ASUSTEK COMPUTER INC. and SUBSIDIARIES Consolidated
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ASUSTEK COMPUTER INC. NON-CONSOLIDATED FINANCIAL STATEMENTS December 31, 2007 and 2006 with Report of Independent Auditors
ASUSTEK COMPUTER INC. NON-CONSOLIDATED FINANCIAL STATEMENTS December 31, 2007 and 2006 With Report of Independent Auditors The reader is advised that these financial statements have been prepared originally in Chinese. In the event of a conflict between these financial statements and the original Chinese version or difference in interpretation between the two versions, the Chinese language financial statements shall prevail. English Translations of Financial Statements Originally Issued in Chinese ASUSTEK COMPUTER INC. NON-CONSOLIDATED BALANCE SHEETS DECEMBER 31, 2007 AND 2006 (Expressed in New Taiwan Thousand Dollars) ASSETS Notes 2007 2006 LIABILITIES AND STOCKHOLDERS' EQUITY Notes 2007 2006 CURRENT ASSETS CURRENT LIABILITIES Cash and cash equivalents II, IV.1 $9,174,219 $10,791,836 Notes and accounts payable $80,372,075 $109,230,069 Financial assets at fair value through profit or loss-current II, IV.2 7 ,257,169 4,218,719 Notes and accounts payable -affiliated companies V 837,669 9,007,117 Notes and accounts receivable-Net II, IV.3 61 ,863,244 80,950,232 Income tax payable II, IV.19 5,795,472 3,558,780 Accounts receivable-affiliated companies-Net II, IV.3, V 45 ,747,118 21,152,900 Accrued expenses II, IV.12, V 31,771,898 21,553,421 Other receivables-Net II,V 5 ,069,634 1,627,107 Other payables V 771,563 469,653 Inventories-Net II, IV.4 53 ,643,865 72,627,961 Receipts in advance V 2,412,198 2,502,732 Prepayments V 121 ,788 162,382 Bonds payable-current portion IV.11 - 6,613,377 Other current assets 101 ,863 - Other current liabilities -
Apple U1 Ultra Wideband (UWB) Analysis
Apple U1 Ultra Wideband (UWB) Analysis Product Brief – October 2019 techinsights.com All content © 2019. TechInsights Inc. All rights reserved. GLOBAL LEADER IN IP & TECHNOLOGY INTELLIGENCE By revealing the innovation others can’t inside advanced technology products, we prove patent value and drive the best Intellectual Property (IP) and technology investment decisions Technology Intelligence Intellectual Property Services We help decision makers in semiconductor, system, financial, We help IP Professionals in global technology companies, and communication service provider companies: licensing entities and legal firms to: • Discover what products are winning in the highest- • Build higher quality, more effective patents growth markets and why • Identify patents of value and gather evidence of use to • Spot or anticipate disruptive events, including the demonstrate this value entrance of new players • Obtain accurate data for planning a potential defensive • Understand state-of-the-art technology strategy or assertion case through independent, objective analysis • Make better portfolio management decisions to invest, • Make better, faster product decisions with greater abandon, acquire or divest confidence • Understand their competition, identify strategic partners, • Understand product costs and bill of materials acquisition targets and business threats 2 All content © 2019. TechInsights Inc. All rights reserved. TechInsights has been publishing technology analysis for 30 years, enabling our customers to advance their intellectual property -
Operational Highlights
