Exhibition fees

*1 Members of the WECC member associations 2 Exhibition fees 1 booth / 9m (tax excluded) (CPCA, EIPC, ELCINA, HKPCA, IPC, IPCA, KPCA and TPCA.) *2 Based on availability, corner booth will be reserved. 49th International Electronic 33rd ADVANCED 21st Jisson Process Technology Non-Members Yen 410,000 Circuits Exhibition PACKAGING EXHIBITION Exhibition *Please apply early due to limited availability. Members*1 Yen 350,000 In-line type: 2 side open plan Block type: 3 side open plan Total Organic Devices Expo Other exhibition related expenses *If you are allocated a corner booth, the corner booth fee is applied, JEP/TEP Show IoT supporting semiconductor Electrical Smart Sensing Federation Of Electronic Parts Distributors And Dealers even if you did not apply for it. /circuit board exhibition /optical transmission technology Exhibiton Electronics Appliances Wholesalers Association Corner charge (per corner)*2 Yen 15,000

Booth type

How to apply (B) Block (C) Island (A) In-line Please fill out the Application Form in consideration with ofllows: (four or more units) (20 or more units) − Carefully read the "Exhibition Regulations" − Select the exhibition based on your product The Secretariat Office will send the invoice. Based on the invoice, please make the Length payment by the due date. Width The entrance of the hall Deadline Thursday, January 31, 2019 Schedule prior to the Exhibition (Tentative)

Cancellation charges January 31, 2019 .... Application deadline February 18 ...... Exhibitors’ Briefing (Tokyo) If an exhibit is cancelled to suit the exhibitor 's circumstances, February 21 ...... Exhibitors’ Briefing (Osaka) cancellation charges (full or partial fees) shall apply as below. Early-April ...... Sending invitations Date of receipt of written notice of cancellation Cancellation charges Last-April ...... Deadline for submission of application documents Last-April ...... Starting registration to the exhibition By Friday, February 1, 2019 50% of booth fees June 3 & June 4 ..... Installation period June 5 to June 7 ..... Exhibition open From Saturday, February 2, 2019 onward 100% of booth fees * Immediate removal on the last day

Reference) Package booth

Use of the venue is restricted due to We are offering the package booths which include the basic furnishings and ornamentation. If you apply for the package booth, the Olympic and Paralympic Games you can participate in the Exhibition with little time and effort. Various Tokyo 2020. plans will be made available on the official website. ● 1 booth / basic plan Determination of Booth Location 75,000 Yen (excluding tax) This plan includes the minimum Booth locations will be determined by the organizers based necessary booth fixtures and fittings, on factors such as the number of exhibition booths, past power supply and carpet. participation, and membership, and will be announced at the ● 1 booth / upgrade plan Exhibitors’ Briefing. 264,000 Yen (excluding tax) This plan includes the booth fixtures Exhibition Period and fittings, power supply and carpet and also pays attention to the The Exhibition Guide Considering the time required for setting up and removal, the signage and colors that enhance visibility of a booth. 6.5 6.7 Exhibition is scheduled to be open as follows: Tokyo Big Sight West Hall 1-4＋Conference Tower Wednesday, June 5, 10:00 a.m. - 5:00 p.m. ● 2 booths / upgrade plan Thursday, June 6, 10:00 a.m. - 5:00 p.m. 464,000 Yen (excluding tax) This plan allows the exhibitor to Friday, June 7, 10:00 a.m. - 4:00 p.m. place shelves and inventory spaces according to the exhibitor's Booth Fixtures and Decorations needs. To set up and remove your booth efficiently, please cooperate by * The above prices are fees for furnishing and ornamentation only and does not include the exhibition fee. using a package booth. Details will be informed at a later date. * Specifications and prices are subject to change. * Details will be informed at a later date.

