DOCSLIB.ORG

T Echnical B Riefs Technical Briefs

Total Page：16

File Type：pdf, Size：1020Kb

Download full-text PDF Read full-text
T Echnical B Riefs Technical Briefs JANUARY 2021 VOL. 28, NO. 1 ISSN: 1074 1879 EDITOR-IN-CHIEF: DANIEL TOMASZEWSKI TABLE OF CONTENTS T ECHNICAL B RIEFS TECHNICAL BRIEFS . 1 • System and High-Volume-Manufacturing Driven More Moore Scaling Roadmap • Highlights of IEDM 2020 SYSTEM AND HIGH-VOLUME- • Highlights of the 2020 IEEE Photovoltaic Specialists Conference MANUFACTURING DRIVEN MORE • Review of the 2020 IRPS UPCOMING TECHNICAL MEETINGS . 31 MOORE SCALING ROADMAP • 5th IEEE Electron Devices Technology and MUSTAFA BADAROGLU1 AND PAOLO A. GARGINI2 Manufacturing (EDTM) Conference 1 • 2021 IEEE Photovoltaics Specialist Conference (PVSC) IEEE IRDS MORE MOORE CHAIRMAN, QUALCOMM, • 2021 IEEE International Memory Workshop (IMW) 2IEEE LIFE FELLOW, I-JSAP FELLOW, CHAIRMAN IRDS • 2021 IEEE Latin American Electron Devices Conference (LAEDC) [email protected], [email protected] SOCIETY NEWS . 35 • Board of Governors Meeting • Message from EDS President • Message from the Chair of the EDS Optoelectronic Devices Committee 1. Introduction • Message from Editor-in-Chief Scaling device features by approximately 30% in each new tech- • Congratulations to Dr. Robert W. Dutton-2020 nology generation supported Moore’s Law doubling the number of IEEE EDS Celebrated Member • EDS Members Named Recipients of 2021 IEEE transistors every 2-years for decades while also improving system Technical Field Awards performance by concurrently increasing transistor drive current • In Memory of James D. Meindl • Announcement of the 2020 EDS Undergraduate and reducing operating voltage. This combination allowed intro- Student Scholarship Winners duction of new functions in innovative System-On-Chip (SoC) • Announcement of the 2020 EDS Masters Student products with better performance and lower cost. The progress Fellowship Winners • Announcement of the 2020 EDS PhD Student of technology scaling has been measured by monitoring PPAC Fellowship Winners (Performance-Power-Area-Cost) improvements, typically hap- • 2020 EDS Chapter of the Year Award Winners • Call for Nominations—EDS Student Fellowships pening with any new technology introduction with a cadence of for 2021 2–3 years. However, pure geometric scaling does not provide any YOUNG PROFESSIONALS . 46 longer the necessary PPAC improvements at the system level due • India’s Rise in Nanoelectronics Research to several reasons: • IEEE Young Professionals Germany at Robert Bosch Semiconductor Headquarters 1) limits of practical power dissipation were reached around the middle of the previous decade and this constraint im- CHAPTER NEWS . 51 • DIPED-2020 Seminar/Workshop Dedicated to the posed a maximum useable frequency of 5–6 GHz, Memory of Prof. Nikolai Voitovich 2) ideal geometric scaling introduces increasing levels of para- • TEC Costa Rica Recipient of the 2020 IEEE EDS Student Branch Chapter of the Year Award sitics that adversely reduce performance, • EDS Cares: Face Mask Loop Extender and Face Shield 3) cost of scaling is increasing faster than in the past due to for SMK 18 Shah Alam Muslimah Student and lithographic limitations demanding multiple exposure per Teacher Volunteers layer and therefore making final products very costly, REGIONAL NEWS . 55 EDS MEETINGS CALENDAR . 69 (continued on page 3) CALL FOR PAPERS—SPECIAL ISSUE OF THE IEEE TRANSACTIONS ON ELECTRON DEVICES . 71 NEWSLETTER DISTRIBUTION CHANGES . 