078 079 5.1 Business Activities 5.2 Technology Leadership ●Developed integrated fan-out on substrate (InFO-oS) Gen-3, which provides more chip partition integration with larger 5.1.1 Business Scope 5.2.1 R&D Organization and Investment package size and higher bandwidth As the founder and a leader of the dedicated semiconductor foundry segment, TSMC provides a full range of integrated In 2020, TSMC continued to invest in research and ●Expanded 12-inch Bipolar-CMOS-DMOS (BCD) technology semiconductor foundry services, including the most advanced process technologies, leading specialty technologies, the most development, with total R&D expenditures amounting to 8.2% portfolio on 90nm, 55nm and 22nm, targeting a variety of comprehensive design ecosystem support, excellent manufacturing productivity and quality, advanced mask technologies, and of revenue, a level that equals or exceeds the R&D investment fast-growing applications of mobile power management ICs 3DFabricTM advanced packaging and silicon stacking technologies, to meet a growing variety of customer needs. The Company of many other leading high-tech companies. with various levels of integration strives to provide the best overall value to its customers and views customer success as TSMC’s own success. As a result, TSMC has ●Achieved technical qualification of 28nm eFlash for gained customer trust from around the world and has experienced strong growth and success of its own. Faced with the increasingly difficult challenge to continue automobile electronics and micro controller units (MCU) extending Moore’s Law, which calls for the doubling of applications 5.1.2 Customer Applications semiconductor computing power every two years, TSMC has ●Began production of 28nm resistive random access memory focused its R&D efforts on offering customers first-to-market, (RRAM) as a low-cost solution for the price sensitive IoT TSMC manufactured 11,617 different products for 510 customers in 2020. -
Inventec Corporation
(English Translation of Pro Forma Financial Report Originally Issued in Chinese) PEGATRON CORPORATION AND ITS SUBSIDIARIES PRO FORMA CONSOLIDATED FINANCIAL STATEMENTS DECEMBER 31, 2008 AND 2007 (With Independent Auditors’ Report Thereon) Address: 5F., No.76, Ligong St., Beitou District, Taipei City 112, Taiwan Telephone: 886-2-8143-9001 - 1 - TABLE OF CONTENTS Contents Page Cover Page 1 Table of Contents 2 Independent Auditors’ Report 3 Pro Forma Consolidated Balance Sheets 4 Pro Forma Consolidated Statements of Income 5 Pro Forma Consolidated Statements of Changes in Stockholders’ Equity 6 Pro Forma Consolidated Statements of Cash Flows 7 Notes to Pro Forma Consolidated Financial Statements (1) Organization and Business 8 (2) Summary of Significant Accounting Policies 8-28 (3) Reasons for and Effects of Accounting Changes 28 (4) Summary of Major Accounts 28-49 (5) Related-Party Transactions 50-56 (6) Pledged Assets 56 (7) Significant Commitments and Contingencies 57-58 (8) Significant Catastrophic Losses 59 (9) Significant Subsequent Events 59 (10) Others 59 (11)Additional Disclosures 60-61 (12)Segment Information 61-62 - 2 - (English Translation of Financial Report Originally Issued in Chinese) PEGATRON CORPORATION AND ITS SUBSIDIARIES PRO FORMA CONSOLIDATED BALANCE SHEETS DECEMBER 31, 2008 AND 2007 (All Amounts Expressed in Thousands of New Taiwan Dollars, Except for Share Data) December 31, 2008 December 31, 2007 Amount % Amount % ASSETS Current Asset: Cash (Notes 2 and 4(1)) $ 27,065,987 12 26,294,882 9 Financial assets reported -
Taiwan's Top 50 Corporates
Title Page 1 TAIWAN RATINGS CORP. | TAIWAN'S TOP 50 CORPORATES We provide: A variety of Chinese and English rating credit Our address: https://rrs.taiwanratings.com.tw rating information. Real-time credit rating news. Credit rating results and credit reports on rated corporations and financial institutions. Commentaries and house views on various industrial sectors. Rating definitions and criteria. Rating performance and default information. S&P commentaries on the Greater China region. Multi-media broadcast services. Topics and content from Investor outreach meetings. RRS contains comprehensive research and analysis on both local and international corporations as well as the markets in which they operate. The site has significant