Analysis of a Tunnel-Diode Delay-Line Reflex Memory Cell
Total Page:16
File Type:pdf, Size:1020Kb
Load more
Recommended publications
-
DRAM EMAIL GIM Teams!!!/Teaming Issues •Memories in Verilog •Memories on the FPGA
Memories & More •Overview of Memories •External Memories •SRAM (async, sync) •Flash •DRAM EMAIL GIM teams!!!/teaming Issues •Memories in Verilog •Memories on the FPGA 10/18/18 6.111 Fall 2018 1 Memories: a practical primer • The good news: huge selection of technologies • Small & faster vs. large & slower • Every year capacities go up and prices go down • Almost cost competitive with hard disks: high density, fast flash memories • Non-volatile, read/write, no moving parts! (robust, efficient) • The bad news: perennial system bottleneck • Latencies (access time) haven’t kept pace with cycle times • Separate technology from logic, so must communicate between silicon, so physical limitations (# of pins, R’s and C’s and L’s) limit bandwidths • New hopes: capacitive interconnect, 3D IC’s • Likely the limiting factor in cost & performance of many digital systems: designers spend a lot of time figuring out how to keep memories running at peak bandwidth • “It’s the memory - just add more faster memory” 10/18/18 6.111 Fall 2018 2 How do we Electrically Remember Things? • We can convey/transfer information with voltages that change over time • How can we store information in an electrically accessible manner? • Store in either: • Electric Field • Magnetic Field 10/18/18 6.111 Fall 2018 3 Mostly focus on rewritable • Punched Cards have existed as electromechanical program storage since ~1800s • We’re mostly concerned with rewritable storage mechanisms today (cards were true Computer program in punched card format ROMs) https://en.wiKipedia.org/wiKi/Computer_programming_in_the_ -
Metal Ultrasonic Delay Lines
Research Paper 2453 rOOmOI of R~eo"h of The NO tiO ~;;:if ~;=asoni;l~~i~;~~~:: Russell W . Mebs, John H. Darr, and John D. Grimsley A study was made of the applicability of a number of metals and a lloys for therm all y stable ultrasonic delay lin es. A preliminary iavestigation was made of different types of pressure holders and ad hesi ves for use in crystal t ransducer attachments and of the iafluence of specimen length on attenuation for valious m etals and alloy. The effect of cold-work, annealing, and specimen cross section on attenuation was a lso determined for a representati ve isoelastic alloy. Measurements of temperature variation of signal attenuation, distort ion, a nd delay t im e on a number of assembled delay lines indicated t hat an isoelastic a lloy employing over cured epoxy-resin crystal attachments gave best over-all t ransmission characteristics. No correlation was obtainable between strength and SOLl nd-transmission characteristics with varioLls cemented joints. 1. Introduction variations in pulse attenuation and distortion with acceleration or change of temperature. The ultrasonic delay line has come into wide use Only a general survey will be given of the basic in recent years with the development of radar, com theory of ultrasonic transmission as related to delay ~uters , and other electronic devices [1 , 2, 3, 4V It lines of 50 tLsec or less. More comprehensive 's a means for delaying a signal for a predetermined treatments have been given elsewhere [2, 4, and 5]. ~hort period to be accurately reproduced for use at _tn appropriate later instant. -
A Noise Investigation of Tunnel-Diode Microwave Amplifiers* A
1961 PROCEEDINGS OF THE IRE 739 A Noise Investigation of Tunnel-Diode Microwave Amplifiers* A. YARIVt, MEMBER, IRE, AND J. S. COOKt, MEMBER, IRE Summary-An analysis and derivation of the noise figure of a must consider the shot noise accompaniying the tunniel- tunnel-diode microwave amplifier are presented. The agreement be- ing process.7 There are two separate and independenit tween the measured noise figure and the theoretical results is an in- direct check on the existence of full shot noise in germanium tunnel tunineling currents, one consisting of electrons tunnelinlg diodes at microwave frequencies. The limiting noise temperature of from the N to the P side of the