MICRO.Tec 2003 Applications - Trends - Visions

2nd VDE World Microtechnologies Congress October 13-15, 2003 International Congress Centre, Munich, Germany

Organized by VDE Association for Electrical, Electronic & Information Technologies

Sponsored by EUREL, IEE, VDI/VDE-IT, VDMA, ZVEI

m vw i VDE IT Convention of National Soctitiis at Eltctrical Engine«ri of Europe

Zentralverband X/DAA A Elektrotechnik-Elektrotechnik- 1und Elektronikindustrie e.V.

UB/TIB Hannover 89

VDE VERLAG GMBH • Berlin • Offenbach Contents

Plenary Session I

PL 1.1 Opportunities of Micro Systems Technology in Life Siences, Communication and Control 17 N. F. de Rooij, University of Neuchatel and EPFL, Switzerland

PL 1.2 A Micro/Nanotechnology Approach for Probe Based Data Storage 25 Peter Vettiger, T. Albrecht, M. Despont, U. Drechsler, U. Diirig, B. Gotsmann, D. Jobin, W. Haberle, M. A. Lantz, H. Rothuizen, R. Stutz, D. Wiesmann, G.K. Binnig, P. Bachtold, G. Cherubini, A. Dholakia, Ch. Hagleitner, T. Loeliger, H. Pozidis, E. Eleftheriou, IBM Research, Zurich Research Laboratory, Riischlikon, Switzerland

Plenary Session II

PL 2.1 Trends in System Integration Technologies 29 H. Reichl, M. J. Wolf. R. Aschenbrenner, Fraunhofer Institute, Berlin, Germany

PL 2.2 Industrial Manufacturing of Microsystems 37 E. Westkamper, Fraunhofer Institute, Stuttgart, Germany

Technical Session 1 - Micro- and Nano Fabrication

1.1 Keynote Micro- and IMano-Powder-Technologies for Advancend Ceramic Micro-Components . 45 J. HauRelt, Forschungszentrum Karlsruhe, Germany

1.2 Non-reactive and Reactive Ion Etching Processes for Patterning Magnetic MEMS Components 51 M. Balke, H. Liithje, G. Brauer, Fraunhofer Institute, Braunschweig; T. Budde, H. H. Gatzen, Hannover University, Germany

1.3 Ensuring Reliability and Repeatability in Deep X-Ray LIGA Process - State of Standardization 53 P. Meyer, L. Hahn, J. Schulz, K. Bade, A. Janssen, R. Thelen, Forschungszentrum Karlsruhe, Germany; J. Lange, Precision Engineering AG, Schaffhausen, Swizerland; M. Arendt, ANKA GmbH, Karlsruhe, Germany

1.4 Investigatipn and First Results of uECM Processing of Microstructures for Micro Moulds 59 A. Schoth, R. Forster, W. Menz, Albert Ludwig University Freiburg, Germany

Technical Session 2 - Microfluidic Systems I

2.1 Keynote Micro-Liquid Handling Devices for Biochemical Analysis 67 R. Miyake, Hitachi Ltd., Ibaraki, Japan

5 2.2 Highly Parallel Droplet Release in a Nanoliter Dispenser 73 0. Gutmann, R. Kuehlewein, R. Niekrawietz, C. Steinert, B. de Heij, M. Daub, R. Zengerle, IMTEK University of Freiburg, Germany

2.3 Micromachined ESI Nozzle for On-Chip Application 77 A. Rudzinski, T. Muiler, A. Neyer, University of Dortmund; W. Nigge, M. Schilling, R. Hergenroder, Institute of Spectrochemistry and Applied Spectroscopy, Dortmund, Germany

2.4 Plastic Capillary Systems for Biomedical Research and Diagnosis 81 D. Herrmann, A. E. Guber, M. Heckele, P. Henzi, A. Muslija, R. Truckenmiiller, L. Eichhorn, Th. Gietzelt, Th. Schaller, W. Hoffmann, A. Gerlach, N. Gottschlich, G. Knebel, Forschungszentrum Karlsruhe, Germany

