiller, L. Eichhorn, Th. Gietzelt, Th. Schaller, W. Hoffmann, A. Gerlach, N. Gottschlich, G. Knebel, Forschungszentrum Karlsruhe, Germany Technical Session 3 - Measuring and Control Systems I 3.1 Keynote Engineering Microsystems 87 A. El-Fatatry, BAE SYSTEMS Advanced Technology Centre, Loughborough, UK 3.2 Experimental Study of Microforces in a Controlled Environment 89 B. Chang, H. N. Koivo, Helsinki University of Technology; Q. Zhou, Tampere University of Technology, Finland 3.3 3D Evaluation of Tensile Tests by SEM-Microscopy 95 G. Molnar, R. Tutsch, G. Fischer, Technical University of Braunschweig, Germany 3.4 Microengineered Dynamometer for Microfan Thrust Measurement 99 J. Armstrong, M. Desmulliez, M. Faizal Ahmad, B. Reuben, M. Leonard, R. Dhariwal, P. Chowti, Heriot Watt University, Edinburgh, UK Technical Session 4 - Technologies for Information and Communication Applications I 4.1 Keynote Moore's Law at its End? Challenges in Chip Design 105 E. Barke, University of Hanover, Germany 4.2 Low Loss and High Temperature Stable Polymer Waveguides for Hybrid Electrical-Optical Devices 109 S. Kopetz, A. Neyer, University of Dortmund, Germany 4.3 Silicon Nitride Membrane Suspended Stripline Filter Technology Ill D. Voyce, R. Greed, R. Jeffries, BAE SYSTEMS Advanced Technology Centre, Gt. Baddow, Chelmsford, UK 4.4 Investigation of Bit Resolution Reduction in Analog-to-Digital Converter for Smart Antennas Systems 113 J. Vagner Vital, T. Do-Hong, P. Russer, Technical University of Munich, Germany Technical Session 5 - Packaging and Molding 5.1 Tool-less Batch Production of MST Products 119 R. Gotzen, microTEC Gesellschaft fiir Mikrotechnologie mbH, Duisburg, Germany 5.2 A High Volume, Low Cost and Low Temperature MEMS Packaging Technology Based on a Flip-Chip Assembly Process 123 R. Kay, M. Desmulliez, Heriot Watt University; St. Stoyanov, G. Glinski, Ch. Bailey, R. Durairaj, N. Ekere, University of Greenwich; M. Hendriksen, B. Smith, Celestica Limited; D. Price, A. Roberts, Merlin Circuit Technology Limited; M. Whitmore, DEK Printing Machines Limited; P. Ongley, Electronic Technology Services; J. Gourlay, MicroEmissive Displays, UK; 5.3 Low Cost Fabrication Technology for Microfluidic Devices Based on Micro Injection Moulding 129 W. Eberhardt, H. Kiick, M. Munch, H. Sandmaier, M. Spritzendorfer, M. Willmann, Hahn-Schickard-Gesellschaft, Stuttgart; P. Koltay, R. Steger, R. Zengerle, University of Freiburg, Germany 5.4 Simultaneous Replication of both Refractive and Diffractive Optical Components using Elektroformed Tools and Injection Moulding 135 P. T. Tang, Technical University of Denmark, Lyngby, T. R. Christensen, Danish Technological Institute, Taastrup, Denmark Technical Session 6 - Cryobiotechnology/Cell Manipulation 6.1 Cryopreservation in Miniaturized Substrates: Components for "High Throughput Freezing" 139 H. Zimmermann, G. R. Fuhr, Fraunhofer Institute, St. Ingbert, Germany 6.2 A Microfluidic Syringe Chip for Microinjection with Integrated Actuator 141 F. Tagliareni, B. Stadelbauer, S. Tahreem Ahmed, Th. Velten, Fraunhofer Institute, St. Ingbert, Germany 6.3 A Novel Fabrication Method for Microstructured Cell Culture Systems 147 S. Giselbrecht, R. Truckenmiiller, E. Gottwald, A. E. Guber, K. F. Weibezahn, W. K. Schomburg, L. Eichhorn, Th. Gietzelt, Forschungszentrum Karlsruhe, Germany 6.4 Transporting and Sorting of Cells with Microrobots 153 T. Triiper, A. Kortschack, M. Jahnisch, H. Hulsen, S. Fatikow, University of Oldenburg, Germany Technical Session 7 - Measuring and Control Systems II 7.1 Development of New Inductive Microsensors for Angular Position Measurement. 