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Specification XPC SN85G4V3
Shuttle Mini Barebone PC System Hardware at its finest! Based on NVIDIA's nForce3 250 chipset this 3rd generation SN85G4 shines with an excellent feature set, quiet operation and cool thermals. It boasts plenty of power under the hood that can satisfy the demands of the most power hungry gamers, while presenting a very well design and aesthetically pleasing exterior. The SN85G4V3 is not only the right weapon for every LAN- party, but also a fast companion at home. The XPC SN85G4V3 is an ideal: LAN-gaming PC, Home gaming machine, Digital media management center, Digital content workstation. Feature Highlight · Black Alu chassis with mirror front face · Integrated 8-in-1 card reader G4 chassis · Temperature controlled 92mm fan · Bays: 1x 5.25“, 1x 3.5“ Chipset · NVIDIA nForce3 250 · Socket 754 CPU · Supports AMD Athlon 64 · 1 x AGP (8X) Slots · 1 x PCI Memory · Supports 2x DDR-400/333 Drive · 2x Serial ATA Raid connectors · 2x IDE ATA 133 other · 6-channel audio, SPDIF connectors · Firewire, USB 2.0, LAN Power supply · Silent-X 240 Watt Application · Gaming Article number: SN85G4V3 Order number: PC-SN85G4V3 UPC (see bar code) Date: 24. Nov. 2004 Shuttle Computer Handels GmbH, Fritz-Strassmann-Strasse 5, D-25337 Elmshorn, Germany Tel. +49 (0)4121 476-860 Fax. +49 (0)4121 476-900 Email: [email protected] www.shuttle.com Shuttle Mini Barebone PC System Specification Chassis G4-type chassis made of aluminum, black color, acrylic mirror front face integrated 8-in-1 memory card reader storage bays: 1 x 5.25" (external), 1 x 3.5" ( internal) dimensions: 30 x 20 x 18.5 cm (LWH), weight: 2.85 kg net / 4.65 kg gross Mainboard Shuttle FN85, Shuttle form factor, proprietary design for SN85G4V3 chipset: NVIDIA nForce3 250 with HyperTransport link at 1600MT/s Award V6.0PG BIOS, 4MBit flash memory with hardware monitoring and ACPI power management functions dimensions: 25.4 x 18.5 cm Power supply Silent-X 240 Watt mini PSU, supports 115/230V connectors: 20-pin ATX, 4-pin ATX12V Processor support Socket 754 supports AMD Athlon 64 processors Processor cooling Shuttle I.C.E. -
Hypertransport Extending Technology Leadership
HyperTransport Extending Technology Leadership International HyperTransport Symposium 2009 February 11, 2009 Mario Cavalli General Manager HyperTransport Technology Consortium Copyright HyperTransport Consortium 2009 HyperTransport Extending Technology Leadership HyperTransport and Consortium Snapshot Industry Status and Trends HyperTransport Leadership Role February 11, 2009 Mario Cavalli General Manager HyperTransport Technology Consortium Copyright HyperTransport Consortium 2009 HyperTransport Snapshot Low Latency, High Bandwidth, High Efficiency Point-to-Point Interconnect Leadership CPU-to-I/O CPU-to-CPU CPU-to-Coprocessor Copyright HyperTransport Consortium 2009 Adopted by Industry Leaders in Widest Range of Applications than Any Other Interconnect Technology Copyright HyperTransport Consortium 2009 Snapshot Formed 2001 Controls, Licenses, Promotes HyperTransport as Royalty-Free Open Standard World Technology Leaders among Commercial and Academic Members Newly Elected President Mike Uhler VP Accelerated Computing Advanced Micro Devices Copyright HyperTransport Consortium 2009 Industry Status and Trends Copyright HyperTransport Consortium 2009 Global Economic Downturn Tough State of Affairs for All Industries Consumer Markets Crippled with Long-Term to Recovery Commercial Markets Strongly Impacted Copyright HyperTransport Consortium 2009 Consequent Business Focus Cost Effectiveness No Redundancy Frugality Copyright HyperTransport Consortium 2009 Downturn Breeds Opportunities Reinforced Need for More Optimized, Cost-Effective Computing -
A Unified Memory Network Architecture for In-Memory