reference value for market practitioners and academic institutions who wish to have an insight on the default probability of Taiwanese corporations. (as of June 30, 2015) Chinese English Rating News 3,440 3,406 Rating Reports 2,006 2,145 TRC Local Analysis 462 458 S&P Greater China Region Analysis 76 77 Contact Us Iris Chu; (886) 2 8722-5870; [email protected] TAIWAN RATINGS CORP. | TAIWAN'S TOP 50 CORPORATESJenny Wu (886) 2 872-5873; [email protected] We warmly welcome you to our latest study of Taiwan's top 50 corporates, covering the island's largest corporations by revenue in 2014. Our survey of Taiwan's top corporates includes an assessment of the 14 industry sectors in which these companies operate, to inform our views on which sectors are most vulnerable to the current global (especially for China) economic environment, as well as the rising strength of China's domestic supply chain. -
TSMC Integrated Fan-Out (Info) Package Apple A10
Electronic Costing & Technology Experts 21 rue la Nouë Bras de Fer 44200 Nantes – France Phone : +33 (0) 240 180 916 email : [email protected] www.systemplus.fr September 2016 – Version 1 – Written by Stéphane ELISABETH DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners. © 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 1 Return to TOC Glossary 1. Overview / Introduction 4 – A10 Die Analysis 57 – Executive Summary – A10 Die View, Dimensions & Marking – Reverse Costing Methodology – A10 Die Cross-Section – A10 Die Process Characteristics 2. Company Profile 7 – Comparison with previous generation 65 – Apple Inc. – A9 vs. A10 PoP – Apple Series Application processor – A9 vs. A10 Process – Fan-Out Packaging – TSMC Port-Folio 4. Manufacturing Process Flow 70 – TSMC inFO packaging – Chip Fabrication Unit – Packaging Fabrication Unit 3. Physical Analysis 15 – inFO Reconstitution Flow – Physical Analysis Methodology – iPhone 7 Plus Teardown 17 5. Cost Analysis 81 – A10 Die removal – Synthesis of the cost analysis – A10 Package-on-Package Analysis 23 – Main steps of economic analysis – A10 Package View, Dimensions – Yields Hypotheses – A10 Package XRay View – Die Cost Analysis 86 – A10 Package Opening – Wafer Cost – A10 Package Marking – Die Cost – A10 Package Cross-Section – inFO Packaging Cost Analysis 90 – A10 Package Cross-Section – Adhesive & Passivation – Packaging Wafer Cost – A10 package cross-Section - TIVs – Packaging Cost per process Steps – A10 package cross-Section – Solder Balls – Component Cost – A10 package cross-Section – RDL – Land-Side Decoupling Capacitor Analysis 48 6. -
TSMC Investement in Arizona
Michael R. Splinter Chairman of the Board Senator Robert Menendez Senator Lisa A. Murkowski Honorary Co-Chair Honorary Co-Chair Rupert J. Hammond-Chambers President INTERNAL COMMENTARY: THE STRATEGIC IMPORTANCE OF THE TSMC ARIZONA INVESTMENT MAY 15, 2020 RUPERT J. HAMMOND-CHAMBERS PRESIDENT Taiwan Semiconductor Manufacturing Company (TSMC) is the world’s largest contract chip manufacturer. A key link in the global technology supply chain, it is the most important company most people have never heard of. TSMC, based in Taiwan, is now doubling down on its relationship with the United States in a big way. On Friday, May 15, 2020 TSMC announced the most important technology news of the year; the company committed to building a cutting-edge 5nm fabrication plant (fab) to produce semiconductor chips in Arizona. Its U.S. customers for the chips produced here will not only include U.S. tech companies, but will also include the Pentagon, defense contractors, and the national security community. The visionary founder of TSMC, Morris Chang, imagined a world where fabless semiconductor companies would absorb the financial burden of designing chips, but would outsource their actual production to his TSMC. His vision created a monster that dominates the sector he created - the foundry manufacturing sector – making almost 50% of all chips produced by foundries globally. TSMC’s state-of-the-art process technology and CAPEX investment of approximately US$15 billion/year ensures that it has few, if any, peers. Successive Taiwan governments have continued to nurture TSMC through prioritized access to land, power, and water, thereby allowing it to serve as the beating heart of Taiwan’s technology miracle. -