159 A. Wogersien, S. BeiBner, S. Samson, S. Buttgenbach, Technical University of Braunschweig, Germany 7.2 Tungsten Carbide Layers for Nanomeasuring Systems 165 L. Spiess, M. Gubisch, H. Romanus, M. Breiter, Ch. Miiller, V. Cimalla, G. Ecke, Y. Liu, Ch. Knedlik, Technical University llmenau, Germany 7.3 Microscopic Characterisation of Flow Patterns in Rotating Microchannels 171 T. Brenner, M. Grumann, Ch. Beer, R. Zengerle, J. Ducree, University of Freiburg, Germany and Rapid Prototyping of a Smart Sensor Using Simulink 175 E. UlJcna, IMMS gGmbH, llmenau, Germany Technical Session 8 - Technologies for Information and Communication Applications II 8.1 Integration of Optics, Electronics and Mechatronics on Miniaturized Platforms .... 179 E. Beckert, C. Damm, R. Eberhardt, P. Schreiber, Fraunhofer Institute, Jena, Germany 8.2 Novel Micromechanical Fiber Optic Modules with Integrated 2x2-Switches and Variable Optical Attenuators 185 M. Voit, T. Schary, H. F. Schlaak, Technical University of Darmstadt, Germany 8.3 Planning WDM Networks with Semi-Transparent Optical Cross-Connectors 191 M. Korkel, H. Schmidt, T-Systems Nova GmbH, Darmstadt, Germany 8.4 Manufacturing Line for the Distributed Fabrication of Modular Microoptical Systems 195 U. Wallrabe, U. Hollenbach, J. Mohr, Forschungszentrum Karlsruhe, Germany; T. Oka, Mitsubishi Electric Co., Amagasaki City, Japan Technical Session 9 - Micro-Nano Interface 9.1 Micro and Nano Filled Ceramic Polymer Composites: Properties and Potential Applications in Microsystem Technology 201 Th. Hanemann, J. Bb'hm, K. Honnef, J. Hausselt, Forschungszentrum Karlsruhe und Albert- Ludwigs-University Freiburg; P. Henzi, Forschungszentrum Karlsruhe, Germany 9.2 Atomic Force Microscopy Studies of Thin and Ultra-thin SiO2 Films 207 W. Frammelsberger, G. Benstetter, P. Breitschopf, University of Applied Sciences, Deggendorf; T. Schweinboeck, Infineon Technologies, Munich, Germany; R. Stamp, J. Kiely, University of the West of England, Bristol, UK 9.3 Manufacturing of Field Electron Emitters: Turn from "Self-Organized" Systems to Nanoengineering 215 V. D. Frolov, S. M. Pimenov, V. I. Konov, V. I. Kuzkin, General Physics Institute of RAS, Moscow, Russia 9.4 Fabrication Conditions and Detecting Properties of a Metal Oxide Gradient Microarray Based on Nanocrystalline Tin Dioxide 221 J. Goschnick, K. Betsarkis, T. Schneider, Forschungszentrum Karlsruhe, Germany Technical Session 10 - Medical Diagnostics and Therapy Devices 10.1 New Aspects in the Automated Analysis of Cardiac Arrhythmias 225 I. Tchoudovski, K. Egorouchkina, A. Bolz, University of Karlsruhe; L. Pang, University of Erlangen-Niirnberg, Germany 10.2 Multiparametric Sensor Chips for Therapy and Intervention 229 C. Stepper, B. Wolf, H. Grothe, A. M. Otto, E. Motrescu, Technical University of Munich, Germany 10.3 Development and
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