Technical Session 3 - Measuring and Control Systems I

3.1 Keynote Engineering Microsystems 87 A. El-Fatatry, BAE SYSTEMS Advanced Technology Centre, Loughborough, UK

3.2 Experimental Study of Microforces in a Controlled Environment 89 B. Chang, H. N. Koivo, Helsinki University of Technology; Q. Zhou, Tampere University of Technology, Finland

3.3 3D Evaluation of Tensile Tests by SEM-Microscopy 95 G. Molnar, R. Tutsch, G. Fischer, Technical University of Braunschweig, Germany

3.4 Microengineered Dynamometer for Microfan Thrust Measurement 99 J. Armstrong, M. Desmulliez, M. Faizal Ahmad, B. Reuben, M. Leonard, R. Dhariwal, P. Chowti, Heriot Watt University, Edinburgh, UK

Technical Session 4 - Technologies for Information and Communication Applications I

4.1 Keynote Moore's Law at its End? Challenges in Chip Design 105 E. Barke, University of Hanover, Germany

4.2 Low Loss and High Temperature Stable Polymer Waveguides for Hybrid Electrical-Optical Devices 109 S. Kopetz, A. Neyer, University of Dortmund, Germany

4.3 Silicon Nitride Membrane Suspended Stripline Filter Technology Ill D. Voyce, R. Greed, R. Jeffries, BAE SYSTEMS Advanced Technology Centre, Gt. Baddow, Chelmsford, UK

4.4 Investigation of Bit Resolution Reduction in Analog-to-Digital Converter for Smart Antennas Systems 113 J. Vagner Vital, T. Do-Hong, P. Russer, Technical University of Munich, Germany Technical Session 5 - Packaging and Molding

5.1 Tool-less Batch Production of MST Products 119 R. Gotzen, microTEC Gesellschaft fiir Mikrotechnologie mbH, Duisburg, Germany

5.2 A High Volume, Low Cost and Low Temperature MEMS Packaging Technology Based on a Flip-Chip Assembly Process 123 R. Kay, M. Desmulliez, Heriot Watt University; St. Stoyanov, G. Glinski, Ch. Bailey, R. Durairaj, N. Ekere, University of Greenwich; M. Hendriksen, B. Smith, Celestica Limited; D. Price, A. Roberts, Merlin Circuit Technology Limited; M. Whitmore, DEK Printing Machines Limited; P. Ongley, Electronic Technology Services; J. Gourlay, MicroEmissive Displays, UK;

5.3 Low Cost Fabrication Technology for Microfluidic Devices Based on Micro Injection Moulding 129 W. Eberhardt, H. Kiick, M. Munch, H. Sandmaier, M. Spritzendorfer, M. Willmann, Hahn-Schickard-Gesellschaft, Stuttgart; P. Koltay, R. Steger, R. Zengerle, University of Freiburg, Germany

5.4 Simultaneous Replication of both Refractive and Diffractive Optical Components using Elektroformed Tools and Injection Moulding 135 P. T. Tang, Technical University of Denmark, Lyngby, T. R. Christensen, Danish Technological Institute, Taastrup, Denmark

Technical Session 6 - Cryobiotechnology/Cell Manipulation

6.1 Cryopreservation in Miniaturized Substrates: Components for "High Throughput Freezing" 139 H. Zimmermann, G. R. Fuhr, Fraunhofer Institute, St. Ingbert, Germany

6.2 A Microfluidic Syringe Chip for Microinjection with Integrated Actuator 141 F. Tagliareni, B. Stadelbauer, S. Tahreem Ahmed, Th. Velten, Fraunhofer Institute, St. Ingbert, Germany

6.3 A Novel Fabrication Method for Microstructured Cell Culture Systems 147 S. Giselbrecht, R. Truckenmiiller, E. Gottwald, A. E. Guber, K. F. Weibezahn, W. K. Schomburg, L. Eichhorn, Th. Gietzelt, Forschungszentrum Karlsruhe, Germany

6.4 Transporting and Sorting of Cells with Microrobots 153 T. Triiper, A. Kortschack, M. Jahnisch, H. Hulsen, S. Fatikow, University of Oldenburg, Germany

