DOCSLIB.ORG

A Flexible Solution-Processed Memristor

Total Page：16

File Type：pdf, Size：1020Kb

Download full-text PDF Read full-text
A Flexible Solution-Processed Memristor This article has been accepted for inclusion in a future issue of this journal. Content is final as presented, with the exception of pagination. IEEE ELECTRON DEVICE LETTERS 1 A Flexible Solution-Processed Memristor Nadine Gergel-Hackett, Member, IEEE, Behrang Hamadani, Barbara Dunlap, John Suehle, Senior Member, IEEE, Curt Richter, Senior Member, IEEE, Christina Hacker, and David Gundlach, Member, IEEE Abstract—A rewriteable low-power operation nonvolatile physi- cally flexible memristor device is demonstrated. The active compo- nent of the device is inexpensively fabricated at room temperature by spinning a TiO2 sol gel on a commercially available polymer sheet. The device exhibits memory behavior consistent with a memristor, demonstrates an on/off ratio greater than 10 000 : 1, is nonvolatile for over 1.2 × 106 s, requires less than 10 V, and is still operational after being physically flexed more than 4000 times. Index Terms—Flexible electronics, flexible memory, memristor, sol gel, titanium dioxide. I. INTRODUCTION E HAVE fabricated a physically flexible solution- W processed device that exhibits electrical behavior con- Fig. 1. Flexible polymer sheet patterned with four rewriteable nonvolatile sistent with that of a memristor, a memory device recently flexible TiO2 sol gel memory devices with cross-bar aluminum contacts. The experimentally demonstrated and proposed to be the miss- inset is a side view cartoon of the flexible TiO2 device structure. ing fourth basic circuit element [1], [2]. Although electrical make our flexible memristor device a prime candidate for use switching behavior has been observed from organic mono- in inexpensive flexible lightweight portable electronics, such as layers and metal oxides from as early 1968 [3]–[11], the disposable sensors [13]–[17]. unique electrical characteristics associated with the memristor have the potential to revolutionize computing. For example, the functionality of a memristor has been compared to that II. EXPERIMENT of a neurological synapse; thus, memristors may eventually Rather than using expensive methods and equipment for the enable electronic computation functionally similar that which deposition of the active TiO2 layer of our device, we per- occurs in the human brain [12]. We have fabricated devices formed a room-temperature deposition through a spin-on sol gel that demonstrate these desirable memristor characteristics as process that required no annealing [18]. This procedure consists well as: physical flexibility, fabrication by using inexpensive of spinning a titanium isopropoxide solution on the flexible room-temperature solution processing, operation voltages of plastic substrate (spun on at a rate of approximately 33 r/s for less than 10 V (relatively low power for flexible electronics), 60 s), and then leaving the precursor in air for at least 1 h to on/off ratios greater than 10 000 : 1, memory potential that is hydrolyze and form a 60-nm-thick amorphous TiO film [18]. × 6 2 nonvolatile for over 1.2 10 s, and the ability to be operated To electrically contact the active area, a simple two-terminal after being physically flexed 4000 times. These characteristics crossbar is formed by depositing the bottom contact (80 nm Al) on the substrate (approximately 2.5 cm × 2.5 cm square of HP Manuscript received March 18, 2009; revised April 6, 2009. This work color laserjet transparency C2934A) prior to spinning the pre- was supported in part by the NIST Office of Microelectronics Programs, by the NIST Competence on Organic Electronics, and by the DARPA MoleApps cursor, and depositing the top contact (80 nm Al) after the pre- Program. The research was performed while the first two authors held National cursor has hydrolyzed. The devices presented in this letter were Research Council Research Associate Awards and the third author was a fabricated by depositing the top and bottom metal contacts via Society of Physics Students Summer Intern. Certain equipment, instruments, thermal evaporation through a shadow mask; however, there is or materials are identified in this paper in order to adequately specify the experimental details. Such identification neither implies recommendation by the potential to deposit contacts from solution to enable roll-to- the National Institute of Standards and Technology nor does it imply the roll or inkjet processing [19]. The final Al/TiO2/Al stack has materials are necessarily the best available for the purpose. The review of this an area of approximately 2 mm × 2mmandisshowninFig.1. letter was arranged by Editor C.