Executive Summary OE-A Roadmap for Organic and Printed Electronics

8th Edition

A working group within

The Executive Summary is an excerpt of the White “OE-A Roadmap for Organic and Printed Electronics” Copyright © OE-A, a working group within VDMA, Frankfurt, 2020 All rights reserved. Reproduction only with written permission by OE-A and citation of the Roadmap White Paper (ISBN 978-3-8163-0736-5). EXECUTIVE SUMMARY - OE-A ROADMAP WHITE PAPER, 8th EDITION 1

About the OE-A Roadmap

The OE-A Roadmap is one of the key activities of the OE-A (Organic and Printed Electronics Association). It represents the common perspective of OE-A members on the current state of printed electronics based on the work of more than 250 experts. The OE-A Roadmap also gives short-, medium- and long-term forecasts on where the industry is heading.

Roadmapping is an ongoing process within the OE-A. First published more than a decade ago, the OE-A Roadmap has been updated periodically and is now in its eighth edition. The 130-page Roadmap is White Paper

organized into the six key industry sectors Electronics and Printed Organic OE-A Roadmap for Organic Automotive, , Healthcare, and Printed Electronics and Packaging, Smart Buildings and Internet of Things. 8th Edition Furthermore, it gives insight into recent, short-, medium- and long-term developments of the major application clusters Flexible and OLED Displays, Organic and Perovskite , Electronics and

Components, Integrated Smart Systems and OLED Lighting. In addition to key industries and applied technologies, a chapter is dedicated to the enabling technologies Functional Materials, Substrate Materials and Printing, and Patterning techniques. Each chapter is led by a renowned expert in the respective A working group within field. The OE-A Roadmap aims to provide information on technology and applications, to support the industry, governmental agencies and scientists in identifying strategies regarding R&D activities and Cover page of the White Paper “OE-A Roadmap for Organic product plans. and Printed Electronics”.

Elaborating on major findings of the Roadmap on Organic and Printed Electronics, the OE-A periodically publishes a white paper providing more in-depth insight into the respective applications and technologies. For the first time, the white paper will also look more closely at the six key industry sectors and how printed electronics will be of benefit. Besides showing current technologies and applications enabled by printed electronics, the OE-A experts provide individual Roadmaps for each of the industry sectors, giving short-, medium- and long-term forecasts for product developments.

Information on obtaining the full document of the OE-A Roadmap White Paper can be found at https://oe-a.org/roadmap

2 EXECUTIVE SUMMARY - OE-A ROADMAP WHITE PAPER, 8th EDITION

Executive Summary

Organic and printed electronics is based on the combination of new materials and cost-effective, large-area production processes to enable new applications which are not possible to create with (only) conventional electronics. A key advantage of organic and printed electronics is the ability to make thin, lightweight, flexible, robust and environmentally friendl y electronic products. One of the key activities of the OE-A since its inception has been the regular updating of the Roadmap for this young but growing industry. This document summarizes the major findings of the OE-A’s eighth edition of the Organic and Printed Electronics Roadmap based on work done since the seventh edition of the OE-A Roadmap was completed in 2017.

In 2017 we already found that the growth in organic and printed electronics (OPE) industry had continued and that there were already applications (organic light emitting i.e. OLED displays, for example) where it was already a strong player with signs pointing to further growth. This growth has been realized, with foldable displays and even rollable OLED TVs entering the market. Other applications, such as organic photovoltaics (OPV) or OLED lighting, are still relatively niche markets, as stated in the last Roadmap, but with signs of increased growth and more commercial products in the market. The number of wearable products including OPE is continuing to grow. Touch sensitive surfaces based on OPE are becoming more and more prevalent, e.g. in automobiles seat heaters are being printed instead of being made from wire coils. Sales of products including OPE were over 35 billion US$ in 2019, with the market expected to grow to over 74 billion US$ by 20301. The largest share of the market continues to go to OLED displays, where the market was over 26 billion US$ in 2018 and expected to grow to over 52 billion US$ by 20232, though other fields are also growing1. Printed primary batteries and electroluminescent (EL) displays continue to have stable sales. Printed transparent conductive films have reached increased utilization in interactive display products, e.g. in automobiles and home appliances, and there has been progress in textile-based and skin wearable flexible devices.

