DOCSLIB.ORG

Mapping out the Future of Packaging – OE-A Roadmap for Organic and Printed Electronics

Total Page：16

File Type：pdf, Size：1020Kb

Download full-text PDF Read full-text
Mapping out the Future of Packaging – OE-A Roadmap for Organic and Printed Electronics Organic and Printed Electronics Association Mapping Out the Future of Packaging – OE-A Roadmap for Organic and Printed Electronics Packaging Management Council October 14, 2015 Rochester, N.Y. Barbara M. Fisher Regional Manager, OE-A North America a working group within P h o t o : OE-A H o l s t C www.oe-a.org e n t r e © OE-A 2015, October 2015 Page 1 Organic and Printed Electronics Association Outline z Introduction OE-A z LOPEC z 6th Edition of the OE-A Roadmap } Applications and Technologies z Demonstrator Projects © OE-A 2015, October 2015 Page 2 1 Organic and Printed Electronics Association What is Organic and Printed Electronics? Organic and Printed Electronics is z thin z lightweight z flexible z robust and enables z low-cost electronics z new applications z single-use disposable electronics using large-area, high-volume processing Enables: z Electronics everywhere z Ambient intelligence © OE-A 2015, October 2015 Page 3 Organic and Printed Electronics Association What is Organic and Printed Electronics? Multifunctional systems Active and passive organic Power supply devices: transistor, IC, (organic photovoltaics, antenna, ...) flexible battery, ...) Sensors (touch, temperature, pressure, gas, …) Displays and lighting (OLED, electrochromic, electrophoretic,...) Source: PolyIC, Fraunhofer ISE, Thinfilm, Plastic Logic © OE-A 2015, October 2015 Page 4 2 Organic and Printed Electronics Association Basics of Organic and Printed Electronics Printing Organic and Printed Electronics Chemistry Source: Heraeus, manroland, Infineon, Karl Knauer Microelectronics © OE-A 2015, October 2015 Page 5 Organic and Printed Electronics Association Printing Technologies Gravure Printing Offset Printing Flexographic Printing Screen Printing Ink-jet Printing © OE-A 2015, October 2015 Page 6 3 Organic and Printed Electronics Association New Functional Inks / Substrates z Soluble Functional Materials } Polymers } Metal filled pastes } Nanoparticles z Substrates } Paper } Plastic } Glass } Stainless Steel z The material best suited for specific application depends on process conditions, surface roughness, thermal expansion, barrier properties Source: Heraeus Clevios, Cynora © OE-A 2015, October 2015 Page 7 Organic and Printed Electronics Association OE-A – Overview z Global industry association for organic and printed electronics, driven by over 240 international members z Our members represent the entire organic electronics value chain: } Component & material suppliers } Equipment & tool suppliers } Producers / system integrators } End-users } R&D institutes z Benefits of OE-A membership: } Networking Opportunities } Frequent Working Group Meetings } Europe, North America, Asia } LOPEC } Industry Roadmaps } Demonstrator Projects } Industry Visibility © OE-A 2015, October 2015 Page 8 4 Organic and Printed Electronics Association New OE-A Board of Directors Chairman: Dr. Jeremy Burroughes Vice Chairman Asia: Prof. Dr. Toshihide Kamata Vice Chairman Europe: Jaap Lombaers Vice Chairman North America: Stan Farnsworth Dr. Stephan Kirchmeyer Members of the Board: Thomas Kolbusch Markus Bamberger Thibaud Le Séguillon Prof. Dr. Reinhard Baumann Dr. Giovanni Nisato Dr. Peter Fischer © OE-A 2015, October 2015 Page 9 Organic and Printed Electronics Association OE-A Has More than 240 Members, Representing the Whole Process Chain in Organic and Printed Electronics Membership Development of the OE-A 243 October 2015 Competencies of the OE-A Members © OE-A 2015, October 2015 Page 10 5 Organic and Printed Electronics Association 240+ Members Representing the Entire Value Chain (1) Companies © OE-A 2015, October 2015 Page 11 Organic and Printed Electronics Association 240+ Members Representing the Entire Value Chain (2) Research Institutes LIOS © OE-A 2015, October 2015 Page 12 6 Organic and Printed Electronics Association Global Approach z Establish a global network North DE 91, GR 3, OE-A is active in EU GB 23, SE 3, Asia JP 7, America FR 13, PT 2, 183 CN 3, 21 z Europe CH 7, DK 1, 37 IL 3, z ES 7, IE 1, US 34, TW 3, z North America z NL 6, NO 1, CA 3 KR 2, BE 5, PL 1, AE 1, z Asia FI 5, RO 1, SG 1, AT 4, RS 1, TH 1 IT 4, RU 1, Headquarters: CZ 3, SI 1 z Frankfurt, Germany Australia North American Office: Total: 243 Members1 z Pittsburgh, PA., USA from 33 countries (as of October 2015) © OE-A 2015, October 2015 Page 13 Organic and Printed Electronics Association Global Approach North America z Quarterly Working Group Meetings z Next Meeting: } 23rd North American Working