Basic Research Needs for Microelectronics
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A Review Paper on Enhancement of Radio Frequency Microelectro Mechanical Systems
International Journal of Engineering Research & Technology (IJERT) ISSN: 2278-0181 Vol. 3 Issue 10, October- 2014 A Review Paper on Enhancement of Radio Frequency MicroElectro Mechanical Systems Shilpa G. Kulkarni Electronics And Telecommunication Engineering V.I.T.Wadala Mumbai - India Abstract—Radio Frequency Micro Electro Mechanical Systems (RF MEMS) refers to the design and fabrication of committed II. NEED FOR RF MEMS MEMS for RF circuits. RF MEMS is a multi-disciplinary area MEMS switches combine the advantageous properties of in which the components operate Micromechanical And / Or mechanical and semiconductor switches.RF MEMS have components are fabricated using micromachining and these advantages such as, Low insertion loss, High isolation, Lower components are used in RF systems. The regular microwave switches currently employed in the microwave industry are power consumption, Excellent signal linearity, Better mechanical switches and semiconductor switches. Mechanical impedance match, Less dispersion , Miniaturization, Simple coaxial and waveguide switches offer benefits such as, low control circuits, High volume production possible, Very large insertion loss, large off-state isolation and high power handling bandwidth , Resistant to external environment. Table Iand Fig capabilities. Yet, they are bulky, heavy and slow. Semiconductor 1provide a comparison of RF MEMS Switches with the switches provide switching at a much faster speed and are conventional switches. smaller in size and weight, but are inferior in insertion loss, DC power consumption, isolation and power handling capabilities TABLE I. COMPARISON OF VARIOUS PARAMETERS[2] than their mechanical counterparts. MEMS switches promise to RF combine the advantageous properties of mechanical and Parameter PIN FET semiconductor switches. There are nevertheless few issues in RF MEMS MEMS Switch like, Actuation Speed, Power handling capacity, Voltage(V) 20-80 ±3-5 3-5 Stiction and Actuation voltage etc. -
News, Information, Rumors, Opinions, Etc
http://www.physics.miami.edu/~chris/srchmrk_nws.html ● Miami-Dade/Broward/Palm Beach News ❍ Miami Herald Online Sun Sentinel Palm Beach Post ❍ Miami ABC, Ch 10 Miami NBC, Ch 6 ❍ Miami CBS, Ch 4 Miami Fox, WSVN Ch 7 ● Local Government, Schools, Universities, Culture ❍ Miami Dade County Government ❍ Village of Pinecrest ❍ Miami Dade County Public Schools ❍ ❍ University of Miami UM Arts & Sciences ❍ e-Veritas Univ of Miami Faculty and Staff "news" ❍ The Hurricane online University of Miami Student Newspaper ❍ Tropic Culture Miami ❍ Culture Shock Miami ● Local Traffic ❍ Traffic Conditions in Miami from SmartTraveler. ❍ Traffic Conditions in Florida from FHP. ❍ Traffic Conditions in Miami from MSN Autos. ❍ Yahoo Traffic for Miami. ❍ Road/Highway Construction in Florida from Florida DOT. ❍ WSVN's (Fox, local Channel 7) live Traffic conditions in Miami via RealPlayer. News, Information, Rumors, Opinions, Etc. ● Science News ❍ EurekAlert! ❍ New York Times Science/Health ❍ BBC Science/Technology ❍ Popular Science ❍ Space.com ❍ CNN Space ❍ ABC News Science/Technology ❍ CBS News Sci/Tech ❍ LA Times Science ❍ Scientific American ❍ Science News ❍ MIT Technology Review ❍ New Scientist ❍ Physorg.com ❍ PhysicsToday.org ❍ Sky and Telescope News ❍ ENN - Environmental News Network ● Technology/Computer News/Rumors/Opinions ❍ Google Tech/Sci News or Yahoo Tech News or Google Top Stories ❍ ArsTechnica Wired ❍ SlashDot Digg DoggDot.us ❍ reddit digglicious.com Technorati ❍ del.ic.ious furl.net ❍ New York Times Technology San Jose Mercury News Technology Washington -
Electronics Ii Curriculum Guide January 2012