The growth of interest in and establishment of OPE in important industrial sectors, such as auto- motive, consumer electronics, health care/wellbeing, smart buildings, printing and packaging and the Internet of Things, which was observed as a nascent phenomenon in the 7th edition, has continued. As a result, we have dedicated an entire chapter to the innovative products that are appearing in these sectors and those that are expected to appear in the coming years. These industry sectors implement solutions from a wide range of technology applications; for example in the automotive sector products such as OLED taillights and curved interactive surfaces are appearing, and the use of sensors is increasing. In the figure below we summarize a number of the OPE solutions finding their way into major industry sectors. Some of the solutions are already commercial on a significant scale, while others are still concept prototypes.

1 https://www.idtechex.com/de/research-report/printed-organic-and-flexible-electronics-2020-2030- forecasts-technologies-markets/687

2 https://www.oled-info.com/dscc-amoled-revenues-reach-over-52-billion-2023 EXECUTIVE SUMMARY - OE-A ROADMAP WHITE PAPER, 8th EDITION 3

Organic and Printed Electronics Solutions in Important Industry Sectors

Automotive OLED lighting for rear lights and interior human-centric lighting; flexible and OLED displays for side mirror replacement and HMI; sensors for seat occupancy and hands-on detection; Seamless integration of touch sensors for HMI; In-mold electronics for new interior design; Printed heating foils for electric vehicles

Consumer Foldable & flexible displays for smart phones / tablets / Electronics wearables; Curved touch surfaces with sensing & signage for white goods; Smart wearables and textiles; OLED lighting; Rollable TV

Healthcare Smart medical packages for therapy monitoring; Patches for therapy and vital parameter monitoring; Sensors for On- and ­ Off-body biomarker diagnosis; for light therapy; Smart wound treatment and bandages

Printing & Low-cost & low-power displays for price labels; Smart labels for Packaging brand protection and cross-media interaction; smart packaging with autonomous sensors; printed and hybrid NFC & RFID; Lighting

Smart Sensors for material monitoring, energy management (climate, Buildings smart windows) and wellbeing (humidity, gas); energy autonomous sensors; Heating elements; BIOPV; OLED lighting;

Internet of Optimized maintenance of buildings, machinery parts and in the Things mobility sector by structural health monitoring; energy autonomous devices; smart labels for logistics and consumer protection; Environmental monitoring;

Organic and Printed Electronics solutions in important industry sectors.

The trend from “technology push” to “market pull” defined by the needs of the end users has continued since the last Roadmap, and we document this in the chapter on important industry sectors. The OPE industry is not trying to put organic and printed electronics “everywhere” but is effectively implementing into products in use cases for which it offers specific advantages in performance, cost or form factor over conventional solutions. The consensus appears to be growing that many OPE applications from now to the mid-term future will involve hybrid system integration, with a “brain” based on electronics and other parts of the system enabled by printing.

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The current edition of the OE-A Roadmap continues the work started in previous versions and reports on the growth in the organic and printed electronics market in a wide range of applications. It also reports on technical progress that has been made in the field since the seventh edition of the Roadmap. In addition to our new analysis of OPE in important industry sectors, we continue to look at the development of the market in five key application clusters:

• Flexible and OLED Displays, where curved OLED displays have reached the market and conformable LCD displays are being integrated into prototype automobiles, and the first devices with foldable displays are being brought to market

• Organic Photovoltaics (OPV), where stability has improved strongly and more and more flexible modules are now available on the open market

• Electronics and Components (printed memory and batteries, active components and passive components), where active matrix backplanes are still not in the mass market but are in test marketing and production, touchscreens are finding much wider use, and both supercapacitors and printed batteries are emerging as energy storage options

• Integrated Smart Systems (ISS, including smart objects (also RFID), sensors and smart textiles), where NFC tags based on printed Silicon have expanded their market penetration, RFID is being integrated directly into packaging materials, and flexible smart wireless sensors are being enabled by hybrid integration of conventional Silicon and OPE

• Organic LED (OLED) Lighting, which is still reaching new markets, such as the automotive sector and architecture, despite challenges from alternatives such as micro-LEDs on flex

We have updated our report on current markets and forecast for the market entry on larger scales for the application clusters and reviewed the appearance of additional products. We have also re- examined the key application and technology parameters and principle challenges (so-called red brick walls) seen for further development of organic and printed electronics. We also include a discussion of the Technology Readiness Levels (TRLs) of the applications. In addition, we look in more detail at the role of OPE in enabling innovative products in key industry sectors.

