IEEE International Ultrasonics Symposium 2019 6-9 October 2019 SEC, Glasgow, Scotland, UK
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IEEE International Ultrasonics Symposium 2019 6-9 October 2019 SEC, Glasgow, Scotland, UK PROGRAMME We are thankful to all our sponsors for supporting the IEEE International Ultrasonics Symposium 2019! GOLD SPONSOR SILVER SPONSORS BRONZE SPONSORS PROGRAMME Table Of Contents WELcoME . 02 ORGANISATIONAL STRuctuRE . 03 TecHNICAL PROGRAMME COMMITTEE . 04 VENUE DETAILS . 07 GENERAL INFORMATION . 09 PROCEEDINGS . 12 BecoMING A MEMBER OF IEEE . 12 SOCIAL PROGRAMME . 13 ANCILLARY MEETINGS . 17 STUDENT ARRANGEMENTS . 18 LEGACY AND OUTREACH . 20 TecHNICAL PROGRAMME . 22 Plenary Speakers . 23 Invited Speakers . 25 Invited Spotlight Session Speakers . 27 Industry Speakers . 28 Oral Presentations . 29 Panel Sessions . 29 Technical Programme at a Glance . 30 Posters . 34 Technical Programme in Detail . 45 – Monday, 7 October 2019 . 46 – Tuesday, 8 October 2019 . 80 – Wednesday, 9 October 2019 . 115 SPONSORS AND EXHibitoRS . 150 Hall 2 Exhibition Floorplan . 150 Exhibition Stands . 151 Exhibitors . 155 AutHOR INDEX . 156 Sec FLOOR PLANS . 182 MAP OF GLASGow . 184 Notes . 185 IEEE IUS 2019 – 01 WELCOME Message from the IEEE IUS 2019 General Co-Chairs The IEEE International Ultrasonics Symposium, in Glasgow, Scotland, from 6th to 9th October 2019, is at the Scottish Event Campus on the bank of the historic River Clyde. This is the first time this expanding symposium has been held in the United Kingdom, bringing together academic and industrial researchers from a host of countries around the world for scientific exchange, to inspire new ideas, to sell products, and to launch new projects. Glasgow has a very long history of ultrasound. As a place where ships have been built for many years, this brought interest in SONAR and in non-destructive evaluation. With equipment used in the ship-building industry and borrowed from Kelvin and Hughes Ltd, Ian Donald, Regius Professor of Obstetrics and Gynaecology at the University of Glasgow, originated and led the development of obstetric ultrasound, now the most widely used application in the world. Professor Donald’s work paved the way for more than 60 years of innovation in ultrasound, with a continuing thread ever-renewing through existing activity, startup companies, and creativity in research. Glasgow itself is a historic city, situated in the Clyde Valley, and reputed to be founded with the building of a Christian church in the 6th century, now the site of Glasgow Cathedral. It has been a particularly active trading and industrial city for the past 300 years, with many notable buildings and attractive parks and residential areas. It is easily accessible from the rest of the UK and is an ideal place from which to explore Ayrshire, home of the poet, Robert Burns, Edinburgh, city of the Scottish Enlightenment, and the incomparable Scottish highlands, a land of mists and mountains, renowned for its deep lochs, hairy cattle and plentiful Scotch whisky. We welcome you to Glasgow and wish you all a fantastic IUS Symposium and visit to Scotland. Sincerely, Sandy Cochran and Margaret Lucas 02 – IEEE IUS 2019 ORGANISATIONAL STRUCTURE Organisational Structure Symposium Organising Committee Dr Lori Bridal Prof. Sandy Cochran Prof. Margaret Lucas Laboratoire d’Imagerie University of Glasgow University of Glasgow Biomédicale - UPMC General Co-Chair General Co-Chair Technical Co-Chair Prof. John Hossack University of Dr Mark Schafer Dr Richard O’Leary Virginia Sonic Tech, Inc. University of Strathclyde Technical Co-Chair Finance Co-Chair Finance Co-Chair Dr Larry Kessler Dr Andrew Mathieson Dr Paul Prentice Sonoscan Exhibits Thales UK University of Glasgow Co-Chair Exhibits Co-Chair Web / App Co-Chair Mr Srinath Rajagopal Dr Helen Mulvana National Physical University of Strathclyde Dr Vassilis Sboros Laboratory Legacy and Outreach Heriot-Watt University Web / App Co-Chair Co-Chair / Publicity Co-Chair Legacy and Outreach Co-Chair Dr Julien Reboud University of Glasgow Prof. Anthony Gachagan Dr David Hughes Legacy and Outreach Co-Chair Strathclyde University Novosound Ltd Short Courses Co-Chair Local Arrangements Co-Chair Local Arrangements Co-Chair Dr Bill Wright Prof. Steve Freear Prof. Peter Hoskins University College Cork University of Leeds University of Edinburgh Short Courses Co-Chair Proceedings Co-Chair Proceedings Co-Chair Dr Xiaoning Jiang Prof. Zhihong Huang North Carolina State University of Dundee University Student Arrangements Student Arrangements Dr Paul Reynolds Co-Chair Co-Chair / Publicity Co-Chair IUS 2020 General Co-Chair Dr Scott Smith Jessica Liu Strohmann GE Global Research Qualcomm Technologies, Inc. IUS 2020 General Co-Chair Industrial Engagement IEEE IUS 2019 – 03 Technical Programme Committee 37. Larry