Intel Introduces Core™ I7, Xeon® 3400 and First Core™ I5 Processors
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Intel® Server Board S3420GP
Intel® Server Board S3420GP Technical Product Specification Intel order number E65697-010 Revision 2.4 January, 2011 Enterprise Platforms and Services Division - Marketing Revision History Intel® Server Board S3420GP TPS Revision History Date Revision Modifications Number Feb. 2009 0.3 Initial release. May 2009 0.5 Update block diagram. July. 2009 0.9 Updated POST error code and diagram. Aug. 2009 1.0 Updated MTBF. Nov. 2009 1.1 Additional details for memory configuration. Dec. 2009 1.2 Added Intel® Server Board S3420GPV details. Dec. 2009 2.0 Updated processor name. Jan. 2010 2.1 Corrected the typo. Apr. 2010 2.2 Corrected the typo, updated processor name and remove CCC certification marking information. July. 2010 2.3 Corrected the typo. Jan.2011 2.4 Corrected the typo. Added RDIMM support on S3420GPV. Updated Table 45. Add USB device readiness beep code information. ii Revision 2.4 Intel order number E65697-010 Intel® Server Board S3420GP TPS Disclaimers Disclaimers Information in this document is provided in connection with Intel® products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not intended for use in medical, life saving, or life sustaining applications. -
Desktop 3Rd Generation Intel® Core™ Processor Family, Desktop Intel® Pentium® Processor Family, Desktop Intel® Celeron® Processor Family, and LGA1155 Socket
Desktop 3rd Generation Intel® Core™ Processor Family, Desktop Intel® Pentium® Processor Family, Desktop Intel® Celeron® Processor Family, and LGA1155 Socket Thermal Mechanical Specifications and Design Guidelines (TMSDG) January 2013 Document Number: 326767-005 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. A “Mission Critical Application” is any application in which failure of the Intel Product could result, directly or indirectly, in personal injury or death. SHOULD YOU PURCHASE OR USE INTEL'S PRODUCTS FOR ANY SUCH MISSION CRITICAL APPLICATION, YOU SHALL INDEMNIFY AND HOLD INTEL AND ITS SUBSIDIARIES, SUBCONTRACTORS AND AFFILIATES, AND THE DIRECTORS, OFFICERS, AND EMPLOYEES OF EACH, HARMLESS AGAINST ALL CLAIMS COSTS, DAMAGES, AND EXPENSES AND REASONABLE ATTORNEYS' FEES ARISING OUT OF, DIRECTLY OR INDIRECTLY, ANY CLAIM OF PRODUCT LIABILITY, PERSONAL INJURY, OR DEATH ARISING IN ANY WAY OUT OF SUCH MISSION CRITICAL APPLICATION, WHETHER OR NOT INTEL OR ITS SUBCONTRACTOR WAS NEGLIGENT IN THE DESIGN, MANUFACTURE, OR WARNING OF THE INTEL PRODUCT OR ANY OF ITS PARTS. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined”. -
CPU) MCU / MPU / DSP This Page of Product Is Rohs Compliant
INTEL Central Processing Units (CPU) MPU /DSP MCU / This page of product is RoHS compliant. CENTRAL PROCESSING UNITS (CPU) Intel Processor families include the most powerful and flexible Central Processing Units (CPUs) available today. Utilizing industry leading 22nm device fabrication techniques, Intel continues to pack greater processing power into smaller spaces than ever before, providing desktop, mobile, and embedded products with maximum performance per watt across a wide range of applications. Atom Celeron Core Pentium Xeon For quantities greater than listed, call for quote. MOUSER Intel Core Cache Data Price Each Package Processor Family Code Freq. Size No. of Bus Width TDP STOCK NO. Part No. Series Name (GHz) (MB) Cores (bit) (Max) (W) 1 10 Desktop Intel 607-DF8064101211300Y DF8064101211300S R0VY FCBGA-559 D2550 Atom™ Cedarview 1.86 1 2 64 10 61.60 59.40 607-CM8063701444901S CM8063701444901S R10K FCLGA-1155 G1610 Celeron® Ivy Bridge 2.6 