Summary of Investments by Type
COMMON INVESTMENT FUNDS Schedule of Investments March 31, 2017 SUMMARY OF INVESTMENTS BY TYPE Cost Market Value Fixed Income Investments $ $ Short-term investments 42,653,484 42,653,484 Bonds 175,482,352 175,327,122 Mortgage-backed securities 22,199,796 21,785,061 Emerging markets debt 9,619,817 10,899,147 Bank loans - high income fund 20,985,176 23,595,337 Total Fixed Income Investments 270,940,624 274,260,151 Equity-Type Investments Mutual funds Domestic 9,234,353 12,420,750 International 18,849,681 18,688,379 Common stocks Domestic 152,833,551 187,487,257 International 216,167,277 227,850,648 Total Equity-Type Investments 397,084,862 446,447,034 Alternative Investments Funds of hedge funds 38,264,990 46,247,453 Real estate trust fund 6,876,041 10,104,141 Total Alternatives Investments 45,141,031 56,351,594 TOTAL INVESTMENTS 713,166,517 777,058,779 Page 1 of 32 COMMON INVESTMENT FUNDS Schedule of Investments March 31, 2017 SUMMARY OF INVESTMENTS BY FUND Cost Market Value Fixed Income Fund $ $ Short-term investments 13,092,627 13,092,627 Bonds 143,036,345 143,362,214 Mortgage-backed securities 21,372,523 20,977,317 Emerging markets debt 9,619,817 10,899,147 Bank loans - high income fund 20,985,176 23,595,337 208,106,487 211,926,642 Domestic Core Equity Fund Short-term investments 9,127,791 9,127,791 Common stocks 134,983,626 165,021,220 Futures - (5,950) Private placement 4,150 4,150 144,115,567 174,147,211 Small Cap Equity Fund Short-term investments 2,937,066 2,937,066 Mutual funds 9,234,353 12,420,750 Common stocks 17,845,775 22,467,836 -
Semiconductors: a Changing of the Guard
Semiconductors: A Changing of the Guard Richard Spalton MA, CFA Investment Manager Semiconductors: A Changing of the Guard “While an early chip from the 1970s could fit thousands of micrometre-sized transistors, today’s most advanced chips are a complex web of billions of transistors, the smallest of which are just 10nm. To get some idea of how small that is: your fingernails grew 10nm in the time it took to read the previous sentence.”1 Background One of the key enablers of technological progress has been the constantly shrinking size of the transistors on semiconductor chips. Smaller transistors mean that the same number of computations can be completed faster, more efficiently and at lower cost. This concept was famously outlined by Gordon Moore, co-founder of Intel, who in 1965 wrote what became known as Moore’s Law. The manufacturing process for a particular size of transistor is called a process node. Shifting to a new node is highly complex and involves significant capital expenditure. In July 2020 Intel announced that their transition to the 7 nanometre node was running a year behind schedule. This delay will have a significant impact on Intel and its competitors. This announcement marks a changing of the guard in the semiconductor market, with leadership shifting away from Intel towards Taiwan Semiconductor Manufacturing Company (TSMC) and Samsung Electronics. Scale Matters Assessing the future prospects of a company requires an assessment of its industry. Manufacturing semiconductors is highly capital intensive – the industry spends USD 100bn per annum on capital expenditure. Companies also need to spend substantial amounts on R&D because each process node is more complex than the last. -
Chapter 2 Hon Hai/Foxconn: Which Way Forward ?
