802.11Ac Wave 2 with MU-MIMO: the Next Mainstream Wi-Fi Standard
Total Page:16
File Type:pdf, Size:1020Kb

Load more
Recommended publications
-
QCNFA324 Product Name: 2X2 802.11 A/B/G/N/AC Wifi + Bluetooth Module Mistral Confidential
Mistral Confidential QCNFA324 Product name: 2x2 802.11 A/B/G/N/AC WiFi + Bluetooth Module Mistral Confidential NOTICE The information in this document is reviewed and is believed to be accurate. Nonetheless, this document is subject to change without Notice and Mistral Solutions private Limited (Mistral) assumes no responsibility for any inaccuracies that may be contained in this document, and make no commitment to update or to keep current the contained information, or to notify a person or organization of any updates. Mistral reserves right to make changes, at any time, in order to improve reliability, function or design and to attempt to supply the best product possible. Mistral does not represent that products described herein are free from patent infringement or from any third party right. No part of this document may be reproduced, adapter or transmitted in any form or by any means, electronic or mechanical, for any purpose, except as expressly set forth in a written agreement signed by Mistral. Mistral or its affiliates may have patents or pending patent applications, trademarks, copyrights, mask work rights or other intellectual property rights that apply to the ideas, material and information expressed herein. No license to such rights is provided except as expressly set forth in a written agreement signed by Mistral. Mistral makes no warranties of any kind with regard to the content of this document. In no event shall Mistral be liable for direct, indirect, special, incidental, speculator or consequential damages arising from the use or inability to use this product or documentation, Even if advised of the possibility of such damages. -
Graphics Card Support List
Graphics card support list Device Name Chipset ASUS GTXTITAN-6GD5 NVIDIA GeForce GTX TITAN ZOTAC GTX980 NVIDIA GeForce GTX980 ASUS GTX980-4GD5 NVIDIA GeForce GTX980 MSI GTX980-4GD5 NVIDIA GeForce GTX980 Gigabyte GV-N980D5-4GD-B NVIDIA GeForce GTX980 MSI GTX970 GAMING 4G GOLDEN EDITION NVIDIA GeForce GTX970 Gigabyte GV-N970IXOC-4GD NVIDIA GeForce GTX970 ASUS GTX780TI-3GD5 NVIDIA GeForce GTX780Ti ASUS GTX770-DC2OC-2GD5 NVIDIA GeForce GTX770 ASUS GTX760-DC2OC-2GD5 NVIDIA GeForce GTX760 ASUS GTX750TI-OC-2GD5 NVIDIA GeForce GTX750Ti ASUS ENGTX560-Ti-DCII/2D1-1GD5/1G NVIDIA GeForce GTX560Ti Gigabyte GV-NTITAN-6GD-B NVIDIA GeForce GTX TITAN Gigabyte GV-N78TWF3-3GD NVIDIA GeForce GTX780Ti Gigabyte GV-N780WF3-3GD NVIDIA GeForce GTX780 Gigabyte GV-N760OC-4GD NVIDIA GeForce GTX760 Gigabyte GV-N75TOC-2GI NVIDIA GeForce GTX750Ti MSI NTITAN-6GD5 NVIDIA GeForce GTX TITAN MSI GTX 780Ti 3GD5 NVIDIA GeForce GTX780Ti MSI N780-3GD5 NVIDIA GeForce GTX780 MSI N770-2GD5/OC NVIDIA GeForce GTX770 MSI N760-2GD5 NVIDIA GeForce GTX760 MSI N750 TF 1GD5/OC NVIDIA GeForce GTX750 MSI GTX680-2GB/DDR5 NVIDIA GeForce GTX680 MSI N660Ti-PE-2GD5-OC/2G-DDR5 NVIDIA GeForce GTX660Ti MSI N680GTX Twin Frozr 2GD5/OC NVIDIA GeForce GTX680 GIGABYTE GV-N670OC-2GD NVIDIA GeForce GTX670 GIGABYTE GV-N650OC-1GI/1G-DDR5 NVIDIA GeForce GTX650 GIGABYTE GV-N590D5-3GD-B NVIDIA GeForce GTX590 MSI N580GTX-M2D15D5/1.5G NVIDIA GeForce GTX580 MSI N465GTX-M2D1G-B NVIDIA GeForce GTX465 LEADTEK GTX275/896M-DDR3 NVIDIA GeForce GTX275 LEADTEK PX8800 GTX TDH NVIDIA GeForce 8800GTX GIGABYTE GV-N26-896H-B -
Manual, Chapter 1 and 2 Contains the Introduction of the Motherboard and Step-By-Step Installation Guides