2 2 64 55 54.93 52.70 607-RK80532RC041128S RK80532RC041128S L6VR PPGA-478 - Celeron® Northwood 2.0 0.0156 1 32 52.8 42.00 40.50 607-CM8062301046804S CM8062301046804S R05J FCLGA-1155 G540 Celeron® Sandy Bridge 2.5 2 2 64 65 54.60 52.65 607-AT80571RG0641MLS AT80571RG0641MLS LGTZ LGA-775 E3400 Celeron® Wolfdale 2.6 1 2 64 65 54.93 52.70 607-HH80557PG0332MS HH80557PG0332MS LA99 LGA-775 E4300 Core™ 2 Conroe 1.8 2 2 64 65 139.44 133.78 607-AT80570PJ0806MS AT80570PJ0806MS LB9J LGA-775 E8400 Core™ 2 Wolfdale 3.0 6 2 64 65 207.04 196.00 607-AT80571PH0723MLS AT80571PH0723MLS LGW3 LGA-775 E7400 Core™ 2 Wolfdale -
Five9ns T3110 Tower Server
FIVE9NS DATA SHEET Note: This data sheet is for informational purposes. It is not a commitment to deliver hardware features or functionality. The development, release and timing of features and functionality described in this document are at the sole discretion of Five9 Network Systems. FIVE9NS T3110 TOWER SERVER The Five9NS T3110 is an entry-level, single socket, tower server. Powered by an Intel processor, this high-performance system provides I/O slot flexibility that enables seamless integration into a variety of OEM applications. HIGHLIGHTS: Flexible Tower Server Variety of expansion slots The Five9NS T3110 was designed with OEM needs in mind. With its Tower form factor rich feature set – including 7 expansion slots, remote management Supports Windows, Linux and capabilities, and high performance Intel 3400 series processor it’s an Solaris Operating Systems ideal fit for commercial printing and healthcare environments. The Remote system management Five9NS T3110 tower server is on the Oracle Solaris Hardware capabilities ideal for central Compatibility List (HCL). office and other demanding environments Easy to customize and integrate Specialty Services into existing infrastructure Easy to scale out as business OEM customers can choose from a host of services that will accelerate needs grow the integration process and reduce time to market. With our in-house Product Lifecycle Management service, Five9NS is uniquely positioned to architect systems for OEM customers. The Five9NS T3110 tower server is customizable and you can brand it as your own. We also provide free engineering support via experts who understand the unique requirements of OEM customers. The Five9NS Product Lifecycle Management service aims to help you proactively manage your product lifecycle. -
Mainboard Diagram HI05
Mainboard Diagram HI05 1. INTEL® P55 Express Chipset 2. Support INTEL® LGA1156 Processors 3. Supports PCI-Express 2.0 4. Supports Dual Channel DDR3 1333/1066 5. Onboard 2 x Gigabit LAN 6. Onboard 1 * e-SATA port 7. Integrated ALC888 HD Audio CODEC with 8.0 CH 8. Integrated 6 * SATA2 3Gb/s with RAID function 9. Support G.P.I Technology 10. CPU Vcore x-Shift 11. Ready for Windows® Vista™ 12. ATX Form Factor(305mm X 245mm) Features and Benefits PCI Express 2.0 Buses The PCI Express 2.0 x16 graphics delivers up to 8 GB/s per direction, 2 times more bandwidth than PCI Express x16 and up to 16 GB/s concurrent bandwidth. PCI Express x1 I/O offers 1GB/s concurrently, over 7 times more bandwidth than AGP8X, tackling the most demanding multimedia tasks nowadays Serial ATA2 3Gb/s&RAID ,e-SATA This platform supports reliable storage solution for enhanced data protection and data accessing performance. Serial ATA 3Gb/s is firstly introduced in this platform to provide blazingly 3Gb/s bus bandwidth thus higher disk performance. The SATA RAID allows multi-disk designs to be set up as RAID 0, 1,10 based on users’ priority of protection/performance, and which even makes more accessible by introducing the