junction, which we de- the amplifier is elIR/2k, and can be approached by using diodes with inote by ii, and a second curreit, i2, made up of electrons small (RC) products in which the extreme overcoupling (load mis- crossing the junctioni in the opposite directioni. The niet match) and high gain can be achieved simultaneously. measurable dc current is Io-= ii -| i2 . Since the cur- INTRODUCTION renits ii and i2 are uncorrelated, the total shot noisel is represented by a current generator of mean-square A MPLIFIERS utilizing tunniel diodes were first re- amplitude, ported by Chang' at frequencies up to 80 Mc. He also suggested that the noise conitribution of the diode was due to the shot noise accompanying the j2 = 2e( 1iI + i2 I )B, (1) tunneling process. This suggestion was con1firmed by Lee and MAIonitgomery,2 who showed by measurements where e is the electronic charge and B is the bandwidth at 5 Mc that full shot noise was inideed genierated by the in cycles per seconid in which the noise is conisidered. -
Px4v; All 4.Us/ ATTORNEYS Nov
Nov. 16, 1971 J. E. CONANT ET All 3,619,912 WSUA SIMULATION DISPLAY SYSTEM Filed Aug. 9, 1968 4. Sheets-Sheet I. 12 O MODEL&r 3 MOON TRANSA ORY Motion systEM F.G. 25 D SPLAY SYSTEM GENERA Puy RPOS OG A ARCRAFT COMPER SMUAYOR 5 INVENTORS yOAN. E. CONAN & ATER F.B.CZEK px4v; All 4.us/ ATTORNEYS Nov. 16, 1971 J. E. CONANT ETAL 3,619,912 WISUAL SIMULATION DISPLAY SYSTEM Nov. 16, 1971 J. E. conANT ETAL 3,619,912 WISUAL SIMULATION DISPLAY SYSTEM ATTC)RNIEYS Nov. 16, 1971 J. E. CONANT ET All 3,619,912 WISUAL SIMULATION DISPLAY SYSTEM 3,619,912 United States Patent Office Patented Nov. 16, 1971 2 3,619,912 ual techniques, for coordination of the several monitors VISUAL SIMULATION DISPLAY SYSTEM in an overall display in which an image target is trans John E. Conant, Arlington, and Walter F. Buczek, Spring lated in a path across the several monitors, in any direc field, Va., assignors to Melpar, Inc., Falls Church, Va. tion thereacross, to correspond to the path of such an Filed Aug. 9, 1968, Ser. No. 751,522 image in actual flight of the craft as simulated by the con Int, CI. B64g 7/00, G09b 9/08 trols exercised by the trainee. U.S. C. 35-12 5 Claims Each monitor is supplied with delayed sync pulses and blanking information from its own video control network, with control coordination effected, in a preferred embodi ABSTRACT OF THE DISCLOSURE 10 ment, by computer input signals developed in response An optical image display is provided in a mosaic of to trainee control. -
History Timeline by Jeff Drobman (C) 2015 === 1889 - Punch Cards - Herman Hollerith (Of IBM Forerunner) Invented "IBM" Punch Cards to Be Used for the 1890 Census
Computer Memory History Timeline by Jeff Drobman (C) 2015 === 1889 - Punch cards - Herman Hollerith (of IBM forerunner) invented "IBM" punch cards to be used for the 1890 census. 1932 - Drum memory 1947 - Delay line memory 1949 - Magnetic CORE memory 1950 - Magnetic TAPE memory 1955 - Magnetic DISK memory - IBM RAMAC was first one 1957 - Plated wire memory 1962 - Thin film memory 1968 (ca) - Paper tape - Had beginnings dating back to 1846, but became widely used with teletype machines such as the Teletype Model 33 ASR, which were adopted early on by minicomputers as a primitive terminal. 1970 - Bubble memory 1970 - DRAM - Invented by Intel, first device was the 1101, organized as 256x1, followed by the 4x larger (1024x1) 1103(A) -- regarded as the world's first commercial DRAM (intro in October 1970). 1971 - Bipolar SRAM - Fairchild 256x1 (note IBM made a 16-bit SRAM in late 1960s. AMD made a second source of a 64x1 SRAM by Fairchild in 1971.) 1971 - EPROM - Invented by Dov Frohman of Intel as the i1702, a 2K-bit (256x8) EPROM. 1971 - "Floppy" disks -- First were 8-inch, hence very flexible ("floppy"). The 8" became commercially available in 1971. 1973 (ca) - Magnetic TAPE CASSETTE memory 1976 - Shugart Associates introduced the first 5¼-inch floppy (flexible) disk drive 1977 - EEPROM - invented by Eli Harari at Hughes - a BYTE erasable device 1979 - CMOS SRAM (static RAM, 4T/6T cell, implemented as a latch) - first introduced by HP then its spinoff as Integrated Device Technology. I believe first devices were 1K (1024x1), and later organized as x4 then x8. -