Technical Session 7 - Measuring and Control Systems II

7.1 Development of New Inductive Microsensors for Angular Position Measurement. . . 159 A. Wogersien, S. BeiBner, S. Samson, S. Buttgenbach, Technical University of Braunschweig, Germany

7.2 Tungsten Carbide Layers for Nanomeasuring Systems 165 L. Spiess, M. Gubisch, H. Romanus, M. Breiter, Ch. Miiller, V. Cimalla, G. Ecke, Y. Liu, Ch. Knedlik, Technical University llmenau, Germany

7.3 Microscopic Characterisation of Flow Patterns in Rotating Microchannels 171 T. Brenner, M. Grumann, Ch. Beer, R. Zengerle, J. Ducree, University of Freiburg, Germany and Rapid Prototyping of a Smart Sensor Using Simulink 175 E. UlJcna, IMMS gGmbH, llmenau, Germany

Technical Session 8 - Technologies for Information and Communication Applications II

8.1 Integration of Optics, Electronics and Mechatronics on Miniaturized Platforms .... 179 E. Beckert, C. Damm, R. Eberhardt, P. Schreiber, Fraunhofer Institute, Jena, Germany

8.2 Novel Micromechanical Fiber Optic Modules with Integrated 2x2-Switches and Variable Optical Attenuators 185 M. Voit, T. Schary, H. F. Schlaak, Technical University of Darmstadt, Germany

8.3 Planning WDM Networks with Semi-Transparent Optical Cross-Connectors 191 M. Korkel, H. Schmidt, T-Systems Nova GmbH, Darmstadt, Germany

8.4 Manufacturing Line for the Distributed Fabrication of Modular Microoptical Systems 195 U. Wallrabe, U. Hollenbach, J. Mohr, Forschungszentrum Karlsruhe, Germany; T. Oka, Mitsubishi Electric Co., Amagasaki City, Japan

Technical Session 9 - Micro-Nano Interface 9.1 Micro and Nano Filled Ceramic Polymer Composites: Properties and Potential Applications in Microsystem Technology 201 Th. Hanemann, J. Bb'hm, K. Honnef, J. Hausselt, Forschungszentrum Karlsruhe und Albert- Ludwigs-University Freiburg; P. Henzi, Forschungszentrum Karlsruhe, Germany

9.2 Atomic Force Microscopy Studies of Thin and Ultra-thin SiO2 Films 207 W. Frammelsberger, G. Benstetter, P. Breitschopf, University of Applied Sciences, Deggendorf; T. Schweinboeck, Infineon Technologies, Munich, Germany; R. Stamp, J. Kiely, University of the West of England, Bristol, UK

9.3 Manufacturing of Field Electron Emitters: Turn from "Self-Organized" Systems to Nanoengineering 215 V. D. Frolov, S. M. Pimenov, V. I. Konov, V. I. Kuzkin, General Physics Institute of RAS, Moscow, Russia

9.4 Fabrication Conditions and Detecting Properties of a Metal Oxide Gradient Microarray Based on Nanocrystalline Tin Dioxide 221 J. Goschnick, K. Betsarkis, T. Schneider, Forschungszentrum Karlsruhe, Germany

Technical Session 10 - Medical Diagnostics and Therapy Devices

10.1 New Aspects in the Automated Analysis of Cardiac Arrhythmias 225 I. Tchoudovski, K. Egorouchkina, A. Bolz, University of Karlsruhe; L. Pang, University of Erlangen-Niirnberg, Germany

10.2 Multiparametric Sensor Chips for Therapy and Intervention 229 C. Stepper, B. Wolf, H. Grothe, A. M. Otto, E. Motrescu, Technical University of Munich, Germany 10.3 Development and Functional Test of an Epiretinal Prosthesis 233 I. Krisch, M. Gbrtz, H. K. Trieu, W. Mokwa, B. J. Hosticka, Fraunhofer Institute of Microelectronic Circuits and Systems, Duisburg, Germany

10.4 A 6-Axis Force/Torque Sensor Design for Haptic Feedback in Minimally Invasive Robotic Surgery 239 U. Seibold, G. Hirzinger, German Aerospace Center (DLR), Oberpfaffenhofen, German