Group Meeting } November 17, 2015 San Jose, CA. } Special Topic: Enabling the Internet of Everything z Frequent Presentations at Conferences and Trade Fairs in North America z Installation of a North American Chapter z North American office Barbara M. Fisher +1-412-828-0370 [email protected] © OE-A 2015, October 2015 Page 14 7 Organic and Printed Electronics Association Standardization of Printed Electronics IEC z OE-A supports the international standardization activities z Technical Committee TC119 for Printed Electronics IEC (International Electrotechnical Commission) www.iec.ch, founded in May 2012 ® z OE-A members participate via their National Standardization Organization z Creation of ad hoc working groups } Terminology, Materials Equipment, Parts and Devices, Printability z TC 119 Meetings 2015: } November 2015 (parallel to 23rd North American OE-A Working Group meeting in San Jose, CA.) z Facts and Figures on the TC 119: } Chairman: Dr. Alan Hodgson, UK } 13 “Active” Members (“P-Members”, voting rights): CN, CY, DE, ES, FI, GB, IT, JP, KR, NL, RU, SE, US form national mirror committees } 7 "Passive / Observer" Members (O-Members): BR, CA, CZ, FR, MY, PL, ZA presently signed up © OE-A 2015, October 2015 Page 15 Organic and Printed Electronics Association Communication OPE-Journal z OPE Journal } Globally circulated magazine for the organic and printed electronics industry } Launched in 2012, circulation of 9,500 copies } Publication by nimble show & media } Includes 12 pages of OE-A news } Advisory Board by OE-A Members } Benefits for OE-A members z free subscription z 15% discount on advertisements z articles in OE-A news section z Next issue will be published in November 2015 z www.ope-journal.com © OE-A 2015, October 2015 Page 16 8 Organic and Printed Electronics Association Networking Initiative The on Join the OE-A Group on LinkedIn! z Open to OE-A members and non-OE-A members z Network with over 2,200 of your colleagues, contacts and business partners z Platform for discussions, networking and up-to-date information z All parties interested in the OE-A are welcome to join this forum! z www.linkedin.com © OE-A 2015, October 2015 Page 17 LOPEC 2016, April 5-7, 2016 New Munich Trade Fair Centre, Germany Provides the central marketplace for Organic and Printed Electronics 2,300+ attendees 130+ international exhibitors 190+ presentations Exhibition Largest industry exhibition in the field On-site production on demo line Conference Business conference Technical conference /Scientific conference Pre-conference seminars 10% discount for OE-A members www.lopec.com Messe München International | Connecting Global Competence OE-A 18 9 Organic and Printed Electronics Association Outline z Introduction OE-A z LOPEC z 6th Edition of the OE-A Roadmap } Applications and Technologies z Demonstrator Projects © OE-A 2015, October 2015 Page 19 Organic and Printed Electronics Association Organic and Printed Electronics A Future Multi-Billion $ Market z Organic electronics enables new applications and opens new markets z 2014: US$23B, predominately in OLED displays z Potential for a US$50B market within the next 10 years driven by lighting, displays, OPV, logic, memory/RFID, sensors © OE-A 2015, October 2015 Page 20 10 Organic and Printed Electronics Association Sixth Edition OE-A Roadmap 2015 for Organic and Printed Electronics z Roadmap is a key activity of the OE-A z Forecast: Short-, medium-, longer term for applications and technologies z Target group: } End-users, producers, material suppliers, equipment manufacturers, researchers } Public } Government and funding agencies z Represents the common perspectives of the 230+ OE-A members z Identification of Red Brick Walls z Updated bi-annually z 14 dedicated teams } Application oriented } Technology oriented } End-User oriented Roadmap `Health Care´ © OE-A 2015, October 2015 Page 21 Organic and Printed Electronics Association OE-A Roadmap 2015 for OE Applications Overview © OE-A 2015, October 2015 Page 22 11 Organic and Printed Electronics Association Clusters 6th Edition OE-A Roadmap 2015 OLED Lighting Electronics and Components Flexible Passive Batteries Devices & Touch Active Sensors Organic Devices & Photovoltaics Printed Memory Integrated Smart Systems (ISS) Smart Smart OLED and Flexible Displays Objects & RFID Textiles Sensor Systems Flexible OLED Displays Displays New Source: FhG ISE, Plastic Logic, Novaled AG, Samsung, Schreiner PrinTronics, PolyIC, Thin Film Electronics, exax, Plastic Electronic, VARTA, Francital © OE-A 2015, October 2015 Page 23 Organic and Printed Electronics Association OE-A Roadmap 2015: Key Trends z OLED displays have become a mass market item in mobile displays and are starting to penetrate the TV market. z Major industry sectors, such as automotive, consumer electronics, white goods, pharmaceuticals/health care and packaging, are bringing organic electronics products to the market. z Integration of printed and silicon-based components to make hybrid systems looks to be one of the primary paths to further
