AMD Brings Power of “Zen 3” to World's Best Mobile Processors for Business(1)
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DYNAMIC RANDOM ACCESS MEMORY and NAND FLASH MEMORY DEVICES and PRODUCTS Investigation No
UNITED STATES INTERNATIONAL TRADE COMMISSION Washington, D.C. In the Matter of CERTAIN DYNAMIC RANDOM ACCESS MEMORY AND NAND FLASH MEMORY DEVICES AND PRODUCTS Investigation No. 337- TA-803 CONTAINING SAME NOTICE OF A COMMISSION DETERMINATION NOT TO REVIEW INITIAL DETERMINATIONS TERMINATING THE INVESTIGATION AS TO ALL REMAINING RESPONDENTS; TERMINATION OF THE INVESTIGATION AGENCY: U.S. International Trade Commission. ACTION: Notice. SUMMARY: Notice is hereby given that the U.S. International Trade Commission has determined not to review initial determinations ("IDs") (Order Nos. 70, 71, and 72) of the presiding administrative law judge ("ALJ") terminating the above-captioned investigation as to all remaining respondents based on settlement and license agreements. The remaining respondents included the following: Acer Inc. of Taipei, Taiwan; Acer America Corp. of San Jose, California; ADATA Technology Co., Ltd. of New Taipei City, Taiwan; ADATA Technology (U.S.A.) Co., Ltd. of Hacienda Heights, California; Asustek Computer Inc. of Taipei City, Taiwan; Asus Computer International Inc. of Freemont, California; Dell, Inc. of Round Rock, Texas; Hewlett-Packard Company of Palo Alto, California; Kingston Technology Co., Inc. of Fountain Valley, California; Logitek International S.A. ("LISA") ofVaud, Switzerland; Logitech, Inc. of Fremont, California; Best Buy Co., Inc. of Richfield, Minnesota; and Wal-Mart Stores, Inc. of Bentonville, Arkansas (collectively, "the remaining respondents"); Elpida Memory, Inc. of Tokyo, Japan and Elpida Memory (USA) of Sunnyvale, California (collectively, "Elpida"); and SK Hynix Inc. (f/k/a Hynix Semiconductor Inc.) ofGyeonggi-do, Korea and Hynix Semiconductor America, Inc. of San Jose, California (collectively, "Hynix"). FOR FURTHER INFORMATION CONTACT: Clint Gerdine, Esq., Office of the General Counsel, U.S. -
Webcore: Architectural Support for Mobile Web Browsing
WebCore: Architectural Support for Mobile Web Browsing Yuhao Zhu Vijay Janapa Reddi Department of Electrical and Computer Engineering The University of Texas at Austin [email protected], [email protected] Abstract The Web browser is undoubtedly the single most impor- Browser Browser tant application in the mobile ecosystem. An average user 63% 54% spends 72 minutes each day using the mobile Web browser. Web browser internal engines (e.g., WebKit) are also growing 23% 8% 32% Media 6% in importance because they provide a common substrate for 7% 7% Others developing various mobile Web applications. In a user-driven, Media Games Others interactive, and latency-sensitive environment, the browser’s Email performance is crucial. However, the battery-constrained na- (a) Time dist. of window focus. (b) Time dist. of CPU processing. ture of mobile devices limits the performance that we can de- Fig. 1: Mobile Web browser share study conducted by our industry liver for mobile Web browsing. As traditional general-purpose research partner on their employees’ devices [2]. Similar observa- techniques to improve performance and energy efficiency fall tions were reported by NVIDIA on Tegra-based mobile handsets [3,4]. short, we must employ domain-specific knowledge while still maintaining general-purpose flexibility. network limited. However, this trend is changing. With about In this paper, we first perform design-space exploration 10X improvement in round-trip time from 3G to LTE, network to identify appropriate general-purpose architectures that latency is no longer the only performance bottleneck [51]. uniquely fit the characteristics of a popular Web browsing Prior work has shown that over the past decade, network engine. -
EVA: an Efficient Vision Architecture for Mobile Systems