Technical Session 11 - Smart Energy

11.1 Keynote Smart Energy for Sensors and Microsystems M. Klein, DaimlerChrysler AG, Ulm, Germany (The Paper is not available)

11.2 Solar Cells and Fuel Cells as Device Integrated Power Sources C. Hebling, A. Schmitz, Fraunhofer-lnstitut for Solar Energy Systems, Freiburg, Germany (The Paper is not available)

11.3 Power Management in Wireless Sensor Systems for Home Applications 245 0. Kanoun, U. Trbltzsch, H. Ruser, H.-R. Trankler, University of the Bundeswehr Miinchen, Neubiberg, Germany

11.4 Wireless Sensors enabled by Smart Energy - Concepts and Solutions 251 F. Schmidt, M. Heiden, EnOcean GmbH, Oberhaching, Germany

Technical Session 12 - Microelectronics

12.1 Keynote Challenges of Future On-Chip Interconnects 259 M. Engelhardt, G. Schindler, W. Steinhoegel, G. Steinlesberger, M. Traving, Infineon Technologies AG, Munich, Germany

12.2 AIGaN/GaN HEMT on Silicon Substrates 261 Y. Dikme, M. Fieger, A. Szymakowski, H. Kalisch, R. H. Jansen, RWTH Aachen; H. M. Chern, M. Heuken, AIXTRON AG, Aachen; P. Javorka, M. Marso, N. Kaluza, P. Kordos, H. Luth, Forschungszentrum Julich, Germany; J. F. Woitok, PANalytical Application Laboratory, Almelo, The Netherlands

12.3 Nanostructural Field Emission Triodes as Active Components for a New Generation of Microsystems 267 N. I. Tatarenko, Russian Aerospace Agency; A. Y. Vorobyev, Bauman Moscow State University, Moscow, Russia

12.4 Transistor Architectures for Future Technologies 273 T. Schulz, L. Dreeskomfeld, J. Hartwich, F. Hofmann, J. Kretz, E. Landgraf, H. Luyken, W. Rosner, M. Specht, M. Stadele, Infineon Technologies AG, Munich, Germany Technical Session 13 - Micro Assembly

13.1 A Modular System for Microassembly with Standardised Interface 279 A. Hoch, Schunk GmbH & Co. KG, Lauffen, Germany

13.2 Non-Contact Handling and Assembly in Microfabrication 289 M. F. Zaeh, J. Zimmermann, M. Schilp, A. Zitzmann, Technical University of Munich, Germany

13.3 Handling and Assembly of Micro-Optical Components - Modules and Solutions .. . 289 A. Hofmann, U. Gengenbach, R. Scharnowell, Forschungszentrum Karlsruhe; M. Bar, lEF-Wemer GmbH, Furtwangen, Germany

13.4 Droplet Based Self-Assembly of SU-8 Microparts 293 C. del Corral, Q. Zhou, A. Albut, Tampere University of Technology; B. Chang, H. N. Koivo, S. Franssila, S. Tuomikoski, Helsinki University of Technology, Finland

Technical Session 14 - Micro Analytical Devices

14.1 Miniaturised Quartz Crystal Microbalance (QCM) Array for Immunosensor Application 299 M. Liekefett, J. Rabe, S. Buttgenbach, J. Wendler, U. Bilitewski, Technical University of Braunschweig, Germany

14.2 Atmospheric Pressure Plasma Printing for Patterned Surface Functionalization and Coating 305 C. Penache, C. Gessner, T. Betker, V. Bartels, C.-P. Klages, Fraunhofer Institute, Braunschweig, Germany

14.3 Polymeric Analytical Devices with Integrated Polymer Waveguides for Optical Detection in Microfluidic Channels 311 M. Fleger, B. Bauer, D. Siepe, A. Neyer, AG Mikrostrukturtechnik, University of Dortmund, Germany

14.4 Manufacturing of Flexible Polymer Film Capillary Electrophoresis Chips by Microthermoforming 315 R. Truckenmiiller, S. Giselbrecht, T. Schaller, W.K. Schomburg, Forschungszentrum Karlsruhe, Germany