Two Terminal Special Purpose Devices First Year
www.uptunotes.com Content: - Special Purpose two terminal Devices: Light-Emitting Diodes, Varactor (Varicap)Diodes, Tunnel Diodes, Liquid-Crystal Displays. 1- Light Emitting Diode (LED) Light Emitting Diode is a photo electronic device which converts electrical energy to light energy. It is heavily doped P-N junction diode which under forward biased emits spontaneous radiation. The diode is covered with a transparent cover so that the emitted light may come out. Construction- In an LED, the upper layer of p-type semiconductor is deposited by diffusion on n-type layer of semiconductor. The metalized contacts are provided for applying the forward bias to the P-N junction diode from battery B through resistance R which controls the brightness of light emitted. Fig: LED construction Working of LED The LED works on the principle of electroluminescence. When a P-N junction is forward biases, the electrons in N- region cross the junction & recombines with holes in P-region. When electrons recombine with the holes, they move from conduction band to valence band which is at lower energy level. While moving, the additional energy is released by the free electrons which appear in the form of light due to the special material used in the LED. The energy released depends on the forbidden gap energy which determines the wavelength & the colour of the emitted light. Materials of LED The materials which are the mixtures of Gallium, Arsenic & Phosphorus are used in LED to obtain different coliour of light. S.No. Material Symbol Colour 1 Gallium Arsenide GaAs Infrared(Invisible) 2 Gallium Phosphide GaP Red or Green 3 Gallium Arsenide Phosphide GaAsP Red or Yellow By: Navneet Pal Email:[email protected] Page 1 www.uptunotes.com Output Characteristics- The amount of power output translated into light is directly propotional to the forward current If , more forward current If , the greater the output light. -
Basic Electronics Engineering. Chapter-1
Basic Electronics Engineering. Chapter-1 1. Diode Circuit 1.1 Define Electronics & its application. The world's reliance on electronics is so great that commentators claim people live in an "electronic age." People are surrounded by electronics—televisions, radios, computers, mobiles, Laptop and DVD players, along with products with major electric components, such as microwave ovens, refrigerators, and other kitchen appliances, automatic vehicles, Robotics, as well as hearing aids and medical instruments and numerous applications in industry. Definition: The branch of engineering which deals with current conduction through a Vacuum or Gas or Semiconductor is known as Electronics. An electronic device is that in which current flows through a vacuum or gas or semiconductor. This control of electrons is accomplished by devices that resist, carry, select, steer, switch, store, manipulate, and exploit the electron. Or Electronics deals with electrical circuits that involve active electrical components such as vacuum tubes, transistors, diodes and integrated circuits, and associated passive interconnection technologies. Commonly, electronic devices contain circuitry consisting primarily or exclusively of active semiconductors supplemented with passive elements; such a circuit is described as an electronic circuit. Pre Knowledge (Some of the basic definitions): Passive Components: Capable of operating without an external power source. Typical passive components are resistors, capacitors, inductors. Active components: Requiring a source of power -
Pioneering Study on Tunnel Diodes Study on Static Induction Transistors (SIT)