EVA: An Efficient Vision Architecture for Mobile Systems Jason Clemons, Andrea Pellegrini, Silvio Savarese, and Todd Austin Department of Electrical Engineering and Computer Science University of Michigan Ann Arbor, Michigan 48109 fjclemons, apellegrini, silvio, [email protected] Abstract The capabilities of mobile devices have been increasing at a momen- tous rate. As better processors have merged with capable cameras in mobile systems, the number of computer vision applications has grown rapidly. However, the computational and energy constraints of mobile devices have forced computer vision application devel- opers to sacrifice accuracy for the sake of meeting timing demands. To increase the computational performance of mobile systems we Figure 1: Computer Vision Example The figure shows a sock present EVA. EVA is an application-specific heterogeneous multi- monkey where a computer vision application has recognized its face. core having a mix of computationally powerful cores with energy The algorithm would utilize features such as corners and use their efficient cores. Each core of EVA has computation and memory ar- geometric relationship to accomplish this. chitectural enhancements tailored to the application traits of vision Watts over 250 mm2 of silicon, typical mobile processors are limited codes. Using a computer vision benchmarking suite, we evaluate 2 the efficiency and performance of a wide range of EVA designs. We to a few Watts with typically 5 mm of silicon [4] [22]. show that EVA can provide speedups of over 9x that of an embedded To meet the limited computation capability of mobile proces- processor while reducing energy demands by as much as 3x. sors, computer vision application developers reluctantly sacrifice image resolution, computational precision or application capabili- Categories and Subject Descriptors C.1.4 [Parallel Architec- ties for lower quality versions of vision algorithms. -
6Th Generation Intel® Core™ Processors Based on the Mobile U-Processor for Iot Solutions (Intel® Core™ I7-6600U, I5-6300U, and I3-6100U Processors)
PLATFORM BRIEF 6th Generation Intel® Core™ Mobile Processor Family Internet of Things 6th Generation Intel® Core™ Processors Based on the Mobile U-Processor for IoT Solutions (Intel® Core™ i7-6600U, i5-6300U, and i3-6100U Processors) Harness the Performance, Features, and Edge-to-Cloud Scalability to Build Tomorrow’s IoT Solutions Today Product Overview Stunning Visual Performance Intel is proud to announce its 6th The 6th generation Intel Core generation Intel® Core™ processor processors utilize the new Gen9 family featuring ultra low-power, graphics engine, which improves 64-bit, multicore processors built on graphic performance by up to the latest 14 nm technology. Designed 34 percent.1 The improvements are for small form-factor applications, this demonstrated through faster 3-D multichip package (MCP) integrates graphics performance and rendering a low-power CPU and platform applications at low power. Video controller hub (PCH) onto a common playback is also faster and smoother package substrate. thanks to the new multiplane overlay capability. The new generation offers The 6th generation Intel Core processor up to three independent audio streams family offers dramatically higher CPU and displays, Ultra HD 4K support, and and graphics performance, a broad workload consolidation for lower BOM range of power and features scaling costs and energy output. the entire Intel product line, and new, advanced features that boost edge-to- Users will also enjoy enhanced cloud Internet of Things (IoT) designs high-density streaming applications in a wide variety of markets. These and optimized 4K videoconferencing processors run at 15W thermal design with accelerated 4K hardware media power (TDP) and are ideal for small, codecs HEVC (8-bit), VP8, VP9, and energy-efficient, form-factor designs, VDENC encoding, decoding, and including digital signage, point-of-sale transcoding. -
PART I ITEM 1. BUSINESS Industry We Are
PART I ITEM 1. BUSINESS Industry We are the world’s largest semiconductor chip maker, based on revenue. We develop advanced integrated digital technology products, primarily integrated circuits, for industries such as computing and communications. Integrated circuits are semiconductor chips etched with interconnected electronic switches. We also develop platforms, which we define as integrated suites of digital computing technologies that are designed and configured to work together to provide an optimized user computing solution compared to ingredients that are used separately. Our goal is to be the preeminent provider of semiconductor chips and platforms for the worldwide digital economy. We offer products at various levels of integration, allowing our customers flexibility to create advanced computing and communications systems and products. We were incorporated in California in 1968 and reincorporated in Delaware in 1989. Our Internet address is www.intel.com. On this web site, we publish voluntary reports, which we update annually, outlining our performance