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GEL DISPENSE for ENCAPSULATION of MEMS PRESSURE SENSORS Gel Encapsulation Poses Unique Challenges in Packaging Page 24

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GEL DISPENSE for ENCAPSULATION of MEMS PRESSURE SENSORS Gel Encapsulation Poses Unique Challenges in Packaging Page 24 2016 A Quarterly Publication of The Microelectronics Packaging & Test Engineering Council Volume 20, Number 4 WINTER GEL DISPENSE FOR ENCAPSULATION OF MEMS PRESSURE SENSORS Gel Encapsulation Poses Unique Challenges in Packaging page 24 Everything-Proof: The Future+ of Mobile and Wearable Devices page 28 MEPTEC MEMBER COMPANY PROFILE Established in 1997, UTAC’s customers span across all vertical markets including: mobile phone and communication, consumer, computing, automotive, security banking, and security identity, industrial and medical applications. page 12 -Corp. INSIDE THIS ISSUE The success of Epoxy paste adhe- In an industry that is accus- IC Designers, EDA Fan-Out packaging sives have histori- tomed to many package and IP Vendors, platforms is so cally been the sole options, consolidation could Foundries and undeniable today. epoxy material avail- produce “The Big Five” ad- Assembly Houses able for die attach. vanced packaging platforms. Can Work Together. 11 16 20 SPRING30 2011 MEPTEC Report 3 Wear Sense Move it. it. it. Innovative IC, System-in-Package, and MEMS packaging portfolio for today’s miniaturization, mobility, and IoT needs. Wire Flip 2.5D WLP Fanout SiP Bond Chip & 3D Package it. Visit: aseglobal.com 2016 The MEPTEC Report is a Publication of the Microelectronics Packaging & Test Engineering Council 315 Savannah River Dr., Summerville, SC 29485 Tel: (650) 714-1570 Email: [email protected] A Quarterly Publication of The Microelectronics Packaging & Test Engineering Council Volume 20, Number 4 WINTER Publisher MEPCOM LLC Editor Bette Cooper Art Director/Designer Gary Brown Sales Manager Gina Edwards 2016 ON THE COVER A Quarterly Publication of The Microelectronics Packaging & Test Engineering Council Volume 20, Number 4 WINTER GEL DISPENSE FOR ENCAPSULATION As the MEMS-based sensing industry grows, the environmental conditions OF MEMS PRESSURE SENSORS MEPTEC Advisory Board Gel Encapsulation Poses Unique Challenges in Packaging in which these sensors must perform grow with it. Pressure sensing is one page 24 application where particularly harsh environments can be present. Unlike Board Members Everything-Proof: The Future+ of Mobile and Wearable Devices previous technology, the MEMS-based technology offers the ability to place page 28 Ivor Barber AMD MEPTEC MEMBER COMPANY PROFILE Established in 1997, UTAC’s customers span across the microscopic sense element and wire bond interconnects directly in the all vertical markets including: mobile phone and communication, consumer, computing, automotive, security banking, and security identity, industrial and medical applications. fluid path. It is often necessary to protect the sense element and intercon- Joel Camarda SemiOps page 12 -Corp. INSIDE THIS ISSUE The success of Epoxy paste adhe- In an industry that is accus- IC Designers, EDA nects with products such as encapsulation gels. Fan-Out packaging sives have histori- tomed to many package and IP Vendors, platforms is so cally been the sole options, consolidation could Foundries and undeniable today. epoxy material avail- produce “The Big Five” ad- Assembly Houses Booz Allen Hamilton able for die attach. vanced packaging platforms. Can Work Together. Jeff Demmin 11 16 20 SPRING30 2011 MEPTEC Report 3 Cover Photo Courtesy of SMART Microsystems Ltd. Douglass Dixon Henkel Corporation Nikhil Kelkar Exar Corporation COLUMN ANALYSIS INDUSTRY Acquirer Acquiree Amount ANALYSIS – 2016 was a turning point for the Fan-Out ON Anadigics $32 M INSIGHTS By Ron Jones Microsemi PMC-Sierra $2,500 M Will Fan-Out Packaging be Sustainable Micron Tech Inotera Memories $3,200 M They’re Still Microchip Tech Atmel $3,600 M Long-Term? Dancing Sony Altair Semiconductor $220 M Jean-Christophe Eloy Cisco Systems Leaba Semiconductor $320 M Yole Développement SMART Microsystems packaging market since both leaders, Apple and TSMC A YEAR AGO, I WROTE AN ARTICLE Nick Leonardi GigOptics Magnum $54 M titled “Who’s Next on the Dance Floor.” It’s focus was on the rapid rise in the Cypress Broadcom wireless IoT $550 M Fan-Out History: 11 level of M&A activity in the semicon- ductor industry. Cavium QLogic $1,360 M 2016 IS A TURNING POINT FOR THE A Long Development and a Recent Hype For several years, semiconductor Softbank ARM, Inc. $32,000 M Fan-Out packaging market since both M&A had been averaging about $12 bil- leaders, Apple and TSMC changed lion per year. (See Table 1.) Analog Devices Linear Tech Corp (LTC) $14,800 M the game and may create a trend of acceptance of Fan-Out packages. Yole changed the game and may create a trend of acceptance of Renesas Intersil $3,200 M Développement (Yole) is analyzing the