POWER10 Processor Chip
POWER10 Processor Chip Technology and Packaging: PowerAXON PowerAXON - 602mm2 7nm Samsung (18B devices) x x 3 SMT8 SMT8 SMT8 SMT8 3 - 18 layer metal stack, enhanced device 2 Core Core Core Core 2 - Single-chip or Dual-chip sockets + 2MB L2 2MB L2 2MB L2 2MB L2 + 4 4 SMP, Memory, Accel, Cluster, PCI Interconnect Cluster,Accel, Memory, SMP, Computational Capabilities: PCI Interconnect Cluster,Accel, Memory, SMP, Local 8MB - Up to 15 SMT8 Cores (2 MB L2 Cache / core) L3 region (Up to 120 simultaneous hardware threads) 64 MB L3 Hemisphere Memory Signaling (8x8 OMI) (8x8 Signaling Memory - Up to 120 MB L3 cache (low latency NUCA mgmt) OMI) (8x8 Signaling Memory - 3x energy efficiency relative to POWER9 SMT8 SMT8 SMT8 SMT8 - Enterprise thread strength optimizations Core Core Core Core - AI and security focused ISA additions 2MB L2 2MB L2 2MB L2 2MB L2 - 2x general, 4x matrix SIMD relative to POWER9 - EA-tagged L1 cache, 4x MMU relative to POWER9 SMT8 SMT8 SMT8 SMT8 Core Core Core Core Open Memory Interface: 2MB L2 2MB L2 2MB L2 2MB L2 - 16 x8 at up to 32 GT/s (1 TB/s) - Technology agnostic support: near/main/storage tiers - Minimal (< 10ns latency) add vs DDR direct attach 64 MB L3 Hemisphere PowerAXON Interface: - 16 x8 at up to 32 GT/s (1 TB/s) SMT8 SMT8 SMT8 SMT8 x Core Core Core Core x - SMP interconnect for up to 16 sockets 3 2MB L2 2MB L2 2MB L2 2MB L2 3 - OpenCAPI attach for memory, accelerators, I/O 2 2 + + - Integrated clustering (memory semantics) 4 4 PCIe Gen 5 PCIe Gen 5 PowerAXON PowerAXON PCIe Gen 5 Interface: Signaling (x16) Signaling
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