A Unified Memory Network Architecture for In-Memory Computing in Commodity Servers Jia Zhan∗, Itir Akgun∗, Jishen Zhao†, Al Davis‡, Paolo Faraboschi‡, Yuangang Wang§, and Yuan Xie∗ ∗University of California, Santa Barbara †University of California, Santa Cruz ‡HP Labs §Huawei Abstract—In-memory computing is emerging as a promising largely residing in main memory, they also pose significant paradigm in commodity servers to accelerate data-intensive challenges in DRAM scaling, especially for memory capacity. processing by striving to keep the entire dataset in DRAM. To If the large dataset cannot fit entirely in memory, it has to address the tremendous pressure on the main memory system, discrete memory modules can be networked together to form a be spilled to disk, thus causing sub-optimal performance due memory pool, enabled by recent trends towards richer memory to disk I/O contention. Unfortunately, with the current DDRx interfaces (e.g. Hybrid Memory Cubes, or HMCs). Such an inter- based memory architecture, the scaling of DRAM capacity memory network provides a scalable fabric to expand memory falls far behind the growth of dataset size of in-memory capacity, but still suffers from long multi-hop latency, limited computing applications [12]. A straightforward approach to bandwidth, and high power consumption—problems that will continue to exacerbate as the gap between interconnect and increase memory capacity is to add more CPU sockets for transistor performance grows. Moreover, inside each memory additional memory channels. However, this will introduce module, an intra-memory network (NoC) is typically employed to significant hardware cost [13]. Moreover, in a multi-socket connect different memory partitions. -
Introduction to AGP-8X
W H I T E P A P E R Introduction to AGP-8X Allan Chen Jessie Johnson Angel Suhrstedt ADVANCED MICRO DEVICES, INC. One AMD Place Sunnyvale, CA 94088 Page 1 Introduction to AGP-8X May 10, 2002 W H I T E P A P E R Background Tremendous efforts have been made to improve computing system performance through increases in CPU processing power; however, I/O bottlenecks throughout the computing platform can limit the system performance. To eliminate system bottlenecks, AMD has been working with industry leaders to implement innovative technologies including AGP, DDR SDRAM, USB2.0, and HyperTransport™ technology. This white paper will provide an overview of the latest graphics subsystem innovation: AGP-8X. Introduction The Accelerated Graphics Port (AGP) was developed as a high-performance graphics interface. It alleviates the PCI graphics bottleneck by providing high bandwidth throughput and direct access to system memory. The new AGP3.0 specification adds an 8X mode definition, which doubles the maximum data transfer rate from the previous high reached with AGP-4X by doubling the amount of data transferred per AGP bus cycle. Figure 1 shows the graphic interface bandwidth performance evolution from PCI to AGP-8X. In this figure, AGP3.0 refers to the specific AGP interface specification. AGP-1X, AGP-2X, AGP-4X and AGP-8X represent the data transfer speed mode. Graphics Interface Peak Bandwidth 2500 2000 1500 1000 Bandwidth (MB/s) 500 0 PCI AGP1X AGP2X AGP4X AGP8X AGP 1.0 Specification AGP 2.0 Specification AGP 3.0 Specification Figure 1: Available bandwidth of different graphic interfaces. -
ATX Mainboard Supports AMD® Socket 754 K8 Athlon64 Processor B M T
K8N Neo-V(MS-7030 v2.0A) ATX Mainboard Supports AMD® Socket 754 K8 Athlon64 Processor B M T J U C : J : : L C M C B P T A B T S L B T i D S o : n o a i : O o i B E 1 n o c p e U t r L p J 1 M t W e t p a A J - t A o : S - o : 8 W C I l U o O n m l p 3 N D B m m D e i r 6 n 1 t o 1 u : l 2 b p j s : o 7 o r a P t BIOS t k u T n o c o d H e s r k F t r y e s t b o a r d J C O M C 1 _ F A J L N E 1 D 1 P P P P P J C C C C C I R I I I I I 1 S S S S S l l l l l S S o o o o o JPW1 A A t t t t t 3 2 T T 5 4 1 A A 2 1 A G P 1 J U B S A B + 2 T T J U J B S B A T n 1 1 F O F n D R V D C I 1 S D E _ I F 3 A A J F N 2 P 2 5 1 0 S _ F A J IDE 1 IDE 2 F N P 1 2 N B _ D D F A D D N R R 1 JWR1 1 2 Mainboard Specification - 1 floppy port supports 2 FDD with 360K, 720K, 1.2M, 1.44M and 2.88Mbytes CPU - 1 serial port (COM port ) l Supports 64bit Athlon64(Socket754) processor - 1 parallel port supporting SPP/EPP/ECP mode l Supports up to 3400+ processor - 1 Audio jack(5-in-1) - 1 IrDA pinheader Chipset - 8 USB1.1/2.0 ports (Rear * 4 / Front * 4) l nVIDIA® nForce3 250 chipset - HyperTransport link to the AMD Athlon 64/Athlon 64 FX CPU BIOS - HyperTransport supporting speed up to 1600MHz , with bandwidth l The mainboard BIOS provides “Plug & Play” BIOS which detects 6.4 GB/S the peripheral devices and expansion cards of the board - AGP3.0 8X interface at 533 MT/s (million transfers per second) automatically. -