Load more

Recommended publications
  • A Flexible Solution-Processed Memristor
    This article has been accepted for inclusion in a future issue of this journal. Content is final as presented, with the exception of pagination. IEEE ELECTRON DEVICE LETTERS 1 A Flexible Solution-Processed Memristor Nadine Gergel-Hackett, Member, IEEE, Behrang Hamadani, Barbara Dunlap, John Suehle, Senior Member, IEEE, Curt Richter, Senior Member, IEEE, Christina Hacker, and David Gundlach, Member, IEEE Abstract—A rewriteable low-power operation nonvolatile physi- cally flexible memristor device is demonstrated. The active compo- nent of the device is inexpensively fabricated at room temperature by spinning a TiO2 sol gel on a commercially available polymer sheet. The device exhibits memory behavior consistent with a memristor, demonstrates an on/off ratio greater than 10 000 : 1, is nonvolatile for over 1.2 × 106 s, requires less than 10 V, and is still operational after being physically flexed more than 4000 times. Index Terms—Flexible electronics, flexible memory, memristor, sol gel, titanium dioxide. I. INTRODUCTION E HAVE fabricated a physically flexible solution- W processed device that exhibits electrical behavior con- Fig. 1. Flexible polymer sheet patterned with four rewriteable nonvolatile sistent with that of a memristor, a memory device recently flexible TiO2 sol gel memory devices with cross-bar aluminum contacts. The experimentally demonstrated and proposed to be the miss- inset is a side view cartoon of the flexible TiO2 device structure. ing fourth basic circuit element [1], [2]. Although electrical make our flexible memristor device a prime candidate for use switching behavior has been observed from organic mono- in inexpensive flexible lightweight portable electronics, such as layers and metal oxides from as early 1968 [3]–[11], the disposable sensors [13]–[17].
    [Show full text]
  • Amorphous Metal Oxide Semiconductor Thin Film Transistors for Printed Electronics
    New Jersey Institute of Technology Digital Commons @ NJIT Theses Electronic Theses and Dissertations Fall 12-31-2018 Amorphous metal oxide semiconductor thin film transistors for printed electronics Mustafa Mohammad Yousef New Jersey Institute of Technology Follow this and additional works at: https://digitalcommons.njit.edu/theses Part of the Electrical and Electronics Commons Recommended Citation Yousef, Mustafa Mohammad, "Amorphous metal oxide semiconductor thin film transistors for printed electronics" (2018). Theses. 1637. https://digitalcommons.njit.edu/theses/1637 This Thesis is brought to you for free and open access by the Electronic Theses and Dissertations at Digital Commons @ NJIT. It has been accepted for inclusion in Theses by an authorized administrator of Digital Commons @ NJIT. For more information, please contact [email protected]. Copyright Warning & Restrictions The copyright law of the United States (Title 17, United States Code) governs the making of photocopies or other reproductions of copyrighted material. Under certain conditions specified in the law, libraries and archives are authorized to furnish a photocopy or other reproduction. One of these specified conditions is that the photocopy or reproduction is not to be “used for any purpose other than private study, scholarship, or research.” If a, user makes a request for, or later uses, a photocopy or reproduction for purposes in excess of “fair use” that user may be liable for copyright infringement, This institution reserves the right to refuse to accept
    [Show full text]
  • Printed Electronics Inks and Coatings Introduction
    PRINTED ELECTRONICS INKS AND COATINGS INTRODUCTION Countless devices rely on printed electronic technologies • Antennas for contactless SmartCards and RFID labels for function, form and flexibility. One of the most efficient • Touch screens production methods, printed electronics, allows for high- • Lighting volume, high-throughput, cost-effective manufacturing for • Printed circuit boards and potentiometers many of the products we rely on every day. Henkel is a leader • Household appliances in specialized and cross-functional ink formulations for Like most things in electronics, the majority of applications printed electronics and its line of LOCTITE® brand electronic that incorporate printed electronics are getting finer in inks has been enabling leading-edge printed electronics for dimension and more complex in functionality. Henkel’s well over three decades. ability to formulate inks that address the demands of fine- line printing, while maintaining robust conductive and other With a broad portfolio of silver, carbon, dielectric and functional properties, sets us apart from the competition, and clear conductive inks, Henkel is making today’s medical has led to technology leadership within our comprehensive solutions, in-home conveniences, handheld connectivity and portfolio of inks for printed electronics. automotive advances reliable and effective. Our inks serve multiple markets including consumer, displays, medical and automotive and RFID. They are also used in the manufacture of: • Flexible circuits for membrane touch switches