Chapter 2 Hon Hai/Foxconn: which way forward ? Gijsbert van Liemt 1 1. Introduction Hon Hai/Foxconn, the world's leading contract manufacturer, assembles consumer electronics products for well-known brand-names. It is also a supplier of parts and components and has strategic alliances with many other such suppliers. Despite its size (over a million employees; ranked 32 in the Fortune Global 500) and client base (Apple, HP, Sony, Nokia), remarkably little information is publicly available on the company. The company does not seek the limelight, a trait that it shares with many others operating in this industry. Quoted on the Taiwan stock exchange, Hon Hai Precision Industry (HHPI) functions as an ‘anchor company’ for a conglomerate of companies. 2 As the case may be, HHPI is the sole, the majority or a minority shareholder in these companies and has full, partial or no control at all. Many subsidiaries use the trade name Foxconn and that is why this chapter refers to the company as Hon Hai/Foxconn. Among its many subsidiaries and affiliates are Ambit Microsystems, Cybermart, FIH Mobile, Fu Taihua Industrial, Hong Fujin Precision and Premier Image. After a near hundredfold increase in sales in the first decade of this century Hon Hai/Foxconn's sales growth slowed down drastically. The company is facing several challenges: slowing demand growth in its core (electronics) business; a weakening link with Apple, its main customer; rising labour costs and a more assertive labour force in China, its main production location; and pressure from its shareholders. 1. Copyright 2015 Gijsbert van Liemt. -
Pegatron Corporation and Subsidiaries
1 Stock Code:4938 (English Translation of Consolidated Financial Statements and Report Originally Issued in Chinese) PEGATRON CORPORATION AND SUBSIDIARIES Consolidated Financial Statements With Independent Accountants’ Review Report For the Three Months Ended March 31, 2018 and 2017 Address: 5F., No.76, Ligong St., Beitou District, Taipei City 112, Taiwan Telephone: 886-2-8143-9001 The auditors’ review report and the accompanying consolidated financial statements are the partial English translation of the Chinese version prepared and used in the Republic of China. If there is any conflict between, or any difference in the interpretation of the English and Chinese language auditors’ review report and consolidated financial statements, the Chinese version shall prevail. 2 Table of contents Contents Page 1. Cover Page 1 2. Table of Contents 2 3. Independent Accountants’ Review Report 3 4. Consolidated Balance Sheets 4 5. Consolidated Statements of Comprehensive Income 5 6. Consolidated Statements of Changes in Equity 6 7. Consolidated Statements of Cash Flows 7 8. Notes to the Consolidated Financial Statements (1) Company history 8 (2) Approval date and procedures of the consolidated financial statements 8 (3) Application of new standards, amendments and interpretations 8~15 (4) Summary of significant accounting policies 16~50 (5) Significant accounting assumptions and judgments, and major sources 50 of estimation uncertainty (6) Explanation of significant accounts 51~90 (7) Related-party transactions 90~91 (8) Pledged assets 91 (9) Significant -
AQR TM Emerging Multi-Style Fund June 30, 2021
AQR TM Emerging Multi-Style Fund June 30, 2021 Portfolio Exposures NAV: $685,149,993 Asset Class Security Description Exposure Quantity Equity A-Living Services Ord Shs H 2,001,965 402,250 Equity Absa Group Ord Shs 492,551 51,820 Equity Abu Dhabi Commercial Bank Ord Shs 180,427 96,468 Equity Accton Technology Ord Shs 1,292,939 109,000 Equity Acer Ord Shs 320,736 305,000 Equity Adani Enterprises Ord Shs 1,397,318 68,895 Equity Adaro Energy Tbk Ord Shs 2,003,142 24,104,200 Equity Advanced Info Service Non-Voting DR 199,011 37,300 Equity Advanced Petrochemical Ord Shs 419,931 21,783 Equity Agricultural Bank of China Ord Shs A 288,187 614,500 Equity Agricultural Bank Of China Ord Shs H 482,574 1,388,000 Equity Al Rajhi Bank Ord Shs 6,291,578 212,576 Equity Alibaba Group Holding ADR Representing 8 Ord Shs 33,044,794 145,713 Equity Alinma Bank Ord Shs 1,480,452 263,892 Equity Ambuja Cements Ord Shs 305,517 66,664 Equity Anglo American Platinum Ord Shs 174,890 1,514 Equity Anhui Conch Cement Ord Shs A 307,028 48,323 Equity Anhui Conch Cement Ord Shs H 1,382,025 260,500 Equity Arab National Bank Ord Shs 485,970 80,290 Equity ASE Technology Holding Ord Shs 2,982,647 742,000 Equity Asia Cement Ord Shs 231,096 127,000 Equity Aspen Pharmacare Ord Shs 565,696 49,833 Equity Asustek Computer Ord Shs 1,320,000 99,000 Equity Au Optronics Ord Shs 2,623,295 3,227,000 Equity Aurobindo Pharma Ord Shs 3,970,513 305,769 Equity Autohome ADS Representing 4 Ord Shs Class A 395,017 6,176 Equity Axis Bank GDR 710,789 14,131 Equity Ayala Land Ord Shs 254,266 344,300