innovative windows-based facility E-SATA is a new standard for external storage devices. With an external data transfer rate of up to 3 Gb/s no other external data transfer solution can compete with speed and ease of use OC-CON high-polymer solid electrolysis aluminum capacitors embedded The working temperature is from 55 degrees Centigrade below zero to 125 degrees Centigrade, OC_CON capacitors possess superior physical characteristics that can be while reducing the working temperature between 20 degrees Centigrade each time, intact extension 10 times of effective product operation lives, at not rising degrees Centigrade of working temperatures each time a relative one, life of product decline 10% only too. -
TH55 HD Motherboard TH55 HD Specifcation
TH55 HD Motherboard • Supports the Intel Core i7 / i5 / i3 / Pentium Processors in the LGA1156 Package • Intel H55 single chip architecture • 7 Phases Power Design • Support 4-DIMM DDR3- 2000+(OC)/1800(OC)/1600/1333 up to 16G maximum capacity • 100% X.D.C Japanese solid capacitor • Integrated HDMI/DVI interface with HDCP Supporting all HD formats including 720P, 1080i, 1080P. ( Required processors with Intel HD Graphics ) • CPU integrated Graphics performance tunable via BIOS • BIOSTAR G.P.U (Green Power Utility) Technology for Energy Saving • BIOSTAR Toverclocker utility • Optimized to deliver full windows 7 Experience TH55 HD Specifcation CPU SUPPORT Intel® Core™ i7 LGA 1156 Processor Intel® Core™ i5 LGA 1156 Processor Intel® Core™ i3 LGA 1156 Processor BIOSTARIntel® Pentium® LGA 1156 Processor MEMORY Support Dual Channel DDR3 800/1066/1333/1600(OC)/1800(OC)/2000(OC) MHz 4 x DDR3 DIMM Memory Slot Max. Supports up to 16GB Memory INTEGRATED VIDEO By CPU model STORAGE 6 x SATA II Connector 1 x IDE Connector LAN Realtek RTL8111DL - 10/100/1000 Controller AUDIO CODEC Realtek ALC888 8+2 Channel HD Audio USB 4 x USB 2.0 Port 3 x USB 2.0 Header EXPANSION SLOT 1 x PCI-E 2.0 x16 Slot 1 x PCI-E 2.0 x4 Slot 2 x PCI Slot REAR I/O 1 x PS/2 Mouse 1 x PS/2 Keyboard 4 x USB 2.0 Port 1 x HDMI Connector 1 x DVI Connector 1 x VGA Port 1 x LAN Port 6 x Audio Jacks INTERNAL I/O 3 x USB 2.0 Header 6 x SATA II Connector (3Gb/s ) 1 x IDE Connector 1 x Front Audio Header 1 x Front Panel Header 1 x CD-IN Header 1 x S/PDIF-Out Header 1 x CPU Fan Connector 2 x -
Acer Aspire M5811 Service Guide
Acer Aspire M5811 Service Guide Service guide files and updates are available on the ACER/CSD web; for more information, please refer to http://csd.acer.com.tw PRINTED IN TAIWAN Revision History Please refer to the table below for the updates made on this service guide. Date Chapter Updates ii Copyright Copyright © 2009 by Acer Incorporated. All rights reserved. No part of this publication may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language or computer language, in any form or by any means, electronic, mechanical, magnetic, optical, chemical, manual or otherwise, without the prior written permission of Acer Incorporated. iii Disclaimer The information in this guide is subject to change without notice. Acer Incorporated makes no representations or warranties, either expressed or implied, with respect to the contents hereof and specifically disclaims any warranties of merchantability or fitness for any particular purpose. Any Acer Incorporated software described in this manual is sold or licensed "as is". Should the programs prove defective following their purchase, the buyer (and not Acer Incorporated, its distributor, or its dealer) assumes the entire cost of all necessary servicing, repair, and any incidental or consequential damages resulting from any defect in the software. Acer is a registered trademark of Acer Corporation. Intel is a registered trademark of Intel Corporation. Pentium Dual-Core, Celeron Dual-Core, Core 2 Duo, Core 2 Quad, Celeron, and combinations thereof, are trademarks of Intel Corporation. Other brand and product names are trademarks and/or registered trademarks of their respective holders. iv Conventions The following conventions are used in this manual: SCREEN Denotes actual messages that appear on screen. -
