IBM System Z10 Introduction and Hardware Overview
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IBM System z10 Introduction and Hardware Overview Dr. Stephan Kammerer IBM Germany Research & Development August 2010 [email protected] © 2010 IBM Corporation Trademarks The following are trademarks of the International Business Machines Corporation in the United States and/or other countries. AlphaBlox* GDPS* Processor Resource/Systems Manager System z10 APPN* HiperSockets RACF* System zEnterprise z196 CICS* HyperSwap Redbooks* System/30 Cool Blue IBM* Resource Link Tivoli* DB2* IBM eServer RETAIN* Tivoli Storage Manager DFSMS IBM logo* REXX TotalStorage* DFSMShsm IMS RMF VSE/ESA DFSMSrmm Language Environment* S/370 VTAM* DFSORT* Lotus* S/390* WebSphere* DirMaint Multiprise* Scalable Architecture for Financial Reporting xSeries* DRDA* MVS Sysplex Timer* z9* DS6000 OMEGAMON* Systems Director Active Energy Manager z10 DS8000 Parallel Sysplex* System p* z10 BC ECKD Performance Toolkit for VM System Storage z10 EC ESCON* POWER6 System x z/Architecture* FICON* POWER7 System z z/OS* FlashCopy* PowerPC* System z9* z/VM* * Registered trademarks of IBM Corporation PR/SM z/VSE zSeries* The following are trademarks or registered trademarks of other companies. Adobe, the Adobe logo, PostScript, and the PostScript logo are either registered trademarks or trademarks of Adobe Systems Incorporated in the United States, and/or other countries. Cell Broadband Engine is a trademark of Sony Computer Entertainment, Inc. in the United States, other countries, or both and is used under license therefrom. Java and all Java-based trademarks are trademarks of Sun Microsystems, Inc. in the United States, other countries, or both. Microsoft, Windows, Windows NT, and the Windows logo are trademarks of Microsoft Corporation in the United States, other countries, or both. Intel, Intel logo, Intel Inside, Intel Inside logo, Intel Centrino, Intel Centrino logo, Celeron, Intel Xeon, Intel SpeedStep, Itanium, and Pentium are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. UNIX is a registered trademark of The Open Group in the United States and other countries. Linux is a registered trademark of Linus Torvalds in the United States, other countries, or both. ITIL is a registered trademark, and a registered community trademark of the Office of Government Commerce, and is registered in the U.S. Patent and Trademark Office. IT Infrastructure Library is a registered trademark of the Central Computer and Telecommunications Agency, which is now part of the Office of Government Commerce. * All other products may be trademarks or registered trademarks of their respective companies. Notes : Performance is in Internal Throughput Rate (ITR) ratio based on measurements and projections using standard IBM benchmarks in a controlled environment. The actual throughput that any user will experience will vary depending upon considerations such as the amount of multiprogramming in the user's job stream, the I/O configuration, the storage configuration, and the workload processed. Therefore, no assurance can be given that an individual user will achieve throughput improvements equivalent to the performance ratios stated here. IBM hardware products are manufactured from new parts, or new and serviceable used parts. Regardless, our warranty terms apply. All customer examples cited or described in this presentation are presented as illustrations of the manner in which some customers have used IBM products and the results they may have achieved. Actual environmental costs and performance characteristics will vary depending on individual customer configurations and conditions. This publication was produced in the United States. IBM may not offer the products, services or features discussed in this document in other countries, and the information may be subject to change without notice. Consult your local IBM business contact for information on the product or services available in your area. All statements regarding IBM's future direction and intent are subject to change or withdrawal without notice, and represent goals and objectives only. Information about non-IBM products is obtained from the manufacturers of those products or their published announcements. IBM has not tested those products and cannot confirm the performance, compatibility, or any other claims related to non-IBM products. Questions on the capabilities of non-IBM products should be addressed to the suppliers of those products. Prices subject to change without notice. Contact your IBM representative or Business Partner for the most current pricing in your geography. 