Semiconductor Contract Manufacturing Services Worldwide, 1996
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Representative Legal Matters Alex Chiang
Representative Legal Matters Alex Chiang M&A and Direct Investment Carlyle’s investment in Ta Chong Bank. Carlyle’s proposed acquisition of Advanced Semi-conductor Engineering Inc. Oaktree’s management buyout on Fu Sheng. Eaton’s management buyout on Phoenixtec. Goldman Sachs PIA’s investment in Taiwan Mobile. Lehman’s investment in Data System. Nomura Securities’s investment in preferred shares of Taishin Financial Holding Co., Ltd. at the amount of approximately USD140 million. Goldman’s bid on the acquisition of CNS. Sinopac Holding’s acquisition of International Bank of Taipei through 100% share swap. BenQ’s acquisition of Siemens’ mobile division. Joint Venture (an insurance company) between BNP and Taiwan Cooperative Bank. Tokio Marine’s purchase of 30% Newa Insurance. Millea Holding’s Purchase of 98% Allianz President General Insurance Company Ltd. Merger of Newa Insurance Co., Ltd. and Allianz President General Insurance Co., Ltd. Mitsui Sumitomo Insurance’s purchase of 100% Mingtai Fire & Marine Insurance Co. Ltd. owned by First Financial Holding Co. AIG’s acquisition of 100% Central Insurance Co., Ltd. Purchase of 100% of National Investment Trust Corporation by First Financial Holding Co., Ltd. Merger of Siliconware Precision Industries Co., Ltd. and Siliconware Corporation. Merger of UBS and SBC. 1 Purchase of MMC's US subsidiary by Grand Pacific. Purchase of all assets of MBf's credit card company in Taiwan by Associates USA. Transfer of Kolin's factory, equipment and machinery to Malaysian company. Establishment of Sinopac Holdings (converted by Bank SinoPac and National Securities Corp.). Capital Markets ADRs: Taiwan Semiconductor Manufacturing Company Ltd., Siliconware Precision Industries Co., Ltd., AU Optronics Corp. -
Going Vertical: a New Integration Era in the Semiconductor Industry Table of Contents
Going vertical: A new integration era in the semiconductor industry Table of contents 01 Executive overview Integration in the 02 semiconductor industry Strategic options for 03 semiconductor companies Moving forward: what semiconductor 04 companies must consider today Going vertical: A new integration era in the semiconductor industry 2 Executive overview Like many industries, the semiconductor industry is not immune to waves of diversification and consolidation through inorganic and organic growth. While inflection points with large-scale systemic changes in the value chain are relatively rare, our perspective is that there is a systemic change currently trending in the industry. Since the inception of the industry, semiconductor companies have recognized the value of technology. Accordingly, the market has rewarded semiconductor companies for specializing in distinct parts of the value chain by developing technological advantages by investing in R&D and by scaling technology through horizontal integration. This way of working transformed an industry that was initially vertically integrated (semiconductor design, semiconductor manufacturing, and system integration) into an ecosystem focused on specific areas of design, manufacturing, and/or systems. In the past five years, business value in some segments has moved from underlying technology to specific use cases to better monetize end-customer data and experience. • 5G, automotive, AI, cloud, system integration and hardware-software integration System integrators and software and cloud platform companies are no longer just important customers for the semiconductor industry—they are directly expanding into multiple upstream areas. • Taking advantage of silicon and system design • Control more of the technology stack • Optimize system performance • Improve the customer experience This vertical integration trend is distinctly different from the vertical integration which occurred at the inception of the semiconductor and integrated device manufacturing industry more than 50 years ago. -
Semiconductor Contract Manufacturing Worldwide, 1997