72 YOUR COMMENTS SOLICITED Your comments are most welcome. Please write directly to the Editor-in-Chief of the Newsletter at [email protected] 28neds01_Final_DigitalOnly.indd 1 1/20/21 11:13 AM ELECTRON DEVICES NEWSLETTER SOCIETY EDITORIAL STAFF Editor-In-Chief President Vice President of Membership Daniel Tomaszewski Ravi Todi and Services Lukasiewicz Research Network—Institute of Western Digital Technologies Patrick Fay Microelectronics and Photonics Email: [email protected] University of Notre Dame Email: [email protected] E-mail: [email protected] Treasurer Bin Zhao Vice President of Publications REGIONS 1–6, 7 & 9 United Kingdom, Middle Freescale Semiconductor and Products Eastern, Northeastern & East & Africa E-mail: [email protected] Joachim Burghartz Southeastern USA Stewart Smith Institute for Microelectronics (Regions 1, 2 & 3) Scottish Microelectronics Centre Secretary Stuttgart Rinus Lee E-mail: [email protected] M.K. Radhakrishnan E-mail: [email protected] NanoRel GlobalFoundries E-mail: [email protected] Vice President of Regions/ E-mail: [email protected] Western Europe Chapters Mike Schwarz Jr. Past President Murty Polavarapu Central USA & Canada Technische Hochschule Fernando Guarin Space Electronics Solutions (Regions 4 & 7) Mittelhessen University of GlobalFoundries E-mail: [email protected] Michael Adachi Applied Sciences E-mail: [email protected] Simon Fraser University E-mail: mike.schwarz1980@ Vice President of Strategic E-mail: [email protected] googlemail.com Sr. Past President Directions Samar Saha Paul Berger Prospicient Devices The Ohio State University Southwestern & Western USA REGION 10 E-mail: [email protected] E-mail: [email protected] (Regions 5 & 6) Australia, New Zealand & Muhammad Mustafa Hussain South East Asia Vice President of Education Vice President of Technical University of California—Berkeley Sharma Rao Balakrishnan Navakanta Bhat Committees E-mail: MuhammadMustafa. Universiti Sains Islam Malaysia Indian Institute of Science John Dallessase [email protected] E-mail: [email protected] Email: [email protected] University of Illinois at Urbana- Champaign Vice President of Meetings Email: [email protected] Latin America (Region 9) North East and East Asia Kazunari Ishimaru Edmundo A. Guiterrez-D. Ming Liu Kioxia Corporation INAOE Institute of Microelectronics Email: [email protected] E-mail: [email protected] E-mail: [email protected] REGION 8 South Asia Eastern Europe Soumya Pandit Kateryna Arkhypova University of Calcutta IRE NASU E-mail: [email protected] E-mail: [email protected] IEEE prohibits discrimination, harassment, and bullying. For more information, visit http://www.ieee.org/web/aboutus/whatis/policies/p9-26.html. Scandinavia & Central Europe Marcin Janicki Lodz University of Technology E-mail: [email protected] EDS Board of Governors (BoG) CONTRIBUTIONS WELCOME Elected Members-at-Large Elected for a three-year term (maximum two terms) with ‘full’ voting privileges Readers are encouraged to submit news items concerning the Society and its members. Please send your ideas/articles directly to either Editor-in- 2021 TERM 2022 TERM 2023 TERM Chief or the Regional Editor for your region. The email addresses of all Paul Berger (1) Constantin Bulucea (1) Roger Booth (2) Regional Editors are listed on this page. Email is the preferred form of Navakanta Bhat (2) Daniel Camacho (1) Xiojun Guo (1) submission. Merlyne De Souza (1) John Dallesasse (1) Edmundo A. Gutierrez-D. (2) NEWSLETTER DEADLINES Kazumari Ishimaru (1) Mario Lanza (1) Francesca Iacopi (1) William (Bill) Nehrer (1) Geok Ing Ng (1) Benjamin Iniguez (2) ISSUE DUE DATE Murty Polavarapu (2) Claudio Paoloni (1) P. Susthitha Menon (1) Camilo Velez Cuervo (1) Hitoshi Wakabayashi (1) Manoj Saxena (2) Sumant Sood (2) October July 1st January October 1st April January 1st July April 1st The EDS Newsletter archive can be found on the Society web site at http://eds.ieee.org/eds-newsletters.html. The archive contains issues from July 1994 to the present. IEEE Electron Devices Society Newsletter (ISSN 1074 1879) is published quarterly by the Electron Devices Society of the Institute of Electrical and Electronics Engineers, Inc. Headquarters: 3 Park Avenue, 17th Floor, New York, NY 10016–5997. Printed in the U.S.A. One dollar ($1.00) per member per year is included in the Society fee for each member of the Electron Devices Society. Periodicals postage paid at New York, NY and at additional mailing offices. Postmaster: Send address changes to IEEE Electron Devices Society Newsletter, IEEE, 445 Hoes Lane, Piscataway, NJ 08854. Copyright © 2021 by IEEE: Information contained in this Newsletter may be copied without permission provided that copies are not used or distributed for direct commercial advantage, and the title of the publication and its date appear on each photocopy. 2 IEEE Electron Devices Society Newsletter ❍ January 2021 28neds01_Final_DigitalOnly.indd 2 1/20/21 11:13 AM SYSTEM AND HIGH-VOLUME-MANUFACTURING DRIVEN MORE MOORE SCALING ROADMAP (continued from page 1) 4) there is an increasing imbal- ter is to provide physical, electrical, 10 years, for multiple cloud applica- ance and disconnect between and reliability requirements for a tions. The first step in the roadmap the performance of devices at unified logic and memory technol- process is to identify the ground rules the die level and the perfor- ogy platform to sustain power, per- and their inherent limits set by the mance requirements of the formance, area, cost (PPAC) “scaling unit process modules, devices, and overall system (e.g. memo- guidelines” for mobile and cloud ap- the impact of any parasitics on perfor- ry bandwidth bottleneck) that plications over a time horizon of 15 mance. The second step is to describe creates a significant burden years for Mainstream/High-Volume the standard cell scaling parameters to further enhance system in- Manufacturing (HVM) [1]. Such tech- and how to further tighten key design tegration and performance. nology platform identifies the main rules by means of Design Technology Therefore, for all the above technology drivers and provides the Co-Optimization
Load more

Recommended publications
  • Critical Making at the Edges
    Visible Language 49.3 the journal of visual communication research special issue Jessica Barness Amy Papaelias guest editors December 2015 critical making DESIGN and the DIGITAL HUMANITIES ADVISORY BOARD GUEST EDITORS' INTRODUCTION Naomi Baron — The American University, Washington, D.C. 4–11 Critical Making at the Edges Michael Bierut — Pentagram, New York, NY Jessica Barness, Amy Papaelias Matthew Carter — Carter & Cone Type, Cambridge, MA Keith Crutcher — Cincinnati, OH THEORY AND SPECULATIONS Mary Dyson — University of Reading, UK 12–33 Meta!Meta!Meta! A Speculative Design Brief for the Digital Humanities Jorge Frascara — University of Alberta, Canada / Universidad Anne Burdick de las Americas Puebla Ken Friedman — Swinburne University of Technology, Melbourne, Australia 34–61 Clues. Anomalies. Understanding. Detecting underlying assumptions and Michael Golec — School of the Chicago Art Institute, Chicago, IL Judith Gregory — University of California-Irvine, Irvine, CA expected practices in the Digital Humanities through the AIME project Kevin Larson — Microsoft Advanced Reading Technologies Donato Ricci, Robin de Mourat, Christophe Leclercq, Bruno Latour Aaron Marcus — Aaron Marcus & Associates, Berkeley, CA Per Mollerup — Swinburne University of Technology, Melbourne, Australia 62–77 Writing Images and the Cinematic Humanities Tom Ockerse — Rhode Island School of Design, Providence, RI Holly Willis Sharon Poggenpohl — Estes Park, CO Michael Renner — The Basel School of Design — Visual Communication 78–99 Beyond the Map: Unpacking
    [Show full text]
  • Design Technology Sl, Year 1
