TO-247-4L Half-Bridge Evaluation Board Product Specification

Notice

＜High Voltage Safety Precautions＞

◇ Read all safety precautions before use

Please note that this document covers only the SiC MOSFET evaluation board (P02SCT3040KR-EVK-001) and its functions. For additional information, please refer to the Operation Manual.

To ensure safe operation, please carefully read all precautions before handling the evaluation board

Depending on the configuration of the board and voltages used,

Potentially lethal voltages may be generated.

Therefore, please make sure to read and observe all safety precautions described in the red box below.

Before Use [1] Verify that the parts/components are not damaged or missing (i.e. due to the drops). [2] Check that there are no conductive foreign objects on the board. [3] Be careful when performing soldering on the module and/or evaluation board to ensure that solder splash does not occur. [4] Check that there is no condensation or water droplets on the circuit board.

During Use [5] Be careful to not allow conductive objects to come into contact with the board. [6] Brief accidental contact or even bringing your hand close to the board may result in discharge and lead to severe injury or death. Therefore, DO NOT touch the board with your bare hands or bring them too close to the board. In addition, as mentioned above please exercise extreme caution when using conductive tools such as tweezers and screwdrivers. [7] If used under conditions beyond its rated voltage, it may cause defects such as short-circuit or, depending on the circumstances, explosion or other permanent damages. [8] Be sure to wear insulated gloves when handling is required during operation.

After Use [9] The ROHM Evaluation Board contains the circuits which store the high voltage. Since it stores the charges even after the connected power circuits are cut, please discharge the electricity after using it, and please deal with it after confirming such electric discharge. [10] Protect against electric shocks by wearing insulated gloves when handling.

This evaluation board is intended for use only in research and development facilities and should by handled only by qualified personnel familiar with all safety and operating procedures. We recommend carrying out operation in a safe environment that includes the use of high voltage signage at all entrances, safety interlocks, and protective glasses.

User’s Guide

SiC MOSFET Evaluation Board TO-247- 4L Half-Bridge Evaluation Board Product Specification

For SiC MOSFET evaluation we are working with fast voltage and current slew rates, thus an appropriate evaluation environment is required. Unfortunately, it is almost impossible to get an evaluation board which fulfills all the required conditions when considering a device’s new package. Therefore, we have developed an evaluation board based on the most common circuit configuration known as a half-bridge circuit. In order to obtain appropriate evaluation conditions with simple preparation, this board is equipped with a driver circuit, an isolated power supply for the driver circuit, an over current protection circuit, Gate signal protection circuit and so forth. In this application note the evaluation board operational guide for the TO-247- 4L package will be explained. Additionally the detail information regarding operation of this evaluation board is described in the other application note. (TO-247-4L Half-Bridge Evaluation Board Operation Manual: No.61UG047E Rev.001）

１．Appearance

Figure 1 shows a top view picture of this evaluation board. Dimensions and weight are shown in Table 1.

Table 1. Dimensions and Weight

Length 150 mm

Width 150 mm

Height 65 mm

Weight 0.335 kg

Figure 1. Top view picture

２．Main Features

This evaluation board for SiC MOSFET can demonstrate switching characteristics of two types of package such as TO-247-4L and TO-247N. Main features are:

 Alternative mounting either TO-247-4L or TO-247-3L package

 Operate only by +12V power supply  Maximum 150A double-pulse test  Maximum 500 kHz switching operation  Several power topologies supported (Buck, Boost, Half-Bridge)  Built-in isolated adjustable output power supply for gate driving (output range is +12V up to +23V.)  Alternative easy set up turn-off bias voltage either zero bias or minus bias (-2V up to -4V)  Safety function to prevent both upper and lower MOSFETs from turning on at the same time  Over current protection function (DESAT, OCP)

３．Order specification

Order form is as below. It is configured by board name, device Name, and serial number. Minimum order quantity (MOQ) of this evaluation kit is just one piece. Order specification is shown in Table1.

P 0 2 SCT3040KR - Eー V K - 0 0 1

Board Name Device Name Serial Number

Table2. Order specification

Turn-off Device Package Order specification Bias voltage

SCT3040KR TO-247-4L 0V P02SCT3040KR-EVK-001 SCT3080KL TO247-3L 0V P02SCT3080KL-EVK-001 SCT2080KE TO247-3L -2V P02SCT3080KE-EVK-001

４．Functional block diagram

Functional block diagram is shown in Figure 2. Four functions are possible, and each function has an HS_xxx or LS_xxx description. It means “HS” is upper arm, “LS” is lower arm. Functions without “HS” or “LS” are used in both arms.

 Driving driving circuits to operate the switching power device

 Logic logic circuit to control input TTL level signals

 Protection protecting circuits to prevent damage to the switching power device

 Power component high voltage and high current applied components

Table 3 has functional details. Each main function has several sub-functions. Input or output signals are defined in Table 4.