    [Show full text]
  • Development of Digital Application Specific Printed Electronics Circuits: from Specification to Final Prototypes
    View metadata,This is the citation author's and version similar of an papers article atthat core.ac.uk has been published in the Journal of Display Technology. Changes were made to this version by the publisherbrought to youprior by to CORE publication. The final version of record is available at http://dx.doi.org/10.1109/JDT.2015.2404974 provided by Diposit Digital de Documents de la UAB Development of Digital Application Specific Printed Electronics Circuits: From Specification to Final Prototypes Manuel Llamas, Mohammad Mashayekhi, Ana Jofre Pallarès, Francesc Vila, Adrià Conde and Lluís Alcalde and Jordi Carrabina Terés CAIAC Group ICAS Group Universitat Autònoma de Barcelona IMB-CNM (CSIC) Campus UAB, Bellaterra 08193, Spain Campus UAB, Bellaterra 08193, Spain E-mail: [email protected] E-mail: [email protected] Abstract— This paper presents a global proposal and characterized cell libraries allow a high degree of automation, methodology for developing digital Printed Electronics (PE) increase design productivity and helps bridging the gap prototypes, circuits and Application Specific Printed Electronics between applications and technology. Circuits (ASPECs). We start from a circuit specification using standard Hardware Description Languages (HDL) and executing Our ASPEC (Application Specific Printed Electronics its functional simulation. Then we perform logic synthesis that Circuits) approach is intended to reuse the ASIC models used includes logic gate minimization by applying state-of-the-art in industry in terms of designs flows and towards industrial algorithms embedded in our proposed Electronic Design manufacturing foundries. This methodology applied to digital Automation (EDA) tools to minimize the number of transistors is complementary to the use of existing design methodologies required to implement the circuit.
    [Show full text]
  • Technologies for Printing Sensors and Electronics Over Large Flexible Substrates: a Review Saleem Khan, Leandro Lorenzelli, Member, IEEE, and Ravinder S
    3164 IEEE SENSORS JOURNAL, VOL. 15, NO. 6, JUNE 2015 Technologies for Printing Sensors and Electronics Over Large Flexible Substrates: A Review Saleem Khan, Leandro Lorenzelli, Member, IEEE, and Ravinder S. Dahiya, Senior Member, IEEE Abstract— Printing sensors and electronics over flexible substrates are an area of significant interest due to low-cost fab- rication and possibility of obtaining multifunctional electronics over large areas. Over the years, a number of printing technolo- gies have been developed to pattern a wide range of electronic materials on diverse substrates. As further expansion of printed technologies is expected in future for sensors and electronics, it is opportune to review the common features, the complementarities, and the challenges associated with various printing technologies. This paper presents a comprehensive review of various printing technologies, commonly used substrates and electronic materials. Various solution/dry printing and contact/noncontact printing technologies have been assessed on the basis of technological, materials, and process-related developments in the field. Fig. 1. The classification of common printing technologies. Critical challenges in various printing techniques and potential research directions have been highlighted. Possibilities of merging various printing methodologies have been explored to extend are difficult to realize with the conventional wafer-based the lab developed standalone systems to high-speed roll-to-roll fabrication techniques. The printed electronics on flexible production lines for system level integration. substrates will enable conformable sensitive electronic systems Index Terms— Printed sensors, printed electronics, flexible such as electronic skin that can be wrapped around the body electronics, large area electronics, roll-to-roll, dispersion solution. of a robot or prosthetic hands [20]–[25].