C-8 Pioneering Study on Tunnel Diodes Leo Esaki (1925-) started the study of PN junction diodes as a chief scientist in the diode research laboratory at Tokyo Communication Industry Co., Ltd., (currently Sony). After trial and error for about one year, he discovered the fact that when making the width of the PN junction of germanium as thin as 10 nm, negative resistance—the higher the voltage, the lower the current, contrary to conventional knowledge—occurred because its current-voltage properties were dominated by the impact of tunnel effects. This discovery was the first example of verifying the tunnel effect of quantum mechanics in the diode and the birth of new electronic devices—tunnel diode (or Esaki diode)—in electronic engineering as well. Then in 1973, L. Esaki was awarded the Nobel Prize for Physics together with Ivar Giaever who made the achievement of tunnel effects in ultrahigh conductors. Initially, the tunnel diode was made from germanium, however, now it is also made from gallium arsenide and silicon. It has also been used for various electronic circuits, e.g., oscillation circuits, amplifying circuits, frequency converters, and detector circuits. C-9 Study on Static Induction Transistors (SIT) In 1950, Junichi Nishizawa (1926-) developed the static induction transistor (hereinafter, SIT) applying the perfect crystal growth technique and high purity crystal growth technique originated by himself. He introduced a transistor having a rising property into the field of conventional transistors, where the properties of both the bipolar transistor and the field-effect transistor (FET) were limited to only the property of current saturation to increase in voltage. -
Tunnel-Diode Microwave Amplifiers
Tunnel diodes provide a means of low-noise microwave amplification, with the amplifiers using the negative resistance of the tunnel diode to a.chieve amplification by reflection. Th e tunnel diode and its assumed equivalent circuit are discussed. The concept of negative-resistance reflection amplifiers is discussed from the standpoints of stability, gain, and noise performance. Two amplifi,er configurations are shown. of which the circulator-coupled type 1'S carried further into a design fo/' a C-band amplifier. The result 1'S an amph'fier at 6000 mc/s with a 5.S-db noise figure over 380 mc/s. An X-band amplifier is also reported. C. T. Munsterman Tunnel-Diode Microwave Am.plifiers ecent advances in tunnel-diode fabrication where the gain of the ith stage is denoted by G i techniques have made the tunnel diode a and its noise figure by F i. This equation shows that Rpractical, low-noise, microwave amplifier. Small stages without gain (G < 1) contribute greatly to size, low power requirements, and reliability make the overall system noise figure, especially if they these devices attractive for missile application, es are not preceded by some source of gain. If a pecially since receiver sensitivity is significantly low-noise-amplification device can be located near improved, with resulting increased homing time. the source of the signal, the contribution from the Work undertaken at APL over the past year has successive stages can be minimized by making G] resulted in the unique design techniques and hard sufficiently large, and the overall noise figure is ware discussed in this paper.-Y.· then that of the amplifier Fl. -
A Spice Behavioral Model of Tunnel Diode: Simulation and Application
International Journal of Control and Automation Vol. 9, No. 4 (2016), pp. 39-50 http://dx.doi.org/10.14257/ijca.2016.9.4.05 A Spice Behavioral Model of Tunnel Diode: Simulation and Application Messaadi Lotfi1 and Dibi Zohir1 1Department of Electronics, Advanced Electronic Laboratory (LEA), Batna University, Avenue Mohamed El-hadi Boukhlouf, 05000, Batna, Algeria [email protected],[email protected] Abstract This paper provides an Analog Behavioral Model (ABM) in Pspice of a tunnel diode The Pspice parameters are implemented as separate parameterized blocks constructed from Spice (ABM) controlled sources and extracted through experiment. A tunnel diode based oscillator is also proposed and simulated using circuit analysis software. The behavior of the tunnel diode is simulated and compared to the measured data to show the accuracy of the Pspice model. Close agreement was obtained between the simulation and experimental results. Keywords: Tunnel diode, tunnel diode oscillator (TDO), Spice simulation, resonant tunneling diode (RTD), Analog Behavioral Modeling (ABM) 1. Introduction Leo Esaki invented a tunnel diode, which is also known as “Esaki diode” on behalf of its inventor. It’s a high conductivity two terminal P-N junction diode doped heavily about 1000 times greater than a conventional junction diode. Because of heavy doping depletion layer width is reduced to an extremely small value of 1/10000 m. When a DC voltage is applied in the forward bias operation, a TD I-V curve features a region of negative differential resistance. At low voltages (< 0.5 V in Figure 1) electrons from the conduction band of the n-side will tunnel to the hole states of the valence band of the p- side through the narrow p - n junction, creating a forward bias tunnel current. -