AMD Opteron™ 4000 Series Platform Quick Reference Guide
AMD Opteron™ 4000 Series Platform Quick Reference Guide The AMD Opteron™ 4100 Series processor, the world’s lowest power per core processor1, sets the foundation for cloud workloads and affordability for mainstream infrastructure servers with prices starting at $992. AMD Opteron™ 4100 Series Processor END USER BENEFITS Outstanding Performance-Per-Watt > Designed from the ground up to handle demanding server workloads at the lowest available energy draw, beating the competition by as much as 40% (per/core).1 Business Value > The world’s first 1P and 2P capable processor at sub $100 pricing.2 Easy to Purchase and Operate > Scalable solutions with feature, component and platform consistency. PRODUCT FEATURES New AMD-P 2.0 Power Savings Features: > Ultra-low power platforms provide power efficiency beyond just the processor, 3 SOUNDBITE for both 1P and 2P server configurations. THE WORLD’S LOWEST POWER PER CORE SERVER PROCESSOR1 > APML (Advanced Platform Management Link)4 provides an interface for processor and systems management monitoring and controlling of system resources such as platform power Quick Features consumption via p-state limits and CPU thermals to closely monitor power and cooling. AMD-P 2.0: > Link Width PowerCap which changes all 16-bit links to 8-bit links5 can help power conscious Ultra-low power platform > customers improve performance-per-watt. > Advanced Platform Management Link (APML)4 > AMD CoolSpeed Technology reduces p-states when a temperature limit is reached to allow a > Link Width PowerCap server to operate if the processor’s thermal environment exceeds safe operational limits. > AMD CoolSpeed Technology > When C1E5,6 is enabled, the cores, southbridge and memory controller enter a sleep state that > C1E6 can equate to significant power savings in the datacenter depending on system configuration. -
An FPGA Based Verification Platform for Hypertransport 3.X
An FPGA based Verification Platform for HyperTransport 3.x Heiner Litz Holger Froening Maximilian Thuermer Ulrich Bruening University of Heidelberg Computer Architecture Group Germany {heiner.litz, holger.froening, ulrich.bruening}@ziti.uni-heidelberg.de ABSTRACT ware (HW/SW) co-verification Field Programmable Gate In this paper we present a verification platform designed Arrays (FPGAs) have several advantages compared to for HyperTransport 3.x (HT3) applications. It is intended to Electronic Design Automation (EDA) tools. FPGAs allow be used in computing environments in which it is directly to run prototypes in real world environments, in which both connected over a HyperTransport link to the main CPUs. hardware modules and software layers can be verified in an No protocol conversions or intermediate bridges are neces- early prototyping stage. However, the drawback is that sary, which results in a very low latency. An FPGA tech- FPGA-based verification platforms have to be specially nology is chosen due to of its reconfigurability. The main designed for certain applications, in particular if the appli- challenge of this work is the implementation of an HT3 cation is based on a new technology. link using FPGA technology. We provide a design space The verification platform presented here connects to a exploration in order to find the most suitable I/O technol- HyperTransport (HT) link. HyperTransport 2.x (HT2) ogy. This includes verification of the HyperTransport-spe- [1][2] is an established technology for chip-to-chip connec- cific signal levelling, the development of an I/O tions offering a very low latency and a high bandwidth. It is architecture supporting a link width of up to 16 lanes with used in all major AMD processors, including the Opteron source synchronous clocking and a clocking scheme to [3]. -
View Annual Report