    FREEHOLD REGIONAL HIGH SCHOOL DISTRICT OFFICE OF CURRICULUM AND INSTRUCTION INTERNATIONAL BACCALAUREATE PROGRAM DESIGN TECHNOLOGY SL, YEAR 1 Grade Level: 11 Credits: 2.5 BOARD OF EDUCATION ADOPTION DATE: AUGUST 28, 2017 SUPPORTING RESOURCES AVAILABLE IN DISTRICT RESOURCE SHARING APPENDIX A: ACCOMMODATIONS AND MODIFICATIONS APPENDIX B: ASSESSMENT EVIDENCE APPENDIX C: INTERDISCIPLINARY CONNECTIONS FREEHOLD REGIONAL HIGH SCHOOL DISTRICT Board of Education Mrs. Jennifer Sutera, President Mr. Peter Bruno, Vice President Mr. Vincent Accettola Mrs. Elizabeth Canario Mr. Samuel Carollo Mrs. Amy Fankhauser Mrs. Kathie Lavin Mr. Michael Messinger Mr. Heshy Moses Central Administration Mr. Charles Sampson, Superintendent Dr. Nicole Hazel, Chief Academic Officer Ms. Shanna Howell, Director of Curriculum and Instruction Mr. Oscar Diaz, Administrative Supervisor of Curriculum & Instruction Ms. Stephanie Mechmann, Administrative Supervisor of Curriculum & Instruction Ms. Renee Schneider, Administrative Supervisor of Curriculum & Instruction Curriculum Writing Committee Mr. Thomas Jennings Supervisor Ms. Mary Hough IB DESIGN TECHNOLOGY SL YEAR 1 COURSE PHILOSOPHY The International Baccalaureate Organization provides the following philosophy: “Diploma Programme Design Technology aims to develop internationally- minded people whose enhanced understanding of design and the technological world can facilitate our shared guardianship of the planet and create a better world. Both science and technology have a fundamental relationship with design. Technology preceded science, but now most technological developments are based on scientific understanding. Traditional technology comprised useful artifacts often with little understanding of the science underpinning their production and use. In contrast, modern technology involves the application of scientific discoveries to produce useful artifacts. The application of scientific discovery to solve a problem enables designers to create new technologies and these new technologies, in turn, can impact on the rate of scientific discovery.
    [Show full text]
  • Architectural Design Technology – Interior Design ASSOCIATE of APPLIED SCIENCE DEGREE (AAS) REQUIRED CREDITS: 67 DEGREE CODE: ADTDSG-AAS
    ARCHITECTURAL DESIGN TECHNOLOGY PROGRAM Architectural Design Technology – Interior Design ASSOCIATE OF APPLIED SCIENCE DEGREE (AAS) REQUIRED CREDITS: 67 DEGREE CODE: ADTDSG-AAS DESCRIPTION This degree program builds the skills required to produce professional and quality interior architectural designs. The core curriculum is a sequence of lecture/lab courses that stress the design theory and application, color, space planning, interior materials, furniture specification, CADD, business practices and field experience. STUDENT LEARNING OUTCOMES • Demonstrate competency in the foundations and theory of interior design. • Demonstrate competency in drafting, CADD and presentation skills. • Demonstrate competency in design development skills in the selection and specification of interior furnishings, finishes, materials, textiles and decorative elements. • Demonstrate knowledge in design process including research, programming, concept development, specifications and business practices. PLEASE NOTE - The courses listed below may require a prerequisite or corequisite. Read course descriptions before registering for classes. All MATH and ENG courses numbered 01-99 must be completed before reaching 30 total college-level credits. No course under 100-level counts toward degree completion. GENERAL EDUCATION REQUIREMENTS (25 CREDITS) FULL-TIME STUDENT DEGREE PLAN Add more semesters to modify this plan to fit part-time student needs. MATHEMATICS (3 credits) FIRST SEMESTER Credits MATH 116 or above (except MATH 122, 123) ENG 100 or 101 or 113 3-5 AAD