Technical Session 15 - Measuring and Control Systems III

15.1 Fabrication of an Electrostatic Miniature Valve from Metallized Microinjection Molded Polymers 219 M. Arnold, W. Eberhardt, H. Kuck, M. Munch, Hahn-Schickard-Gesellschaft, Stuttgart; D. Warkentin, University of Stuttgart; M. Giousouf, G. Munz, Festo AG & Co., Esslingen; M. Oprea, Endress+Hauser, Gerlingen, Germany

15.2 Current Control of Piezoelectric Actuators with Environmental Compensation .... 323 P. Ronkanen, P. Kallio, Tampere University of Technology; Q. Zhou, H. N. Koivo, Helsinki University of Technology, Finland

15.3 Function and Performance of a Piezo InkJet Printhead with Bimorph Beams 329 G. Beurer, J. Stempfle, G. Schmidt, Tally Computerdrucker GmbH, Ulm, Germany 10 15.4 A New Quality Management System for PZT Bending Actuators 335 M. Schindler, J. Rucha, J. Heinzl, Technical University of Munich, Germany

Technical Session 16 - Microtechnology in Driver Assistance and Comfort Applications

16.1 Keynote Driver Assistance Systems - Driver Support or Driver Tutelage? 341 P. M. Knoll, Robert Bosch GmbH, Leonberg, Germany

16.2 Micro-Technologies and their Impact on Automotive Radar 347 J. Wenger, DaimlerChrysler, Ulm, Germany,

16.3 Thermal Image Sensor for Safety and Comfort Application First Technology 353 B. Johnson, J. Milne, First Technology, Farnborough, UK; Alec Williams, QinetiQ, UK

16.4 Evolution in Steering Systems 359 S. Schrabler, 0. Hoffmann, St. Linkenbach, A. Schirling, A. Netz, J. Nell, Continental Teves AG & Co. oHG, Frankfurt am Main, Germany

Technical Session 17 - Simulation 17.1 Reliability of Micro- and Nanosystems 365 B. Michel, Fraunhofer Institute, Berlin, Germany 17.2 Compact Modelling of an InkJet Printhead with Piezoelectrical Cantilever Beams 369 R. Scheicher, J. Heinzl, Technical University of Munich, Germany 17.3 Microtribological Characterisation of Ceramic Materials under Sliding and Sliprolling Conditions 375 J. Herz, J. Schneider, K.-H. Zum Gahr, University of Karlsruhe, Germany 17.4 Application of the Microoptical Construction Kit to a Microoptical Distance Sensor 381 I. Sieber, A. Hofmann, U. Hollenbach, Forschungszentrum Karlsruhe, Germany

Technical Session 18 - Microfluidic Systems II

18.1 The Microfluidic Toolbox - Examples for Fluidic Interfaces and Standardization Concepts 387 C. Gartner, Applikationszentrum Mikrotechnik Jena; B. Anton, 0. Rotting, Microfluidic ChipShop GmbH, Jena, Germany

18.2 Modular Microlabs for Point of Care Use 391 A. Schule, D. Mutschler, D. Neumann, Fraunhofer IPA, Stuttgart, Germany

18.3 Coriolis-lnduced Switching and Mixing of Laminar Flows in Rotating Microchannels 397 J. Ducree, T. Brenner, T. Glatzel, R. Zengerle, University of Freiburg, Germany

18.4 Integration of Microfluidics for Lead Discovery 405 V. Spikmans, I. Morao, M. Montembault, St. Y. F. Wong, GlaxoSmithKline Pharmaceuticals, Harlow, UK n Technical Session 19 - Measuring and Control Systems IV

19.1 Highly Integrated VIS Spectrometer 409 S. Wuestling, Forschungszentrum Karlsruhe, Germany

19.2 Microspectrometer for Non-Destructive Inline Analysis and Mobil Sensors 415 S. Schoenfelder, STEAG microParts GmbH, Germany

19.3 Feasibility of Micro Heating in the Food Industry 421 P. de Jong, H. C. van der Horst, NIZO Food Research, The Netherlands; A. Freitag, Mikroglastechnik AG, Mainz, Germany