As in previous editions of the Roadmap, our working groups have monitored and analyzed the progress and predictions in the core technology fields that are necessary for the success of applications. Functional materials have continued to improve in charge carrier mobility, with today’s values starting to be feasible for OLED display driving rather than only liquid crystal or electrophoretic displays. Ability to compete with polysilicon is expected in coming years. Particular interest has been paid by key players since the last Roadmap by focusing not only on mobility, but also on processability and reproducibility. Processing temperatures for metal oxide materials are still higher than desired but are continuing to come down. Many of the same substrates are being used for OPE as in previous editions of the Roadmap, with a focus on low cost materials, but there are new trends as well. In particular, interest in substrates that are stretchable as well as bendable has grown significantly, especially with regard to wearables. There is also renewed interest in paper as a low-cost, environmentally friendly substrate for electronics. In the field of printing, coating and patterning, many of the same methods that are common in graphics printing and the industry continue to be used for OPE. However due to the increased requirements for resolution and registration, improvements have been made to the printing forms and machines, including modifications of ink jet printing that can deliver 1 fl droplets, as well as high resolution screens and gravure cylinders. Due to these and other advances such as roll to roll nano-imprint lithography (NIL), throughput is starting to improve without loss of resolution. Other coating and patterning methods such as aerosol jet printing, and 3D processes are gaining in importance. EXECUTIVE SUMMARY - OE-A ROADMAP WHITE PAPER, 8th EDITION 5

As before, we look at the key application and technology parameters that are critical for the competitiveness of the main applications of OPE. While the key parameters for each cluster reflect the diversity of the applications of OPE, the following were especially common across different fields:

• Environmental impact/end of life/recycling has become recognized as a more and more critical issue that must be dealt with

• Reliability

• Capital expenditure for new equipment

• Cost (coming more and more to the forefront in discussions)

• Compatibility with standards

Individual roadmaps were developed for each application field and will be presented in the following chapters. In addition, an overall Roadmap for organic and printed electronics was developed, a summary version of which is graphically represented below.

As with each edition, we have looked at the key trends in the OPE industry since the last edition of the Roadmap. Some of the most important ones include:

• OLED displays continue to be the biggest success story of OPE and dominate the OPE market, and the market continues to grow with more and more sophisticated products

• OPE is making breakthroughs in the automotive sector, with seat heaters, seat occupation sensors and touch sensitive surfaces as well as OLED lights now being integrated

• OPE’s presence in the health care and well-being industry is also expanding strongly, with such products as electrodes and diabetes tests becoming widespread

• More and more OPE-based products are also being used in other key industry sectors, such as construction and printing and packaging

• The Internet of Things is a technology platform spread across many industry sectors, and OPE is enabling innovations such as sensors, energy autonomy, and lower environmental impact

• The trend from flexible/bendable to stretchable products continues, and there is progress in integration to wearables and even skin-mountables, both technically and commercially

• Integration of printed and silicon-based components to make hybrid systems is still a key paradigm for the development and manufacturing of OPE products

• The position of NFC-enabled smart labels based on OPE grows, with developments towards direct integration to packaging materials

• The industry continues to mature. Realistic growth continues, with growing revenues and with an increasing diversity of products

6 EXECUTIVEEXECUTIVE SUMMARY - OEOE-A-A ROADMAP WHITE PAPER , 8th EDITION

OE-A Roadmap for Organic and Printed Electronics Applications 2020

Existing Short Term Medium Term Long Term 2020 2021-2023 2024-2026 2027+

Foldable displays for large flexible OLED- In-mold electronic Flexible QD-Displays; Flexible & OLED phones; Reflective EPD Displays; rollable TV; (IME) Displays; flexible µLED-Displays Displays curved display for automotive interior

OPV OPV objects; portable Opaque OPV for BIPV; Semitransparent OPV Color and shape on chargers; OPV-R2R Large area OPV foil; for BIPV; OPV for demand; OPV on “all” products OPV power supply autonomous sensors surfaces (e.g. wallpaper, mobile devices) combined with battery