FORM 10−K/A NVIDIA CORP − NVDA Filed: November 29, 2006 (period: January 29, 2006) Amendment to a previously filed 10−K Table of Contents Part I Item 1 Business as to Forward−Looking Statements and Available Information ; Part II Item 5 Market for Registrant s Common Equity, Related Stockholder Matters and Issuer Purchas Part IV Item 15 Exhibits and Financial Statement Schedules. Item 1. Business 1 ITEM 1. BUSINESS ITEM 1A. RISK FACTORS ITEM 1B. UNRESOLVED STAFF COMMENTS ITEM 2. PROPERTIES ITEM 3. LEGAL PROCEEDINGS ITEM 4. SUBMISSION OF MATTERS TO A VOTE OF SECURITY HOLDERS PART II ITEM 5. MARKET FOR REGISTRANT S COMMON EQUITY, RELATED STOCKHOLDER MATTERS AND ISSUER PURCHASES OF E ITEM 6. SELECTED FINANCIAL DATA ITEM 7. MANAGEMENT S DISCUSSION AND ANALYSIS OF FINANCIAL CONDITION AND RESULTS OF OPERATIONS ITEM 7A. QUANTITATIVE AND QUALITATIVE DISCLOSURES ABOUT MARKET RISK ITEM 8. CONSOLIDATED FINANCIAL STATEMENTS AND SUPPLEMENTARY DATA ITEM 9. CHANGES IN AND DISAGREEMENTS WITH ACCOUNTANTS ON ACCOUNTING AND FINANCIAL DISCLOSURE ITEM 9A. CONTROLS AND PROCEDURES ITEM 9B. OTHER INFORMATION PART III ITEM 10. DIRECTORS AND EXECUTIVE OFFICERS OF THE REGISTRANT ITEM 11. EXECUTIVE COMPENSATION ITEM 12. SECURITY OWNERSHIP OF CERTAIN BENEFICIAL OWNERS AND MANAGEMENT AND RELATED STOCKHOLDER MATT ITEM 13. CERTAIN RELATIONSHIPS AND RELATED TRANSACTIONS ITEM 14. PRINCIPAL ACCOUNTING FEES AND SERVICES PART IV ITEM 15. EXHIBITS, FINANCIAL STATEMENT SCHEDULES SIGNATURES EXHIBIT INDEX EX−23.1 (CONSENT OF PRICEWATERHOUSECOOPERS LLP) EX−23.2 (CONSENT OF KPMG LLP) EX−31.1 (RULE 13A−14(A) CERTIFICATION OF CHIEF EXECUTIVE OFFICER) EX−31.2 (RULE 13A−14(A) CERTIFICATION OF CHIEF FINANCIAL OFFICER) EX−32.1 (STATEMENT OF THE CHIEF EXECUTIVE OFFICER UNDER RULE 13A−14(B)) EX−32.2 (STATEMENT OF THE CHIEF FINANCIAL OFFICER UNDER RULE 13A−14(B)) EX−99.1 (NVIDIA CORPORATION AND SUBSIDIARIES SELECTED CONSOLIDATED FINANCIAL DATA) Table of Contents UNITED STATES SECURITIES AND EXCHANGE COMMISSION Washington, D.C. -
NVIDIA Nforce Mcps Analyst Day 2004 Drew Henry – GM, Platform Processors NVIDIA Focus on Key Technologies of the “Networked Digital Media” Era
NVIDIA nForce MCPs Analyst Day 2004 Drew Henry – GM, Platform Processors NVIDIA Focus on Key Technologies of the “Networked Digital Media” Era Graphics and Video Network, Media, and Processing Connectivity Processing (GPUs) (MCPs) Digital Media Software ©2004 NVIDIA Corporation. All rights reserved. Worldwide Critical Acclaim For nForce2 ©2004 NVIDIA Corporation. All rights reserved. Highly Regarded by Top Reviewers “We wouldn't recommend a lesser chip set than the NVIDIA nForce2 ….” PC Magazine “Best Innovation in Chipsets” “Best Innovation in Motherboards” Tom’s Hardware Guide “Manufacturer of the Year 2003” PC Games Hardware ©2004 NVIDIA Corporation. All rights reserved. Outstanding Market Share Growth in AMD 45% 40% 35% 30% 25% 20% 15% Share 10% 5% 0% Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 2002 2002 2002 2002 2003 2003 2003 2003 Source: Mercury Research and NVIDIA ©2004 NVIDIA Corporation. All rights reserved. Designed for the PC Customer Gamer’s Bedroom Home Office Family Room ©2004 NVIDIA Corporation. All rights reserved. nForce2 Ultra 400 Outstanding Gaming Platform Uncompromised System Performance Unmatched Features Immersive Surround Sound Amazing Online Experiences ©2004 NVIDIA Corporation. All rights reserved. nForce2 with GeForce4 MX Graphics The Media PC for the Family Room Stunning digital audio for movies and music Home Media Server Feature-Rich graphics drive an interactive experience High-Speed networking for fast and easy streaming media ©2004 NVIDIA Corporation. All rights reserved. Solutions for Corporations ©2004 NVIDIA Corporation. All rights reserved. nForce2 with GeForce4 MX Graphics The Perfect Corporate PC Unified Driver Architecture Enterprise Class Networking Low Total Cost of Ownership nView Multi-Monitor ©2004 NVIDIA Corporation. -
AMD-XXXX(Tm) Device Data Sheet