PRIMERY SECONDERY HVdc HS- DCR ICAP VEESEL SNB Vcc VEE2 SGND Vcc1 UVLO HS PGND Gate Power VCC2 PGND PGND +5Vcc LDO BD7F200 DUT_HS HS_DESAT

Vcc1 UVLO1 RCD-SNB HS-GADJ ENABLE Vcc1 UVLO2 ActiveClamp HS_GSC CSEL Vcc1 HS_GD IN_H_CLK HS_DSSEL Vsw HS BM6101 DUT_LS IN_L_CLK FID LS_DESAT UVLO1 RCD-SNB LS UVLO2 LS-GADJ Vcc1 FID Active Clamp LS_GSC DTS LS_GD IN_CLK & LS_DSSEL STP BM6101 VCC2 OCP LS-CS HS_ALOW

LS VEE2 LS_ALOW Gate Power PGND HS- GSEL BD7F200 VEESEL PGND

SGND GND Connect PGND

Figure 2. Function block diagram

Table 3. Functional details

Function Sub-function Symbol Detail

Driving Gate Driver GD Gate driving logic (included in BM6101FV-C)

Gate Power GP Power controller and components for gate driving (includes in BD7F200FV-C) Gate Adjust GADJ Adjustment of gate resistor for MOSFET switching speed Individual adjustment of turn on and turn off Driver Source Select DSSEL Source return route selection by TO-247N(3L) orTO-247-4L(4L)

Logic Low Drop-Out regulator LDO Power for logic circuit (included in BD450M2WEFJ) Clock Select CSEL Set up “Single-clock mode” or “Dual/DP-clock mode”

Dead Time setup DTS Dead-time between HS and LS adjustment circuit (available in Single-clock mode) Shoot Through Prevention STP Circuit preventing HS and LS simultaneously ON (available in Single-clock mode) Protection Gate Surge Clamp GSC Eliminating surge voltage between gate and source Positive or negative surge is clamped by Schottky barrier diode (SBD) or MOSFET.

VEE2 Select VEESEL VEE2 power set up circuit 0V or -2V of turn off bias is selected by jumper pin. GND Select GSEL GND level selection of OCP circuit “VEE2 Select” condition determines GND level of OCP circuit.

Over Current Protection OCP Over current protection circuit (LS source current sensing) Detected level is adjustable with potentiometer.

Device Under Test DUT SiC MOSFET or SiC SBD in HS and LS for evaluation

Desaturation Circuit DESAT Over current detection circuit (individual device sensing) Detected VDS voltage is adjustable by chip resistor Detect unmatched logic signal to gate signal

Fault Indicator FID Indicator of OCP and DESAT status Red LED turns on when FLT signal is high.

Current Sense CS Current Sense resistor circuit (4.7mΩ sensing resistor)

Discharge Resistor DCR Discharge resistor circuit for input capacitor (68 kohm × 6 series)

Power Input Capacitor ICAP Input smoothing capacitor component Snubber Capacitor SNB Snubber capacitor for DC link power line RDC Snubber Circuit RCD_SNB Non-discharged RDC snubber circuit for individual MOSFET of HS and LS Device Under Test DUT MOSFET or SBD in HS and LS for evaluation

Table 4. Definition of Input and Output signals

Connector Pin signal I/O Details

CN201 01 ENABLE I Driver IC Enable signal. When signal is “L”, CLK signal is available. Individual control of HS and LS is invalid. 02 SGND -- Signal GND 03 IN_CLK I HS and LS MOSFET drive signal with reversal. When signal is “H”, HS side MOSFET is ON and LS side MOSFET is OFF. When signal is “L”, HS side MOSFET is OFF and LS side MOSFET is ON. When Single-clock mode, available. When Open, level is “L”. 04 IN_L_CLK I LS side MOSFET drive signal. When signal is “H”, MOSFET is ON. When DUAL/DP-clock mode, available. When Open, level is “L”. 05 SGND -- Signal GND 06 IN_H_CLK I HS side MOSFET drive signal. When signal is “H”, MOSFET is ON. When DUAL/DP-clock mode, available. When Open, level is “L”. 07 HS_ALOW I Exclusive OR function signal for “IN_H_CLK”

08 +5Vcc -- Internal logic power output. Available supply current is max. 20mA. 09 LS_ALOW I Exclusive OR function signal for “IN_H_CLK” 10 SGND -- Signal GND CN202 01 Vcc -- Driver IC and internal logic power. (No need for gate drive power) 02 SGND -- Signal GND JP1 01 DUAL/DP I Dual/DP-clock Mode signal. When “L”, IN_H/L_CLK signals are available. When Open, level is “H”. 02 SGND -- Signal GND 03 SINGLE I Single-clock Mode signal. When “L”, IN_CLK signal is available. When Open, level is “H”. T1 -- HVdc -- High voltage input terminal. In Buck topology, input function. In Boost topology, output function. T2, T4 -- Vsw -- HS side MOSFET source terminal and LS side MOSFET drain terminal. Internally connected between them T3, T5 -- PGND -- Power GND Possible to connect to SGND. (default is connected)

５．Electrical Characteristics

Table 5 lists major absolute maximum ratings of this evaluation board. This table shows limitations which should not be exceeded. You should pay attention to apply voltage or load within these limitations for safe and non-damaged operation.

Table 5. Absolute Maximum Ratings

Parameter Symbol Min. Max. Unit Remarks

Input Voltage DC VHVdc 1200 V

Input Voltage slew rate SRHVdc 50 V/μs Limited by input film capacitor

Output Voltage VOUT 1200 V

Vcc Supply Voltage VCC 5.0 20 V For isolated gate power and internal logic

Input Signal Voltage VENABLE VHS_ALOW VLS_ALOW - 0.3 5.3 V VIN_H_CLK VIN_L_CLK VIN_CLK

+5Vcc Output Current I5Vcc 20 mA Auxiliary Power Source

Storage Temperature TSTG -10 40 ℃ Limited by input film capacitor

Table 6 shows the recommended operating conditions of this board.

Table 6. Recommended Operating Conditions and Electrical Characteristics

Parameter Symbol Min. TYP. Max. Unit Remarks

Input Voltage DC VHVdc 900 V

Output Voltage VOUT 900 V

Vcc Supply Voltage VCC 10 12 15 V

Output Current IOUT 30 A

Double Pulse Current IDP 150 A

CLK signal Pulse width tPWDT 10 μs LS only, 0V bias

CLK Signal frequency fIN_xx_CLK 500 kHz

Input signal Low level voltage VIN_H_CLK 0 1.5 V VIN_L_CLK VIN_CLK VHS_ALOW Input signal High Level voltage VLS_ALOW 3.5 5.1 V VENABLE

Operating Temperature TOPR 25 ℃

Cumulative operating Time tCUM 100 Hrs.