with respect to corporate responsibility, including environmental, health, and safety compliance. On our Investor Relations web site, located at www.intc.com, we post the following filings as soon as reasonably practicable after they are electronically filed with, or furnished to, the U.S. Securities and Exchange Commission (SEC): our annual, quarterly, and current reports on Forms 10-K, 10-Q, and 8-K; our proxy statements; and any amendments to those reports or statements. All such filings are available on our Investor Relations web site free of charge. The SEC also maintains a web site (www.sec.gov) that contains reports, proxy and information statements, and other information regarding issuers that file electronically with the SEC. -
Flash Memory Summit Pocket Guide 2017
2017 FLASH MEMORY SUMMIT POCKET GUIDE AUGUST 8-10 SANTA CLARA CONVENTION CENTER AUGUST 7 PRE-CONFERENCE TUTORIALS Contents 3 4 Highlights 6 Exhibitors 8 Exhibit Hall Floor Plan 11 Keynote Presentations 2017 Sponsors Gold Sponsors Mobiveil Executive Premier Sponsors SANBlaze Technology Samsung SD Association SK Hynix Bronze Sponsors AccelStor Toshiba America ADATA Technology Electronic Components Apeiron Data Systems ATP Electronics Premier Sponsors Broadcom Brocade Communications Hewlett Packard Enterprise Systems Development Cadence Design Systems Intel Calypso Systems CEA LETI Marvell Semiconductor Celestica Micron Technology CNEX Labs Microsemi Epostar Electronics Excelero NetApp FADU Seagate Technology Fibre Channel Industry Assoc. Foremay Silicon Motion Technology Hagiwara Solutions Western Digital IBM JEDEC Platinum Sponsors Kroll Ontrack Crossbar Lam Research Maxio E8 Storage Mentor Graphics Everspin Technologies Newisys Innodisk NVMdurance NVXL Technology Lite-On Storage Sage Microelectronic NGD Systems SATA-IO Nimbus Data SCSI Trade Association Silicon Storage Technology One Stop Systems SiliconGo Microelectronics Radian Memory Systems SNIA-SSSI Synopsys Smart IOPS Tegile SMART Modular Teledyne LeCroy Technologies Teradyne Transcend Information Swissbit UFSA Symbolic IO ULINK Technology Viking Technology UNH-IOL UniTest Emerald Sponsors VARTA Microbattery VIA Technologies Advantest Virtium Amphenol Xilinx Dera Storage Participating Organizations Diablo Technologies Chosen Voice Gen-Z Consortium Circuit Cellar Connetics USA Hyperstone -
Product Line Card
Product Line Card 3Com Corporation ATI Technologies Distribution CCT Technologies 3M Attachmate Corporation Century Software 4What, Inc. Autodesk, Inc. Certance 4XEM Avaya, Inc. Certance LLC Averatec America, Inc. Chanx Absolute Software Avocent Huntsville Corp. Check Point Software ACCPAC International, Inc. Axis Communications, Inc. Cherry Electrical Products Acer America Corporation Chicony Adaptec, Inc. Barracuda Networks Chief Manufacturing ADC Telecommunications Sales Battery Technology, Inc. Chili Systems Addmaster Bay Area Labels Cingular Interactive, L.P. Adesso Bay Press & Packing Cisco Systems, Inc. Adobe Systems, Inc. Belkin Corporation CMS Products, Inc. Adtran Bell & Howell CNET Technology, Inc. Advanced Digital Information BenQ America Corporation Codi Advanced Micro Devices, Inc. Best Case & Accessories Comdial AEB Technologies Best Software SB, Inc. Computer Associates Aegis Micro/Formosa– USA Bionic CCTV ComputerLand AI Coach Bionic Video Comtrol Corporation Alcatel Internetworking, Inc. Black Box Connect Tech All American Semi Block Financial Corel Corporation Allied Telesyn BorderWare Corporate Procurement Altec Lansing Technologies, Inc. Borland Software Corporation Corsair Althon Micro Boundless Technologies, Inc. Corsair Altigen Brady Worldwide Countertrade Products Alvarion, Inc. Brands, Inc. Craden AMCC Sales Corp. Brenthaven Creative Labs, Inc. AMD Bretford Manufacturing, Inc. CRU-Dataport American Portwell Technology Brooktrout Technology, Inc. CryptoCard American Power Conversion Brother International Corporation CTX Anova Microsystems Buffalo Technology/Melco Curtis Young Corporation Antec, Inc. Business Objects Americas AOpen America, Inc. BYTECC Dantz Development Corp. APC Data911 Arco Computer Products, LLC Cables To Go, Inc. Datago Ardence Cables Unlimited Dataram Areca. US Caldera Systems, Inc. Datawatch Corporation Arima Computer Cambridge Soundworks Decision Support Systems Artronix Canon USA Inc. Dedicated Micros Aspen Touch Solutions, Inc. Canton Electronics Corporation Dell Astra Data, Inc. -
Database Performance with Enterprise-Class Kingston Ssds