    [Show full text]
  • 2021 February - FISH & SHELLFISH FREE MENU GSD INTERNATIONAL SCHOOL COSTA RICA MONDAY TUESDAY WEDNESDAY THURSDAY FRIDAY 1 2 3 4 5 SPAIN
    2021 February - FISH & SHELLFISH FREE MENU GSD INTERNATIONAL SCHOOL COSTA RICA MONDAY TUESDAY WEDNESDAY THURSDAY FRIDAY 1 2 3 4 5 SPAIN Macaroni a la italiana Cream of spinach soup Potatoes a la marinera Chickpea salad Vegetables bits whit jam Beef schnitzel Griddled turkey steak Diced breaded cheese SIN TRADUCCIÓN Spanish omelet Mixed sautéed vegetables Baked potatoes Greek salad Rice with vegetables Ratatouille Fresh fruit Fresh fruit Yoghurt Fresh fruit Fresh fruit Water Water Water Water Bread and water 8 9 10 11 12 Gallo pinto (rice and beans) Tossed broccoli Chicken soup with noodles Sautéed Mediterranean vegetables Cream of zucchini soup Roast chicken Sliced meat in creole sauce Pork tenderloin whit mhrooms gravy Homemade meatballs Chicken ravioli Coleslaw Garden rice Mixed salad Campesino potatoes Pilaf rice Fresh fruit Yoghurt Fresh fruit Fresh fruit Fresh fruit Bread Water Water Water Water and 15 16 17 18 19 LEBANON Rice with tomato Potatoes with ribs Lentil stew Tossed carrots with garlic with bacon Chicken parcels Griddled veal fillet French omelet with ham and cheese Griddled turkey steak Chiken whit roasted tomato sauce Grilled zucchini Vegetable stew Mixed salad Rice with corn Fresh fruit Yoghurt Fresh fruit Fresh fruit Fresh fruit Bread and Water Water Water Water water 22 23 24 CHINA 25 26 Pasta salad Cream of broccoli soup with croutons Chinese tacos Caprese salad White beans with chorizo Pork chop loin Breaded chicken fillet Three delights noodles Pork stew French omelet with ham Sauteed vegetables Garden salad Bok choy and vegetable salad Fries Mixed salad Yoghurt Fresh fruit Fresh fruit Fresh fruit Fresh fruit Water Water Water Water Bread and water.
    [Show full text]
  • Architectural and Engineering Design Technology
    MCHENRY COUNTY COLLEGE ARCHITECTURAL AND ENGINEERING DESIGN TECHNOLOGY A PROGRAM IN CONJUNCTION WITH THE MCC FAST TRACK The Fast Track at McHenry County College is a cohort-based program that helps give students the advantage they need when competing for jobs in today’s workforce. Through the Fast Track, students can earn a certificate in two years or less and an associate’s degree in three years, depending on the program. Nearly everything manufactured and built in today’s society starts with computer generated drawings. Drafters and designers work in a variety of industries, including manufacturing, architecture and construction to develop the technical drawings needed for the manufacturing and construction of our built environment. Using the latest computer- aided design (CAD) systems, including parametric solid modeling and building information modeling (BIM), they create both 2-D and 3-D models and drawings for everything—from the simplest machined part of a mechanical assembly to the largest and most complex structures SALARY RANGE such as bridges and skyscrapers and everything in between. $30,000 to $45,700 The Architectural and Engineering Design Certificate program, with specialization in either architectural, engineering, or interior JOB OUTLOOK* design technology, represents a collective approach to developing Projected growth is 3-9% in most or upgrading the necessary visualization, graphical communication fields, higher in others. Projected and organization skills required of this ever evolving field. CAD job openings range by field. Top technicians can expect to find employment in such diverse occupations industries are professional, as architectural/mechanical/civil design and construction, surveying, scientific, manufacturing, and product design, or fashion/interior design.