-P. Chang. N. Gergel-Hackett, B. Hamadani, J. Suehle, C. Richter, C. Hacker, and D. Gundlach are with the National Institute of Standards and III. RESULTS AND DISCUSSION Technology, Gaithersburg, MD 20899 USA (e-mail: [email protected]; [email protected]; [email protected]; [email protected]; The flexible TiO2-based devices exhibit electrical switching [email protected]; [email protected]). B. Dunlap was with the National Institute of Standards and Technology, with memory characteristics that match the electrical behavior Gaithersburg, MD 20899 USA. She is now with Alleghany College, Meadville, reported for memristors [1], [2]. A representative example of PA 16335 USA (e-mail: [email protected]). the basic switching behavior is shown in Fig. 2. On the first Color versions of one or more of the figures in this letter are available online at http://ieeexplore.ieee.org. voltage sweep (1), the device starts in the low-conductivity state Digital Object Identifier 10.1109/LED.2009.2021418 until the bias is increased to approximately +3 V, when the 0741-3106/$25.00 © 2009 IEEE Authorized licensed use limited to: NIST Researchers. Downloaded on June 3, 2009 at 11:25 from IEEE Xplore. Restrictions apply. This article has been accepted for inclusion in a future issue of this journal. Content is final as presented, with the exception of pagination. 2 IEEE ELECTRON DEVICE LETTERS Fig. 2. Current versus voltage for one switching cycle of a device. The inset shows sweeps of the same bias polarity applied consecutively (i.e., consecutive “writes” with no “erasing”) to a previously unbiased device, demonstrating a decrease in device resistance with each sweep as the device transitions from a low to high state in multiple steps. The electrical results shown in the inset Fig. 3. Median current at 0.25 V from several devices initially set in the are from a different device than those shown in the body of the figure. For “high” state and “read” (by applying 0.25 V) at various time increments, and measurements, the current compliance was 50 mA, and the voltage compliance the median current from several devices initially set in the “low” state and then was 10 V. “read” at various time increments. Moreover, shown on the graph is the standard deviation of the current values “read” at all elapsed times for a representative current abruptly transitions to a high conductivity state device initially set in the “high” state and for a representative device initially (“write”). This state remains until a negative bias of approx- set in the “low” state. imately −2 V is applied (2), resulting in a transition back to a low-conductivity state (“erase”). The initial “write” of a Although our TiO2 film was deposited by using a nontra- device can be achieved by applying either an adequate positive ditional sol gel method, the unbiased film was determined via or adequate negative bias through a voltage sweep or pulse; X-ray photoelectron spectroscopy to have the same chemical however, once this initial switch is performed, the opposite composition as that of reported memristors [22]. Additionally, polarity is required to “erase.” These devices also showed although there has been some question as to the origin of relatively high yields. Of the 50 devices that were fabricated switching in devices with aluminum contacts [23], the switch- over seven different experimental runs, 42 devices exhibited ing behavior from our devices cannot be attributed to the electrical behavior indicative of electrical switching (overall aluminum (or aluminum oxide), since it was also observed from yield of 84%) with the 16% of devices that did not show devices with noble metal (gold, silver, and platinum) contacts. switching behavior as electrical “shorts” (R<50 Ω).The Furthermore, the devices still exhibited switching behavior 50 switching devices exhibited a median “write” bias mag- when placed under vacuum overnight and then electrically nitude of |2.8|±1.3 V, a median “erase” bias magnitude of characterized in an argon environment, which indicates that |4.0|±1.4 V, a median high state resistance of 1.1 × 103 Ω, the behavior is not ambient dependent. The switching was and a median low state resistance of 2.7 × 107 Ω. We performed also observed when a glass substrate was used instead of a multiple switching cycles on devices and observed switching polymer sheet, indicating that while using the polymer sheet between high and low states with resistance values similar to demonstrates the potential of the devices to be used as flexible those of the original cycles. substrates, the switching mechanism is not intrinsic to it. These electrical results are consistent with the theorized The memory of the devices remained nonvolatile for more memristor mechanism, the drift of oxygen vacancies in the than 1.2 × 106 s (14 days). To characterize the volatility of the TiO2 under bias [1]–[3], [20]. Although it is possible that this flexible memristors, several devices were first each set “high” vacancy drift occurs through a single filament rather than a or “low” by applying voltage sweeps of the appropriate polar- frontlike system, filament switching generally results in binary ity until the device resistance was consistent with previously electrical characteristics [4]. While our devices can be operated observed values for the respective state. These states were then as binary switches (“hard switching”), they can also be operated “read” (by applying 0.25 V) on day 0, and periodically over in the “soft switching” regime where consecutive bias sweeps time.