Version 1.0 Published June 2018 Copyright©2018 ASRock INC. All rights reserved. Copyright Notice: No part of this documentation may be reproduced, transcribed, transmitted, or translated in any language, in any form or by any means, except duplication of documentation by the purchaser for backup purpose, without written consent of ASRock Inc. Products and corporate names appearing in this documentation may or may not be registered trademarks or copyrights of their respective companies, and are used only for identification or explanation and to the owners’ benefit, without intent to infringe. Disclaimer: Specifications and information contained in this documentation are furnished for informational use only and subject to change without notice, and should not be constructed as a commitment by ASRock. ASRock assumes no responsibility for any errors or omissions that may appear in this documentation. With respect to the contents of this documentation, ASRock does not provide warranty of any kind, either expressed or implied, including but not limited to the implied warranties or conditions of merchantability or fitness for a particular purpose. In no event shall ASRock, its directors, officers, employees, or agents be liable for any indirect, special, incidental, or consequential damages (including damages for loss of profits, loss of business, loss of data, interruption of business and the like), even if ASRock has been advised of the possibility of such damages arising from any defect or error in the documentation or product. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. -
View Annual Report
2007 ANNUAL REPORT TSE:2303 NYSE:UMC Corporate Information Spokesperson Fab 8C ADR Depositary and Registrar Chitung Liu No.6 Li-Hsin 3rd Rd., Hsinchu Science Citibank, N.A. Chief Financial Officer Park, Hsinchu, Taiwan 30078, R.O.C. Depositary Receipt Services 886 (2) 2700 6999 886 (3) 578 2258 14F, 388 Greenwich Street, [email protected] New York, NY 10013, U.S.A. Fab 8D 1 (877) 248 4237 (Toll-free) Deputy Spokesperson(s) No.8 Li-Hsin 3rd Rd., Hsinchu Science Stockholder Service Representatives are Sandy Yen Park, Hsinchu, Taiwan 30078, R.O.C. available Monday through Friday, The Chairman and CEO Office 886 (3) 578 2258 8:30a.m. to 6:00p.m., Eastern Time. Senior Manager http://wwss.citissb.com/adr/www/ 886 (2) 2700 6999 Fab 8E [email protected] [email protected] No.17 Li-Hsin Rd., Hsinchu Science Park, Hsinchu, Taiwan 30078, R.O.C. ADR Exchange Marketplace Bowen Huang 886 (3) 578 2258 New York Stock Exchange, Inc. Finance Division 11 Wall Street Senior Manager Fab 8F New York, NY 10005, U.S.A. 886 (2) 2700 6999 No.3 Li-Hsin 6th Rd., Hsinchu Science 1 (212) 656 3000 [email protected] Park, Hsinchu, Taiwan 30078, R.O.C. www.nyse.com 886 (3) 578 2258 Ticker/Search Code: UMC Headquarters No.3 Li-Hsin 2nd Rd., Hsinchu Science Fab 8S Exchangeable Bond Exchange Park, Hsinchu, Taiwan 30078, R.O.C. No.16 Creation 1st Rd., Hsinchu Science Marketplace 886 (3) 578 2258 Park, Hsinchu, Taiwan 30077, R.O.C. -
K10n78hsli-Wifi / K10n78hsli-1394
K10N78hSLI-WiFi / K10N78hSLI-1394 User Manual Version 1.0 Published April 2008 Copyright©2008 ASRock INC. All rights reserved. 1 Copyright Notice: No part of this manual may be reproduced, transcribed, transmitted, or translated in any language, in any form or by any means, except duplication of documentation by the purchaser for backup purpose, without written consent of ASRock Inc. Products and corporate names appearing in this manual may or may not be regis- tered trademarks or copyrights of their respective companies, and are used only for identification or explanation and to the owners’ benefit, without intent to infringe. Disclaimer: Specifications and information contained in this manual are furnished for informa- tional use only and subject to change without notice, and should not be constructed as a commitment by ASRock. ASRock assumes no responsibility for any errors or omissions that may appear in this manual. With respect to the contents of this manual, ASRock does not provide warranty of any kind, either expressed or implied, including but not limited to the implied warran- ties or conditions of merchantability or fitness for a particular purpose. In no event shall ASRock, its directors, officers, employees, or agents be liable for any indirect, special, incidental, or consequential damages (including damages for loss of profits, loss of business, loss of data, interruption of business and the like), even if ASRock has been advised of the possibility of such damages arising from any defect or error in the manual or product. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. -