t). Semiconductor Contract Manufacturing Worldwide—SCMS-WW to Re- Document Publication order Code Date Document Title Tab: Perspective • SCMS-WW-DP-9701 February 3, 1997 DQ Predicts: Semiconductor Contract Manufacturing in 1997 y a SCMS-WW-DP-9702 March 17, 1997 Telebriefing Summary: Is the Recovery Around the Corner in Wafer Fab Equipment? Or Will the Slowdow/n Extend into 1998? ^ a SCMS-WW-DP-9703 May 12, 1997 Semiconductor Contract Manufacturing W^fer Pricing Trends / a SCMS-WW-DP-9704 June 9, 1997 1996 Fabless Semiconductor Review v a SCMS-WW-DP-9705 June 16. 1997 System-Level Integration ASICs Add Embedded DFIAM y a SCMS-WW-DP-9706 July 21, 1997 Wafer Fab Equipment Market Forecast and Capacity Update • SCMS-WW-DP-9707 August 25, 1997 The Challenges of Embedded DRAM in ASICs: A Manufacturing K/" Economics Point of View • SCMS-WW-DP-9708 September 1, 1997 Capital Spending And Wafer Fab Equipment Midyear Forecast Update: Real Recovery in Progress? Or Is Another Stall in the Works'' ^-^ a SCMS-WW-DP-9709 December 1, 1997 Amkor Wafer Fabrication Services'^ • SCMS-WW-DP-9710 October 13, 1997 IBM Transfers First Copper Metallization Process into Production) a SCMS-WW-DP-9711 November 10, 1997 A Ride Down Intel's Pricing Escalator • SCMS-WW-DP-9712 December 22, 1997 Semiconductor Contract Manufacturing Wafer Pricing Trends: Fall 1997 y Tab: Market Trends a SCMS-WW-MT-9701 September 15, 1997 Midyear 1997 Forecast: Semiconductor Contract Manufacturing Tab: Market StatisUes a SCMS-WW-MS-9701 November 24, 1997 1996 Semiconductor Contract Manufacturing -
An Embedded Linux Based Navigation System for an Autonomous Underwater Vehicle
An Embedded Linux Based Navigation System for an Autonomous Underwater Vehicle Sonia Thakur James M. Conrad University of North Carolina at Charlotte University of North Carolina at Charlotte [email protected] [email protected] Abstract The purpose of a data acquisition system is to provide reliable and timely information. The received information can be then analyzed in real-time or remotely to assess the state of the measured environment. Similarly, for an autonomous underwater navigation system it is critical to analyze the data received from the inertial measurement unit and other acoustic sensors to calculate its position and direct the vehicle. This work is an effort toward the development of a data logging system based on an embedded Linux platform for an unmanned underwater vehicle. An embedded Linux based board has been chosen Fig. 1. A Hydroid Remus AUV [2] as the core data processing unit of the Autonomous Underwater Vehicle (AUV). This work implements device drivers required for interfacing the inertial sensors and 1.1. Motivation GPS unit to the core-processing unit. This system is intended to provide a development base for implementing The motivation of this work is to design an underwater various navigation algorithms, like Kalman Filter, to navigation system composed of a low cost Embedded calculate the direction of the vehicle. Linux platform and small sized sensors. For air or ground vehicles, a Global Positioning System (GPS) receiver with differential corrections (DGPS) can provide very precise 1. Introduction and inexpensive measurements of geodetic coordinates. Unfortunately these GPS radio signals cannot penetrate Autonomous Underwater Vehicles (AUVs) are beneath the ocean’s surface, and this poses a considerable unmanned and untethered submarines. -
Apple U1 Ultra Wideband (UWB) Analysis
Apple U1 Ultra Wideband (UWB) Analysis Product Brief – October 2019 techinsights.com All content © 2019. TechInsights Inc. All rights reserved. GLOBAL LEADER IN IP & TECHNOLOGY INTELLIGENCE By revealing the innovation others can’t inside advanced technology products, we prove patent value and drive the best Intellectual Property (IP) and technology investment decisions Technology Intelligence Intellectual Property Services We help decision makers in semiconductor, system, financial, We help IP Professionals in global technology companies, and communication service provider companies: licensing entities and legal firms to: • Discover what products are winning in the highest- • Build higher quality, more effective patents growth markets and why • Identify patents of value and gather evidence of use to • Spot or anticipate disruptive events, including the demonstrate this value entrance of new players • Obtain