The Graphic Display of Computer Memory Data
University of Windsor Scholarship at UWindsor Electronic Theses and Dissertations Theses, Dissertations, and Major Papers 7-21-1969 The graphic display of computer memory data. Satish P. Agrawal University of Windsor Follow this and additional works at: https://scholar.uwindsor.ca/etd Recommended Citation Agrawal, Satish P., "The graphic display of computer memory data." (1969). Electronic Theses and Dissertations. 6548. https://scholar.uwindsor.ca/etd/6548 This online database contains the full-text of PhD dissertations and Masters’ theses of University of Windsor students from 1954 forward. These documents are made available for personal study and research purposes only, in accordance with the Canadian Copyright Act and the Creative Commons license—CC BY-NC-ND (Attribution, Non-Commercial, No Derivative Works). Under this license, works must always be attributed to the copyright holder (original author), cannot be used for any commercial purposes, and may not be altered. Any other use would require the permission of the copyright holder. Students may inquire about withdrawing their dissertation and/or thesis from this database. For additional inquiries, please contact the repository administrator via email ([email protected]) or by telephone at 519-253-3000ext. 3208. INFORMATION TO USERS This manuscript has been reproduced from the microfilm master. UMI films the text directly from the original or copy submitted. Thus, some thesis and dissertation copies are in typewriter face, while others may be from any type of computer printer. The quality of this reproduction is dependent upon the quality of the copy submitted. Broken or indistinct print, colored or poor quality illustrations and photographs, print bleedthrough, substandard margins, and improper alignment can adversely affect reproduction. -
This Is an Open Access Document Downloaded from ORCA, Cardiff University's Institutional Repository
This is an Open Access document downloaded from ORCA, Cardiff University's institutional repository: http://orca.cf.ac.uk/112084/ This is the author’s version of a work that was submitted to / accepted for publication. Citation for final published version: Han, Yu, Li, Qiang and Lau, Kei May 2017. Tristate memory cells using double-peaked fin-array III-V tunnel diodes monolithically grown on (001) silicon substrates. IEEE Transactions on Electron Devices 64 (10) , pp. 4078-4083. 10.1109/TED.2017.2738675 file Publishers page: http://dx.doi.org/10.1109/TED.2017.2738675 <http://dx.doi.org/10.1109/TED.2017.2738675> Please note: Changes made as a result of publishing processes such as copy-editing, formatting and page numbers may not be reflected in this version. For the definitive version of this publication, please refer to the published source. You are advised to consult the publisher’s version if you wish to cite this paper. This version is being made available in accordance with publisher policies. See http://orca.cf.ac.uk/policies.html for usage policies. Copyright and moral rights for publications made available in ORCA are retained by the copyright holders. > REPLACE THIS LINE WITH YOUR PAPER IDENTIFICATION NUMBER (DOUBLE-CLICK HERE TO EDIT) < 1 Tri-state memory cells using double-peaked fin- array III-V tunnel diodes monolithically grown on (001) silicon substrates Yu Han, Qiang Li, member, IEEE, and Kei May Lau, Fellow, IEEE quality III-V buffers within a few tens of nanometers has been Abstract— We demonstrate functional tri-state memory cells demonstrated [15]-[22].