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3D-MID Technology for Surface Modification of Polymer

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3D-MID Technology for Surface Modification of Polymer polymers Review 3D-MID Technology for Surface Modification of Polymer-Based Composites: A Comprehensive Review Jiratti Tengsuthiwat 1, Mavinkere Rangappa Sanjay 2 , Suchart Siengchin 3 and Catalin I. Pruncu 4,5,* 1 Department of Mechanical Engineering Technology, College of Industrial Technology, King Mongkut’s of University Technology North Bangkok, Bangsue, Bangkok 10800, Thailand; [email protected] 2 Natural Composites Research Group Lab, King Mongkut’s of University Technology North Bangkok, Bangsue, Bangkok 10800, Thailand; [email protected] 3 Department of Mechanical and Process Engineering, The Sirindhorn International Thai German Graduate School of Engineering (TGGS), King Mongkut’s University of Technology North Bangkok, Bangsue, Bangkok 10800, Thailand; [email protected] 4 Mechanical Engineering Department, University of Birmingham, Birmingham B15 2TT, UK 5 Mechanical Engineering, Imperial College London, Exhibition Rd., London SW7 2AZ, UK * Correspondence: [email protected] Received: 27 May 2020; Accepted: 18 June 2020; Published: 23 June 2020 Abstract: The three-dimensional molded interconnected device (3D-MID) has received considerable attention because of the growing demand for greater functionality and miniaturization of electronic parts. Polymer based composite are the primary choice to be used as substrate. These materials enable flexibility in production from macro to micro-MID products, high fracture toughness when subjected to mechanical loading, and they are lightweight. This survey proposes a detailed review of different types of 3D-MID modules, also presents the requirement criteria for manufacture a polymer substrate and the main surface modification techniques used to enhance the polymer substrate. The findings presented here allow to fundamentally understand the concept of 3D-MID, which can be used to manufacture a novel polymer composite substrate. Keywords: 3D-MID technology; surface modification; polymer; composites 1. Introduction Molded interconnected device (MID) represents the versatility of injection molding process that incorporates a conductive circuit pattern with structured metallization. It has ideal mechanical and electrical functions. This is commonly referred to as “3D-MID” and can be integrated directly into plastics structures which include the three-dimensional circuits [1–5]. MID technology has become well-known because of its freedom of geometric design in combination with selective structuring and metallization of 3D layout. It is able to define the angle between components, stacking of chips and foaming of cavities in contrast to the traditional printed circuit boards (PCBs) that are two-dimensional one [6–11]. Moreover, MIDs not only reduce the number of components and the cost by the embedding parts such as connector within a single device but also may save space and shorten assembly time. Therefore, MIDs are employed in numerous applications (i.e., sensor technology, medical technology, automotive, telecommunications, and antennas) [12–15]. 1 The MID modules can be classified into class 2 2 D, n 2D and 3D categories as shown in Table1. × 1 The conventional circuit board is a flat module with 2D planar process surface. Class 2 2 D permits to produce sample that have flat or plane-parallel process surfaces in Z direction and on the reverse Polymers 2020, 12, 1408; doi:10.3390/polym12061408 www.mdpi.com/journal/polymers Polymers 2020, 12, x FOR PEER REVIEW 2 of 36 Polymersto produce 2020, 12 sample, x FOR PEER that REVIEWhave flat or plane-parallel process surfaces in Z direction and on the reverse2 of 36 Polymersside of 2020processed, 12, x FOR surfaces PEER REVIEW two or more plane-parallel. On the other hand, the class n × 2D and 23D of 36is toPolymersan produce interconnected 2020 sample, 12, x FOR that device PEER have REVIEW that flat consist or plane of- parallelmultiple process process surfaces surfaces in intersected Z direction at and the on angles the reverse or2 haveof 36 - sidetofreeformPolymers produce of processed 2020 surfaces sample, 12, x FORsurfaces [16–20] that PEER have .twoREVIEW flat or more or plane plane-parallel-parallel process. On the surfaces other hand,in Z direction the class and n × on2D theand reverse 3D2 ofis 36 to produce sample that have flat or plane-parallel process surfaces in Z direction and on the reverse anside interconnected of processed devicesurfaces that two consist or more of planemultiple-parallel process. On surfaces the other intersected hand, the atclass the n angles × 2D and or have 3D is side of processed surfaces two or more plane- -parallel. On the other hand, the class n × 2D and 3D is freeformanto interconnectedproduceTable surfaces 1. sample The classification[16–20] device that . have that of flatconsist MID or modules. plane of multipleparallel pr processocess surfaces surfaces intersected in Z direction at the and angles on the or reverse have anfreeformside interconnected of processed surfaces [16–20] devicesurfaces . that two consist or more of planemultiple-parallel process. On surfaces the other intersected hand, the atclass the n angles × 2D and or have 3D is Polymersfreeform 2020, 12 surfaces, x FOR PEER [16–20] REVIEW. 