accurate data for planning a potential defensive • Understand state-of-the-art technology strategy or assertion case through independent, objective analysis • Make better portfolio management decisions to invest, • Make better, faster product decisions with greater abandon, acquire or divest confidence • Understand their competition, identify strategic partners, • Understand product costs and bill of materials acquisition targets and business threats 2 All content © 2019. TechInsights Inc. All rights reserved. TechInsights has been publishing technology analysis for 30 years, enabling our customers to advance their intellectual property -
Operational Highlights
078 079 5.1 Business Activities 5.2 Technology Leadership ●Developed integrated fan-out on substrate (InFO-oS) Gen-3, which provides more chip partition integration with larger 5.1.1 Business Scope 5.2.1 R&D Organization and Investment package size and higher bandwidth As the founder and a leader of the dedicated semiconductor foundry segment, TSMC provides a full range of integrated In 2020, TSMC continued to invest in research and ●Expanded 12-inch Bipolar-CMOS-DMOS (BCD) technology semiconductor foundry services, including the most advanced process technologies, leading specialty technologies, the most development, with total R&D expenditures amounting to 8.2% portfolio on 90nm, 55nm and 22nm, targeting a variety of comprehensive design ecosystem support, excellent manufacturing productivity and quality, advanced mask technologies, and of revenue, a level that equals or exceeds the R&D investment fast-growing applications of mobile power management ICs 3DFabricTM advanced packaging and silicon stacking technologies, to meet a growing variety of customer needs. The Company of many other leading high-tech companies. with various levels of integration strives to provide the best overall value to its customers and views customer success as TSMC’s own success. As a result, TSMC has ●Achieved technical qualification of 28nm eFlash for gained customer trust from around the world and has experienced strong growth and success of its own. Faced with the increasingly difficult challenge to continue automobile electronics and micro controller units (MCU) extending Moore’s Law, which calls for the doubling of applications 5.1.2 Customer Applications semiconductor computing power every two years, TSMC has ●Began production of 28nm resistive random access memory focused its R&D efforts on offering customers first-to-market, (RRAM) as a low-cost solution for the price sensitive IoT TSMC manufactured 11,617 different products for 510 customers in 2020. -
TSMC Integrated Fan-Out (Info) Package Apple A10
Electronic Costing & Technology Experts 21 rue la Nouë Bras de Fer 44200 Nantes – France Phone : +33 (0) 240 180 916 email : [email protected] www.systemplus.fr September 2016 – Version 1 – Written by Stéphane ELISABETH DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners. © 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 1 Return to TOC Glossary 1. Overview / Introduction 4 – A10 Die Analysis 57 – Executive Summary – A10 Die View, Dimensions & Marking – Reverse Costing Methodology – A10 Die Cross-Section – A10 Die Process Characteristics 2. Company Profile 7 – Comparison with previous generation 65 – Apple Inc. – A9 vs. A10 PoP – Apple Series Application processor – A9 vs. A10 Process – Fan-Out Packaging – TSMC Port-Folio 4. Manufacturing Process Flow 70 – TSMC inFO packaging – Chip Fabrication Unit – Packaging Fabrication Unit 3. Physical Analysis 15 – inFO Reconstitution Flow – Physical Analysis Methodology – iPhone 7 Plus Teardown 17 5. Cost Analysis 81 – A10 Die removal – Synthesis of the cost analysis – A10 Package-on-Package Analysis 23 – Main steps of economic analysis – A10 Package View, Dimensions – Yields Hypotheses – A10 Package XRay View – Die Cost Analysis 86 – A10 Package Opening – Wafer Cost – A10 Package Marking – Die Cost – A10 Package Cross-Section – inFO Packaging Cost Analysis 90 – A10 Package Cross-Section – Adhesive & Passivation – Packaging Wafer Cost – A10 package cross-Section - TIVs – Packaging Cost per process Steps – A10 package cross-Section – Solder Balls – Component Cost – A10 package cross-Section – RDL – Land-Side Decoupling Capacitor Analysis 48 6. -