Organizers: Japan Electronics Packaging and Circuits Association, Overseas Cooperation: Managed by Secretariat Office Japan Institute of Electronics Packaging, Japan Robot Association World Electronic Circuits Council (WECC) Member Associates: Co-organizers: Electronic Device Industry News (Sangyo Times, Inc.), Printed Circuit Association (CPCA), European Institute of Printed Circuits (EIPC), Japan Electronics Packaging and Circuits Association (JPCA) JTB Communication Design, Inc. Electric Wire &Cable News (KOGYO TSUSHIN CO., LTD), JTB Communication Design, Inc. Electronic Industries Association of (ELCINA), Hong Kong Printed Circuit Association (HKPCA), Japan Federation Of Electronic Parts Distributors And Dealers IPC-Association Connecting Electronics Industries (IPC), Indian Printed Circuit Association (IPCA), Kairo Kaikan 2F, 3-12-2, Nishiogikita, Suginami-ku, Tokyo 167-0042 Celestine Shiba Building, 3-23-1, Shiba, Minato-ku, Tokyo, Japan 105-8335 Korea Printed Circuit Association (KPCA), Taiwan Printed Circuit Association (TPCA) 出展に関するお問い合わせ・お申し込みは本部事務局または運営事務局まで Tokyo Electronics Appliances Wholesalers Association ＋ ＋ TEL: 81-3-5310-2020 FAX: 81-3-5310-2021 E-mail: [email protected] TEL:＋81-3-5657-0767 FAX:＋81-3-5657-0645 E-mail: [email protected] Sponsor: Ministry of Economy, Trade and Industry The Total Solution Exhibition for Electronic Equipment Comprehensive exhibition of technology embodying IoT, automobile, robots, medical care, wearable, etc. − Highly specialized and focused − Exhibition of large attendance from all over the world

2019.6.5▶6.7 Tokyo Big Sight West Hall 1-4＋Conference Tower

East Hall 3 Result of 2018 East Hall 2 Option Receive visitor information immediately Free East Halls Presentation by exhibitors Exhibit scale East Hall 1 after the Show 516 companies East Hall 6 East Hall 5 West Hall 3・4 West Halls Information on visitors to your booth will be provided on June 10th The presentation will provide an opportunity to increase your presence 1,476 spaces East Hall 4 (Monday immediately after the exhibition period)!! at the exhibition. Utilize the information to send thank-you messages to visitors and ●Seminar hall (Thirty-minute presentation) Number of visitors people Conference Tower providing information at an early phase. 50,827 West Hall 1・2 ●Equipment for presentation is fully provided. ●Made possible by recommending online visitor registration Number of seminar ●Staff are assigned for the seminar reception counter. audiences people ●Data delivery enables exhibitors to approach visitors immediately 12,571 * Lecture time and date can be selected on a first-come-first-served basis. * Details will be informed at the Exhibitors’ Briefing

Bus Terminal Floor Layout（Tentative） Main companies visiting the exhibition

West Hall 1 West Hall 2 West Hall 3 West Hall 4 ●Related to automobile: Aisin Seiki, Asahi , ICHIKOH INDUSTRIES, Calsonic Kansei, Keihin, KOA, KOITO MANUFACTURING, , Sumitomo Wiring Systems, DAIHATSU MOTOR, DENSO, TOKAI RIKA, Toyodenso, MOTOR, MOTOR, NHK SPRING, PIONEER, Automotive Systems, , SUBARU, Motor, Motor, , YAZAKI ● JEP/TEP Show OA/Robotics: , , Canon, , CYBERDYNE, DENKI, JUKI, , , Panasonic Smart Factory Solutions, FANUC, FUJI, , , YASKAWA Electric, Yamaha Motor, Industry, RICOH JAPAN ● Related to information and communication: Apple, Intel, NHK Media Technology, NTT, NTT DOCOMO, , Korean Broadcasting System (KBS), , PWB Tech PWB Tech KDDI, SoftBank, TOKYO BROADCASTING SYSTEM HOLDINGS (TBS), Information Systems (Japan), IBM Japan, NEC, Microsoft Japan, Nihon Unisys, Panasonic, ・Manufacturing Equipment ・ Finished Products ・ Processing PFU, Hitachi, Huawei, , , Technologies, Materials, ● Related to AV and home electrical appliances: LG Electronics, COMPUTER, Canon, Samsung Electronics, Sharp, , Sony Global Manufacturing & Operations, Sony and Equipment Semiconductor Solutions, INDUSTRIES, , PIONEER, Panasonic, FUJITSU GENERAL, YAMAHA, Roland Atrium ・ Processing Technologies, ● Related to medical equipment: Olympus, Siemens, , SHIRAKAWA OLYMPUS, , Toshiba Medical Systems, Hitachi High-Technologies, Hitachi Healthcare Materials, and Manufacturing, Fujifilm, MARK ELECTRONICS, MORITA TOKYO MFG Equipment Reliability and ● Related to semiconductor device: Intel, STMicroelectronics, Canon, Samsung Electronics, SCREEN Holdings, Sony, TDK, , Toshiba Memory, NIKON, Hitachi High- Inspection Technologies, FUJITSU SEMICONDUCTOR, Micron Japan, , Technologies New Theme ・ Main Materials ● Related to aerospace: IHI, NEC Space Technologies, JAXA (Japan Aerospace Exploration Agency), SINFONIA TECHNOLOGY, Nabtesco, Nippon Avionics, NEC, Mitsubishi Other Zone ・ Heavy Industries, Mitsubishi Electric ● Other: Japan Maritime Self-Defense Force, Japan Ground Self-Defense Force, , Tokyo Electric Power, Central Japan Railway, WEST JAPAN RAILWAY, East Japan