    [Show full text]
  • Controlling Nanostructure in Inkjet Printed Organic Transistors for Pressure Sensing Applications
    nanomaterials Article Controlling Nanostructure in Inkjet Printed Organic Transistors for Pressure Sensing Applications Matthew J. Griffith 1,2,* , Nathan A. Cooling 1, Daniel C. Elkington 1, Michael Wasson 1 , Xiaojing Zhou 1, Warwick J. Belcher 1 and Paul C. Dastoor 1 1 Centre for Organic Electronics, University of Newcastle, University Drive, Callaghan, NSW 2308, Australia; [email protected] (N.A.C.); [email protected] (D.C.E.); [email protected] (M.W.); [email protected] (X.Z.); [email protected] (W.J.B.); [email protected] (P.C.D.) 2 School of Aeronautical, Mechanical and Mechatronic Engineering, University of Sydney, Camperdown, NSW 2006, Australia * Correspondence: matthew.griffi[email protected] Abstract: This work reports the development of a highly sensitive pressure detector prepared by inkjet printing of electroactive organic semiconducting materials. The pressure sensing is achieved by incorporating a quantum tunnelling composite material composed of graphite nanoparticles in a rubber matrix into the multilayer nanostructure of a printed organic thin film transistor. This printed device was able to convert shock wave inputs rapidly and reproducibly into an inherently amplified electronic output signal. Variation of the organic ink material, solvents, and printing speeds were shown to modulate the multilayer nanostructure of the organic semiconducting and dielectric layers, enabling tuneable optimisation of the transistor response. The optimised printed device exhibits Citation: Griffith, M.J.; Cooling, rapid switching from a non-conductive to a conductive state upon application of low pressures whilst N.A.; Elkington, D.C.; Wasson, M.; operating at very low source-drain voltages (0–5 V), a feature that is often required in applications Zhou, X.; Belcher, W.J.; Dastoor, P.C.
    [Show full text]
  • Flexible and Printed Electronics February 2021
    1. February 2021 Advanced Technologies – for Industry Product Watch Flexible and printed electronics Product Watch Report - European Commission This report was prepared by Chiel Scholten, Kincsö Izsak and Maialen Perez from Technopolis Group. The authors would like to thank the interviewees for their valuable comments and inputs. EUROPEAN COMMISSION Executive Agency for Small and Medium-sized Enterprises (EASME) Unit A.1.2 — COSME E-mail: [email protected] Directorate General for Internal Market, Industry, Entrepreneurship and SMEs Unit D.2 — Industrial forum, alliances, clusters E-mail: [email protected] European Commission B-1049 Brussels LEGAL NOTICE The information and views set out in this report are those of the author(s) and do not necessarily reflect the official opinion of EASME or of the Commission. Neither EASME, nor the Commission can guarantee the accuracy of the data included in this study. Neither EASME, nor the Commission or any person acting on their behalf may be held responsible for the use, which may be made of the information contained therein. More information on the European Union is available on the Internet (http://www.europa.eu). PDF ISBN 978-92-9460-556-6 doi:10.2826/295137 EA-02-21-327-EN-N © European Union, 2021 February 2021 Product Watch Report - European Commission Table of contents Section 1 ............................................................................................................................... 4 1. Background and objectives of the report ....................................................................