６．Schematics

P02SCT3040KR-EVK-001 schematics with SCT3040KR are shown in Figure 3.

68kΩ D12U8W

- H

SML

Red Red LED

HV alive HV

HVdc

LED301

R311

R308

R310

R307

R306

R309

PGND

Vsw

PGND

1MΩ

1/3W

R334 R335 MLCC NOP

NOP 1MΩ

1/3W

NOP

C306

C307 PGND

0.47uF, 0.47uF, 630V S

1MΩ

10Ω

R332

1/3W

1MΩ

3225

R333

3225

1/3W

2/3W

R180

R179

C305

C304

630V

MLCC

0.47uF

）

R181

D169

D168

PGND

C168

5750

33nF

1000V

700V 0.8A

RFN1LAM7S

10Ω

3225

C303

2/3W

Film

10Ω

(6432 size (6432

3225

2/3W

R81

TP302

：

C302

10uF, 10uF, 1250V

(3216 size), 3/4W:(1632 size) 3/4W:(1632 size), (3216

(2012 size), 1/3W,2/3W:(3225 size) 1/3W,2/3W:(3225 size), (2012

NOP

：

NOP

R79

D157

R80

TFZVTR22B

22V 5mA 0.5W 5mA 22V

NOP

C308

100pF

TFZVTR2.0B

1/16W:(1005 size), 1/10W:(1608 size) 1/10W:(1608 size), 1/16W:(1005

1W~2W

1/4W

1/8W

ZD153

2V 20mA 0.5W 20mA 2V

ZD152

Resistor of size is below is size of Resistor

0.063W(1005), 5% in case of no indication no of case in 5% 0.063W(1005),

5750

150A,100us

TP301

33nF

NOP

1000V

C68

1/4W

D69

D68

1/4W

※

0 Ω

trr=45ns

700V 0.8A

RFN1LAM7S

R362

R363

0 Ω

Q152

1/8W

470 470 Ω

NOP

TP303

1608

NOP

（右回りで大きく）

D57

1000pF

Limit Adjust Limit

Current Current

1/8W

R353

100 100 Ω NOP

1/2W L

R331

47 mΩ 47

NOP

C314

TFZVTR22B

NOP

22V 5mA 0.5W 5mA 22V

RV301

1k Ω

CX152

TFZVTR2.0B

R352

ZD53

2V 20mA 0.5W 20mA 2V

1.5k Ω

ZD52

NOP

0 0 Ω

R177

1/4W

150A,100us

R321~R330

150A,100us

1608

1000pF

C313

Q52

523EB

2SAR

R350

1.5k Ω

Q305

NOP

R349

1.5kΩ

NOP

PGND Q151

NOP S

NOP

523EB 2SCR

Q301

CX151

Red

C159

0.1uF

CX52

OCP

NOP

0 0 Ω

R77

60TR

1/4W

1/8W

D156

ｰ

D155

R361

E12U8W

C312

100pF

523EB

2SCR

スルーホール

50V, 1005 size 1005 50V,

No indication Capacitors is Capacitors indication No

R355

NOP

1/4W

スルーホール

R354

C167

NOP

R356

4.7kΩ

1608

LED302

SML

1.5kΩ

※

470 Ω 470

1000pF

R348

6.8k Ω

1/4W

R156

Q306

4.7k Ω 4.7k

0.1uF

C158

60V 1A60V

RB160VAM

NOP

Q51

TH2

R360

NOP

TH1

5m Ω

Q302

1/8W

R343

523EB

2SCR

NOP

CX51

4.7k Ω

C59

1/4W

0.1uF

1608

1000pF

C310

R344

1.5kΩ

0 Ω

1608

1.5kΩ

D56

NOP

D54

1000pF

C311

60TR, 60V 1A 60V 60TR,

3.3kΩ

R341

1/8W

4.7kΩ

RB160VAM

NOP

C67

D55

1608

D154

Q153

R346

700V 0.8A

RFN1LAM7S

D53

1000pF

60V 3A60V

RSR030N06TL

R345

60TR, 60V 1A 60V 60TR,

R56

1/4W

R347

R155

RB160VAM

4.7k Ω 4.7k

1.5k Ω

47k Ω

1/8W

470 Ω 470

1/8W

220 Ω 220

R342

523EB

2SCR

R359

700V 0.8A

RFN1LAM7S

D153

Q304

Q303

01E

R178

0 0 Ω

C58

523EB

2SCR

TP152

OCP

1/10W

(Nonlock)

SW301

RESET

TP151

TP153

: BU4S584G2 BU4S584G2 (IC205,IC206) :