Load more

Recommended publications
  • Amorphous Metal Oxide Semiconductor Thin Film Transistors for Printed Electronics
    New Jersey Institute of Technology Digital Commons @ NJIT Theses Electronic Theses and Dissertations Fall 12-31-2018 Amorphous metal oxide semiconductor thin film transistors for printed electronics Mustafa Mohammad Yousef New Jersey Institute of Technology Follow this and additional works at: https://digitalcommons.njit.edu/theses Part of the Electrical and Electronics Commons Recommended Citation Yousef, Mustafa Mohammad, "Amorphous metal oxide semiconductor thin film transistors for printed electronics" (2018). Theses. 1637. https://digitalcommons.njit.edu/theses/1637 This Thesis is brought to you for free and open access by the Electronic Theses and Dissertations at Digital Commons @ NJIT. It has been accepted for inclusion in Theses by an authorized administrator of Digital Commons @ NJIT. For more information, please contact [email protected]. Copyright Warning & Restrictions The copyright law of the United States (Title 17, United States Code) governs the making of photocopies or other reproductions of copyrighted material. Under certain conditions specified in the law, libraries and archives are authorized to furnish a photocopy or other reproduction. One of these specified conditions is that the photocopy or reproduction is not to be “used for any purpose other than private study, scholarship, or research.” If a, user makes a request for, or later uses, a photocopy or reproduction for purposes in excess of “fair use” that user may be liable for copyright infringement, This institution reserves the right to refuse to accept
    [Show full text]
  • Printed Electronics Inks and Coatings Introduction
    PRINTED ELECTRONICS INKS AND COATINGS INTRODUCTION Countless devices rely on printed electronic technologies • Antennas for contactless SmartCards and RFID labels for function, form and flexibility. One of the most efficient • Touch screens production methods, printed electronics, allows for high- • Lighting volume, high-throughput, cost-effective manufacturing for • Printed circuit boards and potentiometers many of the products we rely on every day. Henkel is a leader • Household appliances in specialized and cross-functional ink formulations for Like most things in electronics, the majority of applications printed electronics and its line of LOCTITE® brand electronic that incorporate printed electronics are getting finer in inks has been enabling leading-edge printed electronics for dimension and more complex in functionality. Henkel’s well over three decades. ability to formulate inks that address the demands of fine- line printing, while maintaining robust conductive and other With a broad portfolio of silver, carbon, dielectric and functional properties, sets us apart from the competition, and clear conductive inks, Henkel is making today’s medical has led to technology leadership within our comprehensive solutions, in-home conveniences, handheld connectivity and portfolio of inks for printed electronics. automotive advances reliable and effective. Our inks serve multiple markets including consumer, displays, medical and automotive and RFID. They are also used in the manufacture of: • Flexible circuits for membrane touch switches
    [Show full text]
  • Development of Digital Application Specific Printed Electronics Circuits: from Specification to Final Prototypes
    View metadata,This is the citation author's and version similar of an papers article atthat core.ac.uk has been published in the Journal of Display Technology. Changes were made to this version by the publisherbrought to youprior by to CORE publication. The final version of record is available at http://dx.doi.org/10.1109/JDT.2015.2404974 provided by Diposit Digital de Documents de la UAB Development of Digital Application Specific Printed Electronics Circuits: From Specification to Final Prototypes Manuel Llamas, Mohammad Mashayekhi, Ana Jofre Pallarès, Francesc Vila, Adrià Conde and Lluís Alcalde and Jordi Carrabina Terés CAIAC Group ICAS Group Universitat Autònoma de Barcelona IMB-CNM (CSIC) Campus UAB, Bellaterra 08193, Spain Campus UAB, Bellaterra 08193, Spain E-mail: [email protected] E-mail: [email protected] Abstract— This paper presents a global proposal and characterized cell libraries allow a high degree of automation, methodology for developing digital Printed Electronics (PE) increase design productivity and helps bridging the gap prototypes, circuits and Application Specific Printed Electronics between applications and technology. Circuits (ASPECs). We start from a circuit specification using standard Hardware Description Languages (HDL) and executing Our ASPEC (Application Specific Printed Electronics its functional simulation. Then we perform logic synthesis that Circuits) approach is intended to reuse the ASIC models used includes logic gate minimization by applying state-of-the-art in industry in terms of designs flows and towards industrial algorithms embedded in our proposed Electronic Design manufacturing foundries. This methodology applied to digital Automation (EDA) tools to minimize the number of transistors is complementary to the use of existing design methodologies required to implement the circuit.