19.4 The Market for Micro Gas Sensors 425 0. Nowak, WTC- Wicht Technologie Consulting, Munich, Germany

Technical Session 20 - Microtechnology in Automotive Sensor Integration

20.1 Automative Sensor Integration 429 G. Teepe, Motorola GmbH, Munich, Germany 20.2 Surface Micro Machined Sensor Technology for Future Tire Pressure Monitoring Systems (TPMS) 435 W. Gaal, Infineon Technologies AG, Munich, Germany 20.3 RF-MEMS Subsystems for Automotive Radar Sensors with Smart Antennas 439 J. Schobel, M. Schneider, Th. Buck, M. Reimann, M. Ulm, Robert Bosch GmbH, Hildesheim, Germany 20.4 High-Sensitivity Uncooled IRFPAs for Driver Vision Enhancement 445 J. J. Yon, L. Biancardini, E. Mottin, L. Letellier, CEA - Commissariat a I'Energie Atomique; J. L. Tissot, ULIS, Veurey-Voroise, France

12 Poster Session

Technology - Micro and Nano Fabrication

PI. 1.1 Micropatterned Thin Films for Optimisation of the Microtribological Behaviour in MEMS and Microactuators 451 R. Bandorf, H. Liithje, C. Henke, J.-H. Sick, Fraunhofer Institute for Surface Engineering and Thin Films 1ST, Braunschweig, Germany

PI. 1.2 Factory Planning for Miniaturized Mechatronical Systems 453 J. Fleischer, H. Weule, A. Blessing, T. Volkmann, University of Karlsruhe, Germany

PI. 1.3 Near-Field Optical Lithography Method for Fabrication of the Nanodimensional Objects 459 V. F. Dryakhlushin, A. Yu. Klimov, V. V. Rogov, N. V. Vostokov, Institute for Physics of Microstructure RAS, Nizhny Novgorod, Russia

PI. 1.4 Selective Plasma Etching Ill-V Multilayer Heterostructures 463 V. I. Shashkin, G. L. Pakhomov, N. V. Vostokov, V. M. Daniltsev, Y. N. Drozdov, S. A. Gusav, Institute for Physics of Microstmctures RAS, Nizhny Novgorod, Russia

PI.1.5 Miniaturized and Flexible Fabrication of Microarrays Using Variable Dispensing Techniques - the Biochip Microproduction System 467 D. Malthan, H. Dobler, T. Gaugel, Fraunhofer-IPA, Stuttgart; N. Gajovic-Eichelmann, E. Ehrentreich-Forster, F. F. Bier, Fraunhofer-IBMT, Bergholz-Rehbrucke; M. Kuhn, CONGEN Biotechnology, Berlin, Germany

PI. 1.7 Planar Fuel Cells for Miniaturized Power Supply 469 A. Schmitz, A. Weil, M. Tranitz, C. Hebling, Fraunhofer Institute, Freiburg, Germany

PI. 1.8 New Technology for the Replication of Micro- / Nanostructures 473 J. Kiihnholz, G. Lecarpentier, SUSS MicroTec Lithography, Asslar, Germany

PI.1.9 Thick Photo Resist for MEMS Applications 475 E. Cullmann, J. Kuehnholz, SUSS MicroTec, Garching, Germany PI. 1.10 Influence of the Initial Surface Roughness on the Wear Behaviour of Micro Probes under Rotating and Oscillating Flat Micro Contact 477 M. Beck, H.-H. Gatzen, Hannover University; R. Bandorf, H. Liithje, J.-H. Sick, Fraunhofer-lnstitut fur Schicht- und Oberflachentechnik 1ST, Braunschweig, Germany

PI.1.11 Technical and Economical Aspects of Micro Injection Moulding 479 V. Plotter, K. Plewa, R. Rupprecht, J. Hausselt, Forschungszentrum Karlsruhe, Germany

Technology - Micro Assembly and Packaging

PI.2.1 The Interconnection System for Fabricating Digital Logic Elements Based on Nanostructural Field Emission Triodes 485 N. I. Tatarenko, Russian Aerospace Agency; A. Y. Vorobyev, Bauman Moscow State Technical University, Moscow, Russia

