Introduction

1) IBM’s Copper wiring

Microscope photo of IBM’s Copper wiring on CU-11 ASIC 130nm technology

2) POWER5 - Power5 Chip Die : Date added: 2005-10-25

IBM introduces POWER5, the world's most advanced microprocessor. POWER5 will be the "brain" of a new line of powerful computer systems that will be introduced in 2004.

3) SOC Picture

Cover of the IBM Journal of Research and Development, Vol 46 No. 6 Nov. 2002.

4) Animation of Power Grid Simulation

Global clock networks provide the heartbeat that synchronizes operations on a processor chip. This movie visualizes the voltages and currents in the POWER6 clock network with two processor cores operating at 5 GHz, slowed down about 20 billion times for the human eye. The high speed clock signal is generated in the center of the chip, and takes more than two clock cycles traveling through wires near the speed of light to reach everywhere in both cores. The rising and falling voltages in each wire and buffer are clearly shown, with larger currents displayed using wider widths and hotter colors. Wires are simulated as transmission lines, including overshoots above and below the yellow box representing the power supply. Buffers appear as vertical cones, since their output currents are larger than their input currents.

Animation by Philip Restle

Reference: "The Physical Design of the POWER6 Microprocessor," Joshua Friedrich, Bradley McCredie, Norman James, Bill Huott, Brian Curran, Eric Fluhr, Gauray Mittal, Eddie Chan, Yuen Chan, Donald Plass, Sam Chu, Hung Le, Leo Clark, John Ripley, Scott Taylor, Jack DiLullo, Mary Lanzerotti, Proceedings of the International Solid-State Circuits Conference (ISSCC), San Francisco, CA, Feb. 11-15, 2007

5) The IBM Stretch : Date added: 2008-09-11

The machine pioneered many advances in circuits, memory, I/O, packaging and power. http://www-03.ibm.com/press/us/en/pressrelease/25079.wss

6) IBM System/360 : Date added: 2005-10-25

IBM System/360 http://www- 03.ibm.com/press/us/en/attachment/10040.wss?fileId=ATTACH_FILE2&fileName=S360ColorPhoto.JPG

7) IBM Watson : Date added: 2011-1-13

Watson, powered by IBM POWER7, is a work-load optimized system that can answer questions posed in natural language over a nearly unlimited range of knowledge. http://www-03.ibm.com/press/us/en/pressrelease/33373.wss

8) Automatic Sequence Control Calculator - Interpolators

Length: 51 feet. Height: eight feet. Weight: nearly five tons. An SUV on steroids? No, those dimensions actually describe the IBM Automatic Sequence Controlled Calculator (ASCC) -- also known as the Harvard Mark I -- the largest electromechanical calculator ever built and the first automatic digital calculator in the United States.

This undated view of the ASCC shows (at right) its three interpolators -- the value tape mechanisms which automatically selected values required in interpolating processes -- next to which are (from right to left) the functional counters, multiplying-dividing unit and storage counters. http://www-03.ibm.com/ibm/history/exhibits/markI/markI_intro.html

9) IBM 701 – Electronic Analytical Control Unit

On April 29, 1952, IBM President Thomas J. Watson, Jr., informed his company's stockholders at the annual meeting that IBM was building "the most advanced, most flexible high-speed computer in the world." Known as the Defense Calculator while in development, the new machine emerged from the IBM Poughkeepsie Laboratory later that year and was formally unveiled to the public on April 7, 1953 as the IBM 701 Electronic Data Processing Machines.

What was so special about the 701? Well, a few things. The 701 was a landmark product because it was:

* The first IBM large-scale electronic computer manufactured in quantity; * IBM's first commercially available scientific computer; * The first IBM machine in which programs were stored in an internal, addressable, electronic memory; * Developed and produced in record time -- less than two years from "first pencil on paper" to installation; * Key to IBM's transition from punched-card machines to electronic computers; and * The first of the pioneering line of IBM 700 series computers, including the 702, 704, 705 and 709. http://www-03.ibm.com/ibm/history/exhibits/701/701_intro.html

10) IBM 29 card punch

The IBM 29 card punch was announced on October 14, 1964, the newest version of a device first developed 74 years earlier. The punch and its companion, the IBM 59 card verifier, were used to record and check information in punched cards. The cards were then read and processed by a computer or an accounting machine. The IBM 29 remained in the product catalog until May 1984.