2 of 36 freeformanPolymers Tableinterconnected surfaces20201. The, 12 classification, 1408 [16–20] device. that of MID consist modules. of multiple process surfaces intersected at the angles or have2 of 33 to producefreeformTable sample surfaces1. The that classification [16–20] have flat. of or MID plane modules.-parallel process surfaces in Z direction and on the reverse Table 1. The classification of MID modules. side of processed surfaces two or more plane-parallel. On the other hand,The conventional the class n ×planar 2D and process 3D is sideTable of processed 1. The classification surfaces two of MID or moremodules. plane-parallel. On the other hand, the class( n) 2D and 3D is an interconnected device that consist of multiple process surfaces intersected surfaceat the angles 2D × or have an interconnected device that consist of multiple process surfacesThe conventional intersected planar at the anglesprocess or have freeformfreeform surfaces surfaces[16–20] [16. –20]. The conventionalsurface ( 2Dplanar) process The conventionalsurface planar(2D) process Table 1. The classification of MID modules.Table 1. The classification of MID modules. surface (2D) The conventionalsurface ( 2Dplanar) process The planar processsurface surface (2D) with 3D The conventionalelement planar on the process process surface side (2D)(2½D) The planar process surface with 3D The conventional planar process elementThe planar surfaceon theprocess process (2D )surface side with(2½D 3D) Theelement planar on process the process surface side with (2½D 3D) Theelement planar on processthe process surface side with (2½D 3D) The planarThe process planar surface process with 3Dsurface element with on 3D element on the opposite1 process side elementthe process on sidethe process (2 2 D) side (2½D) The planar process(2½D surface) with 3D elementThe planar on the process opposite surface process with side 3D TheelementThe planar planar processon theprocess( 2½Dopposite surface )surface withprocess with 3D side3D The planar process surface with 3D element on elementelementThe planaron on the the process opposite(2½D )surface side process (2½D with) side 3D the oppositeThe multi process parallel side plane (2 1 D) process element on the( 2½Dopposite) 2 process side surfaces (2½D) ( ) The multi parallel2½D plane process The planarThe multi processsurfaces parallel surface (2½D plane )with process 3D 1 The multielement parallelThe on multi the plane surfacesopposite parallel process ( 2½D planeprocess surfaces) process (2side2 D) The multisurfaces(2½D parallel) (2½D plane) process The multi process surfaces with differentsurfaces angles (2½D (2D) x n) The multi process surfaces with TheThe multi Themulti processdifferent multi parallel surfaces process angles plane with surfaces (2D process di ffx erentn) with angles (2D x n) The differentmultisurfaces process angles (2½D surfaces) (2D x n with) Thedifferent multi process angles surfaces (2D x n) with The differentregular cylindrical angles (2D process x n) surfaces (3D) The regular cylindrical process The regular cylindrical process surfaces (3D) The multi process surfaces with The regularsurfaces cylindrical (3D) process different angles (2D x n) The regularsurfaces cylindrical (3D) process The regularsurfaces cylindrical (3D) process The freeformThe freeform processsurfaces process surfaces (3D surfaces (3D)) (3D) The freeform process surfaces (3D) The regular cylindrical process So far, there are reported several methods for manufacturingThe freeform the MIDprocess substrate. surfaces ( Some3D) of So far, there are reported several methods for manufacturingThe thefreeformsurfaces MID substrate.process (3D) surfaces Some of (3D them) them reported the polymer substrate and surface modificationThe infreeform order to process develop surfaces polymer-based (3D) reported the polymer substrate and surface modi fication in order to develop polymer-based composites. Therefore, this review presents adetailed and a meaningfulThe freeform insight process of surfaces each processing (3D) composites.So far, there Therefore, are reported this review several presents methods a fordetailed manufacturing and a meaningful the MID insight substrate. of each Some processing of them routes. The main objective of this work is to highlight the benefits of using the MID technology reportedroutes.So
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