PI.2.2 Development of Adaptive Tong Grippers for Automated Microassembly 491 J. Schlick, D. Zuehlke, Kaiserslautern University of Technology, Germany

13 Pl.2.3 Simulation and Offline Programming of Automated Microassembly Processes 497 R. Dabelow, D. Zuehlke, Kaiserslautern University of Technology, Germany

PI.2.4 A Fiber-Based Fringe Projection System 503 S. Driessen, T. Pfeifer, Aachen University of Technology, Germany

PI.2.5 Development of Flexible Force-Controlled Piezo-Bimorph Microgripping System 507 A. Albut, C. del Corral, Q. Zhou, Tampere University of Technology; H. N. Koivo, Helsinki University of Technology, Espoo, Finland

Technology - Simulation and Design

PI.3.1 Structure and Parameter Studies of an Aerostatic Linear Guidance for Microsystems 513 B. Denkena, D. Kopp, J. Li, University of Hanover, Germany

PI.3.2 Tribological Studies on Mould Inserts Used in Micro Powder Injection Moulding with Ceramic Feedstocks 517 J. Schneider, H. Iwanek. K.-H. Zum Gahr, University of Karlsruhe and Forschungszentrum Karlsruhe, Germany

PI.3.3 FEM Analysis of a Via-Line Structure in Cu-Technology with Low-k-Dielectric with Respect to the Distribution of Current Density and Temperature 523 H. Brocke, University of Hannover, Germany

PI.3.4 Comparison of Electrically Powered Micro Heat Exchangers and Evaporators . . 529 T. Henning, J. J. Brandner, K. Schubert, Forschungszentrum Karlsruhe, Germany

Life Sciences

P2.1 Biological Evaluation of Miniaturized Cryosubstrates: towards the Cryobank-on-a-Chip 535 H. Zimmermann, A. D. Katsen, Fraunhofer Institute for Biomedical Engineering, St. Ingbert, Germany

P2.2 Challenges in Packaging of Batch-Fabricated Micro Fluidic Devices 541 M. Giousouf, U. Gebhard, C. Hanisch, A. Muth, Festo AG & Co., Esslingen, Germany; A. Enzler, T. Lamprecht, A. Dommann, NTB Interstaatliche Hochschule fur Technik Buchs; W. Tschanun, Reinhardt Microtech AG, Wangs, Switzerland

P2.3 Stacking of Beads into Monolayers by Flow through Flat Microfluidic Chambers 545 M. Grumann, P. Schippers, M. Dobmeier, S. Haberle, A. Geipel, T. Brenner, R. Zengerle, J. Ducree, University of Freiburg, Germany

P2.4 Microreactors for Optimisation Chemical Reactions by Raman Spectroscopy . . 551 M. Schafer, R. Starzmann, N. Lammerzahl, H. v. Eiff, A. H. Foitzik, University of Applied Sciences Esslingen, Germany

14 P2.5 Highly Parallel Picoliter Dispensing Based on Direct Liquid Displacement 555 C. P. Steinert, I. Goutier, B. de Heij, 0. Gutmann, M. Daub, R. Zengerle, IMTEK, University of Freiburg; H. Sandmaier, HSG-IMIT, Villingen-Schwenningen, Germany

P2.6 Simulation and Fabrication of a Microturbine Using Fluid-Assisted Levitation . . . 559 A. Kanteres, M. Leonard, M. Desmulliez, R. S. Dhariwal, Heriot-Watt University, Edinburgh, UK

P2.7 A Highly Integrated Nanoliter Dispensing System for fast Liquid Handling 563 R. Steger, B. Bohl, P. Koltay, C. Moosmann, G. Birkle, R. Zengerle, University of Freiburg, Germany

P2.8 Electrical Detection for DNA Identification with Nanoparticle Probes in an Array-based CMOS Biochip 567 C.-C. Pun, C.-Y. Tsai, Y.-C. Cheng, Y.-T. Cheng, P.-H. Chen, P.-Z. Chang, National Taiwan University, ROC