    [Show full text]
  • Technologies for Printing Sensors and Electronics Over Large Flexible Substrates: a Review Saleem Khan, Leandro Lorenzelli, Member, IEEE, and Ravinder S
    3164 IEEE SENSORS JOURNAL, VOL. 15, NO. 6, JUNE 2015 Technologies for Printing Sensors and Electronics Over Large Flexible Substrates: A Review Saleem Khan, Leandro Lorenzelli, Member, IEEE, and Ravinder S. Dahiya, Senior Member, IEEE Abstract— Printing sensors and electronics over flexible substrates are an area of significant interest due to low-cost fab- rication and possibility of obtaining multifunctional electronics over large areas. Over the years, a number of printing technolo- gies have been developed to pattern a wide range of electronic materials on diverse substrates. As further expansion of printed technologies is expected in future for sensors and electronics, it is opportune to review the common features, the complementarities, and the challenges associated with various printing technologies. This paper presents a comprehensive review of various printing technologies, commonly used substrates and electronic materials. Various solution/dry printing and contact/noncontact printing technologies have been assessed on the basis of technological, materials, and process-related developments in the field. Fig. 1. The classification of common printing technologies. Critical challenges in various printing techniques and potential research directions have been highlighted. Possibilities of merging various printing methodologies have been explored to extend are difficult to realize with the conventional wafer-based the lab developed standalone systems to high-speed roll-to-roll fabrication techniques. The printed electronics on flexible production lines for system level integration. substrates will enable conformable sensitive electronic systems Index Terms— Printed sensors, printed electronics, flexible such as electronic skin that can be wrapped around the body electronics, large area electronics, roll-to-roll, dispersion solution. of a robot or prosthetic hands [20]–[25].
    [Show full text]
  • Controlling Nanostructure in Inkjet Printed Organic Transistors for Pressure Sensing Applications
    nanomaterials Article Controlling Nanostructure in Inkjet Printed Organic Transistors for Pressure Sensing Applications Matthew J. Griffith 1,2,* , Nathan A. Cooling 1, Daniel C. Elkington 1, Michael Wasson 1 , Xiaojing Zhou 1, Warwick J. Belcher 1 and Paul C. Dastoor 1 1 Centre for Organic Electronics, University of Newcastle, University Drive, Callaghan, NSW 2308, Australia; [email protected] (N.A.C.); [email protected] (D.C.E.); [email protected] (M.W.); [email protected] (X.Z.); [email protected] (W.J.B.); [email protected] (P.C.D.) 2 School of Aeronautical, Mechanical and Mechatronic Engineering, University of Sydney, Camperdown, NSW 2006, Australia * Correspondence: matthew.griffi[email protected] Abstract: This work reports the development of a highly sensitive pressure detector prepared by inkjet printing of electroactive organic semiconducting materials. The pressure sensing is achieved by incorporating a quantum tunnelling composite material composed of graphite nanoparticles in a rubber matrix into the multilayer nanostructure of a printed organic thin film transistor. This printed device was able to convert shock wave inputs rapidly and reproducibly into an inherently amplified electronic output signal. Variation of the organic ink material, solvents, and printing speeds were shown to modulate the multilayer nanostructure of the organic semiconducting and dielectric layers, enabling tuneable optimisation of the transistor response. The optimised printed device exhibits Citation: Griffith, M.J.; Cooling, rapid switching from a non-conductive to a conductive state upon application of low pressures whilst N.A.; Elkington, D.C.; Wasson, M.; operating at very low source-drain voltages (0–5 V), a feature that is often required in applications Zhou, X.; Belcher, W.J.; Dastoor, P.C.