0.1uF

Q53

SMTE3

60V 3A60V

RSR030N06TL

25V

2012

10uF

C309

TP51

1/8W

100Ω

TP52

R154

1/8W

100 100 Ω

R366

R54 10 Ω 10

NOP IC103,IC104,IC203,IC204) : (IC1,IC2,IC3,IC4,IC101,IC102,BU4S11G2

R55

3.3Ω 1/4W

: BU4SU69G2 (IC5,IC105,IC201,IC202,IC207, IC208,IC209,IC210) (IC5,IC105,IC201,IC202,IC207, : BU4SU69G2 47k Ω

3.3Ω 1/4W NOP

1/4W

R174

NOP

R171

Shumitt INV Shumitt

INV

NAND

R175

R74

R172

R75

0 Ω

NOP

R71

NOP

R72

3.3Ω 1/4W

R364

R365

3.3Ω 1/4W

35V

3.3Ω 1/4W

C62

C162

TP54

TP154

0 0 Ω

2012

1/10W

2012

D52

40TR

2.2k Ω 2.2k

R162

4.7uF 4.7uF 35V

R163

R63

1/8W

R62

2.2k Ω 2.2k

NOP

D151

4.7uF

R170

R173

D51

40TR

NOP

D152

1/8W

C163

4.7uF

R304

4.7k Ω 4.7k

R73

R302

R301

R70

R303

C63

35V,2012

C216

4.7uF

4.7k Ω 4.7k

PGND

RV151

35V,2012

（右回りで大きく）

10k Ω

0 Ω

40V 1A40V

RB160MM

0 Ω

1/4W

0.1uF25V

RV51

JP152

10k Ω

R153

0 Ω

JP52

1/4W

8.2 8.2 kΩ

40V 1A40V

RB160MM

1/4W

R53

VSS

R305

8.2kΩ

25V

VADJ

2012

10uF

VSS

VOUT

IC210

VADJ

VOUT

C218

JP151

ON/OFF

JP51

R151

68kΩ

15k Ω

R152

側

R52

（右回りで大きく）

側

R358

10kΩ

C215

側

U151

68 68 kΩ

側

U51

0.1uF25V

47kΩ

1pin

3pin

19700A00A

C57

C157

001Schematics

1pin

100pF

3pin

19700A00A

SENSE

VDD

D12P8W

CSO

R51

VIN

C109

523EB

2SAR

47kΩ 1/8W47kΩ

100pF

15k Ω

SENSE

HS VEE Select VEE HS

VDD

0 0 Ω

Q307

CSO

VIN

IC209

R357

LS VEE Select VEELS

0.1uF25V

1/10W

TP53

1.5kΩ

R161

SML

Green LED Green

+5V ON +5V

ZD151

0Ω

R61

1/10W

0Ω

R78

1/10W

ZD51

IC105

C214

R160

C315

20mA 0.5W 20mA

1.5kΩ

TFZVTR2.0B

3/4W

20mA 0.5W 20mA

100pF

0.47Ω

TFZVTR2.0B

R60

3/4W

0.47Ω

3/4W

150Ω

4.7uF

0.1uF25V

R157

NOP

R57

R168

C108

R340

100Ω1/8W

R68

3/4W

150Ω

4.7kΩ

TP201

1/8W

35V,2012

NOP

TP202

C151

4.7uF

NOP

100 100 Ω,1/8W

EVK

50V

0.1uF25V

C51

1608

C164

R159

R158

35V,2012

0.47uF

R58

R201

C64

1/8W

IC208

1.5kΩ

R59

470Ω

3/4W

150Ω

R165

IC104

LED201

R65

3/4W

150Ω

50V

C154

1/4W

4.7kΩ

3216

10uF

R164

35V

D12P8W

LED151

2012

C213

SML

1/4W

4.7uF

C54

50V

C152

4.7kΩ

4.7uF

R64

3216

4.7uF

10uF

D12P8W

35V

C52

SML

LED51

2012

0.1uF25V

NOP

C166

4.7uF

C107

35V,2012

NOP

35V,2012

C165

NOP

C66

C65

50V

3216

1uF

10uF

35V

0.1uF25V

1608

60TR

VCC1

50V

3216

10uF

1uF

35V

IC207

1608

C161

C156

C153

C61

C60

0.1uF

C53

IC103

0.1uF

C155

0.1uF

2012

50V

C55

3216

10uF

50V

C160

C56

3216

10uF

0.1uF

50V

60TR

C203

3216

10uF

C212

10uF 10uF 25V

D158

50V

ｰ

3216

D159

10uF

60V 1A60V

D58

60V 1A 60V

RB160VAM

150V 1A 150V

RB168VAM150TR

D59

150V 1A

RB168VAM150TR

0.1uF25V

C106

VEE2

OUT1

OUT2

VCC2

0.1uF25V

VTSIN

VREG

GND2

SCPIN

VEE2

PROUT

OUT1

OUT2

VCC2

VTSIN

VREG

GND2

SCPIN

IC206

PROUT

CE2

IC102

RB160VAM

32T

T256

C211

5V/0.2A

VOUT

0.1uF25V

TX1

C105

EE2225

TX101

CE2

EE2225

U201

U102

CE2

04398

0.1uF25V

04398

IC205

BM6101FV

CTL

GND

VCC

IC101

HTSOP BD450M2WEFJ

4.7kΩ,1/8W 1608

4.7kΩ,1/8W 08

C210

1uF, 1uF, 35V

GND1

VCC1

FILTERS

TEST

ENA

INB

40TR