    [Show full text]
  • Development of Flexible and Functional Sequins Using Subtractive Technology and 3D Printing for Embroidered Wearable Textile Applications
    materials Article Development of Flexible and Functional Sequins Using Subtractive Technology and 3D Printing for Embroidered Wearable Textile Applications Ramona Nolden * , Kerstin Zöll and Anne Schwarz-Pfeiffer Research Institute for Textile and Clothing, Hochschule Niederrhein-University of Applied Sciences, Webschulstraße 31, 41065 Mönchengladbach, Germany; [email protected] (K.Z.); [email protected] (A.S.-P.) * Correspondence: [email protected] Abstract: Embroidery is often the preferred technology when rigid circuit boards need to be con- nected to sensors and electrodes by data transmission lines and integrated into textiles. Moreover, conventional circuit boards, like Lilypad Arduino, commonly lack softness and flexibility. One approach to overcome this drawback can be flexible sequins as a substrate carrier for circuit boards. In this paper, such an approach of the development of flexible and functional sequins and circuit boards for wearable textile applications using subtractive and additive technology is demonstrated. Applying these techniques, one-sided sequins and circuit boards are produced using wax printing and etching copper-clad foils, as well as using dual 3D printing of conventional isolating and electri- cally conductive materials. The resulting flexible and functional sequins are equipped with surface mounted devices, applied to textiles by an automated embroidery process and contacted with a Citation: Nolden, R.; Zöll, K.; conductive embroidery thread. Schwarz-Pfeiffer, A. Development of Flexible and Functional Sequins Keywords: 3D printing; additive manufacturing; circuit boards; functional sequins; subtractive Using Subtractive Technology and 3D technology; wearable electronics Printing for Embroidered Wearable Textile Applications. Materials 2021, 14, 2633. https://doi.org/10.3390/ ma14102633 1.
    [Show full text]
  • Towards Printed Chaotic Circuits: a Topology Based on Memristors
    IX Symposium Industrial Electronics INDEL 2012, Banja Luka, November 0103, 2012 Towards printed chaotic circuits: a topology based on memristors A. Buscarino1, S. Dautovic2, L. Fortuna1, M. Frasca1, L. V. Gambuzza1 1DIEEI, University of Catania, Catania, Italy 2DEET FTS, University of Novi Sad, Serbia [email protected] Abstract—In this work a chaotic circuit for printed electronics electrical quantities [5]. The memristor fundamental applications has been designed. The circuit is based on the use of characteristics is described in terms of v=M(q) i, where M(q) is memristors, which provide nonlinear elements with memory and defined as the memristance and is function of the quantity of have been already implemented in flexible electronics. The design charge that has passed through the device. In a memristor, this takes into account a physical model of the memristor suitable for relation is nonlinear and the v–i characteristic is a curve that already fabricated TiO2 devices, in order to reduce the gap takes a form of a hysteresis loop pinched in the origin. The between ideal memristor-based chaotic oscillators and possible memristor is thus a nonlinear element with memory, and, for printed electronics implementations. this reason, its use as fundamental element for the design of chaotic systems is currently intensively explored [6]. The first Keywords-Chaotic circuits; memristor; printed electronics component with a memristor characteristic was fabricated in I. INTRODUCTION the HP laboratory [7], after which different materials and techniques have been used to produce devices with memristive Since its discovery, chaos has fascinated many scientists characteristics. It is worth to note that the memristor is and researchers both in the theoretical fields and in application- implemented in flexible electronics using spin-on sol gel oriented studies.
    [Show full text]
  • An Investigation of Fundamental Competencies for Printed Electronics John Jacobs Clemson University, [email protected]
    Clemson University TigerPrints All Theses Theses 5-2010 An Investigation of Fundamental Competencies for Printed Electronics John Jacobs Clemson University, [email protected] Follow this and additional works at: https://tigerprints.clemson.edu/all_theses Part of the Education Commons Recommended Citation Jacobs, John, "An Investigation of Fundamental Competencies for Printed Electronics" (2010). All Theses. 780. https://tigerprints.clemson.edu/all_theses/780 This Thesis is brought to you for free and open access by the Theses at TigerPrints. It has been accepted for inclusion in All Theses by an authorized administrator of TigerPrints. For more information, please contact [email protected]. AN INVESTIGATION OF FUNDAMENTAL COMPETENCIES FOR PRINTED ELECTRONICS A Thesis Presented to the Graduate School of Clemson University In Partial Fulfillment of the Requirements for the Degree Master of Science Graphic Communications by John Jay Jacobs May 2010 Accepted by: Dr. Samuel T. Ingram, Committee Chair Dr. Liam O’Hara Mr. Chip Tonkin i ABSTRACT A survey was taken of professionals in the printed electronics industry to determine the basic educational requirements the industry had of a student graduating with a degree in graphic communications or printing sciences. A test was conducted of graphic communication seniors graduating in May 2010 to determine their fundamental knowledge of printed electronics. Data obtained from the industry survey was used to determine the relevant components of a basic printed electronics education. The data obtained from the graduating senior examination determined their areas of knowledge of printed electronics. The needs identified from the industry survey were compared to the areas of knowledge of graphic communications graduating seniors.