    [Show full text]
  • Flexible and Printed Electronics February 2021
    1. February 2021 Advanced Technologies – for Industry Product Watch Flexible and printed electronics Product Watch Report - European Commission This report was prepared by Chiel Scholten, Kincsö Izsak and Maialen Perez from Technopolis Group. The authors would like to thank the interviewees for their valuable comments and inputs. EUROPEAN COMMISSION Executive Agency for Small and Medium-sized Enterprises (EASME) Unit A.1.2 — COSME E-mail: [email protected] Directorate General for Internal Market, Industry, Entrepreneurship and SMEs Unit D.2 — Industrial forum, alliances, clusters E-mail: [email protected] European Commission B-1049 Brussels LEGAL NOTICE The information and views set out in this report are those of the author(s) and do not necessarily reflect the official opinion of EASME or of the Commission. Neither EASME, nor the Commission can guarantee the accuracy of the data included in this study. Neither EASME, nor the Commission or any person acting on their behalf may be held responsible for the use, which may be made of the information contained therein. More information on the European Union is available on the Internet (http://www.europa.eu). PDF ISBN 978-92-9460-556-6 doi:10.2826/295137 EA-02-21-327-EN-N © European Union, 2021 February 2021 Product Watch Report - European Commission Table of contents Section 1 ............................................................................................................................... 4 1. Background and objectives of the report ....................................................................
    [Show full text]
  • Development of Flexible and Functional Sequins Using Subtractive Technology and 3D Printing for Embroidered Wearable Textile Applications
    materials Article Development of Flexible and Functional Sequins Using Subtractive Technology and 3D Printing for Embroidered Wearable Textile Applications Ramona Nolden * , Kerstin Zöll and Anne Schwarz-Pfeiffer Research Institute for Textile and Clothing, Hochschule Niederrhein-University of Applied Sciences, Webschulstraße 31, 41065 Mönchengladbach, Germany; [email protected] (K.Z.); [email protected] (A.S.-P.) * Correspondence: [email protected] Abstract: Embroidery is often the preferred technology when rigid circuit boards need to be con- nected to sensors and electrodes by data transmission lines and integrated into textiles. Moreover, conventional circuit boards, like Lilypad Arduino, commonly lack softness and flexibility. One approach to overcome this drawback can be flexible sequins as a substrate carrier for circuit boards. In this paper, such an approach of the development of flexible and functional sequins and circuit boards for wearable textile applications using subtractive and additive technology is demonstrated. Applying these techniques, one-sided sequins and circuit boards are produced using wax printing and etching copper-clad foils, as well as using dual 3D printing of conventional isolating and electri- cally conductive materials. The resulting flexible and functional sequins are equipped with surface mounted devices, applied to textiles by an automated embroidery process and contacted with a Citation: Nolden, R.; Zöll, K.; conductive embroidery thread. Schwarz-Pfeiffer, A. Development of Flexible and Functional Sequins Keywords: 3D printing; additive manufacturing; circuit boards; functional sequins; subtractive Using Subtractive Technology and 3D technology; wearable electronics Printing for Embroidered Wearable Textile Applications. Materials 2021, 14, 2633. https://doi.org/10.3390/ ma14102633 1.