INA

FLT

GND1

1608

C113

R113

40TR

C13

1000pF

1608

GND1

VCC1

TEST FILTERS

ENA 0.5W 20mA

INB

INA

R13

FLT

GND1

0.1uF25V

1000pF

20mA 0.5W 20mA

20 TFZVTR15B

0.1uF25V

D1 C224

TFZVTR15B IC204

D101

ZD101

ZD1

40V 1A 40V

RB160MM

IC5

1uF

35V

C101

40V 1A 40V

RB160MM

1608

1uF

35V

50V

1608

C115

R112

15kΩ

0.1uF

25V

3216

22uF

C15

50V

R12

C209

0.1uF

15kΩ

R219

R218

25V

10kΩ

3216

22uF

10kΩ

C112

R217

68kΩ

VCC1

Vcc

R101

0.1uF25V

C12

Vcc

R111

R11

15kΩ

0.1uF25V

3.9k Ω

VCC1

15kΩ

C102

C104

0.1uF

C103

1608

IC203

3.9k Ω

1608

1000pF

0.1uF

1000pF

VIN

IC4

LBE2

VIN

1608

LBE2

1000pF

PGND

1608

R103

C208

PGND

1000pF

1uF

C202

35V

Vcc

FIN

1608

FIN

100 100 Ω,1/8W

U101

0.1uF25V

R104

0.1uF25V

1/8W

0 0 Ω

1/8W

100 100 Ω

1/8W

100 100 Ω

1uF

100 100 Ω

VCC1

1/10W

IC202

0 0 Ω

1/8W

35V,1608

SDX/EN

1/10W

COMP

C251

REF

IC3

AGND

TP101

BD7F200EFJ

HS_FAULT

SDX/EN

COMP

REF

Figure3. P02SCT3040KR

4.7kΩ

AGND

3.9kΩ

R253

R252

BD7F200EFJ

R102

VCC1

01 04

INA_LS C207

R110

TP1

1.5kΩ

R254

3.9k Ω 3.9k

0.1uF25V

2.2kΩ

INA_HS

3.9k Ω

R251

R10

0.1uF25V

39k Ω

IC201

ENABLE

IC4

IC2

IC104

R107

NOP

39k Ω 39k

NOP

Q252

C11

C111

50V 0.1A 50V

523EB

2SAR

2SCR

Q251

523EB

0.1uF

0 Ω

0.1uF

10kΩ

50V 0.1A 50V

15k Ω 15k

R109

IC3

0 0 Ω

VCC1

R108

IC103

R255

15k Ω

C14

0.1uF25V

LS_FAULT

C114

0.1uF

HS_FAULT

25V

0.1uF

470 470 Ω

C110

1/8W

2012

R214

0.1uF

10uF

C217

IC1

C10

IC5

0.1uF

IC105

TP203

C204

CLK

25V

2012

10uF

CLK / DP Mode

50V 0.1A 50V

523EB

2SCR

IC2

IC1

IC101

IC102

Dual

Q204

Q234

Single

C223

523EB

2SCR

100pF

C219

100pF

VCC1

R245

2.2kΩ

R215

R216

3.3kΩ

R246

3.3kΩ 側

側 HS LS

R202

10kΩ

R232

10kΩ

3pin

1pin

CLK Select

R243

10kΩ

R213

6.8kΩ

R233

6.8kΩ

JP202

10kΩ

R203

1/8W

IC207

IC208

IC201

Q231

Q201

ENABLE

50V 0.1A 50V

523EB

2SCR

470Ω

R205

R235

1/8W

R204

50V 0.1A 50V

523EB

2SCR

10kΩ

R234

JP201

470Ω

1/8W

R236

R206

10kΩ

R207

IC205

R237

LED202

IC206

LED232

470Ω

1/8W

470Ω

R209

R239

2.2kΩ

C222

100p F 100p

C221

50V 0.1A 50V

523EB

2SCR

50V 0.1A 50V

523EB

2SCR

100p F 100p

Q202

Q232

1/8W

R222

470 Ω 470

R221

IN_CKL_SEL

2.2k Ω

C206

0.1uF

R212

0.1uF

C220

R238

10kΩ

time time setup

10kΩ

R208

470 Ω1/8W 470

VCC1

Red LED

40TR

D12U8W

40TR

IC210

DTS

IC209

LS FAULT

HS FAULT HS

(Latched)

50V 0.1A 50V

523EB

2SCR

LS_FAULT Indicator LS_FAULT

50V 0.1A 50V

523EB

2SCR

HS_FAULT Indicator HS_FAULT

Q233

Q203

SML

Dead

40TR

D202

VCC1

IC203

IC204

40V 1A40V

RB160MM

R105

D204

2.2k Ω

40V 1A40V

RB160MM

2.2k Ω

01E

D203

25V

2012

10uF

SW202

3216

2.2k Ω

C205

R210

2.2k Ω

(Nonlock)

VCC1

Shot Through Prevention Circuit Through Prevention Shot

25V

R106

IC202

22uF

C201

Vcc

VCC1

SMTE3

40V 1A40V

RB160MM

VCC1

R211

RESET

2.2k Ω

D201

RESET

IN_CLK

ENABLE

VCC1

+5Vcc

LS_ALOW

IN_L_CLK

SGND

IN_H_CLK

HS_ALOW

IN_L_CLK

Vcc

IN_H_CLK

SGND

HS_ALOW

+5Vcc

SGND

ENABLE

LS_ALOW

01E

(Nonlock)