    [Show full text]
  • A Critical Role for Design Technology Charles L
    Institute of Design Illinois Institute of Technology Chicago, Illinois U.S.A A Critical Role for Design Technology Charles L. Owen Distinguished Professor of Design (Keynote article, Design Management Journal, Design Technology Issue (Spring 1993): pp. 10-18) A phenomenon very apparent to the American businessman, as well as to any lay observer, is the wave of "restructuring" passing through the country. It is a fact of life for seemingly all large companies, and through ripple effects, it affects all but those companies most finely tuned to the new realities of the marketplace. Less apparent, but of greater portent, is the implicit recognition that new rules are taking form for how the games of business will be played. As the recession abates, and revitalized industries emerge, they will not return to the ways of the past; they will seek a development philosophy for their products and services in tune with the times. Of the factors involved in this product/service philosophy, design will be one of the most important, as the growing interest of the business press makes that very clear. There is little question that design will play a major role in the kind of economic world on the horizon. The question is, What role will that be? The Quality The issue really involves "quality", and what is now being termed "product Pyramid integrity". To a great extent, the present opportunity for design is what it is because of the now-general concern for quality. Most customers equate quality with craftsmanship, an observable attribute that has been drummed into everyone’s consciousness for at least a decade.
    [Show full text]
  • Technology of Enterprise Solid State Drive
    White Paper | April 2014 Technology of Enterprise Solid State Drive Recently, large capacity and high-performance storages are highly required in the cloud computing and data center due to rapidly increasing amount of information and number of access. When many people heavily access to internet services such as social network service (SNS) or web search engine, they will always expect an instant response from the service. In the corporate on-premise network system and financial trading system, micro seconds range of the response time makes big difference to the business outcome. As an evolution of the enterprise server and storage system, more focus is placed on speed, response time and latency to support large number of SNS user accesses and time-critical business transactions. Then Solid State Drive (SSD) plays an important role for server system to make the transactions faster. Enterprise class SSD is a storage device with NAND flash memories and required the design to store and retrieve data at very high speed under high duty operation conditions with reliable endurance performance. It will be very beneficial for system managers to deploy SSD for boosting up computing process and storage access speed. By positioning between host processor and hard disk drive (HDD) storage pools as a large cache memory, SSD increases the system transaction speed. SSD has also good points, in addition to higher performance, such as smaller footprint and lower power consumption. Toshiba has matured leading edge technologies in the SSD as the first company developing NAND flash memory. Interfaces Host Controller Interface) is popular for client application.
    [Show full text]
  • Occupying Time: Design, Technology, and the Form of Interaction
    Title Occupying Time: Design, technology, and the form of interaction Type The sis URL https://ualresearchonline.arts.ac.uk/id/eprint/16139/ Dat e 2 0 0 7 Citation Mazé, Ramia (2007) Occupying Time: Design, technology, and the form of interaction. PhD thesis, Malmö University/ Blekinge Institute of Technology. Cr e a to rs Mazé, Ramia Usage Guidelines Please refer to usage guidelines at http://ualresearchonline.arts.ac.uk/policies.html or alternatively contact [email protected] . License: Creative Commons Attribution Non-commercial No Derivatives Unless otherwise stated, copyright owned by the author Occupying Time Ramia Maze Author Ramia Mazé Title Occupying Time: Design, technology, and the form of interaction Blekinge Institute of Technology Doctoral Dissertation Series No. 2007:16 ISSN 1653-2090 ISBN 978-91-7295-124-2 School of Arts and Communication, Malmö University, Sweden in collaboration with Department of Interaction and System Design. School of Engineering, Blekinge Institute of Technology, Sweden Copyright © 2007 Ramia Mazé Published by Axl Books, Stockholm: 2007 www.axlbooks.com info@ axlbooks.com ISBN 978-91-975901-8-1 To the best of my knowledge, all images and photographs featured here were created by members of the ‘project team’ as listed by each respective project or program. Additional photographs of IT+Textiles projects and the Static! ‘Energy Curtain’ were taken by Ben Hooker and James King. Additional photographs of the Front ‘Flower Lamp’ were taken by myself. Book and cover design by Christian Altmann Printed in Latvia Ramia Mazé Occupying Time Abstract As technology pervades our everyday life and material culture, new possibilities and problematics are raised for design.