Intel's Core 2 Family
Intel’s Core 2 family - TOCK lines II Nehalem to Haswell Dezső Sima Vers. 3.11 August 2018 Contents • 1. Introduction • 2. The Core 2 line • 3. The Nehalem line • 4. The Sandy Bridge line • 5. The Haswell line • 6. The Skylake line • 7. The Kaby Lake line • 8. The Kaby Lake Refresh line • 9. The Coffee Lake line • 10. The Cannon Lake line 3. The Nehalem line 3.1 Introduction to the 1. generation Nehalem line • (Bloomfield) • 3.2 Major innovations of the 1. gen. Nehalem line 3.3 Major innovations of the 2. gen. Nehalem line • (Lynnfield) 3.1 Introduction to the 1. generation Nehalem line (Bloomfield) 3.1 Introduction to the 1. generation Nehalem line (Bloomfield) (1) 3.1 Introduction to the 1. generation Nehalem line (Bloomfield) Developed at Hillsboro, Oregon, at the site where the Pentium 4 was designed. Experiences with HT Nehalem became a multithreaded design. The design effort took about five years and required thousands of engineers (Ronak Singhal, lead architect of Nehalem) [37]. The 1. gen. Nehalem line targets DP servers, yet its first implementation appeared in the desktop segment (Core i7-9xx (Bloomfield)) 4C in 11/2008 1. gen. 2. gen. 3. gen. 4. gen. 5. gen. West- Core 2 Penryn Nehalem Sandy Ivy Haswell Broad- mere Bridge Bridge well New New New New New New New New Microarch. Process Microarchi. Microarch. Process Microarch. Process Process 45 nm 65 nm 45 nm 32 nm 32 nm 22 nm 22 nm 14 nm TOCK TICK TOCK TICK TOCK TICK TOCK TICK (2006) (2007) (2008) (2010) (2011) (2012) (2013) (2014) Figure : Intel’s Tick-Tock development model (Based on [1]) * 3.1 Introduction to the 1. -
Intel® 5 Series Chipset and Intel® 3400 Series Chipset Specification
Intel® 5 Series Chipset and Intel® 3400 Series Chipset Specification Update May 2013 Notice: Intel® 5 Series Chipset and Intel® 3400 Series Chipset may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are documented in this specification update. Document Number: 322170-028 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. A "Mission Critical Application" is any application in which failure of the Intel Product could result, directly or indirectly, in personal injury or death. SHOULD YOU PURCHASE OR USE INTEL'S PRODUCTS FOR ANY SUCH MISSION CRITICAL APPLICATION, YOU SHALL INDEMNIFY AND HOLD INTEL AND ITS SUBSIDIARIES, SUBCONTRACTORS AND AFFILIATES, AND THE DIRECTORS, OFFICERS, AND EMPLOYEES OF EACH, HARMLESS AGAINST ALL CLAIMS COSTS, DAMAGES, AND EXPENSES AND REASONABLE ATTORNEYS' FEES ARISING OUT OF, DIRECTLY OR INDIRECTLY, ANY CLAIM OF PRODUCT LIABILITY, PERSONAL INJURY, OR DEATH ARISING IN ANY WAY OUT OF SUCH MISSION CRITICAL APPLICATION, WHETHER OR NOT INTEL OR ITS SUBCONTRACTOR WAS NEGLIGENT IN THE DESIGN, MANUFACTURE, OR WARNING OF THE INTEL PRODUCT OR ANY OF ITS PARTS. -
System Tour Features