200V 3A

RF302LAM2S

SW201

＞

IN_CLK

CN202

CN201

SMTE3

1 2 10

７．BOM

Table 7. Bill of Materials

Package Device Mounted Symbol Parts Number Values Manufacture Size [mm] FR4, 4-layer, PCB -- -- PCB002P Rev.D ROHM 150 x 150 H 3mm Thickness IC Mounted U1,U101 BD7F200EFJ-LB2 PWM IC ROHM HTSOP-J8 IC Mounted U2,U102 BM6101FV-CE2 Driver IC ROHM SSOP-20W S IC Mounted U201 BD450M2WEFJ-CE2 LDO(5V,0.2A) ROHM HTSOP-J8 IC Mounted U51,U151 S-19700A00A-E8 LDO(20V,0.4A) SII HSOP-8A IC1,IC2,IC3,IC4, IC Mounted IC101,IC102,IC103,IC104, BU4S11G2TR NAND(single) ROHM SSOP-5 IC203,IC204 IC5,IC105,IC201,IC202, IC Mounted BU4SU69G2TR INV(single) ROHM SSOP-5 IC207,IC208,IC209,IC210 L IC Mounted IC205,IC206 BU4S584G2TR Schmitt INV(S) ROHM SSOP-5 D1,D51,D52,D101,D151, Diode Mounted RB160MM-40TR 40V,1A ROHM PMDU D152,D202,D203,D204 S Diode Mounted D59,D159 RB160VAM-60TR 60V,1A ROHM TUMD2M Diode NOP D55,D56,D155,D156 RB160VAM-60TR 60V,1A ROHM TUMD2M Diode Mounted D58,D158 RB168VAM150TR 150V,1A ROHM TUMD2M D53,D54,D153,D154, Diode Mounted RFN1LAM7STR 700V,0.8A ROHM PMDTM D68,D69,D168,D169 Diode Mounted D201 RF302LAM2STR 200V,3A ROHM PMDTM Diode NOP D57,D157 DUT TBD TO-247 Transistor NOP Q51,Q151 DUT TBD TO-247-4L Transistor NOP Q52,Q152 DUT TBD TO-247-3L Transistor Mounted Q53,Q153 RSR030N06TL 60V,3A ROHM SC-96 Q201,Q202,Q203,Q204, Q231,Q232,Q233,Q234, Transistor Mounted 2SCR523EBTL 50V,0.1A ROHM SC-89 Q301,Q302,Q303,Q304, Q306,Q251 Transistor Mounted Q305,Q307,Q252 2SAR523EBTL 50V,0.1A ROHM SC-89 Zener Diode Mounted ZD1,ZD101 TFZVTR15B 15V, 20mA ROHM TUMD2M Zener Diode Mounted ZD51,ZD151 TFZVTR2.0B 2.0V, 20mA ROHM TUMD2M Zener Diode NOP ZD52,ZD152 TFZVTR2.0B 2.0V, 20mA ROHM TUMD2M Zener Diode NOP ZD53,ZD153 TFZVTR22B 22V, 5mA ROHM TUMD2M LED Mounted LED201,LED51,LED151 SML-D12P8WT86L Green, 20mA ROHM 1.6 x 0.8 LED Mounted LED202,LED232,LED301, LED302 SML-D12U8WT86Q Red, 20mA ROHM 1.6 x 0.8 Switch Mounted SW201,SW202,SW301 SMTE3-01E-Z SPST, 24V,30mA Copal 6.8 x 7.0 Jumper pin Mounted JP201,JP51,JP151 929647-02-03-EU Male,3-pin 3M --- Jumper-pin shunt Mounted JP202,JP52,JP152 QPC02SXGN-RC 2-pin, black Sullins 2.54 x 5 Terminal Mounted T1,T2,T3,T4,T5 7808 M5, 30A, 6P Keystone 12 x 12 Terminal Mounted CN201 OSTTE100104 10pin, black ON-SHORE 36 x 7 Terminal Mounted CN202 OSTTE020104 2pin, black ON-SHORE 8 x 7 TP1,TP101,TP201,TP202, TP203,TP51,TP52,TP53, Test Pin Mounted HK-2-G SMD Mac8 3.2 x 1.6 TP54,TP151,TP152,TP153, TP154,TP302,TP303 Test Pin NOP TP301 HK-2-G SMD Mac8 3.2 x 1.6 φ3.45 Connector NOP CX51,CX52,CX151,CX152 73415-2061 Jack, SMD mount Molex 3.45 x 3.45 Transformer Mounted TX1,TX101 EE2225 04398-T256 2-output SUMIDA 20 x 18