    [Show full text]
  • Towards Printed Chaotic Circuits: a Topology Based on Memristors
    IX Symposium Industrial Electronics INDEL 2012, Banja Luka, November 0103, 2012 Towards printed chaotic circuits: a topology based on memristors A. Buscarino1, S. Dautovic2, L. Fortuna1, M. Frasca1, L. V. Gambuzza1 1DIEEI, University of Catania, Catania, Italy 2DEET FTS, University of Novi Sad, Serbia [email protected] Abstract—In this work a chaotic circuit for printed electronics electrical quantities [5]. The memristor fundamental applications has been designed. The circuit is based on the use of characteristics is described in terms of v=M(q) i, where M(q) is memristors, which provide nonlinear elements with memory and defined as the memristance and is function of the quantity of have been already implemented in flexible electronics. The design charge that has passed through the device. In a memristor, this takes into account a physical model of the memristor suitable for relation is nonlinear and the v–i characteristic is a curve that already fabricated TiO2 devices, in order to reduce the gap takes a form of a hysteresis loop pinched in the origin. The between ideal memristor-based chaotic oscillators and possible memristor is thus a nonlinear element with memory, and, for printed electronics implementations. this reason, its use as fundamental element for the design of chaotic systems is currently intensively explored [6]. The first Keywords-Chaotic circuits; memristor; printed electronics component with a memristor characteristic was fabricated in I. INTRODUCTION the HP laboratory [7], after which different materials and techniques have been used to produce devices with memristive Since its discovery, chaos has fascinated many scientists characteristics. It is worth to note that the memristor is and researchers both in the theoretical fields and in application- implemented in flexible electronics using spin-on sol gel oriented studies.
    [Show full text]
  • An Investigation of Fundamental Competencies for Printed Electronics John Jacobs Clemson University, [email protected]
    Clemson University TigerPrints All Theses Theses 5-2010 An Investigation of Fundamental Competencies for Printed Electronics John Jacobs Clemson University, [email protected] Follow this and additional works at: https://tigerprints.clemson.edu/all_theses Part of the Education Commons Recommended Citation Jacobs, John, "An Investigation of Fundamental Competencies for Printed Electronics" (2010). All Theses. 780. https://tigerprints.clemson.edu/all_theses/780 This Thesis is brought to you for free and open access by the Theses at TigerPrints. It has been accepted for inclusion in All Theses by an authorized administrator of TigerPrints. For more information, please contact [email protected]. AN INVESTIGATION OF FUNDAMENTAL COMPETENCIES FOR PRINTED ELECTRONICS A Thesis Presented to the Graduate School of Clemson University In Partial Fulfillment of the Requirements for the Degree Master of Science Graphic Communications by John Jay Jacobs May 2010 Accepted by: Dr. Samuel T. Ingram, Committee Chair Dr. Liam O’Hara Mr. Chip Tonkin i ABSTRACT A survey was taken of professionals in the printed electronics industry to determine the basic educational requirements the industry had of a student graduating with a degree in graphic communications or printing sciences. A test was conducted of graphic communication seniors graduating in May 2010 to determine their fundamental knowledge of printed electronics. Data obtained from the industry survey was used to determine the relevant components of a basic printed electronics education. The data obtained from the graduating senior examination determined their areas of knowledge of printed electronics. The needs identified from the industry survey were compared to the areas of knowledge of graphic communications graduating seniors.
    [Show full text]
  • Mobility & 3D Structural Electronics
    NO 26, 2019 ORGANIC AND PRINTED ELECTRONICS Mobility & 3D Structural Electronics components “One plus one” equals more than two! KROENERT and Coatema discuss their alliance events All eyes on Munich LOPEC 2019 preview including news | www.ope-journal.com ORGANIC AND PRINTED ELECTRONICS OPE journal is the renowned globally circulated magazine for the organic and printed electronics industry. OPE journal provides its readers with: • analyses of the latest market trends • most recent industry news • independently researched economic and business reports • reports on new technologies, methods and processes In every issue we publish detailed information on selected technical focus areas. In addition current news stories are released on our website www.ope-journal.com on a daily basis. Place your advertisement in OPE journal - get your personal offer! EDITORIAL PREVIEW Nina Pirchmoser • Phone +49 8033 302-1275 • [email protected] OPE journal Issue 26 OPE journal Issue 27 OPE journal Issue 28 OPE journal Issue 29 Mobility & OLEDs & Energy, Packaging & 3D Structural Displays Photovoltaics, Sensors Electronics Smart Cities Editorial deadline: Editorial deadline: Editorial deadline: Editorial deadline: February 12, 2019 May 31, 2019 August 27, 2019 November 7, 2019 LOPEC, Munich Touch Taiwan, Taipei INPRINT, Munich innoLAE 2020 20.-21.03.2019 28.-30.08.2019 12.-14.11.2019 (tbd) IDTechEx Show Europe, Berlin IDTechEx Show USA, 10.-11.04.2019 Santa Clara 20.-21.11.2019 @OPEjournal EDITORIAL 3 ORGANIC AND PRINTED ELECTRONICS OPE journal is the renowned globally circulated magazine for the organic and printed electronics industry. OPE journal provides its readers with: • analyses of the latest market trends • most recent industry news • independently researched economic and business reports • reports on new technologies, methods and processes In every issue we publish detailed information on selected technical focus areas.