Chapter 1 System Tour Features Below is a brief summary of the computer’s many feature: NOTE: The features listed in this section is for your reference only. The exact configuration of the system depends on the model purchased. Operating System • Microsoft Windows 7 Home Basic (X64/X86) • Microsoft Windows 7 Home Premium (X64/X86) • Microsoft Windows Starter X86 • LinuxXW • LinuxCM • FreeDOS Processor • Socket Type:Intel Socket ,LGA 1156 pins • Socket Quantity: 1 • Processor Type: • Lynnfield Quad Core(95W) family mainstream processors • Clarkdale Dual Core(79W) with on boards Graphics 32nm Chipset • PCH:H57 PCB • DTX, 4 Layers • Size:9.6inchX8.0inch Memory subsystem • Socket Type: DDR III DIMM Slots • Socket Quantity: 4 • Memory Type:DDR III • Capacity support: • 1GB/2GB/4GB DDR3 1.5v 1066/1333 Un-buffered Non-ECC/ DIMM support. • 1 GB to 16GB Max memory support. • Speed 1333 MHZ • Design Criteria: • Must meet Intel Lynnfield and Clarkdale Chipset platform design guide. • Dual channel should be enabled always when plug-in 2 same memory size DDRIII memory module. Chapter 1 1 Hard disk drive • Support SATA interface • 3.5", 25.4mm, 160/320 or higher capacity • Capacity and models are listed on FRU list • The HDD out of AVLC asked by regional office is a special case and OMD is required to propose the test schedule Optical disk drive. • Support one SATA 5.25" standard ODD • Support DVD-ROM, DVD-SuperMulti, BD ROM, BD Combo • Models are listed on FRU list Graphics card • Intel H57 on die graphic solution • Meet Microsoft Windows7 graphic -
PCIE-Q670-R20 Intel® Pcie Gbe, SATA 6Gb/S, Pcie Mini, HD Audio and Rohs
Single Board Computer Full-size www.ieiworld.com Full-size PICMG 1.3 CPU Card supports LGA 1155 Intel® Core™ i7/i5/i3, Pentium® or Celeron® CPU with Intel® Q67, DDR3, VGA, DVI-D, Dual PCIE-Q670-R20 Intel® PCIe GbE, SATA 6Gb/s, PCIe Mini, HD Audio and RoHS Front panel KB/MS I²C Dual-channel DDR3 TPM 1333/1066 MHz 2 x SATA 6Gb/s SMBus 2 x RS-232 RS-422/485 2 x RS-232 LPT DIO IR USB 2.0 Intel ® LAN1 Q67 LAN2 VGA PCIe Mini MPCIE-USB3 PCIe Mini USB 3.0 adapter card 4 x SATA 3Gb/s Audio DVI-D PCIe Mini (optional) The PCIe Mini interface provides PCIe x1 and USB 1.1/2.0 signal for full-size 6 x USB 2.0 or half-size devices such as PCIe Mini USB 3.0 adapter card (MPCIE-USB3) or wireless LAN cards. DDR3 RAID 1333 SATA 6Gb/s PCIe GbE IO-KIT-001-R20 TPM 1.2 Support DVI cable included in DVI model Specifications Features CPU ● PICMG 1.3 full-size graphics grade solution LGA 1155 socket supports Intel® Core™ i7/i5/i3, Pentium® or Celeron® processor ● LGA 1155 Intel® Core™ i7/i5/i3, Pentium® or Celeron® processors supported Chipset ● Up to 16 GB 1333 MHz dual-channel DDR3 SDRAM Intel® Q67 ● Supports dual independent display by VGA and DVI-D (DVI model) Memory ● Supports PCIe Mini expansion Two 240-pin 1333/1066 MHz dual-channel unbuffered DDR3 & DDR3L SDRAM DIMMs ● Intel® PCIe GbE with Intel® AMT 7.0 support support up to 16 GB ● Supports SATA 6Gb/s BIOS ● Supports RAID function via SATA 6Gb/s and SATA 3Gb/s UEFI BIOS ● TPM v1.2 hardware security provided by the TPM module Graphics Engine ● IEI One Key Recovery solution allows you to create rapid OS -
Intel® Desktop Board DP55WG Product Guide
Intel® Desktop Board DP55WG Product Guide Order Number: E62931-003 Revision History Revision Revision History Date -001 First release of the Intel® Desktop Board DP55WG Product Guide July 2009 -002 Second release of the Intel® Desktop Board DP55WG Product Guide December 2009 -003 Third release of the Intel® Desktop Board DP55WG Product Guide April 2010 If an FCC declaration of conformity marking is present on the board, the following statement applies: FCC Declaration of Conformity This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. For questions related to the EMC performance of this product, contact: Intel Corporation, 5200 N.E. Elam Young Parkway, Hillsboro, OR 97124 1-800-628-8686 This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: • Reorient or relocate the receiving antenna.