    [Show full text]
  • Beans + Rice = a Complete Protein for Global Nutrition
    HEALTHY FOR LIFE® EDUCATIONAL EXPERIENCES GIHC1 GLOBALLY INSPIRED HOME COOKING Beans + Rice = A Complete OBJECTIVES: Describe the nutritional Protein for Global Nutrition benefits of eating beans and rice (both together Time: 75 Minutes (1 recipe prepared); 95 Minutes (2 recipes prepared) and separately). Identify different types of beans Learn why pairing these two simple ingredients creates a complete and different types of rice. protein and why beans-and-rice dishes have become culinary staples List two healthy cooking tips across the globe. Learn how various countries make this combination for beans and/or rice. their own with unique preparations. Describe cooking traditions for beans and rice in other countries. SETUP ACTIVITY (20-40 Minutes) • Review the resource list and print it out. • The class will divide into two groups. Each will Purchase all necessary supplies after reviewing prepare the same or a different beans-and- the HFL Cost Calculator. rice recipe. • Set up demo station with the necessary activity resources. RECAP (10 Minutes) • Provide computer, internet access, and • Pass out handout(s) and invite participants projector, if available. to taste the healthy dish or dishes. Ask each participant to share one learning from INTRO (10 Minutes) the lesson. • Welcome participants and introduce yourself. GOAL SETTING/CLOSING (15 Minutes) • Take care of any housekeeping items (closest bathroom, water fountain, etc.). • Engage in a goal setting activity from the bank of options provided in the Welcome Toolkit. • Give a brief description of the educational Pass out the Setting SMART Goals handout experience. to participants. • Engage in an icebreaker to gauge topic • Thank participants and encourage them to knowledge from the bank of options provided join the next activity.
    [Show full text]
  • 2020 ANNUAL MEMBERS MEETING October 22, 2020 8AM Pacific / 11AM Eastern – Teleconference (See Next Page for Dial-In and Zoom Instructions)
    2020 ANNUAL MEMBERS MEETING October 22, 2020 8AM Pacific / 11AM Eastern – Teleconference (See Next Page for Dial-in and Zoom Instructions) 1 | ©2020 Storage Networking Industry Association. All Rights Reserved. Conference Call Dial-in and Zoom Info https://www.snia.org/annualmeeting Link will start Zoom meeting – afterwards, redirects to copy of the presentation materials Teleconference/Zoom coordinates: Zoom Meeting ID: 988 4674 5668 Passcode: 102220 https://zoom.us/j/98846745668?pwd=SW5BUzAxdUJZVDFhTmhPS2VNd0FKZz09 One tap mobile +16699009128,,98846745668#,,,,,,0#,,102220# US (San Jose) +13462487799,,98846745668#,,,,,,0#,,102220# US (Houston) +16465588656,,98846745668#,,,,,,0#,,102220# US (New York) Find your local number: https://zoom.us/u/aekOw6XZjj 2 | ©2020 Storage Networking Industry Association. All Rights Reserved. Zoom Format – Attendee Guidance . Enter Name (Company) on your Zoom Login/Attendee Info . Everyone will be on Mute, except the Moderator/Speaker . You can unmute yourself if you would like to say something . Voting Member Company Primary/Alternate representatives, please identify yourself when joining . Remain on Mute when not speaking . Use the Chat Icon to text message the group or a particular person . Use Raised Hand function under “participants” icon 3 | ©2020 Storage Networking Industry Association. All Rights Reserved. 2020 Annual Members Meeting Agenda . Greetings and Roll Call – Michael Oros, Executive Director . FY2019: Annual Report published . Motion to Approve 2019 Meeting Minutes – Jim Pappas, SNIA Secretary . Fiscal Report (2019 Annual Report) – Sue Amarin, SNIA Treasurer . FY2020: SNIA update and achievements to date – Michael Oros, Executive Director . FY2021: What’s ahead for SNIA – J Metz, Ph.D, SNIA Chairman . Special Guest Speakers: EPA: Ryan Fogle; DMTF: Jeff Hilland; NVM Express: Amber Huffman .