Year Semi M&A Beijing Mgmt Analolgix $500 M current market and technologies trends 2010 $ 7.7 B and offers you to discover these results PPM Associates Inphi Clarify $275 M within a new report entitled Fan-Out: Phil Marcoux 2011 $ 17.0 B Technologies & Market Trends 2016. Qualcomm NXP $38,500 M 2012 $ 8.5 B TSMC investment in Fan-Out TOTAL $101,111 M Wafer Level Packaging (FOWLP) and 2013 $ 11.5 B development of its Integrated Fan-Out Table 2. Source: GSA Market Watch and Press Releases (InFO) changed the wafer level packag- Fan-Out packages. Yole is analyzing the current market and 2014 $ 16.9 B ing (WLP) landscape. Following high 2015 (approx.) $120.0 B masks. Many designs continue to go up want to get a piece of the pie. I believe volume adoption of InFO and further in complexity, taking them beyond the the major factor in Qualcomm’s deci- development of embedded Wafer Level Table 1. Source: IC Insights technical reach of smaller fabless compa- sion to acquire NXP is its penetration in Ball grid array (eWLB) technology, a Source: Fan-Out Technologies & Market Trends 2016 report, Yole Développement. nies. the automotive market to bolster Qual- wave of new players and FO WLP tech- I added up the deals in November, The Internet of Things (IoT) and comm’s small presence. nologies may enter the market. TSMC’s Xilinx 2015 and the total was just north of $100 other smart technologies are continuing Having been in the industry for sev- FO WLP solution called InFO will be it is also a major turn: processors sors, memories, etc. This market is Gamal Refai-Ahmed billion. You can’t get an exact count to grow and are becoming a focus for a eral decades and watching the fabless used to package the Apple A10 applica- require thousands of connections more uncertain and will require new technologies trends and offers you to discover these results because not all deal sizes are disclosed lot of companies. To that end, companies model create hundreds and hundreds of tion processor, implemented in the new while the FO market was essentially integration solutions and high perform- and there is a time lapse between when are acquiring other companies that have new companies over the past 25 years, it iPhone 7 series… The success of FO focused on limited IO count applica- ing FO packages but has a very high deals are announced and when they close enabling products, technology or IP to is interesting to watch as consolidation packaging platforms is so undeniable tions so far. potential. or don’t close. It’s a bit like counting position them for a market that is expect- reverses the trend to some degree with today. What will be the status of the a room full of white cats. The general ed to experience rapid growth. It is not a growing number of mega fabless/IDM market tomorrow? What are the next • Eventually, the potential for market Apart from TSMC, STATS ChipPAC consensus is 2015 came in around $120 a matter of whether IoT will happen, but companies. Nothing is forever . except steps of the leading FO players? Which spread is very high: the Apple brand is willing to make further investments billion. rather in what myriad configurations it change. ◆ technology will be the winning solu- brings more interest to the FO platform. powered by JCET, ASE extends its I don’t think there was any expecta- will reveal itself and how quickly it will tions? partnership with Deca Technologies tion that deals would stop just because grow over the next several years. According to Yole’s advanced pack- while Amkor, SPIL, and Powertech are RON JONES is CEO of N-Able within a new report. we rolled from 2015 to 2016 . and that A new driver this year is the rapid “Production starts in 2016 and rep- aging & semiconductor manufacturing in development phase eyeing future pro- Group International; a semiconduc- was indeed the case. rise in smart, autonomous vehicles of resents a big change in the Fan-Out team, the market will actually be split duction. Samsung is seemingly lagging ASE (US) Inc. tor focused consulting and recruiting Rich Rice It is the end of the year again and the all sizes. Great strides have been made industry for several reasons”, confirms into two types: behind and is considering its options to company. N-Able Group utilizes deep M&A tally is shown in the Table 2. in the last year and lots of companies Jérôme Azémar, Market & Technol- raise competitiveness. At this point in time, it looks like semi supply chain knowledge and a ogy Analyst, Advanced Packaging • The “core” market of FO, including “With such a high potential for the 2016 will be similar to 2015 in number powerful cloud based software appli- & Manufacturing at Yole. And he single die applications such as Base- high-density FO and solid growth of the cation to provide Conflict Mineral of deals in each size category and in total Deal Size 2015 2016 explains: band, Power management, RF trans- core FO, the supply chain is also expect- dollars.
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