11) Engineering Design System

From an IBM Innovation Brochure - “Since the early 1960s, IBM has led the industry in the automated design and manufacture of new computers. The company’s Engineering Design System (EDS) takes logical designs, plus technology definitions and constraints, and (1) verifies the functionality of the designs and (2) generates the instructions for the manufacturing tools. EDS takes a circuit desing from logic entry through simulation, physical design and testing, to production. Linking such a range of functions trhough common interfaces to form a total system has no parallel elsewhere in the industry. Engineers at terminals can develop circuit designs from the start of physical design to chip manufacturing in as short a time as six days, compared with weeks or months using a manual system. EDA currently integrates the design work of 32 IBM laboratory-plant locations worldwide.”

12) microprocessor : Date added: 2005-10-25

IBM Analysis Engineer Tami Vogel holds a prototype of the new Cell microprocessor, a collaboration between engineering teams from IBM, and . Essentially a supercomputer on a chip, the Cell microprocessor is expected to transform consumer electronics and digital entertainment. http://www-03.ibm.com/press/us/en/attachment/10043.wss?fileId=ATTACH_FILE2&fileName=cellpic_1.jpg

Start of Microelectronics

13) 1938 IBM Baseball Team

http://www-03.ibm.com/ibm/history/exhibits/waywewore/waywewore_11.html

14) IBM 704 – Courtesy NASA

Man and woman shown working with IBM type 704 electronic data processing machine used for making computations for aeronautical research.

Wikipedia indicates this picture is in the public domain. http://en.wikipedia.org/wiki/File:IBM_Electronic_Data_Processing_Machine_-_GPN-2000-001881.jpg

15) 704 Data Processing System – Operator’s Console

The 704 operator's panel seen here was mounted on the Electronic Analytical Control Unit. Instructions could be entered into the control section through either storage or manually from the operator's panel. And the entire machine could be manually controlled from the operator's panel through its buttons, keys and switches.

16) Magnetic Cores

Magnetic cores originated with two inventors: A. Wang and F. W. Viehe, who independently began experimenting with cores for computer memories in the 1940s. Later development work was done by others, including the Massachusetts Institute of Technology, RCA and IBM. In the 1950s and 1960s, cores were progressively miniaturized to produce high-speed memories. In this 1955 view, a group of IBM cores is compared in size to a pencil and a printed circuit. (VV2116) http://www-03.ibm.com/ibm/history/exhibits/vintage/vintage_4506VV2116.html

17) Magnetic core memory

From an IBM Innovation Brochure - “Magnetic cores were the basic technology for the computer main memory from the 1950s into the early 1970s. This tiny iron oxide cores could be magnetized clockwise or counter clockwise to represent bits of information. Data could be retrieved in millionths of a second. IBM adapted pill- making machinery to produce tens of billions or cores in the 1950s and 1960s”.

18) Patent 3049291

This photo is Figure 3 from patent 3049291: Tape Reader Control by Roger Greenhaigh and David Norton. Filed on Sept. 30, 1959 and issued August 14, 1962.

19) North Street Lab. Endicott NY – 1933

In 1933 IBM completed construction of an engineering laboratory across North Street from the manufacturing plant. The lab seen here was the first IBM building constructed solely for use as a laboratory. When opened, it housed the people and engineering facilities previously located at both the Endicott factory (about 180 employees) and the Varick Street laboratory (about 70 people) in New York City. The North Street Lab served as the headquarters for all of IBM's development work until 1945. http://www-03.ibm.com/ibm/history/exhibits/endicott/endicott_PH06.html