    [Show full text]
  • ISSM2020 –International Symposium on Semiconductor Manufacturing SPONSORSHIP December 15-16, 2020, Tokyo, Japan
    ISSM2020 –International Symposium on Semiconductor Manufacturing SPONSORSHIP December 15-16, 2020, Tokyo, Japan Shozo Saito Chairman, ISSM2020 Organizing Committee Device & System Platform Development Center Co., Ltd. Shuichi Inoue, ATONARP INC. It is our great pleasure to announce that The 28th annual International Symposium on Semiconductor Manufacturing (ISSM) 2020 will be held on December 15-16, 2020 at KFC Hall, Ryogoku, Tokyo in cooperation with e-Manufacturing & Design Collaboration Symposium (eMDC) which is sponsored by TSIA with support from SEMI and GSA. The program will feature keynote speeches by world leading speakers, timely and highlighted topics and networking sessions focusing on equipment/materials/software/services with suppliers' exhibits. ISSM continues to contribute to the growth of the semiconductor industry through its infrastructure for networking, discussion, and information sharing among the world's professionals. We would like you to cooperate with us by supporting the ISSM 2020. Please see the benefit of ISSM2020 sponsorship. Conference Overview Date: December 15-16, 2020 Location: KFC (Kokusai Fashion Center) Hall 1-6-1 Yokoami Sumidaku, Tokyo 130-0015 Japan +81-3-5610-5810 Co-Sponsored by: IEEE Electron Devices Society Minimal Fab Semiconductor Equipment Association of Japan (SEAJ) Semiconductor Equipment and Materials International (SEMI) Taiwan Semiconductor Industry Association (TSIA) Endorsement by: The Japan Society of Applied Physics Area of Interest: Fab Management Factory Design & Automated Material
    [Show full text]
  • Fashion & Textiles
    DESIGN & TECHNOLOGY: FASHION & TEXTILES WHY CHOOSE DESIGN & TECHNOLOGY: FASHION & TEXTILES? This is arguably one of the most interesting times to study Textiles. Consumers are no longer dictated to, nor slavishly follow a handful of haute couture fashion figures. Today anything goes and emerging new talents are a constant feature of the London fashion world. This is a creative and thought-provoking qualification and gives students the practical skills, theoretical knowledge and confidence to succeed in a number of careers. A global recession and an emphasis on recycling mean vintage clothing has been pushed to the forefront and with it a renewed appreciation for historical colours, prints and designs. Globalisation, cheap travel and easy communication facilities mean the exchange of ideas and inspirations has never been easier or faster. The study of textiles is exciting and challenging. Students work with a range of different materials and produce original, experimental work, whether printing on silk or knitting with bin bags. They are encouraged to look at textiles and fashions from different periods and cultures and interpret those designs using a repertoire HIGHER EDUCATION of different techniques and processes. AND CAREERS OPTIONS The UK’s thinning fashion industry makes a huge contribution to the COURSE DETAILS economy. It is worth 9 billion and is set to increase. Employment in Students will gain a real understanding of what it means to be a the sector is growing year on year, with 15,000 jobs expected to be designer, alongside the knowledge and skills sought by Higher created by 2020. Education and employers. Many students who have studied Design Technology: Textiles have This course will give you an insight to Fashion/Textiles and the wider gone on to university to further study the subject.
    [Show full text]