DATABASE PERFORMANCE WITH ENTERPRISE-CLASS KINGSTON SSDS Processing power isn’t the only thing that drives database performance. High performing server storage, such as enterprise-class solid-state drives (SSDs), can dramatically improve the performance of databases compared to traditional hard disk drives (HDDs). In our labs at Principled Technologies, we put the virtualized database performance of Kingston SSDs to the test, and found that replacing a solution consisting of a server with an external chassis containing 24 HDDs with only six internal SSDs increased total database performance by up to 91.8 percent. While we performed our tests, we measured the power that the solutions consumed while idle and while running database workloads, and found that the Kingston SSD solution used up to 51.0 percent less power than the HDD solution, and increased performance per watt by a staggering 184.2 percent. Organizations that wish to increase database performance and save on power costs should consider the benefits of upgrading their HDD configurations to high- performance enterprise-class Kingston SSDs. APRIL 2012 A PRINCIPLED TECHNOLOGIES TEST REPORT Commissioned by Kingston Technology Corp. SPEED UP YOUR STORAGE WITH SSDS Solid-state drives, or SSDs, can provide many benefits to an organization. They improve performance because they do not have moving disks and heads inside like traditional hard drives. Instead, they have integrated circuitry that works as high-speed storage memory. This design offers more bandwidth and better random performance, although typically with less storage capacity, giving an end user the ability to replace several hard drives with a single SSD providing equal or better performance depending on how many drives you are replacing. -
NVIDIA Tegra 4 Family CPU Architecture 4-PLUS-1 Quad Core
Whitepaper NVIDIA Tegra 4 Family CPU Architecture 4-PLUS-1 Quad core 1 Table of Contents ...................................................................................................................................................................... 1 Introduction .............................................................................................................................................. 3 NVIDIA Tegra 4 Family of Mobile Processors ............................................................................................ 3 Benchmarking CPU Performance .............................................................................................................. 4 Tegra 4 Family CPUs Architected for High Performance and Power Efficiency ......................................... 6 Wider Issue Execution Units for Higher Throughput ............................................................................ 6 Better Memory Level Parallelism from a Larger Instruction Window for Out-of-Order Execution ...... 7 Fast Load-To-Use Logic allows larger L1 Data Cache ............................................................................. 8 Enhanced branch prediction for higher efficiency .............................................................................. 10 Advanced Prefetcher for higher MLP and lower latency .................................................................... 10 Large Unified L2 Cache ....................................................................................................................... -
AMD Ryzen™ PRO & Athlon™ PRO Processors Quick Reference Guide
AMD Ryzen™ PRO & Athlon™ PRO Processors Quick Reference guide AMD Ryzen™ PRO Processors with Radeon™ Graphics for Business Laptops (Socket FP6/FP5) 1 Core/Thread Frequency Boost/Base L2+L3 Cache Graphics Node TDP Intel vPro Core/Thread Frequency Boost*/Base L2+L3 Cache Graphics Node TDP AMD PRO technologies COMPARED TO 4.9/1.1 Radeon™ 6/12 UHD AMD Ryzen™ 7 PRO 8/16 Up to 12MB Graphics 7nm 15W intel Intel Core i7 10810U GHz 13MB 4750U 4.1/1.7 GHz CORE i7 14nm 15W (7 Cores) 10th Gen Intel Core i7 10610U 4/8 4.9/1.8 9MB UHD GHz AMD Ryzen™ 7 PRO Up to Radeon™ intel 4/8 6MB 10 12nm 15W 4.8/1.9 3700U 4.0/2.3 GHz Vega CORE i7 Intel Core i7 8665U 4/8 9MB UHD 14nm 15W 8th Gen GHz Radeon™ AMD Ryzen™ 5 PRO 6/12 Up to 11MB Graphics 7nm 15W intel 4.4/1.7 4650U 4.0/2.1 GHz CORE i5 Intel Core i5 10310U 4/8 7MB UHD 14nm 15W GHz (6 Cores) 10th Gen AMD Ryzen™ 5 PRO 4/8 Up to 6MB Radeon™ 12nm 15W intel 4.1/1.6 3500U 3.7/2.1 GHz Vega8 CORE i5 Intel Core i5 8365U 4/8 7MB UHD 14nm 15W th GHz 8 Gen Radeon™ AMD Ryzen™ 3 PRO 4/8 Up to 6MB Graphics 7nm 15W intel 4.1/2.1 4450U 3.7/2.5 GHz CORE i3 Intel Core i3 10110U 2/4 5MB UHD 14nm 15W (5 Cores) 10th Gen GHz AMD Ryzen™ 3 PRO 4/4 Up to 6MB Radeon™ 12nm 15W intel 3.9/2.1 3300U 3.5/2.1 GHz Vega6 CORE i3 Intel Core i3 8145U 2/4 4.5MB UHD 14nm 15W 8th Gen GHz AMD Athlon™ PRO Processors with Radeon™ Vega Graphics for Business Laptops (Socket FP5) AMD Athlon™ PRO Up to Radeon™ intel Intel Pentium 4415U 2/4 2.3 GHz 2.5MB HD 610 14nm 15W 300U 2/4 3.3/2.4 GHz 5MB Vega3 12nm 15W 1. -
