Diode Embedded Algan/Gan Heterojuction Field-Effect Transistor
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Erik Jonsson School of Engineering and Computer Science Diode Embedded AlGaN/GaN Heterojuction Field-Effect Transistor CC BY-NC 4.0 (Attribution-NonCommercial) ©2016 The Authors Citation: Park, S. -H, J. -G Lee, C. -H Cho, Y. -I Choi, et al. 2016. "Diode embedded AlGaN/ GaN heterojuction field-effect transistor." Journal of Semiconductor Technology and Science 16(2), doi:10.5573/JSTS.2016.16.2.215 This document is being made freely available by the Eugene McDermott Library of The University of Texas at Dallas with permission from the copyright owner. All rights are reserved under United States copyright law unless specified otherwise. JOURNAL OF SEMICONDUCTOR TECHNOLOGY AND SCIENCE, VOL.16, NO.2, APRIL, 2016 ISSN(Print) 1598-1657 http://dx.doi.org/10.5573/JSTS.2016.16.2.215 ISSN(Online) 2233-4866 Diode Embedded AlGaN/GaN Heterojuction Field-Effect Transistor Sung-Hoon Park1, Jae-Gil Lee1,2, Chun-Hyung Cho3, Yearn-Ik Choi4, Hyungtak Kim1, and Ho-Young Cha1,* Abstract—Monolithically integrated devices are monolithic integration of different functional devices is strongly desired in next generation power ICs to highly demanded in future power ICs. In this report, we reduce the chip size and improve the efficiency and review three different functional devices developed in our frequency response. Three examples of the group, which were implemented by embedding AlGaN/ embedment of different functional diode(s) into GaN Schottky barrier diodes (SBDs) into HFETs; (i) AlGaN/GaN heterojunction field-effect transistors are HFET with an embedded freewheeling diode, (ii) reverse presented, which can minimize the parasitic effects blocking HFET, and (iii) bi-directional switch with a caused by interconnection between devices. monolithically integrated diode bridge circuit. Index Terms—AlGaN/GaN, embedment, heterojunction II. DIODE EMBEDMENT field-effect transistor, monolithic integration, Schottky barrier diode 1. Embedment of Freewheeling SBD I. INTRODUCTION When AlGaN/GaN HFETs are used as switching devices in converters or inverters, they have AlGaN/GaN heterojunction field-effect transistors freewheeling capability by themselves but the power loss (HFETs) are great candidates for next generation power during the reverse conduction mode is large due to the switching applications in various power electronics due to large reverse turn-on voltage characteristics. Therefore, it superior physical properties such as high mobility, high is common to add a freewheeling diode in parallel with a breakdown field, and high carrier concentration [1-5]. In switching transistor to reduce the loss during the dead order to fulfill the maximum power conversion efficiency time as illustrated in Fig. 1 [7]. However, when a of AlGaN/GaN based power devices, the parasitic effects separate diode is added for the freewheeling function, not such as parasitic inductance caused by interconnection only does the chip size increase but also the parasitic between devices must be minimized [6]. That is, inductance caused by interconnection limits the efficiency at high frequencies. These issues can be Manuscript received Aug. 29, 2015; accepted Nov. 16, 2015 diminished by embedding a freewheeling diode into an 1 School of Electrical and Electronic Engineering, Hongik University, AlGaN/GaN HFET. Mapo-gu, Seoul 121-791, Korea As shown in Fig. 2, a Schottky contact electrode is 2 Department of Materials Science and Engineering, University of Texas at Dallas, 800 W Campbell Rd, Richardson, TX 75080, USA inserted between the source and drain electrodes, being 3 Department of Electronic & Electrical Engineering, College of connected electrically to the source electrode. When a Science and Technology, Hongik University, Jochiwon, Sejong, 339- 701, Korea positive drain voltage is applied, the Schottky anode is 4 Department of Electrical and Computer Engineering, Ajou University, reverse-biased and thus no current flows through the Suwon 443-749, Korea E-mail : [email protected] anode whereas the FET mode is in normal operation [8]. 216 SUNG-HOON PARK et al : DIODE EMBEDDED ALGAN/GAN HETEROJUCTION FIELD-EFFECT TRANSISTOR Table 1. Process flow for AlGaN/GaN-on-Si MOS-HFET with an embedded freewheeling SBD Seq. Step Process 1 Mesa isolation BCl3/Cl2 ICP-RIE 2 Gate recess BCl3/Cl2 ICP-RIE 3 Gate oxide deposition SiO2 deposition 4 Ohmic formation Si/Ti/Al/Mo/Au 5 Gate formation Ni/Au 6 Passivation SiNx deposition 7 Source connected anode formation Ni/Au Fig. 1. (a) Typical DC-DC buck converter, (b) current-voltage characteristics of AlGaN/GaN HFET with and without a freewheeling SBD, (c) effects of the reverse turn-on voltage with and without a freewheeling SBD on dead time loss. Fig. 3. Current-voltage and breakdown characteristics for the fabricated AlGaN/GaN-on-Si MOS-HFET with an embedded freewheeling SBD. is governed