PASSAIC COUNTY TECHNICAL INSTITUTE ELECTRONICS II CURRICULUM GUIDE JANUARY 2012 I. Course Description – Electronics Technology II Electronics II is designed to provide the student with enhanced skills and understanding of the electronics industry and changing career opportunities. Course goals are to provide the student with an augmented comprehension of advanced digital circuits and applications based on sound electrical fundamentals. Lab applications and projects are combined with theory based learning to provide the learner with a program which emulates industry standards and practices. II. Course Outline and Objectives UNIT 1: ELECTRONICS SHOP SAFETY (5.1.12.C.1, 5.1.4.D.3, 5.1.P.B.3) Students will: 1. develop a clear understanding of things that conduct electricity 2. understand lab and electrical hazards 3. know the dangers of electricity and how it affects the human body 4. learn how to report lab hazards to school personnel 5. develop a positive attitude about safe environments 6. learn proper use of tools in a safe manner 7. operate test equipment safely and effectively 8. avoid and report obstructions in the lab which can lead to injury 9. identify elements in the lab which can potentially cause injury 10. create and document a personal safety plan 11. know where to access safety standards posted in the lab 12. learn to ask appropriate questions when concerned about safety 13. operate and maintain all lab computers and peripherals efficiently 14. wear hand and eye protection as instructed 15. pass the program safety test with a 100% score UNIT 2: WORK ENVIRONMNETS IN ELECTRONICS (9.2.8.A.1, 9.4.12.O. -
Catálogo EMEA De Accesorios, Monitores Y Soluciones De HP Para
Accesorios, monitores y soluciones de HP para las empresas Europa, Oriente Medio y África junio de 2017 Diseñado para la forma en la que trabaja Accesorios con estilo. Haga clic en un botón para empezar. Introducción Guía del ecosistema Soluciones Accesorios Pantallas y destacadas adaptadores gráficos Soluciones Soluciones de software educativas Introducción Guía del Soluciones Accesorios Pantallas y Soluciones Soluciones Recursos ecosistema destacadas Adaptadores de software educativas gráficos FUERZA DE TRABAJO ESTILO DE TRABAJO LUGAR DE TRABAJO Contenido Introducción 3 Guía del ecosistema 8 Soluciones destacadas 10 Para HP Pro x2 612 G2 10 Para HP x2 210 G2 11 Para HP Elite x3 12 Soluciones de escritorio Elite Slice 14 Soluciones Desktop Mini 16 Para HP Z2 Mini G3 18 Para el ultrabook ZBook Studio 19 Accesorios 20 Baterías y alimentación 21 Fundas y maletines 25 Comunicación y colaboración 29 Soluciones docking 32 Chasis 34 Soportes y opciones de montaje 36 La forma en la que trabaja Teclados y ratones 39 Memoria y almacenamiento 46 Adaptadores y cables para la Como siempre, nuestro recorrido en HP para ofrecer lo que se productividad 51 Soluciones de seguridad y privacidad 53 desea empieza por entender a los clientes y sus necesidades. A medida que la tecnología evoluciona, las personas que la Adaptadores gráficos y utilizan también cambia, la forma en la que trabajan pantallas HP comerciales 56 Adaptadores gráficos y de vídeo 57 evoluciona, y el propio lugar de trabajo se transforma. Software HP Business 60 Soluciones educativas 63 La FUERZA DE TRABAJO: Millennials La mayor parte de la fuerza de trabajo ya la conforma la generación millennial, e irá creciendo. -
Three-Dimensional Integrated Circuit Design: EDA, Design And
Integrated Circuits and Systems Series Editor Anantha Chandrakasan, Massachusetts Institute of Technology Cambridge, Massachusetts For other titles published in this series, go to http://www.springer.com/series/7236 Yuan Xie · Jason Cong · Sachin Sapatnekar Editors Three-Dimensional Integrated Circuit Design EDA, Design and Microarchitectures 123 Editors Yuan Xie Jason Cong Department of Computer Science and Department of Computer Science Engineering University of California, Los Angeles Pennsylvania State University [email protected] [email protected] Sachin Sapatnekar Department of Electrical and Computer Engineering University of Minnesota [email protected] ISBN 978-1-4419-0783-7 e-ISBN 978-1-4419-0784-4 DOI 10.1007/978-1-4419-0784-4 Springer New York Dordrecht Heidelberg London Library of Congress Control Number: 2009939282 © Springer Science+Business Media, LLC 2010 All rights reserved. This work may not be translated or copied in whole or in part without the written permission of the publisher (Springer Science+Business Media, LLC, 233 Spring Street, New York, NY 10013, USA), except for brief excerpts in connection with reviews or scholarly analysis. Use in connection with any form of information storage and retrieval, electronic adaptation, computer software, or by similar or dissimilar methodology now known or hereafter developed is forbidden. The use in this publication of trade names, trademarks, service marks, and similar terms, even if they are not identified as such, is not to be taken as an expression of opinion as to whether or not they are subject to proprietary rights. Printed on acid-free paper Springer is part of Springer Science+Business Media (www.springer.com) Foreword We live in a time of great change. -