K10N78-1394.Pdf
K10N78-1394 / K10N78 User Manual Version 1.1 Published August 2008 Copyright©2008 ASRock INC. All rights reserved. 1 Copyright Notice: No part of this manual may be reproduced, transcribed, transmitted, or translated in any language, in any form or by any means, except duplication of documentation by the purchaser for backup purpose, without written consent of ASRock Inc. Products and corporate names appearing in this manual may or may not be regis- tered trademarks or copyrights of their respective companies, and are used only for identification or explanation and to the owners’ benefit, without intent to infringe. Disclaimer: Specifications and information contained in this manual are furnished for informa- tional use only and subject to change without notice, and should not be constructed as a commitment by ASRock. ASRock assumes no responsibility for any errors or omissions that may appear in this manual. With respect to the contents of this manual, ASRock does not provide warranty of any kind, either expressed or implied, including but not limited to the implied warran- ties or conditions of merchantability or fitness for a particular purpose. In no event shall ASRock, its directors, officers, employees, or agents be liable for any indirect, special, incidental, or consequential damages (including damages for loss of profits, loss of business, loss of data, interruption of business and the like), even if ASRock has been advised of the possibility of such damages arising from any defect or error in the manual or product. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. -
R.C.S. Luxembourg B-104.413
R.C.S. Luxembourg B-104.413 Audited Annual Report as at 31 January 2018 No subscription can be accepted on the basis of the financial reports. Subscriptions are only valid if they are made on the basis of the latest published prospectus accompanied by the latest annual report and the most recent semi-annual report, if published thereafter. DB Platinum Table of contents Page Management and Administration 3 Directors’ Report 5 Independent Auditor’s Report 14 Statement of Net Assets 17 Key Figures as at 31 January 2018 21 Statement of Operations and Changes in Net Assets 26 Statistics 30 Statement of Investments DB Platinum Commodity Euro 37 DB Platinum CROCI Branchen Stars 38 DB Platinum Commodity USD 40 DB Platinum CROCI World 41 DB Platinum PWM CROCI Multi Fund 45 DB Platinum CROCI Sectors Fund 46 DB Platinum CROCI Global Dividends 48 DB Platinum CROCI US Dividends 51 DB Platinum Chilton Diversified 53 DB Platinum Ivory Optimal 55 DB Platinum CROCI World ESG 57 DB Platinum Chilton European Equities 60 DB Platinum MCP Terra Grove Pan Asia 62 DB Platinum MidOcean Absolute Return Credit 63 Notes to the Financial Statements 68 Information to Shareholders (unaudited) 164 DB Platinum Management and Administration Registered Office DB Platinum 11-13, boulevard de la Foire L-1528 Luxembourg Grand-Duchy of Luxembourg Board of Directors - Alexander McKenna (chairman of the Board of Directors), Head of Product Platform Engineering, Deutsche Asset Management (UK) Limited, Winchester House, 1 Great Winchester Street, London EC2N 2DB, United Kingdom. - Freddy Brausch, Independent director, Linklaters LLP, 35, avenue John F. -
Z590 Pro4.Pdf
Version 1.0 Published February 2021 Copyright©2021 ASRock INC. All rights reserved. Copyright Notice: No part of this documentation may be reproduced, transcribed, transmitted, or translated in any language, in any form or by any means, except duplication of documentation by the purchaser for backup purpose, without written consent of ASRock Inc. Products and corporate names appearing in this documentation may or may not be registered trademarks or copyrights of their respective companies, and are used only for identification or explanation and to the owners’ benefit, without intent to infringe. Disclaimer: Specifications and information contained in this documentation are furnished for informational use only and subject to change without notice, and