Table 7. Bill of Materials

Package Device Mounted Symbol Parts Number Values Manufacture Size [mm] Trimmer Mounted RV51,RV151 SM-3TW10kohm(103) 10k,1/8W,11turns Copal 3.9 x 3.5 Trimmer Mounted RV301 SM-31W1kohm(102) 1k,1/8W,5turns Copal 3.9 x 3.5 R5,R6,R105,R106, R62,R162,R207, Resistor Mounted MCR01MZPF2201 2.2k,1/16W ROHM 1.0 x 0.5 R210,R211,R212,R237, R215,R245,R251 Resistor Mounted R366 MCR01MZPF10R0 10,1%,1/16W ROHM 1.0 x 0.5 Resistor Mounted R52,R152,R217 MCR01MZPF6802 68k,1%,1/16W ROHM 1.0 x 0.5 R8,R108,R51,R151, Resistor Mounted MCR01MZPF1502 15k,1%,1/16W ROHM 1.0 x 0.5 R11,R12,R111,R112 Resistor Mounted R213,R243,R348 MCR01MZPF6801 6.8k,1%,1/16W ROHM 1.0 x 0.5 Resistor Mounted R9,R109 MCR01MZPJ000 0ohm ROHM 1.0 x 0.5 Resistor Mounted R10,R110,R252, R1,R101 MCR01MZPF3901 3.9k,1%,1/16W ROHM 1.0 x 0.5 Resistor Mounted R345,R216,R246 MCR01MZPF3301 3.3k,1%,1/16W ROHM 1.0 x 0.5 Resistor Mounted R55,R155,R61,R161 MCR01MZPF4702 47k,1%,1/16W ROHM 1.0 x 0.5 Resistor Mounted R7,R107 MCR01MZPF3902 39k,1%,1/16W ROHM 1.0 x 0.5 Resistor Mounted R53,R153 MCR01MZPF8201 8.2k,1%,1/16W ROHM 1.0 x 0.5 R60,R160,R355,R356, Resistor Mounted R344,R346,R347,R357, MCR01MZPF1501 1.5k,1%,1/16W ROHM 1.0 x 0.5 R254,R349,R352,R350 R202,R203,R205,R206, R232,R233,R235,R236, Resistor Mounted MCR01MZPF1002 10k,1%,1/16W ROHM 1.0 x 0.5 R218,R219,R358,R255, R208,R238 R2,R102,R78,R178,R301, Resistor Mounted MCR03EZPJ000 0ohm ROHM 1.6 x 0.8 R302,R303,R304,R305 R3,R4,R103,R104,R54, Resistor Mounted MCR10EZPJ101 100,5%,1/8W ROHM 2.0 x 1.25 R154,R59,R159,R353 Resistor Mounted R342 MCR10EZPF2200 220,1%,1/8W ROHM 2.0 x 125 R13,R113,R63,R163, Resistor Mounted MCR10EZPF4701 4.7k,1%,1/8W ROHM 2.0 x 1.25 R341,R343,R253,R340 R201,R204,R209,R214, Resistor Mounted R234,R239,R221,R222, MCR10EZPF4700 470,1%,1/8W ROHM 2.0 x 1.25 R359,R361 Resistor Mounted R65,R165,R68,R168 LTR18EZPF1500 150,1%,3/4W ROHM 1.6 x 3.2 Resistor Mounted R58,R158 LTR18EZPFLR470 0.47,1%,1W ROHM 1.6 x 3.2 Resistor Mounted R56,R156,R354, R64,R164 MCR18EZPJ472 4.7k,5%,1/4W ROHM 3.2 x 1.6 Resistor Mounted R74,R174 ESR18EZPJ3R3 3.3,5%,1/2W ROHM 3.2 x 1.6 Resistor Mounted R73,R173,R362,R363 MCR18EZPJ000 0ohm ROHM 3.2 x 1.6 Resistor Mounted R334,R335 KTR25JZPJ105 1M,5%,1/3W ROHM 3.2 x 2.5 R306,R307,R308,R309, Resistor Mounted LTR100JZPJ683 68k,5%,2W ROHM 3.2 x 6.4 R310,R311 R321,R322,R323,R324, Resistor Mounted R325,R326,R327,R328, LTR10EVHFSR047 47m,1%,1/2W ROHM 1.2 x 2.0 R329,R330 Resistor NOP R57,R157 MCR03EZPJ000 0ohm ROHM 1.6 x 0.8 Resistor NOP R331 MCR10EZPF4700 470,1%,1/8W ROHM 2.0 x 1.25 Resistor NOP R70,R170,R77,R177,R364,R365 MCR18EZPJ000 0ohm ROHM 3.2 x 1.6 Resistor NOP R72,R75,R172,R175,R71,R171 ESR18EZPJ3R3 3.3,5%,1/4W ROHM 3.2 x 1.6 Resistor NOP R332,R333 KTR25JZPJ105 1M,5%,1/3W ROHM 3.2 x 2.5 Resistor NOP R360 PWR4412-2S-D-R0050F 5m,1% 5W BOURNS 2.1 x 4.8 Resistor Mounted R79,R80,R81, R179,R180,R181 ESR25JZPJ100 10, 5%, 2/3W ROHM 3.2 x 2.5

Table 7. Bill of Materials

Package Device Mounted Symbol Parts Number Values Manufacture Size [mm] C2,C102,C10,C14,C110, C114,C53,C55,C153,C155, C5,C6,C7,C8,C9,C105, C106,C107,C108,C109, Capacitor Mounted C207,C208,C209,C210, CGA2B3X7R1H104K050BB 0.1u,50V,X7R TDK 1.0 x 0.5 C211,C212,C213,C214, C215,C216,C206, C220,C58,C59.C158, C159,C15,C115 C57,C157,C219,C223, Capacitor Mounted CGA2B2C0G1H101J050BA 100p,50V,C0G TDK 1.0 x 0.5 C221,C222,C312 C202,C56,C156, Capacitor Mounted CGA3E1X7R1V105K080AC 1u,35V,X7R TDK 1.6 x 0.8 C224,C1,C101,C251 C3,C4,C13,C103,C104, Capacitor Mounted CGA3E2C0G1H102J080AA 1000p,50V,C0G TDK 1.6 x 0.8 C113,C310,C311,C313 Capacitor Mounted C64,C164 CGA3E3X7R1H474K080AB 0.47u,50V,X7R TDK 1.6 x 0.8 C51,C52,C54,C151,C152, Capacitor Mounted CGA4J1X7R1V475K125AC 4.7u,35V,X7R TDK 2.0 x 1.25 C154,C62,C63,C162,C163 C203,C204,C205, Capacitor Mounted CGA4J1X7S1E106KT0Y0N 10uF,25V,X7S TDK 2.0 x 1.25 C217,C218,C309 Capacitor Mounted C60,C61,C160,C161 CGA5L3X5R1H106K160AB 10uF,50V,X5R TDK 3.2 x 1.6 Capacitor Mounted C12,C112,C201 C3216X5R1E226M160AB 22uF,25V,X5R TDK 3.2 x 1.6 Capacitor Mounted C304,C305 CGA9P1X7T2J474M250KC 0.47u,630V,X7T TDK 5.7 x 5.0 Capacitor Mounted C302,C303 B32776G1106K000 10uF,1250V TDK 42 x 28 Capacitor Mounted C68,C168 C5750C0G3A333J280KC 33000pF,1000V TDK 5.7 x 5.0 Capacitor NOP C11,C111 CGA2B3X7R1H104K 0.1u,50V,X7R TDK 1.0 x 0.5 Capacitor NOP C308,C315 CGA2B2C0G1H101J050BA 100p,50V,C0G TDK 1.0 x 0.5 Capacitor NOP C314,C67,C167 CGA3E2C0G1H102J080AA 1000p,50V,C0G TDK 1.6 x 0.8 Capacitor NOP C65,C66,C165,C166 CGA5L3X5R1H106K160AB 10uF,50V,X5R TDK 3.2 x 1.6 Capacitor NOP C306,C307 CGA9P1X7T2J474M250KC 0.47u,630V,X7T TDK 5.7 x 5.0

