Challenges and Trends on Microbolometer Design

Uwe Pulsfort Product & Applications Support, Europe

Stemmer Imaging Techology Forum 2017 Overview

1. Evolution of the Markets 2. Example Applications 3. Key Drivers for Low Cost Uncooled IR 4. Uncooled IR: How does it work? 5. Infrared Technologies • Detector Technology • Wafer Level Package technology • 3D stacked Camera Technology 6. Teledyne DALSA Capabilities & Facilities 7. Teledyne DALSA Products 8. Conclusions 9. Questions & Answers

Stemmer Imaging Techology Forum 2017 Evolution of the Markets Low to Moderate Volumes: 10-103

Defense Current main Security stream markets UAVs Industrial Smart Homes Smart Phones Automotive New Markets in Gaming Development Internet of Things Others? Very High Volumes: 106-109

Conclusion: The uncooled IR market follows a very similar path as the visible imaging market: from professional markets descending to consumer markets

Stemmer Imaging Techology Forum 2017 Infrared Imaging: Industrial Examples

Electrical Maintenance Process Control •Excess current •Excessive wear Fill levels (solid, liquid, •Damage or Failure and tear gas) •Hot spots due Material flow mechanical Leaks Malfunctions

Confidential and Proprietary 4 Thermography Applications • Features (beyond the general purpose features) – Radiometric calibration to measure absolute temperatures in a scene – Graphics overlay to display Text, Scales, and crosshair • Applications – General Thermography/Machine Vision/Inspection – Firefighting – Search and Rescue – Medical/Physiotherapy

• Production Readiness: Q3 2016 • Comments: For several applications it is important to quantify the temperature in a scene and display the measured values.

5 Small UAV/Portable Applications • Features (beyond the general purpose features) – Input/integration of GPS and Gyroscope sensors to track whereabouts and orientation – Battery operated – Wireless interface • Applications • Perimeter control • Portable law enforcement • Autonomous Sensors

• Comments: The product idea is to provide a very compact OEM product that supports portable and autonomous sensor in the field.

June 2015 Confidential and Proprietary 6 Key Drivers for Low Cost Uncooled IR

Evolution of the pixel size Reduced Pixel size: 60 52 µm • Advancements in pixel technology allows for smaller 50 45µm 40 pixels. Smaller pixels => More Devices per Wafer => 35µm 30 25µm Better Yield => Lower Cost. 20 17µm 12µm10µm But more importantly: Lower Lens Cost! 10 8µm 0 1995 2000 2005 2010 2015 2020 Wafer Level Packaging • Although Conventional Packaging costs are declining, Wafer Level Packaging technology can drive the cost down by considerably.

Wafer Level vs. Conventional package

Stemmer Imaging Techology Forum 2017 Key Drivers for Low Cost Uncooled IR

3D stacked camera modules with Wafer Level Optics • Optics become a dominant cost in the overall camera cost. Advances in Wafer Level Optics in combination with smaller pixels will drive down the 3D stacked uncooled IR module cost further

State of the Art MEMS Facilities • In order to implement all these Technologies and develop integrated solutions require a MEMS infrastructure.

Stemmer Imaging Techology Forum 2017 Uncooled IR: How does it Work?

post

Lens platform

legs Lens mount Heat loss Infrarot Pixel High Vacuum platform leg VOx pixel R +ΔR post TELEDYNEV Read Out IC DALSA Detector Board

Camera processing Board Interface module

Stemmer Imaging Techology Forum 2017 Detector Technology

Micro-bolometer process: Vanadium Oxide (VOx). • In general more sensitive that Amorphous Silicon (αSi) • More suitable for smaller pixels. • More difficult to get uniformity on the wafer.