AMD Product Brief - Preliminary Information AMD-8132TM HyperTransportTM PCI-X® 2.0 Tunnel Product Overview The AMD-8132TM HyperTransportTM PCI-X® 2.0 tunnel developed by AMD provides two PCI-X bridges designed to support PCI-X 266 transfer rates1.. The AMD-8132 tunnel is compliant with HyperTransportTM I/O Link Specification, Rev 2.0 including errata up to specification Rev 1.05c. The package is a 31 x 31 millimeter, 829 ball, flip-chip organic BGA. The core is 1.2 volts. Power dissipation is 7 watts. HyperTransportTM Features: PCI-X® Features: • HyperTransport tunnel with side 0, 16-bit input/ • Two PCI-X bridges: bridge A and bridge B. 16-bit output; and side 1, 16-bit input/16-bit • Each bridge supports a 64-bit data bus. output. • Each bridge supports Mode 1 PCI-X and • Either side can connect to the host or to a Conventional PCI protocol. Each bridge is downstream HyperTransport technology designed to support Mode 2 operation.1. compliant device. • In PCI-X Mode 2, bridges are designed to support transfer rates of 266 and 200 MHz.1. • Each side supports HyperTransport technology- defined reduced bit widths: 8-bit, 4-bit, and 2-bit. • In PCI-X Mode 1, bridges support transfer rates of 133, 100, 66, and 50 MHz. • Each side supports transfer rates of 2000, 1600, • In PCI mode, bridges support transfer rates of 1200, 1000, 800, and 400 mega-bits per second 66, 50, 33, and 25 MHz. per wire. • Independent transfer rates and operational • Maximum bandwidth is 8 gigabytes per second modes for each bridge. -
Dell EMC Poweredge R240 Technical Guide
Dell EMC PowerEdge R240 Technical Guide Regulatory Model: E57S Series Regulatory Type: E57S001 June 2021 Rev. A03 Notes, cautions, and warnings NOTE: A NOTE indicates important information that helps you make better use of your product. CAUTION: A CAUTION indicates either potential damage to hardware or loss of data and tells you how to avoid the problem. WARNING: A WARNING indicates a potential for property damage, personal injury, or death. © 2018 2021 Dell Inc. or its subsidiaries. All rights reserved. Dell, EMC, and other trademarks are trademarks of Dell Inc. or its subsidiaries. Other trademarks may be trademarks of their respective owners. Contents Chapter 1: Product overview......................................................................................................... 5 Introduction...........................................................................................................................................................................5 New technologies................................................................................................................................................................ 5 Chapter 2: System features...........................................................................................................7 Product comparison............................................................................................................................................................ 7 Product specifications........................................................................................................................................................8 -
2.2 Memory Hierarchies for Reconfigurable
Computer Engineering 2010 Mekelweg 4, 2628 CD Delft The Netherlands http://ce.et.tudelft.nl/ MSc THESIS General Purpose Computing with Reconfigurable Acceleration Anthony Arthur Courtenay Brandon Abstract In this thesis we describe a new generic approach for accelerating software functions using a reconfigurable device connected through a high-speed link to a general purpose system. In order for our solu- tion to be generic, as opposed to related ISA extension approaches, we insert system calls into the original program to control the re- configurable accelerator using a compiler plug-in. We define specific mechanisms for the communication between the reconfigurable de- vice, the host general purpose processor and the main memory. The reconfigurable device is controlled by the host through system calls provided by the device driver, and initiates communication by raising interrupts; it further has direct accesses to the main memory (DMA) operating in the virtual address space. To do so, the reconfigurable device supports address translation, while the driver serves the de- vice interrupts, ensures that shared data in the host-cache remain coherent, and handles memory protection and paging. The system is implemented using a machine which provides a HyperTransport CE-MS-2010-28 bus connecting a Xilinx Virtex4-100 FPGA to the host. We evaluate alternative design choices of our proposal using an AES application and accelerating its most computationally intensive function. Our experimental results show that our solution is up to 5 faster than × software