should not be constructed as a commitment by ASRock. ASRock assumes no responsibility for any errors or omissions that may appear in this documentation. With respect to the contents of this documentation, ASRock does not provide warranty of any kind, either expressed or implied, including but not limited to the implied warranties or conditions of merchantability or fitness for a particular purpose. In no event shall ASRock, its directors, officers, employees, or agents be liable for any indirect, special, incidental, or consequential damages (including damages for loss of profits, loss of business, loss of data, interruption of business and the like), even if ASRock has been advised of the possibility of such damages arising from any defect or error in the documentation or product. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. -
COST to COST CORRSAIR 2590 106-107, Meghdoot Building, Nehru Place TRANSCEND I-3---4290 2GB--700 4GB--1142
DUAL CORE DDR3 3.0GHZ-- COST TO COST CORRSAIR 2590 106-107, Meghdoot Building, Nehru Place TRANSCEND I-3---4290 2GB--700 4GB--1142 Rate List Date: 8/27/2011 FREE USB MOUSE (MOSERBAER) WITH ANY LED/LCD MONITOR 35 GIGABYTE / ASUS G41 2325 71 DDR2-2GB simmtronics (5 YEAR) 928 110 NVIDEA 9500GS/512/HDMI/DVI/V 2900 36 INTEL DX 58 OG SATA/USB 3 10500 72 DDR 3 KINGSTON 2GB 738 111 NVIDEA 9600/DDR3/512 HYPER 2750 CPU INTEL 37 GIGABYTE H55M-D2H 3900 73 DDR1 512MB HYNIX LAPTOP 714 112 XFX/ZOTAC 210 NVIDIA 1GB DD 1900 1 INTEL DUAL CORE 3.06 ASK 38 GIGABYTE P55-US3L 6350 74 DDR1 1GB HYNIX LAPTOP 1323 113 ATI 6870 1GB DDR5 SAPPHIRE 9800 2 INTEL (I-5 /2310) ASK 39 INTEL G43RK (OEM) 2750 75 DDR2 2GB TRANSCEND/KINGST 1100 114 ATI 5670 1GB DDR3 SAPPHIRE 3333 3 INTEL (I-5 /2500K) 9740 40 INTEL DG41 WV (BOX) 2675 76 DDR1 1GB HYNIX 976 115 5670 1GB DDR3 SAPPHIRE 3333 4 INTEL (I-5 /2500) 9190 41 INTEL H55TC (OEM) 3950 77 DDR2 1GBTRANS/KING LAPTOP 714 116 5450 1GB DDR3 SAPPHIRE 1900 5 INTEL (I-7 /2600) 13400 42 GIGABYTE X58A-USB3 (1366) 10700 78 DDR2 2GB KINGSTON LAPTOP 1200 117 NVIDEA 9300GE /512MB 1800 6 INTEL I-7/960 4 CORE 8 MB CAS 13700 43 GIGABYTE /ASUS H55M 3600 79 DDR 3 4GB TRANSCEND (1333) 1142 118 NVIDEA 9600GS 768MB (192BIT 3000 7 INTEL I-3 540/3.06GHZ 4290 44 INTEL H55TC BOX 4050 80 DDR2 2GB TRANSCEND LAPTO 1100 119 AGP ATI 9200 1200 8 INTEL CORE 2 QUAD 2.66 GHZ ASK 45 ASUS G41 COMBO 2400 81 DDR3 GSKILL 4GB 1333 1200 120 PCI-E ATI X200SE 1250 9 INTEL CORE 2 DUO 2.93 GHZ 4990 82 DDR1 512MB HYNIX 428 10 INTEL (I-5 /2400) 8240 83 4GB TWINMOS DDR3 1333 -
SCREWED DRIVERS— SIGNED, SEALED, DELIVERED Common Design Flaw in Dozens of Device Drivers Allows Widespread Windows Compromise
SCREWED DRIVERS— SIGNED, SEALED, DELIVERED Common Design Flaw In Dozens of Device Drivers Allows Widespread Windows Compromise INTRODUCTION drivers we discovered have been certified by Microsoft. Since the presence of a vulnerable driver on a device can provide a user (or attacker) with As part of Eclypsium’s ongoing hardware and firmware security research, improperly elevated privileges, we have engaged Microsoft to support we have become increasingly interested in the area of insecure drivers solutions to better protect against this class of vulnerabilities, such as and how they can be abused in an attack against a device. Drivers that blacklisting known bad drivers. provide access to system BIOS or system components for the purposes of updating firmware, running diagnostics, or customizing options on the component can allow attackers to turn the very tools used to manage OVERVIEW AND IMPACT OF THE VULNERABILITIES a system into powerful threats that can escalate privileges and persist invisibly on the host. All these vulnerabilities allow the driver to act as a proxy to perform highly privileged access to the hardware resources, such as read and write Recent research and attacks in the wild have made it clear that this area access to processor and chipset I/O space, Model Specific Registers warrants additional scrutiny. For example, other research has revealed (MSR), Control Registers (CR), Debug Registers (DR), physical memory vulnerabilities in individual hardware vendor drivers (e.g. ASUS, ASRock, and kernel virtual memory. This is a privilege escalation as it can move GIGABYTE) that allowed applications with user privileges to read and an attacker from user mode (Ring 3) to OS kernel mode (Ring 0). -