20) Humorous Journal of R&D Cover

To form circuits in the early 1960s, transistors were combined with capacitors, resistors and other electrical elements on circuit cards such as this. On the reverse side, electrical paths were printed -- to improve reliability and speed manufacturing. The circuit cards were then plugged into "gates" and the cards interconnected by wires to form the logic and control elements of processors. http://www-03.ibm.com/ibm/history/exhibits/vintage/vintage_4506VV3071.html

21) Humorous Journal of R&D Cover

The electronic computer was born of the vacuum tube. Developed for the radio industry, the vacuum tube permitted machines to calculate several times faster than did earlier electromechanical relays. This tube system from 1946 could multiply two 10-digit numbers 40 times a second. http://www-03.ibm.com/ibm/history/exhibits/vintage/vintage_4506VV2111.html

22) Jack Kilby – Courtesy of Texas Instruments

Jack Kilby (circa 1958) photographed shortly after his invention of the first integrated circuit at Texas Instruments. http://www.ti.com/corp/docs/kilbyctr/downloadphotos.shtml

23) Robert Noyce

Public Domain http://en.wikipedia.org/wiki/File:Noyce1.jpg

24) First Integrated Circuit – Courtesy of Texas Instruments

Jack Kilby invented the integrated circuit at Texas Instruments in 1958. Comprised of only a transistor and other components on a slice of germanium, Kilby's invention, 7/16-by-1/16-inches in size, revolutionized the electronics industry. The roots of almost every electronic device we take for granted today can be traced back to Dallas more than 40 years ago. http://www.ti.com/corp/docs/kilbyctr/downloadphotos.shtml

25) IBM POWER7 300mm wafer: Date added: 2010-2-8

A finished 300mm Power 7 processor wafer ready for testing. http://www-03.ibm.com/press/us/en/pressrelease/29315.wss

System 360

26) System 360 Models

From an IBM Innovation Brochure – “In the foreground of this scale model are the central processors of the first five computers announced as part of the IBM System/360 in 1964. To the rear are many of the input-output and storage attachments available att announcement time. Thos units could be connected interchageably with the different processors. Instruction written dor one od the System/360 computers would work with any of the others.

27) System 360 / Model 25

Announced in 1968, the Model 25 was a versatile and compact System/360 for users of small and medium sized computers.

28) System 360 / Model 50

One of the original members of the System/360 family announced in 1964, the Model 50 was the most powerful unit in the medium price range.

29) SLT Package

The Solid Logic Technology (SLT), introduced in 1964 by IBM in System/360, was the industry's first high- volume, automatic, microminiature production of semiconductor circuits. Mounted on 1/2-inch-square ceramic modules seen here, the SLT circuits were denser, faster and required less power than the previous generation of transistor technology. (VV3081) http://www-03.ibm.com/ibm/history/exhibits/vintage/vintage_4506VV3081.html

31) SLT Module Card

In order:

Model 22 - The Model 22 was introduced in 1971 as a general purpose computer that combined intermediate- scale data processing capability with small-system economy. Its main storage was either 24K or 32K.

Model 30 - One of the original System/360 models announced in 1964 -- and the smallest -- the Model 30 could serve as a stand-alone system, a communications system or the satellite processor of a larger system.

Model 40 - The Model 40 made its debut in April 1964 as part of the IBM System/360 roll-out. It was a powerful stand-alone system in the medium price range with communication facilities. The Model 40 had a machine cycle time of 625 nanoseconds and could perform 24,600 additions a second.

Model 44 - Launched in 1965, the Model 44 was used for scientific computation. A permanent disk storage unit was built into the system's central processing unit.

Model 75 - Introduced in 1965, the Model 75 was an outgrowth of IBM's continuing engineering development effort to enhance the capabilities of the original System/360 offerings of 1964. Its main memory was available in three sizes up to 1,048,576 characters of information.

Model 95 - The Model 95 -- two of which were installed in 1968 at NASA's Goddard Space Flight Center in Greenbelt, Md. -- were used to solve space exploration problems requiring unusually high computation speeds. The machines were capable of computing 14-digit multiplications at a rate of over 330 million in one minute.