Software-Based Undervolting Faults in AMD Zen Processors Fehler in AMD Zen Prozessoren Durch Software-Basierte Unterspannung
Software-based Undervolting Faults in AMD Zen Processors Fehler in AMD Zen Prozessoren durch Software-basierte Unterspannung Bachelorarbeit im Rahmen des Studiengangs IT-Sicherheit der Universität zu Lübeck vorgelegt von Anja Rabich ausgegeben und betreut von Prof. Dr. Thomas Eisenbarth mit Unterstützung von Luca Wilke Lübeck, den 31. August 2020 Abstract Dynamic Voltage and Frequency Scaling (DVFS) is a powerful performance enhance- ment method used by modern processors, allowing them to scale voltage or frequency as needed based on the power requirements of the CPU. This not only saves power, but also prevents processors from overheating. However, the continued integration of soft- ware interfaces giving a user direct access to this functionality has been shown to be a potential security risk, allowing a privileged adversary to indirectly tamper with sensitive computations. This thesis summarizes the results of various papers showing that using DVFS features, unsuitable voltage/frequency values can be set for the processor leading to hardware faults and calculation errors which can be used to undermine the integrity of Trusted Execution Environments (TEE). Results are partially replicated for Intel’s TEE implementation SGX, followed by extending the same methodology to AMD’s Zen Pro- cessors, on which there is currently no information. Results show that undervolting is an unlikely attack vector. iii Zusammenfassung Dynamische Spannungs- und Frequenzskalierung (engl. DVFS) ist ein in modernen Prozessoren vorhandener Leistungs- und Stromverwaltungsmechanismus, womit Span- nung und Frequenz der CPU je nach Bedarf skaliert werden können. Somit wird nicht nur Strom gespart, sondern auch zusätzlich verhindert, dass der Prozessor überhitzt. Die zunehmende Integration von Softwareschnittstellen zu diesen Mechanismen die dem Nutzer Einstellungsmöglichkeiten anbieten, haben sich zunehmend als potenzielle Sicherheitslücke erwiesen. -
Semiconductor Manufacturers. Our Primary Semiconductor Competitors
Semiconductor Manufacturers. Our primary semiconductor competitors currently include Hynix, IM Flash Technologies LLC, or IMFT (a company formed by Micron and Intel), Micron, Samsung, and Toshiba. Flash Memory Card and USB Drive Manufacturers. Our primary card and USB drive competitors currently include, among others, A-DATA Technology Co., Ltd., or A-DATA, Buffalo, Inc., or Buffalo, Chips and More GmbH, or CnMemory, Dane-Elec Memory, or Dane-Elec, Eastman Kodak Company, or Kodak, Elecom Co., Ltd., or Elecom, FUJIFILM Corporation, or FUJI, Gemalto N.V., or Gemalto, Hagiwara Sys-Com Co., Ltd., or Hagiwara, Hama, Hynix, Imation Corporation, or Imation, and its division Memorex Products, Inc., or Memorex, I-O Data Device, Inc., or I-O Data, Kingmax Digital, Inc., or KingMax, Kingston Technology Company, Inc., or Kingston, Lexar, Micron, Netac Technology Co., Ltd., or Netac, Panasonic, PNY Technologies, Inc., or PNY, RITEK Corporation, or RITEK, Samsung, Sony, STMicroelectronics N.V., or STMicroelectronics, Toshiba, Tradebrands International, or Tradebrands, Transcend Information, Inc., or Transcend, and Verbatim Americas LLC, or Verbatim. Solid-State Drive and Hard Disk Drive Manufacturers. Our SSDs face competition from other manufacturers of SSDs, including Intel, Samsung, Toshiba, and others. Our SSDs also face competition from hard disk drives, which are offered by companies including, among others, Seagate Technology LLC, or Seagate, Samsung and Western Digital Corporation, or Western Digital. Digital Audio/Video Player Manufacturers. Our digital audio/video players face strong competition from products offered by companies, including Apple Inc., or Apple, ARCHOS Technology, or ARCHOS, Coby Electronics Corporation, or Coby, Creative Technology Ltd., or Creative, Koninklijke Philips Electronics N.V., or Royal Philips Electronics, Microsoft Corporation, or Microsoft, Samsung and Sony.