P2.9 A One Way Micro-Device for DNA-Analysis 573 M. Schafer, R. Stein, L. Vollmer, G. Schuster, A. H. Foitzik, University of Applied Sciences Esslingen, Germany

Measuring Control Systems

P3.1 Lateral Inhomogeneity of Gas Permeable AI2O3 or SiO2 Coatings as Tuning Tools for the Gas Analytical Performance of Gradient Microarrays 577 J. Goschnick, I. Kiselev, Forschungszentrum Karlsruhe; M. Frietsch, Christian Glockner GmbH & Co. KG, Knittlingen; K. Halim, Infinieon Technologies AG, Dresden, Germany

P3.2 A Fully Digital Method of the Generation of Sinusoidal Waveform for the Built-in Self-Test (BIST) of the Audio Chip 583 H. Li, J. Eckmueller, H. Eichfeld, S. Sattler, Infineon AG, Miinchen; R. Weigel, University of Erlangen, Germany

P3.3 Noise Measurement with a Digital Storage Oscilloscope 589 B. Biittgen, CSEM SA, Zurich, Switzerland

P3.4 Mechanical Material Characterisation in a SEM 595 J. Zenke, A. Sill, S. Fatikow, University of Oldenburg, Germany; J. Michler, Swiss Federal Laboratory for Materials Research and Testing, Thun, Swizerland; St. Buttgenbach, Technical University of Braunschweig, Germany

P3.5 Multi-Modal Control Interface for a Microrobot-Based Nanohandling Cell 601 S. Garnica, A. Shirinov, T. Sievers, J. Kamenik, 0. C. HanBler, S. Fatikow, University of Oldenburg, Germany

P3.6 Microsystems in Household Appliances 607 G. Tschulena, SGT Sensor Consulting, Wehrheim, Germany

P3.7 Thin Film Technologies for Three Dimensional Reference Structures 609 A. H. Foitzik, M. Schafer, R. Stein, L. Vollmer, S. Arkhipov, G. Schuster, University of Applied Sciences Esslingen, Germany

15 P3.8 Wafer Level Test: Significant Time and Cost Reduction of MEMS Production ... 613 F.-M. Werner, SUSS MicroTec Test Systems GmbH, Sacka, Germany

P3.9 A Calibration System for 3D Micro Probes 619 S. Cao, U. Brand, Physikalisch-Technische Bundesanstalt, Braunschweig; S. Buttgenbach, Technical University of Braunschweig, Germany

Technology for Information andCommunication Applications

P4.1 Frequency-Invariant Beam-Pattern and Spatial Interpolation for Wideband Beamforming in Smart Antenna System 626 T. Do-Hong, P. Russer, Technical University of Munich, Germany

P4.2 A Novel Alignment-Mechanism for 2D-Fibre-Arrays in Telecom Applications Manufactured by DRIE 631 0. Krampitz, V. Biefeld, R. Hbper, G. Mannmeusel, A. Menz, Protron Mikrotechnik GmbH, Bremen, Germany

P4.3 Manufacturing, Testing and Packaging of Optical Microsystems 635 R. Voelkel, M. Eisner, K. J. Weible, SUSS MicroOptics, Neuchatel, Switzerland; S. Hansen, C. Ossmann, R. Suess, SUSS MicroTec, Munich; J. Hbppner, SUSS MicroTec Lithography, Singen, Germany; W. Noell, U. Staufer, N. F. De Rooij, H. P. Herzig, University of Neuchatel, Switzerland; N. Lindlein, J. Schwider, University of Erlangen-Nuernberg, Germany

Microelectronics

P6.1 High Frequency Suitability of Soft Magnetic FeTaN and FeCoTaN Films for Advanced CMOS-Fabricated Micro Inductors 637 K. Seemann, H. Leiste, V. Bekker, Forschungszentrum Karlsruhe, Germany

P6.2 Evaluation and Adaptation of Flash-Memory for Cryobiophysical Applications 643 F. R. Ihmig, S. G. Shirley, H. Zimmermann, Fraunhofer Institute for Biomedical Technology (IBMT), Sankt Ingbert, Germany