    [Show full text]
  • Mobility & 3D Structural Electronics
    NO 26, 2019 ORGANIC AND PRINTED ELECTRONICS Mobility & 3D Structural Electronics components “One plus one” equals more than two! KROENERT and Coatema discuss their alliance events All eyes on Munich LOPEC 2019 preview including news | www.ope-journal.com ORGANIC AND PRINTED ELECTRONICS OPE journal is the renowned globally circulated magazine for the organic and printed electronics industry. OPE journal provides its readers with: • analyses of the latest market trends • most recent industry news • independently researched economic and business reports • reports on new technologies, methods and processes In every issue we publish detailed information on selected technical focus areas. In addition current news stories are released on our website www.ope-journal.com on a daily basis. Place your advertisement in OPE journal - get your personal offer! EDITORIAL PREVIEW Nina Pirchmoser • Phone +49 8033 302-1275 • [email protected] OPE journal Issue 26 OPE journal Issue 27 OPE journal Issue 28 OPE journal Issue 29 Mobility & OLEDs & Energy, Packaging & 3D Structural Displays Photovoltaics, Sensors Electronics Smart Cities Editorial deadline: Editorial deadline: Editorial deadline: Editorial deadline: February 12, 2019 May 31, 2019 August 27, 2019 November 7, 2019 LOPEC, Munich Touch Taiwan, Taipei INPRINT, Munich innoLAE 2020 20.-21.03.2019 28.-30.08.2019 12.-14.11.2019 (tbd) IDTechEx Show Europe, Berlin IDTechEx Show USA, 10.-11.04.2019 Santa Clara 20.-21.11.2019 @OPEjournal EDITORIAL 3 ORGANIC AND PRINTED ELECTRONICS OPE journal is the renowned globally circulated magazine for the organic and printed electronics industry. OPE journal provides its readers with: • analyses of the latest market trends • most recent industry news • independently researched economic and business reports • reports on new technologies, methods and processes In every issue we publish detailed information on selected technical focus areas.
    [Show full text]
  • Compact Modeling and Physical Design Automation of Inkjet-Printed Electronics Technology
    Compact Modeling and Physical Design Automation of Inkjet-Printed Electronics Technology Zur Erlangung des akademischen Grades eines Doktors der Ingenieurwissenschaften von der KIT-Fakultät für Informatik des Karlsruher Instituts für Technologie (KIT) genehmigte Dissertation von M.Sc. Farhan Rasheed aus Karachi, Pakistan Tag der mündlichen Prüfung: 01.07.2020 Erster Gutachter: Prof. Dr. Mehdi Baradaran Tahoori, Karlsruhe Institute of Technology, Germany Zweiter Gutachter: Prof. Dr. Jasmin Aghassi-Hagmann, University of Applied Sciences Offenburg, Germany, Karlsruhe Institute of Technology, Germany To my family Work, work and work and we are bound to success Muhammad Ali Jinnah (Founder of Pakistan) ii Farhan Rasheed Tivoliplatz 1 76137 Karlsruhe Hiermit erkläre ich an Eides statt, dass ich die von mir vorgelegte Arbeit selbstständig verfasst habe, dass ich die verwendeten Quellen, Internet-Quellen und Hilfsmittel vollständig angegeben haben und dass ich die Stellen der Arbeit - einschlielich Tabellen, Karten und Abbildungen - die anderen Werken oder dem Internet im Wortlaut oder dem Sinn nach entnommen sind, auf jeden Fall unter Angabe der Quelle als Entlehnung kenntlich gemacht habe. Karlsruhe, Mai 2020 Farhan Rasheed iii iv Acknowledgment I would like to thank my advisers, Prof. Mehdi Baradaran Tahoori and Prof. Jasmin Aghassi- Hagmann for supporting me during these past three and a half years. I am very grateful for your scientific advice and knowledge and many insightful discussions and suggestions. Thank you for believing in me and giving me this opportunity. I would like to thank especially to my family. I am very grateful to my parents for their supports and motivations throughout my life. Special thanks to my wife Nisa for her encour- agement, love, support and sacrifices during my Ph.D.
    [Show full text]