Model 195 - Launched in 1969, the Model 195 was at the time, the most powerful computer in IBM's product line. http://www-03.ibm.com/ibm/history/exhibits/mainframe/mainframe_album.html

Early Days

33) SLT Manufacturing

http://www.computerhistory.org/revolution/mainframe-computers/7/164/580

34) SLT Module Card

http://www.computerhistory.org/revolution/mainframe-computers/7/164/585

35) SLT Module Card

http://www.computerhistory.org/revolution/mainframe-computers/7/164/584

36) Rubylith cutting – Used with permission of Intel Corporation

37) Rubylith cutting – Used with permission of Intel Corporation

1970s

38) System 360 Model 195

Launched in 1969, the Model 195 was at the time, the most powerful computer in IBM's product line. http://www-03.ibm.com/ibm/history/exhibits/mainframe/mainframe_2423PH2195.html

39) System/370 Model 115

The Model 115 was introduced in 1973. A new version (seen here) followed two years later, with twice the disk storage capacity, a faster execution rate and larger main storage. Card reader and card punch data entry was no longer needed. Faster data entry rates resulted from the IBM 3540 diskette input/output unit (foreground). Model 115 users could attach up to eight IBM 3340 disk storage drives (background), providing an online storage capacity of up to 558.4 million characters of information. http://www-03.ibm.com/ibm/history/exhibits/mainframe/mainframe_2423PH3115.html

40) IBM Test Engineer Sara Lestage with POWER7 Wafer: Date added: 2010-2-8

IBM Test Engineer Sara Lestage holds a 300mm Power 7 processor wafer next to a wafer test tool. http://www-03.ibm.com/press/us/en/pressrelease/29315.wss

41) Two IBM Transistors : Date added: 2007-05-21

Two IBM Transistors -- This cross section of a new IBM POWER6, 64-bit dual-core microprocessor was photographed using a scanning electron microscope and shows two transistors, shown as a gold color, out of the 790 million on this thumbnail sized chip. At 4.7 GHz, the dual-core POWER6 processor doubles the speed of the previous chips with virtually no increase in electrical consumption. http://www-03.ibm.com/press/us/en/pressrelease/21580.wss

42) STMicroelectronics and IBM to Collaborate on Chip Technology: Date added: 2007-07-25

Unnamed IBM engineer inspects a 300mm CMOS wafer at IBM's East Fishkill, New York semiconductor fabrication facility. Today STMicroelectronics joined an IBM-led CMOS process-technology development, design enablement and advanced research alliance whose partners include AMD, Chartered, Infineon, Samsung, Sony, Toshiba and Freescale. http://www-03.ibm.com/press/us/en/attachment/21935.wss?fileId=ATTACH_FILE2&fileName=577.jpg

43) Cell Broadband Engine: Date added 2008-6-10

Cell Broadband Engine http://www-03.ibm.com/press/us/en/attachment/24421.wss?fileId=ATTACH_FILE2&fileName=butterflycell.jpg

44) IBM POWER microprocessor : Date added: 2005-12-04

IBM BLUEGENE/L supercomputer, with an expected peak performance of 360 teraflops, is scheduled to be delivered in 2005, and will employ thousands of dual-core IBM POWER microprocessors like the one shown on this 15mm blue jeans brass button. http://www-03.ibm.com/press/us/en/attachment/19010.wss?fileId=ATTACH_FILE2&fileName=1028.jpg

45) IBM eDRAM test chip : Date added: 2007-2-14

Magnificent Memory -- IBM announced a major breakthrough in microchip design that will more than triple the amount of memory contained on a single high-end chip. With the advent of multi-core chips, memory has become an increasingly critical aspect of microprocessor performance. This prototype eDRAM, or Embedded Dynamic Random Access Memory chip, contains over 12 million bits and high-performance logic. It will be available in IBM products beginning next year. http://www-03.ibm.com/press/us/en/pressrelease/21074.wss