８．PCB Layout

This PCB has four layers. Each layer routing of PCB is illustrated in Figure 4. (a), (b), (c), (d). The silkscreen top and bottom are shown in Figure 4 (e), (f). Also, the Gerber-files can be provided. Get in contact with our application support team. H

Figure 4. (a) Top Layer (Top view)

Figure 4. (b) Layer 2 (Top view)

Figure 4. (c) Layer 3 (Top view)

Figure 4. (d) Bottom Layer (Top view)

Figure 4. (e) Top assembly silkscreen

Figure 4. (f) Bottom assembly silkscreen

９．Precautions

In addition to the precautions listed throughout this manual and “Operation Manual” (No.61UG047E Rev.001), please read and understand the following conditions. This evaluation board can have over 1000V applied. Therefore, not only on-board-problems but also human failures by wrong operation must be removed completely. H In Table 8, the particular precautions about this board abnormal status are shown. In addition, after all safety steps are taken, this board may be used. S

Table 8. Abnormal status of the evaluation board

Functio Items Details n L DCR  LED non-lighted Please check LED301 (Red) turns ON, when input-voltage is applied. If no LED turns ON, please check voltage-source, layout and so on. S (LED turns ON, when in/output voltage gets over around 20V.)

FLT  LED non-lighted Please check that under FAULT-status, even inputting clock signal, MOSFET drive-signal does not come out and LED202 and LED232 (RED) turns ON. If clock signal over 20us is input without mounting MOSFET, it leads to FLT status.

OCP  Protection circuit is not 100 % This OCP cannot avoid danger completely. This function is for risk avoidance. emergency-stop when protection operation does not work in case of accidental output short-circuit under open-loop control. Thus during HVdc application, please conduct constant monitoring so that instant action against abnormal status is possible such as power cut-off.

 FLT LED lighted during LS DPT In the default condition (0V bias), a pulse width of the double pulse test should be utilized within 10μs and 30A of drain current. However, this limitation is LS MOSFET DPT only. If this evaluation board is utilized out of this limitation, LS_FAULT LED (LED202) will be turned on. In case that over 10μs pulse width is applied, the level-shift condition of OCP circuit should be changed. Get detailed information from the operation Manual of this evaluation board (No.61UG047E Rev.001).

HVdc  Over-spec voltage application Please let an expert handle the board. Over-spec voltage must not Vsw  Miss-layout applied. Please make sure that there is no miss-connection of layout. Please never touch it when it is under operation.

Vcc  Miss-layout Please pay attention to layout not to apply positive and negative Vcc in  Over-spec voltage application reverse. Note that a diode is connected between Vcc to SGND (D201) in order to prevent destruction of the TTL logic circuit. The maximum current rating is 3 A. Therefore, an OCP level of Vcc power supply should be set up to 3A. Also unspecified voltage-application leads to malfunction. Please operate with full-check.

SNB  MLCC Burn-out Large size MLCCs are used. Mechanical stress easily leads to short- RDC_SNB circuit malfunction due to cracks. Please pay attention when handling the board to prevent over-stress.

Notes

1) The information contained herein is subject to change without notice.

2) Before you use our Products, please contact our sales representative and verify the latest specifications :

3) Although ROHM is continuously working to improve product reliability and quality, semicon- ductors can break down and malfunction due to various factors. Therefore, in order to prevent personal injury or fire arising from failure, please take safety measures such as complying with the derating characteristics, implementing redundant and fire prevention designs, and utilizing backups and fail-safe procedures. ROHM shall have no responsibility for any damages arising out of the use of our Poducts beyond the rating specified by ROHM.

4) Examples of application circuits, circuit constants and any other information contained herein are provided only to illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production.

5) The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM or any other parties. ROHM shall have no responsibility whatsoever for any dispute arising out of the use of such technical information.

6) The Products specified in this document are not designed to be radiation tolerant.

7) For use of our Products in applications requiring a high degree of reliability (as exemplified below), please contact and consult with a ROHM representative : transportation equipment (i.e. cars, ships, trains), primary communication equipment, traffic lights, fire/crime prevention, safety equipment, medical systems, servers, solar cells, and power transmission systems.

8) Do not use our Products in applications requiring extremely high reliability, such as aerospace equipment, nuclear power control systems, and submarine repeaters.

9) ROHM shall have no responsibility for any damages or injury arising from non-compliance with the recommended usage conditions and specifications contained herein.

10) ROHM has used reasonable care to ensurH the accuracy of the information contained in this document. However, ROHM does not warrants that such information is error-free, and ROHM shall have no responsibility for any damages arising from any inaccuracy or misprint of such information.

11) Please use the Products in accordance with any applicable environmental laws and regulations, such as the RoHS Directive. For more details, including RoHS compatibility, please contact a ROHM sales office. ROHM shall have no responsibility for any damages or losses resulting non-compliance with any applicable laws or regulations.

12) When providing our Products and technologies contained in this document to other countries, you must abide by the procedures and provisions stipulated in all applicable export laws and regulations, including without limitation the US Export Administration Regulations and the Foreign Exchange and Foreign Trade Act.

13) This document, in part or in whole, may not be reprinted or reproduced without prior consent of ROHM.

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