Mo, GE Global Research, USA 38. Lasse Løvstakken, Norwegian University of Science MEDICAL ULTRASONICS and Technology, Norway Vice-Chair: 39. Lori Bridal, CNRS - Sorbonne University, France Alfred C. H. Yu, 40. Magnus Cinthio, Lund University, Sweden University of Waterloo 41. Marie Muller, North Carolina State University, USA Canada 42. Mark Borden, University of Colorado Boulder, USA 43. Marvin Doyley, University of Rochester, US 44. Massimo Mischi, Eindhoven University of Technology, 1. Ayache Bouakaz, INSERM, France The Netherlands 2. Bajram Zeqiri, National Physical Laboratory, UK 45. Matthew F. Bruce, University of Washington, USA 3. Brian Fowlkes, University of Michigan, USA 46. Matthew W. Urban, Mayo Clinic, USA 4. Caterina Gallippi, University of North Carolina, USA 47. Michael Kolios, Ryerson University, Canada 5. Charles A. Cain, University of Michigan, USA 48. Michael Oelze, University of Illinois, USA 6. Chih-Kuang Yeh, National Tsing Hua University, Taiwan 49. Mickael Tanter, INSERM, France 7. Chris de Korte, Radboud University Medical Center, 50. Mike Averkiou, University of Washington, USA The Netherlands 51. Mingxi Wan, Xi’an Jiaotong University, China 8. Damien Garcia, CREATIS, France 52. Mostafa Fatemi, Mayo Clinic College of Medicine, USA 9. Elisa Konofagou, Columbia University, USA 53. Nico de Jong, Erasmus Medical Centre, The 10. Emad Ebbini, University of Minnesota, USA Netherlands 11. Georg Schmitz, Ruhr-Universität Bochum, Germany 54. Nobuki Kudo, Hokkaido University, Japan 12. George Kapodistrias, Samsung Research, USA 55. Olivier Couture, CNRS at Physics for Medicine, France 13. Guy Cloutier, University of Montreal, Canada 56. Pai Chi Li, National Taiwan University, Taiwan 14. Hairong Zheng, Shenzhen Institutes of Advanced 57. Paul A. Dayton, University of North Carolina/NCSU, USA Technology, China 58. Peter Hoskins, University of Edinburgh, UK 15. Helen Mulvana, University of Strathclyde, UK 59. Piero Tortoli, University of Florence, Italy 16. Hervé Liebgott, CREATIS, France 60. Ralf Seip, SonaCare Medical, LLC, USA 17. Hideyuki Hasegawa, University of Toyama, Japan 61. Roberto Lavarello, Pontificia Universidad Católica del 18. Hiroshi Kanai, Tohoku University, Japan Perú, Peru 19. James Greenleaf, Mayo Clinic, USA 62. Roger J. Zemp, University of Alberta, Canada 20. James Wiskin, QT Ultrasound Inc., USA 63. Shigao Chen, Mayo Clinic, USA 21. Jan Dhooge, Catholic University of Leuven, Belgium 64. Stas Emelianov, Georgia Institute of Technology and Emory University School of Medicine, USA 22. Jean-Yves Chapelon, INSERM, France 65. Steven Freear, University of Leeds, UK 23. Jeff Ketterling, Riverside Research, USA 66. Stuart Foster, University of Toronto, Canada 24. Jeremy Dahl, Stanford University, USA 67. Svetoslav Nikolov, BK Ultrasound, Denmark 25. Jianwen Luo, Tsinghua University, China 68. Thanasis Loupas, Philips Ultrasound, USA 26. Jian-yu Lu, University of Toledo, USA 69. Ton van der Steen, Erasmus Medical Centre, The 27. John Hossack, University of Virginia, USA Netherlands 28. Jonathan Mamou, Riverside Research, USA 70. Wilko G. Wilkening, Siemens Medical Solutions, USA 29. Jørgen Arendt Jensen, Technical University Denmark, 71. William D. O’Brien, University of Illinois, USA Denmark 72. Yonina Eldar, Weizmann Institute of Science, Israel 30. Kai E. Thomenius, Massachusetts Institute of Technology, USA 31. Kang Kim, University of Pittsburgh, USA 32. Kathy Ferrara, Stanford University, USA 33. Kathy Nightingale, Duke University, USA 34. Keith Wear, Food and Drug Administration, USA 35. Kendall Waters, Silicon Valley Medical Instruments, USA 36. Kullervo Hynynen, University of Toronto, Canada 04 – IEEE IUS 2019 ORGANISATIONAL STRUCTURE 73. 9. Jan Brown, JB Consulting, USA 10. Ji Wang, Ningbo University, China SENSORS, NDE & INdustRIAL 11. Jiun-Der Yu, Qualcomm Technologies, Inc., USA APPLICATIONS 12. John Larson, Broadcom Ltd, USA Vice-Chair: Erdal Oruklu, Illinois 13. Jörg Wallaschek, Leibniz Universität Hannover, Institute of Technology, US Germany 14. Kimmo Kokkonen, Qorvo, Germany 15. Margaret Lucas, University of Glasgow, UK 1. Bernhard Tittmann, Pennsylvania State University, USA 16. Masaya Takasaki, Saitama University, Japan 2. David Greve, Carnegie Mellon University, USA 17. Minoru Kuribayashi Kurosawa, Tokyo Institute of Technology, Japan 3. Donald McCann, Seadrill, USA 18. Robert Thalhammer, Qualcomm, Germany 4. Donald E. Yuhas, Industrial Measurement Systems, USA 19. Robert J. McGough, MSU, USA 5. Edward Haeggstrom, University of Helsinki, Finland 20. Takahiko Yanagitani, Waseda University, Japan 6. Jacqueline Hines, Applied Sensor R&D Corporation, USA 21. Takefumi Kanda, Okayama University, Japan 7. Jafar Saniie, Illinois Institute of Technology, USA 22. Vincent Laude, FEMTO-ST / CNRS, France 8. James Blackshire, Air Force Research Laboratory,