    [Show full text]
  • Compact Modeling and Physical Design Automation of Inkjet-Printed Electronics Technology
    Compact Modeling and Physical Design Automation of Inkjet-Printed Electronics Technology Zur Erlangung des akademischen Grades eines Doktors der Ingenieurwissenschaften von der KIT-Fakultät für Informatik des Karlsruher Instituts für Technologie (KIT) genehmigte Dissertation von M.Sc. Farhan Rasheed aus Karachi, Pakistan Tag der mündlichen Prüfung: 01.07.2020 Erster Gutachter: Prof. Dr. Mehdi Baradaran Tahoori, Karlsruhe Institute of Technology, Germany Zweiter Gutachter: Prof. Dr. Jasmin Aghassi-Hagmann, University of Applied Sciences Offenburg, Germany, Karlsruhe Institute of Technology, Germany To my family Work, work and work and we are bound to success Muhammad Ali Jinnah (Founder of Pakistan) ii Farhan Rasheed Tivoliplatz 1 76137 Karlsruhe Hiermit erkläre ich an Eides statt, dass ich die von mir vorgelegte Arbeit selbstständig verfasst habe, dass ich die verwendeten Quellen, Internet-Quellen und Hilfsmittel vollständig angegeben haben und dass ich die Stellen der Arbeit - einschlielich Tabellen, Karten und Abbildungen - die anderen Werken oder dem Internet im Wortlaut oder dem Sinn nach entnommen sind, auf jeden Fall unter Angabe der Quelle als Entlehnung kenntlich gemacht habe. Karlsruhe, Mai 2020 Farhan Rasheed iii iv Acknowledgment I would like to thank my advisers, Prof. Mehdi Baradaran Tahoori and Prof. Jasmin Aghassi- Hagmann for supporting me during these past three and a half years. I am very grateful for your scientific advice and knowledge and many insightful discussions and suggestions. Thank you for believing in me and giving me this opportunity. I would like to thank especially to my family. I am very grateful to my parents for their supports and motivations throughout my life. Special thanks to my wife Nisa for her encour- agement, love, support and sacrifices during my Ph.D.
    [Show full text]
  • Automated Fabrication of Hybrid Printed Electronic Circuits
    Mechatronics 70 (2020) 102403 Contents lists available at ScienceDirect Mechatronics journal homepage: www.elsevier.com/locate/mechatronics Automated fabrication of hybrid printed electronic circuits Ulrich Gengenbach ∗, Martin Ungerer, Liane Koker, Klaus-Martin Reichert, Peter Stiller, Stephan Allgeier, Bernd Köhler, Xiaoqi Zhu, Chengyuan Huang, Veit Hagenmeyer Institute for Automation and Applied Informatics, Karlsruhe Institute of Technology, Karlsruhe 76021, Germany a r t i c l e i n f o a b s t r a c t Keywords: Printed electronics offer great potential for new applications such as Internet of Things devices and wearables. Functional printing However, to date, only a limited number of electronic functions and integration densities can be realised by Hybrid printed electronic circuit printing processes. Hence, hybrid printed electronic circuits are actually created by mounting silicon electronic Process automation components. Since both printed materials and processes are continuously evolving, an accompanying structured Piezo print head as a virtual stepper axis development methodology is required. This paper highlights a digital workflow from design to automated fabrica- Adaptation of surface mount technology Deflectometry tion using the example of a demonstrator circuit. A multi-layer vector ink-jet printing process to print electronic devices onto foil substrates with three functional inks is presented. This printing process is improved using a newly set-up printing system: Integrating a piezo print head into the path planning of the printing system and its control as a virtual stepper axis enable highly precise vector printing. This leads to printed resistors with low tolerances. Adaptations of surface mount technology for assembling silicon electronic components onto printed foil substrates are discussed.
    [Show full text]