Total Organic Devices Expo Railway ● Electronic circuit board: , Eastern, , ELNA, Kyoei Sangyo, KYOSHA, KYOCERA, Kyoden, Shirai Electronics Industrial, SHINKO, SHINKO ELECTRIC INDUSTRIES, Sumitomo Electric Printed Circuits, DAISHO DENSHI, , CMK, NIPPON MEKTRON, Panasonic, Hitachi Chemical, Fujikura, FUJITSU INTERCONNECT First Floor Fourth Floor TECHNOLOGIES, Meiko Electronics, Yamashita Materials, RISHO KOGYO

Exhibitions held inside the exhibition/relevant exhibits Electronic circuits technology High-density packaging technologies Electronic Component Packaging Technologies New circuit fabrication technology Electrical/optical transmission technology Sensor technology Semiconductors and Electronic parts

JEP/TEP Show Japan Federation Of Electronic Parts Distributors And Dealers Tokyo Electronics Appliances Wholesalers Association Electrical/optical transmission technology ●PWB Tech Industrial Equipment and Electric Sensor technology Finished Products, Design Technologies, Reliability and Inspection Technologies, Main Materials, High-density packaging technologies Electronic Component Packaging Applications of Printed Electronics Semiconductors Wires/Cables and Connectors Sensors, Sensor Nodes Processing, Technologies, Materials, and Equipment, Manufacturing Equipment, Environmental, Overall High-Density Packaging Technologies Technologies Parts, MEMS and Sensors Electronic Devices Electric Wire Processors Semiconductors, Parts and Devices Systems, Distribution Systems Sensors Exhibition Pavilion Electronic Component Packaging Machines LED/OLED/Organic Semiconductor AWM Electronics Module JAPAN Mechanical Devices ● Academic plaza and Related Equipment/Systems Applications Wire Harness Telecommunications Devices, Network FA control equipments Module board, Module Mounting/Design, Module Board/Mounting Materials, Manufacturing and eX-tech Semiconductor Packaging Machines and Materials and Devices/Systems and Electric Wires/Cable Measuring Instrument Systems Measuring instruments Processing Technologies/Materials and Equipment, Distribution and Environmental Systems Systems Design/Analysis Systems Software （Electric wire, Cable, Harness ） Power Sources ●Flexible Printed Circuits Products Area Inspection/Test Equipment Inspection/Evaluation Measurement Manufacturing Equipment Data Platform IoT and M2M Solution ●EMS Japan Packaging Design Systems Technologies, etc. Inspection machine Power Sources Other Related Devices,Technologies and Printed Circuit Mounting Board, Module Mounting Board, Various Integrated M2M（Machine to Machine） Circuits/Mounting/Assembly/Inspection Contract Services Optical transmission Services