Pixel node uncooled IR pixel • Current: 17 micron, which is mainstream • Next Generation: 12 micron, which is expected in 2018

12 micron pixel

Stemmer Imaging Techology Forum 2017 Detector Technology

Resolution • 17 micron: QVGA, VGA (2017) • 12 micron: VGA, SXGA, QVGA (2018)

Package Wafer with packaged • Conventional Ceramic Package devices • Wafer Level Package

Performance* • <50mK • >99.5% • Operates shutter-less • High Speed Operation Ceramic package Wafer Level package

*depends on detector grade

Stemmer Imaging Techology Forum 2017 Wafer Level Package Technology • Crucial for addressing low cost solutions, but challenging: 8”CMOS ROIC wafer: starting material Vanadium Oxide process: 14 steps uncooled IR pixel 8” Cap wafer process: 12 steps Cap wafer ROIC + Vox wafer preparation: 5 steps ROIC + VOx Outgassing step High vacuum << 1mTorr Sealed wafer pair

Bonding step High vacuum << 1mTorr Separation step

Stemmer Imaging Techology Forum 2017 3D Stacked Technology

3D stacked Cameras: Conceptual like our Calibir™ Infra Red Camera Technology, but a lot smaller: QVGA module: 6x6x6 mm3

Technological Requirements for low cost 3D stacked camera: WLO • Wafer Level Packaging (WLP) technology: Available • Camera thermal Calibration: Available WLP • Shutter-less operation: Available • Functional Wafer to Wafer bonding: Process under development ASIC TSV • Copper Trough Silicon Via (TSV) Technology: Available • Wafer Level Optics (WLO): Partnership in Place, to be developed • IR Camera Application Specific IC (ASIC) design with embedded self- calibrating algorithms: Capability in place, to be developed

Stemmer Imaging Techology Forum 2017 Teledyne DALSA Capabilities & Facilities

Teledyne DALSA’s State of art MEMS facility is used for the production of many different devices which rely on unique proprietary processes:

• Accelerometers, Gyroscopes, Pressure sensors, Micro-bolometers, BioMEMS etc. , all requiring State of the Art equipment, tools and processes, all under one roof. • 8” (200 mm) wafer line, highly automated equipment, advanced in-line metrology tools • Capacity is 10.000 wafers a year, up-scalable.

Stemmer Imaging Techology Forum 2017 Teledyne DALSA Produkte

QVGA VOx Calibir™ Camera Core • 320 x 240, 17µm • QVGA, VGA models • NETD ≤ 50mK* • NETD ≤ 50mK* • up to 90Hz • up to 50Hz • WLP option • Board level option VGA VOx (pending) • CSI2, parallel digital interface • 640 x 480, 17µm (selectable) • NETD < 50mK • 38 gram • Up to 120Hz • 29mm x29mm x 46mm • WLP option

Calibir™ Fusion Module Calibir™ Camera • QVGA, VGA models • QVGA, VGA models • 2.1 Mpixel Low Light Camera • NETD ≤ 50mK* • 30Hz • up to 50Hz • HDMI, GigE, USB3 interface • GigE, Analog interface options options • 90°and 73°HFOV option • 38 gram • ~250 gram • 29mm x29mm x 46mm • 58mm x29mm x 122mm

*depends on detector grade

Stemmer Imaging Techology Forum 2017 Conclusions Teledyne DALSA offers a:

• Novel approach to microbolometer manufacturing in an optimized MEMS infrastructure • Competitive VOx detector technology with advanced features like Wafer Level Packaging • Compact camera technology withTeledyne excellent shutter -DALSAless operation and advanced features. Uniquely positioned to drive 3D stacked Camera Technologies • Unique Facilities and Process CapabilitiesImaging to drive the next phase in the evolution of Uncooled IR. Technology The Future of Uncooled Infrared in Commercial Markets?

Teledyne DALSA is ready!

Thank you for your attention!

Stemmer Imaging Techology Forum 2017 Questions & Answers

Any Questions?

For additional information, please visit:

https://www.teledynedalsa.com/imaging/products/infrared/

Stemmer Imaging Techology Forum 2017