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256Mb: X16, X32 Mobile LPDDR SDRAM Features Mobile Low-Power DDR SDRAM MT46H16M16LF – 4 Meg X 16 X 4 Banks MT46H8M32LF – 2 Meg X 32 X 4 Banks

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256Mb: X16, X32 Mobile LPDDR SDRAM Features Mobile Low-Power DDR SDRAM MT46H16M16LF – 4 Meg X 16 X 4 Banks MT46H8M32LF – 2 Meg X 32 X 4 Banks Micron Confidential and Proprietary Advance‡ 256Mb: x16, x32 Mobile LPDDR SDRAM Features Mobile Low-Power DDR SDRAM MT46H16M16LF ± 4 Meg x 16 x 4 Banks MT46H8M32LF ± 2 Meg x 32 x 4 Banks Features Options Marking ·VDD/VDDQ ·VDD/VDDQ = 1.70±1.95V ± 1.8V/1.8V H · Bidirectional data strobe per byte of data (DQS) · Configuration · Internal, pipelined double data rate (DDR) architec- ± 16 Meg x 16 (4 Meg x 16 x 4 16M16 ture; two data accesses per clock cycle banks) · Differential clock inputs (CK and CK#) ± 8 Meg x 32 (2 Meg x 32 x 4 8M32 · Commands entered on each positive CK edge banks) · Row-size option · DQS edge-aligned with data for READs; center- ± JEDEC-standard option LF aligned with data for WRITEs ± Reduced page-size option2 LG · 4 internal banks for concurrent operation · Plastic "green" package · Data masks (DM) for masking write dataÐone mask ± 60-ball VFBGA (8mm x 9mm)1 BF per byte ± 90-ball VFBGA (8mm x 13mm)2 B5 · Programmable burst lengths (BL): 2, 4, 8, or 16 · Timing ± cycle time · Concurrent auto precharge option is supported ± 5ns @ CL = 3 (200 MHz) -5 · Auto refresh and self refresh modes ± 5.4ns @ CL = 3 (185 MHz) -54 ± 6ns @ CL = 3 (166 MHz) -6 · 1.8V LVCMOS-compatible inputs ± 7.5ns @ CL = 3 (133 MHz) -75 · On-chip temp sensor to control self refresh rate · Operating temperature range · Partial-array self refresh (PASR) ± Commercial (0Ê to +70ÊC) None · Deep power-down (DPD) ± Industrial (±40ÊC to +85ÊC) IT · Status read register (SRR) ± Industrial/burn-in3 AIT · Selectable output drive strength (DS) ± Automotive (±40ÊC to +105ÊC) AT ± Automotive/burn-in3 AAT · Clock stop capability · Design revision :H · 64ms refresh Notes: 1. Only available for x16 configuration. 2. Only available for x32 configuration. 3. Package-level burn-in. Table 1: Configuration Addressing Reduced Page-Size Architecture 16 Meg x 16 8 Meg x 32 Option2 Configuration 4 Meg x 16 x 2 Meg x 32 x 2 Meg x 32 4 banks 4 banks x 4 banks Refresh count 8K 4K 8K Row 8K A[12:0] 4K A[11:0] 8K A[12:0] addressing Column 512 A[8:0] 512 A[8:0] 256 A[7:0] addressing PDF: 09005aef847f5977 Micron Technology, Inc. reserves the right to change products or specifications without notice. t36n_256mb_embedded_lpddr.pdf - Rev. A 02/12 EN 1 © 2011 Micron Technology, Inc. All rights reserved. ‡Products and specifications discussed herein are for evaluation and reference purposes only and are subject to change by Micron without notice. Products are only warranted by Micron to meet Micron's production data sheet specifications. Micron Confidential and Proprietary Advance 256Mb: x16, x32 Mobile LPDDR SDRAM Features Figure 1: 256Mb Mobile LPDDR Part Numbering MT 46 H 16M16 LF BF -6 AIT :H Micron Technology Revision :H Product family 46 = Mobile DDR SDRAM Operating temperature Blank = Commercial (0°C to +70°C) Operating voltage IT = Industrial (–40°C to +85°C) H = 1.8V/1.8V AIT = Industrial/burn-in AT = Automotive (–40°C to +105°C) Configuration AAT = Automotive/burn-in 16 Meg x 16 8 Meg x 32 Cycle time -5 = 5ns tCK, CL = 3 Addressing -54 = 5.4ns tCK, CL = 3 LF = Mobile standard addressing -6 = 6ns tCK, CL = 3 LG = Reduced page-size addressing -75 = 7.5ns tCK, CL = 3 Package codes BF = 8mm x 9mm VFBGA “green” B5 = 8mm x 13mm VFBGA “green” FBGA Part Marking Decoder Due to space limitations, FBGA-packaged components have an abbreviated part marking that is different from the part number. Micron's FBGA part marking decoder is available at www.micron.com/decoder. PDF: 09005aef847f5977 Micron Technology, Inc. reserves the right to change products or specifications without notice. t36n_256mb_embedded_lpddr.pdf - Rev. A 02/12 EN 2 © 2011 Micron Technology, Inc. All rights reserved. Micron Confidential and Proprietary Advance 256Mb: x16, x32 Mobile LPDDR SDRAM Features Contents General Description ......................................................................................................................................... 7 Functional Block Diagrams ............................................................................................................................... 8 Ball Assignments and Descriptions ................................................................................................................. 10 Package Dimensions ....................................................................................................................................... 14 Electrical Specifications .................................................................................................................................. 16 Electrical Specifications ± IDD Parameters ........................................................................................................ 19 Electrical Specifications ± AC Operating Conditions ......................................................................................... 23 Output Drive Characteristics ........................................................................................................................... 28 Functional Description ................................................................................................................................... 31 Commands .................................................................................................................................................... 32 DESELECT ................................................................................................................................................. 33 NO OPERATION ......................................................................................................................................... 33 LOAD MODE REGISTER ............................................................................................................................. 33 ACTIVE ...................................................................................................................................................... 33 READ ......................................................................................................................................................... 34 WRITE ....................................................................................................................................................... 35 PRECHARGE .............................................................................................................................................. 36 BURST TERMINATE ................................................................................................................................... 37 AUTO REFRESH ......................................................................................................................................... 37 SELF REFRESH ........................................................................................................................................... 38 DEEP POWER-DOWN ................................................................................................................................. 38 Truth Tables ................................................................................................................................................... 39 State Diagram ................................................................................................................................................ 44 Initialization .................................................................................................................................................. 45 Standard Mode Register .................................................................................................................................. 48 Burst Length .............................................................................................................................................. 49 Burst Type .................................................................................................................................................. 49 CAS Latency ............................................................................................................................................... 50 Operating Mode ......................................................................................................................................... 51 Extended Mode Register ................................................................................................................................. 52 Temperature-Compensated Self Refresh ...................................................................................................... 52 Partial-Array Self Refresh ............................................................................................................................ 53 Output Drive Strength ................................................................................................................................ 53 Status Read Register ....................................................................................................................................... 54 Bank/Row Activation ...................................................................................................................................... 56 READ Operation ............................................................................................................................................. 57 WRITE Operation ........................................................................................................................................... 68 PRECHARGE
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