46) "Top Fab 2005" : Date added: 2005-12-04

IBM’s 300-millimeter wafer manufacturing facility was named "Top Fab 2005" by Semiconductor International Magazine. The fully automated “hands-free” fabricator features the world’s most advanced Computer Integrated Manufacturing architecture and control systems -- a model of On Demand Business. http://www-03.ibm.com/press/us/en/attachment/19013.wss?fileId=ATTACH_FILE2&fileName=985.jpg

47) IBM CMOS Integrated Silicon Nanophotonics Technology: Date added: 2010-12-1

IBM's new CMOS Integrated Silicon Nanophotonics chip technology integrates electrical and optical devices on the same piece of silicon, enabling computer chips to communicate using pulses of light (instead of electrical signals). http://www-03.ibm.com/press/us/en/pressrelease/33115.wss

48) POWER5 dual core microprocessor : Date added: 2005-12-04

IBM's Power architecture is the heartbeat of digital devices large and small, from printers to the world's most powerful . Shown is a POWER5 dual core microprocessor.

http://www-03.ibm.com/press/us/en/attachment/19008.wss?fileId=ATTACH_FILE2&fileName=78.jpg

49) IBM POWER6 microprocessors arrive: Date added: 2007-05-21

IBM POWER6 microprocessors arrive-- IBM Test Manufacturing Technician B.J. Barrett tests POWER6 microprocessors at the company's Burlington, Vermont facility. IBM today launched its first POWER6-based systems that set new benchmarks for speed, energy efficiency and virtualization capabilities. http://www-03.ibm.com/press/us/en/pressrelease/21580.wss

50) Optical Microscope Photographic Image: Date added: 2010-3-3

Optical microscope photographic image of an array of nanophotonic avalanche photodetectors on a silicon chip. http://www-03.ibm.com/press/us/en/pressrelease/29595.wss

51) Cell Broadband Engine Project Aims to Supercharge IBM Mainframe for Virtual Worlds : Date added: 2007-04-26

"Gameframe." IBM engineer Tami Vogel inspects the Cell Broadband Engine(tm) under a powerful optical microscope while technician Jim Never prepares to view the IBM mainframe's multi-chip module. IBM announced a project to integrate the Cell Broadband Engine -- which powers the Sony PLAYSTATION(r)3 -- and the mainframe to create a super-powerful system capable of running massive, incredibly-realistic online games and virtual worlds. http://www-03.ibm.com/press/us/en/pressrelease/21433.wss

52) Power chip inside a half inch household copper pipe : Date added: 2005-12-04

IBM researchers pioneered the use of tungsten to create copper based chips capable of running significantly faster than aluminum-based technology. Shown is a Power chip inside a half inch household copper pipe. http://www-03.ibm.com/press/us/en/attachment/19006.wss?fileId=ATTACH_FILE2&fileName=635.jpg

53) IBM Power Architecture : Date added: 2005-12-04

From handhelds to mainframes, printers to game consoles, IBM Power Architecture products deliver high performance, power optimization and excellent value. http://www-03.ibm.com/press/us/en/attachment/19011.wss?fileId=ATTACH_FILE2&fileName=77.jpg

54) IBM and Georgia Tech Break Silicon Speed Record: Date added: 2006-06-20

Close up of cryogenic test station in the Georgia Electronic Design Center at Georgia Tech in Atlanta. The facility is capable of cooling electronic devices to temperatures near absolute zero. http://www-03.ibm.com/press/us/en/pressrelease/19843.wss

55) IBM Test Technician Curtis Babbie : Date added: 2007-02-14

IBM Test Technician Curtis Babbie holds a tray of microprocessors. htp://www-03.ibm.com/press/us/en/pressrelease/21074.wss

56) Thermal Conduction Module

Second IBM Innovation Brochure G505-0068, page 7. July 1987 – “The industry’s densest and most efficient logic packaging is the IBM-developed Thermal Conduction Module (TCM) in large-scale IBM 3090 computers. A module can contain up ot 132 circuit chips and has processing power equivalent to that of a a mid-rage System/370 computer of the 1970s. The TCM has the shortest average chip-to-chip communication time of a packaging in any large general-purpose computer. Its water-colling capability is designed to accommodate future, higher-density chip technologies.”