2 z10 Hardware IBM System z © 2010 IBM Corporation Agenda System z10 EC System z10 BC Overview Overview Architecture Architecture MCM PU Chip zEnterprise System z196 Accelerator Overview SC Chip Architecture Book Layout Connectivity Hardware Development Inter Book Connectivity Firmware Development IO Connectivity Ethernet Connectivity Crypto Capacity on Demand Green IT High Availability Operating Systems 3 z10 Hardware IBM System z © 2010 IBM Corporation Agenda System z10 EC System z10 BC Overview Overview Architecture Architecture MCM PU Chip zEnterprise System z196 Accelerator Overview SC Chip Architecture Book Layout Connectivity Hardware Development Inter Book Connectivity Firmware Development IO Connectivity Ethernet Connectivity Crypto Capacity on Demand Green IT High Availability Operating Systems 4 z10 Hardware IBM System z © 2010 IBM Corporation Von 'System/360' (S/360) zu ESA/390 und z/-Architektur 1964 S/360 – CISC, 24bit Adressierung, 'Real Storage', Uniprozessoren – Amdahl, G.M., Blaauw, G.A., and Brooks, F.P.: Architecture of the IBM System/360 1971 S/370 – 'Virtual Storage', Multiprozessor-Unterstützung, ... 1981 S/370 XA (E xtended Architecture) – 31bit Adressierung (2GB), 'Expanded Storage' (>2GB), 'Channel Subsystem' – 'Interpretive Execution': Basis für Logische Par titionierung ('LPAR') 1988 ESA/370 – ESA = Enterprise Systems Architecture, Logische Partitionierung – Ausbau der Speicher-Zugriffsmethoden: Mehr als ein 'address space‘ 1990 ESA/390 – 'ESCON' ( Enterprise Systems Con nection Architecture) Glasfasertechnologie ... – Datenkompression, Kryptographie, LPAR Erweiterungen 1994 Parallel Sysplex, Übergang von Bipolar zu CMOS Technologie – 'Coupling Facility', Cluster von bis zu 32 x 16-way MultiProzessoren – 'FICON' ( Fi ber Channel Con nectivity), Ausbau der Glasfasertechnologie 2000 z/-Architektur (64-bit), z900, z800, z990(2003), z890(2004), z9 EC(2005), z9 BC(2006), z10 (2008), zEnterprise (2010) 5 z10 Hardware IBM System z © 2010 IBM Corporation IBM z10 EC Continues the CMOS Mainframe Heritage 4000 4.4 3500 GHz 3000 1.7 GHz 2500 1.2 MHz 2000 GHz 770 MHz 1500 550 420 300 MHz 1000 MHz MHz 500 0 1997 1998 1999 2000 2003 2005 2008 G4 G5 G6 z900 z990 z9 EC z10 EC G4 – 1st full-custom CMOS S/390 ® z900 – Full 64-bit z/Architecture ® z10 EC – Architectural G5 – IEEE-standard BFP; branch target prediction z990 – Superscalar CISC pipeline extensions G6 – Copper Technology (Cu BEOL) z9 EC – System level scaling 6 z10 Hardware IBM System z © 2010 IBM Corporation Do GHz matter? GHz does matter – It is the "rising tide that lifts all boats" – It is especially important for CPU-intensive applications GHz is not the only dimension that matters – System z focus is on balanced system design across many factors • Frequency, pipeline efficiency, energy efficiency, cache / memory design, I/O design System performance is not linear with frequency – Need to use LSPR+ System z capacity planning tools for real client / workload sizing System z has been on consistent path while others have oscillated between extremes – Growing frequency steadily, with occasional jumps/step functions (G4 in 1997, z10 in 2008) z10 leverages technology to get the most out of high-frequency design – Low-latency pipeline – Dense packaging (MCM) allows MRU cooling which yields more power-efficient operation – Virtualization technology (etc.) allows consistent performance at high utilization, which makes CPU power-efficiency a much smaller part of the system/data-center power consumption picture 7 z10 Hardware IBM System z © 2010 IBM Corporation Industry’s Approach to Integrated Systems Performance Languages, Application Software Tuning, Efficient Programming Microprocessor frequency will no Middleware longer be the dominant driver of Dynamic optimization, system level performance Assist Threads, Scale-out and small SMPs will System Level Morphing Support, continue to out pace scale-up Fast Computation Migration, Power Optimization, Compiler growth Support Systems will increasingly rely on Compiler Support, modular components for continued Morphing, performance leadership Multiple Cores, SMT, Systems will be designed with the Chip Level Accelerators, ability to dynamically manage and Power Shifting, optimize power Interconnect Circuits Integration over the entire stack, Packaging, from semiconductor technology to Efficient Cooling, end-user applications, will replace Technology Dense SRAM, eDRAM scaling as the major driver of Optics increased system performance Memory 8 z10 Hardware IBM System z © 2010 IBM Corporation Agenda System z10 EC System z10 BC Overview Overview Architecture Architecture MCM PU Chip zEnterprise System z196 Accelerator Overview SC Chip Architecture Book Layout Connectivity Hardware Development Inter Book Connectivity Firmware Development IO Connectivity Ethernet Connectivity Crypto Capacity on Demand Green IT High Availability Operating Systems