Emerging Markets Small Cap Portfolio-Institutional Class As of July 31, 2021 (Updated Monthly) Source: State Street Holdings Are Subject to Change
Emerging Markets Small Cap Portfolio-Institutional Class As of July 31, 2021 (Updated Monthly) Source: State Street Holdings are subject to change. The information below represents the portfolio's holdings (excluding cash and cash equivalents) as of the date indicated, and may not be representative of the current or future investments of the portfolio. The information below should not be relied upon by the reader as research or investment advice regarding any security. This listing of portfolio holdings is for informational purposes only and should not be deemed a recommendation to buy the securities. The holdings information below does not constitute an offer to sell or a solicitation of an offer to buy any security. The holdings information has not been audited. By viewing this listing of portfolio holdings, you are agreeing to not redistribute the information and to not misuse this information to the detriment of portfolio shareholders. Misuse of this information includes, but is not limited to, (i) purchasing or selling any securities listed in the portfolio holdings solely in reliance upon this information; (ii) trading against any of the portfolios or (iii) knowingly engaging in any trading practices that are damaging to Dimensional or one of the portfolios. Investors should consider the portfolio's investment objectives, risks, and charges and expenses, which are contained in the Prospectus. Investors should read it carefully before investing. This fund operates as a feeder fund in a master-feeder structure and the holdings listed below are the investment holdings of the corresponding master fund. Your use of this website signifies that you agree to follow and be bound by the terms and conditions of use in the Legal Notices. -
Wi-Fi Penetration Across the Automobile
Alessandro Norscia, Director Product Management Wi-Fi Penetration Across the Automobile 1 Wi-Fi and Bluetooth Connectivity in the Car Infotainment System Multiple use-cases, concurrencies and profiles supported by the Qualcomm Technologies’ platform Multiple BT profiles AP and STA Bluetooth network 2.4GHz WLAN network • BT Headset (HSP) • Phone tethering • Phone calls (HFP, • Mirroring PBAP) • Email • Music streaming • Web browsing (A2DP) • Video streaming AP and P2P GO 5GHz WLAN network • Video streaming- client Qualcomm® • Miracast/ Mirroring- VIVE™ P2P client QCA6574A Qualcomm Snapdragon and Qualcomm Gobi are products of Qualcomm Technologies, IncQualcomm VIVE is a product of Qualcomm Atheros, Inc. 2 Wi-Fi and Bluetooth in Telematics Applications In-car Wi-Fi/BT, connectivity to outside of car with LTE, Wi-Fi and BT Cell Phone Tower Wi-Fi connectivity to home, service center or other infrastructure Remote access to car from personal device OPEN 802.11ac 802.11ac In-car Wi-Fi and BT Qualcomm® VIVE™ Bluetooth QCA6574 Qualcomm Snapdragon and Qualcomm Gobi are products of Qualcomm Technologies, Inc. Qualcomm VIVE is a product of Qualcomm Atheros, Inc. 3 Vehicle to Vehicle and Vehicle to Infrastructure Communication Dedicated Short Range Communication solution for comprehensive Telematics platform Cell Phone Tower • Wi-Fi based technology based on 802.11p Wi-Fi standard • Acquire security − For latency critical communication certificates and CRLs • Send information to • 360 degree no line of sight (NLOS) awareness remote vehicles and infrastructure • Increased safety • Augmented positioning DSRC Other use cases - Location • - Velocity − Traffic congestion − Emergency help − Payment for tolling, parking DSRC V2I DSRC - Road hazard information Qualcomm® - Services VIVE™ QCA6574 RSU or other infrastructure Qualcomm Snapdragon and Qualcomm Gobi are products of Qualcomm Technologies, Inc.