Printed devices: light sensor; Printed secondary ion Complex stretchable Electronics & memory, RFID antenna, stretchable conductors battery; printed super electronics; Printed Components primary battery, active / ; 3D touch caps; gesture sensors complex logic; backplane, sensors; OTFT piezoelectric elements; backplanes for low Sensors: glucose, energy displays and pressure, temperature, OPD; 3D & large area humidity; printed flexible electronics; phone case integrated active touch sensors antenna; thin flexible Si-chips

Integrated Smart Smart label sensors Ambient monitoring On-skin human Smart labels with geo Systems (humidity, (e.g. humidity); sensors monitoring patches in localization; Breath temperature); Sensors embedded in molded clinical environment; analyzer for medical for blood analysis; NFC parts (automotive); Single article tagging prevention labels; Hybrid systems on-skin human (food) (printed components + monitoring patches for flexible ICs); HMIs sports; ambient (sensors) intelligence (connected); Sleep disturbance monitoring;

Flexible white OLED Flexible red OLEDs 3D OLEDs; OLED OLED for aircraft and OLED Lighting modules; rigid red (segmented) for signage; OLED for railway interior OLEDs for automotive automotive medical applications application applications applications; transparent OLEDs; OLEDs for interior lighting of automotive

OE-A RoadmapOE- Afor Roadmap organic and for printedorganic electronics and printed applications, electronics withapplications, forecast withfor the forecast market for entry the in market large volumesentry in large(general volumes availability) (general for ava theilability) different for applications. the different applications. Based onon anan analysis of the applicationapplication and tetecchnologyhnology parameters, the recent progressprogress in materials and processprocess technologytechnology and the expectedexpected future technologytechnology development,development, keykey challenges were identified for whichwhich significant breakthroughsbreakthroughs are needed.needed. However,However, in comparison to past editions, where no path to solutionsolution was visible and the challengeschallenges were termedtermed “red“red brick walls”,walls”, borrowingbowrro ing a term from the semiconductorsemiconductor roadmap, progressprogress hashas beenbeen made, and we now find the term “Key chachallengesllenges” to be more appropriateappropriate (We popointint out, however, that a kekeyy reason for the success of hybrid systems integration is the fact that it has not so far beenbeen possiblepossible to attainattain the necessarynecessary level of performanceperformance for complex logic or radio communicationscommunications usingusing priprintednted circuitry,circuitry, i.e.i.e. the “red brick wall”wall” was avoided byby using an alternative technology.)technology.) It is notable that the keykey challengeschallenges in thisthis editionedition are more focused onon production, useuse and cost thanthan on basic technology,technology, whichwhich reflects the growinggrowing market orienorientationtation of OPE:

EXECUTIVE SUMMARY - OE-A ROADMAP WHITE PAPER, 8th EDITION 7

• Cost: CapEx for manufacturing equipment as well as materials. Cost also is a key factor in some of the following challenges

• Processes: resolution, registration, uniformity and characterization, especially at low cost

• Encapsulation: not only lower cost but also stretchable encapsulation materials are needed

• Scalability: from lab to production and from small to large area while keeping performance high

• Inspection/yield: progress in both yield improvement and in-line inspection and recognition of defects is needed to improve competitiveness

• Standards and regulations for are under discussion but not yet implemented

We have asked the question of whether there will be a “Moore’s Law” for organic and printed electronics in previous editions of the Roadmap. With the growing diversity of the OPE industry, it becomes more and more difficult to find a single scaling parameter (or even just a few) that can describe the entire industry. While there are indications of regular improvements in materials performance and patterning processes, the effects and importance of these vary widely from application to application. What can be seen in the progress since the 7th edition of this Roadmap is that OPE continues to mature, and rather than a “killer app” (with the exception of OLED displays) we see a growing use of organic and printed electronics in a wide range of industry sectors, with significant market growth in fields such as automotive (touch sensors, lights, seat sensors and heaters), medicine (electrodes, diabetes tests), displays (flexible displays now in the market) and wearables (fitness trackers, clothing integrated sensors). We anticipated this trend in the last Roadmap and expect this growth to continue in coming years. We will update the roadmap regularly to keep stakeholders informed.