by the distance between anode and drain. Fig. 2. Cross-sectional schematic of AlGaN/GaN-on-Si MOS- 2. Embedment of Reverse Blocking SBD HFET with an embedded freewheeling SBD. Despite the need for the freewheeling capability of the On the other hand, when a negative drain voltage is power switching device discussed above, the reverse applied, the Schottky anode is forward-biased allowing conduction is not desired for many other applications. the current flow from the source to the drain. Therefore, Circuits may be destroyed under abnormal situation the reverse conduction mode can be achieved via the when the reverse current flows back to the system [9]. In Schottky anode even when the FET is under the off-state such cases, an extra protection circuit or diode needs to condition. be connected to the FET. A simple approach would be The device fabrication steps are summarized briefly in the addition of a reverse blocking diode to the output Table 1. The gate dielectric film was SiO2 and both gate drain node. Lu et al. reported a Schottky drain electrode metal and Schottky anode contact were formed by Ni/Au. to block the reverse current in AlGaN/GaN HFET [10]. The forward and reverse current-voltage characteristics However, the drawback in this approach is the forward are shown in Fig. 3 along with the forward breakdown on-set characteristics caused by the turn-on voltage of the characteristics. The measured gate threshold voltage for Schottky drain, which increases the on-state loss as the forward FET mode was 2.8 V and the reverse turn-on illustrated in Fig. 4. In order to reduce the on-set voltage, voltage in the freewheeling mode was 1.2 V. The gate a gated-ohmic configuration [11] was employed for the threshold voltage depends on the MOS gate whereas the drain of AlGaN/GaN HFET as illustrated in Fig. 5. reverse turn-on voltage depends on the Schottky barrier The device fabrication steps are summarized briefly in height of the anode contact [8]. The breakdown voltage Table 2. The precise control of the recess depth is the key JOURNAL OF SEMICONDUCTOR TECHNOLOGY AND SCIENCE, VOL.16, NO.2, APRIL, 2016 217 Fig. 4. Forward on-set characteristics caused by adding a Fig. 6. Comparison of the current-voltage characteristics Schottky drain, which increases the on-state loss. between AlGaN/GaN-on-Si HFETs with and without a gated ohmic drain electrode. Fig. 5. Cross-sectional schematics of a reverse blocking AlGaN/GaN-on-Si HFET with a gated-ohmic drain electrode. Fig. 7. Typical bi-directional switches (a) two transistors Table 2. Process flow of AlGaN/GaN HFET with a reverse coupled with two diodes, (b) one transistor connected with a blocking SBD diode bridge. Seq. Step Process conventional HFET fabricated with an ohmic drain 1 Mesa isolation BCl3/Cl2 ICP-RIE 2 Ohmic formation Si/Ti/Al/Mo/Au electrode in the same process lot is plotted together. The 3 Gate oxide deposition SiO2 deposition proposed device exhibited successful reverse blocking 4 Gate opening BOE (7:1) characteristics with a forward on-set voltage of only 5 Gate metal deposition Ni/Au 0.4 V with comparable forward characteristics. 6 Recessed drain region BCl / Cl ICP-RIE 3 2 7 Drain overlay metal deposition Ni/Au 3. Bi-Directional Switch process. The thickness of the remaining AlGaN barrier Matrix converters have received much attention layer underneath the recessed Schottky region was only 3 because of their higher efficiency compared to nm that was thin enough to deplete the 2DEG channel at conventional AC-AC converters [13]. A matrix converter zero bias. The channel under the recessed region can be is composed of multiple bi-directional switches [14]. As opened with a small positive drain voltage, allowing the shown in Fig. 7, typical bi-directional switches can be current path from the ohmic contact region, so-called the implemented by either two transistors coupled with two ‘gated-ohmic’ characteristics [12]. When the drain diodes or one transistor connected with a diode bridge voltage is higher than the turn-on voltage of the recessed composed of four diodes. It should be noted that each SBD, the current can flow from both ohmic drain and transistor requires a gate driver whose chip size is added recessed Schottky regions. to the overall power IC size. The current-voltage characteristics of the fabricated A bi-directional AlGaN/GaN MOS-HFET with a device are shown in Fig. 6. For comparison, those for a monolithically integrated diode bridge is illustrated in 218 SUNG-HOON PARK et al : DIODE EMBEDDED ALGAN/GAN HETEROJUCTION FIELD-EFFECT TRANSISTOR Table 3. Process flow of bi-directional AlGaN/GaN HFET the overall chip area significantly due to the monolithic Seq. Step Process integration technology. In addition, this configuration 1 Mesa isolation BCl3/Cl2 ICP-RIE requires only one gate driver. 2 Ohmic formation Si/Ti/Al/Mo/Au The bi-directional switching characteristics are shown 3 Gate recess BCl /Cl ICP-RIE 3 2 in Fig.