57) Thermal Conduction Module

IBM Journal of R&D Vol/26, No. 1, Cover, January 1982

58) Air Cooled Thermal Conduction Module

Second IBM Innovation Brochure G505-0068, page 7. July 1987 – “Each air-cooled Thermal Conduction Module (TCM) in the IBM 9370 Model 90 contains up to 116 logic, cache memory and control storage chips mounted on a multi-layer ceramic module. Spring-loaded metal pistons pressing against each chip conduct heat to an aluminum heatsink, which gives up heat to room-temperature air blown across it.

59) Journal Paper Picture

IBM Innovation Brochure, page 8. (No date given)

60) IBM 3081 Picture – Courtesy Rutherford Appleton Laboratory

The IBM 3081 was announced by IBM on November 12, 1980 and withdrawn August 4, 1987. The IBM 3081D was the smallest of the three 3081 systems which itself was the smallest of the 3081, 3083, 3084 range.

This Series introduced the System/370 Extended Architecture which added functionality to the 370 architecture while allowing continued execution of existing programs. It, therefore, was an easy replacement for the 3032. http://www.chilton-computing.org.uk/ca/technology/ibm3081/p001.htm

Permissions given via page: http://www.chilton-computing.org.uk/gallery/home.htm

61) IBM 3081 Disc Drives Picture - Courtesy Rutherford Appleton Laboratory

http://www.chilton-computing.org.uk/gallery/ral82/slide7.htm

Permissions given via page: http://www.chilton-computing.org.uk/gallery/home.htm

62) IBM 3081 Picture

The 3081 Processor Complex, which was announced in 1980, provided internal performance about twice that of an IBM 3033 Processor while significantly reducing space, cooling and power requirements. The 3081 used a unique dual processing scheme and new logic modules. Shown here in a design model, the 3081 provided up to 24 channels, or paths for the transfer of data, and a maximum main storage capacity of 32 million characters. http://www-03.ibm.com/ibm/history/exhibits/mainframe/mainframe_2423PH3081.html

1980s

63) Awan verification machine

Photo provided by Kevin Pasnik

64) Awan NG verification machine

Photo provided by Kevin Pasnik

65) Awan Star verification machine

Photo provided by Kevin Pasnik

66) Yorktown Simulation Engine

Photo provided by Daniel Beece

67) Engineering Verification Engine: EVE 1.0

Photo provided by Daniel Beece

68) Engineering Verification Engine – EVE 2.0

Photo provided by Daniel Beece

69) Moore’s Law Graph – Courtesy: The Computer History Museum

http://www.computerhistory.org/revolution/digital-logic/12/267

70) Logic Synthesis Transformations

IBM Journal of R&D, Vol. 25, No. 4, July 1981, pp. 270-280.

71) IBM System z10 Microprocessor Chip : Date added: 2008-02-26

IBM System z10 Microprocessor Chip http://www-03.ibm.com/press/us/en/pressrelease/23592.wss

Photographs 72 through 74 illustrate Optical Proximity Corrections, which are similar to the electron beam proximity corrections methods discussed in the video.

72) Metal Layer without OPC

Photo provided by Ian Stobert

73) OPC Correction Animation

Target Metal (M1) Shapes – 32nm Layout

Layout after OPC Simulated Lithography Contour Lines

Results provided by Ian Stobert

74) Metal layer with and without OPC correction

Photos provided by Ian Stobert

1990s

75) 10 IBM Breakthroughs in 10 Years : Date added: 2007-05-03

10 IBM Breakthroughs in 10 Years -- Beginning with the use of copper for chip wiring, IBM has announced 10 semiconductor innovations over the course of 10 years that have enabled computers and many other kinds of electronic devices to become smaller, less expensive, more powerful, and more energy efficient. IBM today announced it has harnessed the natural tendency of materials to form patterns to create a vacuum between the miles of wires inside chips. This provides better insulation speeding performance and reducing power consumption. http://www-03.ibm.com/press/us/en/pressrelease/21474.wss