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OE-A Members

Companies

3DMA (DE) Inotec Barcode Security (DE) ABeetle (TW) Interlink Electronics (US) A.F. Suter (GB) Is it fresh (DE) Adphos Digital Printing (DE) ISORG (FR) Almax (US) JT International Germany (DE) Apeva (DE) JiLin OLED Material Tech (CN) Alpha Assembly Solutions (US) Karl Knauer (DE) American (US) Kateeva (US) ARM Ltd. (GB) Kelenn Technology (FR) Armor (FR) Kroenert (DE) BASF Coatings Schweiz (CH) KSG (DE) BASF New Business (DE) Leonhard Kurz Stiftung (DE) Brewer Science (US) LG Technology Center Europe (DE) Brückner Maschinenbau (DE) LinkZill Technology (CN) BST Eltromat lnternational (DE) Liquid X Printed Metals (US) CCI Eurolam (DE) Lohmann (DE) Ceradrop (FR) MMP Premium Printing Center (DE) Chasm Advanced Materials (US) M-Solv (GB) Classic Stripes (IN) Masar Printing and Publishing (AE) Coatema Coating Machinery (DE) Masterpress (PL) CondAlign (NO) Matti Technology (CH) Continental Automotive (DE) Merck (DE) Copprint (IL) MSW (DE) Coruna Printed Electronics (CH) Nanorbital Advanced Materials (IN) Cynora (DE) NeuDrive (GB) db-matik (DE) New Cable Corporation (FI) Dowa HD Europe (DE) NovaCentrix (US) Dracula Technologies (FR) Novaled (DE) DuPont Advanced Materials (GB) nsm Norbert Schläfli (CH) DuPont Teijin Films (GB) NXT (DE) Elantas Europe (DE) OLEDWorks (DE) Elmeric (DE) Organic Electronic Technologies (GR) Emde development of light (DE) Oxford Photovoltaics (GB) Enfucell Flexible Electronics (CN) Papierfabik Louisenthal (DE) Engineered Materials Systems (US) Piezotech (FR) EppsteinFoils (DE) Plastic Logic Germany (DE) Eptatech (IT) Policrom Screens (IT) Ersa (DE) PolyIC (DE) Evonik Creavis (DE) PragmatIC Printing (GB) Exakt Advanced Technologies (DE) Printcolor Deutschland (DE) Felix Böttcher (DE) Printed Electronics (GB) Felix Schoeller Holding (DE) Protavic International (FR) FlexEnable (GB) Pütz Folien (DE) Folex Coating (DE) Raynergy Tek (TW) FUELIUM (ES) Reisewitz Beschichtungen (DE) Fujifilm Dimatix (US) RK Siebdrucktechnik (DE) Genes´Ink (FR) ROWO Coating (DE) Grapholymer (GB) SABIC (NL) Greiner Technology & Innovation (AT) SAES Getters (IT) GRT (DE) SAIT Europe (GB) Guangdong Juhua Printing (CN) Saueressig (DE) Heliatek (DE) Schreiner Group (DE) Henkel (DE) Screentec (FI) Heraeus Deutschland (DE) Senorics (DE) Hoffmann + Krippner (DE) Seqens (FR) HyPrint (DE) SmartKem (UK) IBS Precision Engineering (NL) Smit Thermal Solutions (NL) IEE (LU) Smooth & Sharp Corporation (TW) IMAZ Technology (ES) Spin Corporation (JP) InnovationLab (DE) SunaTech (CN) InovisCoat (DE) EXECUTIVE SUMMARY - OE-A ROADMAP WHITE PAPER, 8th EDITION 9

OE-A Members

Surteco Group (DE) VFP Ink Technologies (FR) Tacterion (DE) Werner Blase (DE) Tagenea (ES) Witte plusprint (DE) Teknek (GB) X-Celeprint (IE) Temicon (DE) Xenon Corporation (US) Thin Film Electronics (NO) Xiamen Funano New Material (CN) Toyobo (JP) Xymox Technologies (US) TSE Troller (CH) Ynvisible (PT) VARTA Microbattery (DE) YTC America (US) VDL Flow (NL) ZEON (JP)