A Study of the Foundry Industry Dynamics
A Study of the Foundry Industry Dynamics by Sang Jin Oh B.S. Industrial Engineering Seoul National University, 2003 SUBMITTED TO THE MIT SLOAN SCHOOL OF MANAGEMENT IN PARTIAL FULFILLMENT OF THE REQUIREMENTS FOR THE DEGREE OF MASTER OF SCIENCE IN MANAGEMENT STUDIES AT THE MASSACHUSETTS INSTITUTE OF TECHNOLOGY ARCHVES JUNE 2010 MASSACHUSETTS INSTiUTE OF TECHNOLOGY © 2010 Sang Jin Oh. All Rights Reserved. The author hereby grants MIT permission to reproduce JUN 082010 and to distribute publicly paper and electronic LIBRARIES copies of this thesis document in whole or in part in any medium now known and hereafter created. Signature of Author Sang Jin Oh Master of Science in Management Studies May 7, 2010 Certified by (7 Michael A. Cusumano SMR Distinguished Professor of Management Thesis Supervisor Accepted by (I Michael A. Cusumano Faculty Director, M.S. in Management Studies Program MIT Sloan School of Management A Study of the Foundry Industry Dynamics By Sang Jin Oh Submitted to the MIT Sloan School of Management On May 7, 2010 In Partial Fulfillment of the Requirements for the Degree of Master of Science in Management Studies Abstract In the process of industrial evolution, it is a general tendency that companies which specialize in a specific value chain have emerged. These companies should construct a business eco-system based on their own platform to compete successfully with vertically integrated companies and other specialized companies. They continue to sustain their competitive advantage only when they share their ability to create value with other eco-system partners. The thesis analyzes the dynamics of the foundry industry. -
TSMC Investement in Arizona
Michael R. Splinter Chairman of the Board Senator Robert Menendez Senator Lisa A. Murkowski Honorary Co-Chair Honorary Co-Chair Rupert J. Hammond-Chambers President INTERNAL COMMENTARY: THE STRATEGIC IMPORTANCE OF THE TSMC ARIZONA INVESTMENT MAY 15, 2020 RUPERT J. HAMMOND-CHAMBERS PRESIDENT Taiwan Semiconductor Manufacturing Company (TSMC) is the world’s largest contract chip manufacturer. A key link in the global technology supply chain, it is the most important company most people have never heard of. TSMC, based in Taiwan, is now doubling down on its relationship with the United States in a big way. On Friday, May 15, 2020 TSMC announced the most important technology news of the year; the company committed to building a cutting-edge 5nm fabrication plant (fab) to produce semiconductor chips in Arizona. Its U.S. customers for the chips produced here will not only include U.S. tech companies, but will also include the Pentagon, defense contractors, and the national security community. The visionary founder of TSMC, Morris Chang, imagined a world where fabless semiconductor companies would absorb the financial burden of designing chips, but would outsource their actual production to his TSMC. His vision created a monster that dominates the sector he created - the foundry manufacturing sector – making almost 50% of all chips produced by foundries globally. TSMC’s state-of-the-art process technology and CAPEX investment of approximately US$15 billion/year ensures that it has few, if any, peers. Successive Taiwan governments have continued to nurture TSMC through prioritized access to land, power, and water, thereby allowing it to serve as the beating heart of Taiwan’s technology miracle. -
SPANSION INC., Et Al. Debtors. Chapter 11 Cases
THIS PROPOSED DISCLOSURE STATEMENT IS NOT A SOLICITATION OF ACCEPTANCES OR REJECTIONS OF THE PLAN. ACCEPTANCES AND REJECTIONS MAY NOT BE SOLICITED UNTIL A DISCLOSURE STATEMENT HAS BEEN APPROVED BY THE BANKRUPTCY COURT. THIS PROPOSED DISCLOSURE STATEMENT IS BEING SUBMITTED FOR APPROVAL BUT HAS NOT YET BEEN APPROVED BY THE BANKRUPTCY COURT. UNITED STATES BANKRUPTCY COURT FOR THE DISTRICT OF DELAWARE In re: Chapter 11 Cases SPANSION INC., et al.1 Case No. 09-10690 (KJC) Debtors. (Jointly Administered) FIRST AMENDED DISCLOSURE STATEMENT FOR DEBTORS’ FIRST AMENDED JOINT PLAN OF REORGANIZATION DATED NOVEMBER 25, 2009 LATHAM & WATKINS LLP Michael S. Lurey Gregory O. Lunt Kimberly A. Posin 355 South Grand Avenue Los Angeles, CA 90071 Telephone: (213) 485-1234 Facsimile: (213) 891-8763 DUANE MORRIS, LLP Michael R. Lastowski Richard W. Riley Sommer L. Ross 1100 North Market Street, Suite 1200 Wilmington, DE 19801 Telephone: (302) 657-4900 Facsimile: (302) 657-4901 Counsel for the Debtors and Debtors in Possession 1 The Debtors in these cases, along with the last four digits of each Debtor’s federal tax identification number, are: Spansion Inc., a Delaware corporation (8239); Spansion Technology LLC, a Delaware limited liability company (3982); Spansion LLC, a Delaware limited liability company (0482); Cerium Laboratories LLC, a Delaware limited liability company (0482), and Spansion International, Inc., a Delaware corporation (7542). The mailing address for each Debtor is 915 DeGuigne Dr., Sunnyvale, California 94085. LA\2030380.6 TABLE OF CONTENTS -
Semiconductors: a Changing of the Guard
Semiconductors: A Changing of the Guard Richard Spalton MA, CFA Investment Manager Semiconductors: A Changing of the Guard “While an early chip from the 1970s could fit thousands of micrometre-sized transistors, today’s most advanced chips are a complex web of billions of transistors, the smallest of which are just 10nm. To get some idea of how small that is: your fingernails grew 10nm in the time it took to read the previous sentence.”1 Background One of the key enablers of technological progress has been the constantly shrinking size of the transistors on semiconductor chips. Smaller transistors mean that the same number of computations can be completed faster, more efficiently and at lower cost. This concept was famously outlined by Gordon Moore, co-founder of Intel, who in 1965 wrote what became known as Moore’s Law. The manufacturing process for a particular size of transistor is called a process node. Shifting to a new node is highly complex and involves significant capital expenditure. In July 2020 Intel announced that their transition to the 7 nanometre node was running a year behind schedule. This delay will have a significant impact on Intel and its competitors. This announcement marks a changing of the guard in the semiconductor market, with leadership shifting away from Intel towards Taiwan Semiconductor Manufacturing Company (TSMC) and Samsung Electronics. Scale Matters Assessing the future prospects of a company requires an assessment of its industry. Manufacturing semiconductors is highly capital intensive – the industry spends USD 100bn per annum on capital expenditure. Companies also need to spend substantial amounts on R&D because each process node is more complex than the last. -
ONFI:ONFI: Leadingleading Thethe Wayway Toto Higherhigher NANDNAND Performanceperformance
ONFI:ONFI: LeadingLeading thethe WayWay toto HigherHigher NANDNAND PerformancePerformance AmberAmber HuffmanHuffman PrincipalPrincipal EngineerEngineer IntelIntel CorporationCorporation JuneJune 7,7, 20072007 1 AgendaAgenda yyPCPC platformplatform andand needneed forfor aa standardstandard yyHighHigh speedspeed andand PCPC opportunityopportunity yyOtherOther keykey ingredientsingredients forfor PCPC useuse ofof NANDNAND 2 TheThe PCPC isis aa KeyKey ComponentComponent ofof NANDNAND GrowthGrowth Unit: in 1Gb E., Million units Q307F Q407F Shipment Demand Shipment Demand y NAND growth is projected to be 26.8 697.9 31.5 884.6 Digital Still Cameras 140% YoY for 06/07 13.7% 32.0% 17.4% 27.0% 271.7 880.2 309.7 1,271.5 Cell phones y Largest growth area is “Others” 7.0% 38.0% 14.0% 44.0% 35.1 615.2 38.9 734.5 USB Drives – More than 50% projected QoQ 14.8% 29.0% 10.7% 19.0% 32.6 779.7 46.7 1,223.4 Flash-based MP3/PMP growth for Q3/Q4 9.5% 32.0% 43.3% 57.0% Other 359.6 578.2 y A key component of the (DVs、Game 54.0% 61.0% Total NAND Flash 3,309.0 4,692.2 “Others” category is PC uses Demand 33.0% 42.0% in 1Gb E., Million units Worldwide NAND Flash IC Output (M 1Gb) 1,800 1,600 1,400 1,200 1,000 800 600 400 200 0 Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec 2006 220.8 267.1 278.2 336.1 355.8 373.0 427.9 461.7 488.8 573.2 619.0 655.5 2007 629.7 671.8 703.8 777.6 829.8 869.9 1,027.2 1,095.6 1,147.8 1,416.3 1,511.4 1,584.0 Source: DRAMeXchange, 4/2007 3 NANDNAND InteroperabilityInteroperability ImpactsImpacts AdoptionAdoption inin PCPC PlatformsPlatforms