Universities/Institutes

AIST – Sensing Electronics Imperial College London – Centre for Center (JP) Plastic Electronics (GB) AIT – Austrian Institute of Technology (AT) Institut für Mikroelektronik Aristotle University of Thessaloniki - LTFN Stuttgart (DE) (GR) IPC – Technical Centre of Plastics BRNO University of Technology (CZ) Engineering (FR) CEA Liten (FR) ITRI - Industrial Technology Research Centi - Centre for Nanotechnology Institute (TW) & Smart Materials (PT) Joanneum Research (AT) Centre Technique du Papier Johannes Kepler Universität Linz - LIOS (AT) (CTP) (FR) Karlsruhe Institute of Technology - LTI CIDETEC (ES) (DE) Consiglio Nazionale delle Ricerche Konkuk University - FDRC (KR) (CNR) (IT) Landshut University of Applied Sciences COPT Center (DE) (DE) CPI - Centre for Process Leitat Technological Center (ES) Innovation (GB) Loughborough University (GB) CSEM (CH) MINES Saint-Étienne – Microelectronics - CSEM Brasil (BR) Center of Provence (FR) CSIR (ZA) Munich University of Applied Sciences – CSIRO (AU) Print and Media Technologies (DE) EMPA (CH) National Research Council Eurecat (ES) Canada (CA) Fontys University of Applied NPL - National Physics Sciences (NL) Laboratory (GB) Fraunhofer ENAS (DE) Oulu University of Applied Fraunhofer FEP (DE) Sciences (FI) Fraunhofer IAP (DE) Palo Alto Research Center (US) Fraunhofer IFAM (DE) Papiertechnische Stiftung (DE) Fraunhofer ILT (DE) Profactor (AT) Fraunhofer IPA (DE) RISE Research Institutes of Sweden Fraunhofer ISC (DE) (SE) Friedrich-Alexander-Universität – Tampere University (FI) WW6 – i-Meet (DE) Technische Hochschule Nürnberg Georg Friedrich Schiller Universität Simon Ohm (DE) Jena (DE) Technische Universität Chemnitz (DE) Georgia Tech – Center for Organic Technische Universität Darmstadt - IDD Photonics and Electronics (US) (DE) Hahn-Schickard – Institut für Technische Universität Dresden - IAPP (DE) Mikroaufbautechnik (DE) Tekniker (ES) Hochschule der Medien - TOPIC – Thailand Organic and Printed IAF, IAD (DE) Electronic Innovation Center (TH) Hochschule Niederrhein (DE) University of Applied Sciences Holst Centre (NL) Northwestern Switzerland (CH) ICI – Printability and Graphic University of West Bohemia – Communications Institute (CA) RICE (CZ) IMB-CNM (CSIC) (ES) University of Bordeaux (FR) Imec (BE) University of Cambridge – Electrical Engineering Division (GB)

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University of Manchester (GB) Vito (BE) University of Novi Sad – Faculty of VTT - Technical Research Centre of Technical Sciences (CS) Finland (FI) University of Oulu (FI) WCPC - Swansea University (GB) University of Pardubice (CZ) Yamagata University (JP) University of St. Andrews – Centre (GB)

An up-to-date list of the OE-A members can be found at www.oe-a.org EXECUTIVE SUMMARY - OE-A ROADMAP WHITE PAPER, 8th EDITION 11

Imprint

Editors Picture Sources

Donald Lupo, Tampere University Cover picture Stephan Kirchmeyer, COPT Center pexels.com, Alex Powell Klaus Hecker, OE-A Jan Krausmann, OE-A Pictures in the figure on page 4: Sophie Isabel Verstraelen, OE-A Messe Muenchen Publisher Samsung VTT Technical Research Centre of Finland Ltd OE-A Ynvisible Lyoner Straße 18 Heliatek 60528 Frankfurt am Main, Germany Schreiner MediPharm Phone +49 69 66 03-13 36 E-Mail [email protected] Pictures in the figure on page 7: Internet: www.oe-a.org FlexEnable Copyright 2020 Heliatek IEE OE-A Schreiner Group A working group within VDMA OMLED, EMDE development of light GmbH Frankfurt am Main, Germany

Printing H. Reuffurth GmbH, Mühlheim am Main

OE-A (Organic and Printed Electronics Association) A working group within VDMA

Lyoner Str. 18 60528 Frankfurt am Main Germany

Phone +49 69 6603-1336 Fax +49 69 6603-2336 E-Mail [email protected] Internet www.oe-a.org

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