Design & Performance Analysis of DG-MOSFET for Reduction of Short
View metadata, citation and similar papers at core.ac.uk brought to you by CORE provided by Directory of Open Access Journals Ankita Wagadre Int. Journal of Engineering Research and Applications www.ijera.com ISSN : 2248-9622, Vol. 4, Issue 7( Version 1), July 2014, pp.30-34 RESEARCH ARTICLE OPEN ACCESS Design & Performance Analysis of DG-MOSFET for Reduction of Short Channel Effect over Bulk MOSFET at 20nm Ankita Wagadre*, Shashank Mane** *(Research scholar, Department of Electronics & Communication, SBITM, Betul-460001) ** (Assistant Professor, Department of Electronics & Communication, SBITM, Betul-460001) ABSTRACT An aggressive scaling of conventional MOSFETs channel length reduces below 100nm and gate oxide thickness below 3nm to improved performance and packaging density. Due to this scaling short channel effect (SCEs) like threshold voltage, Subthreshold slope, ON current and OFF current plays a major role in determining the performance of scaled devices. The double gate (DG) MOSFETS are electro-statically superior to a single gate (SG) MOSFET and allows for additional gate length scaling. Simulation work on both devices has been carried out and presented in paper. The comparative study had been carried out for threshold voltage (VT), Subthreshold slope (Sub VT), ION and IOFF Current. It is observed that DG MOSFET provide good control on leakage current over conventional Bulk (Single Gate) MOSFET. The VT (Threshold Voltage) is 2.7 times greater than & ION of DG MOSFET is 2.2 times smaller than the conventional Bulk (Single Gate) MOSFET. Keywords - DG MOSFET (Double Gate Metal oxide Field Effect Transistor), Short Channel Effect (SCE), Bulk (Single Gate) MOSFET. -
Technology, Media, and Telecommunications Predictions
Technology, Media, and Telecommunications Predictions 2019 Deloitte’s Technology, Media, and Telecommunications (TMT) group brings together one of the world’s largest pools of industry experts—respected for helping companies of all shapes and sizes thrive in a digital world. Deloitte’s TMT specialists can help companies take advantage of the ever- changing industry through a broad array of services designed to meet companies wherever they are, across the value chain and around the globe. Contact the authors for more information or read more on Deloitte.com. Technology, Media, and Telecommunications Predictions 2019 Contents Foreword | 2 5G: The new network arrives | 4 Artificial intelligence: From expert-only to everywhere | 14 Smart speakers: Growth at a discount | 24 Does TV sports have a future? Bet on it | 36 On your marks, get set, game! eSports and the shape of media in 2019 | 50 Radio: Revenue, reach, and resilience | 60 3D printing growth accelerates again | 70 China, by design: World-leading connectivity nurtures new digital business models | 78 China inside: Chinese semiconductors will power artificial intelligence | 86 Quantum computers: The next supercomputers, but not the next laptops | 96 Deloitte Australia key contacts | 108 1 Technology, Media, and Telecommunications Predictions 2019 Foreword Dear reader, Welcome to Deloitte Global’s Technology, Media, and Telecommunications Predictions for 2019. The theme this year is one of continuity—as evolution rather than stasis. Predictions has been published since 2001. Back in 2009 and 2010, we wrote about the launch of exciting new fourth-generation wireless networks called 4G (aka LTE). A decade later, we’re now making predic- tions about 5G networks that will be launching this year. -
PC Gamers Win Big
CASE STUDY Intel® Solid-State Drives Performance, Storage and the Customer Experience PC Gamers Win Big Intel® Solid-State Drives (SSDs) deliver the ultimate gaming experience, providing dramatic visual and runtime improvements Intel® Solid-State Drives (SSDs) represent a revolutionary breakthrough, delivering a giant leap in storage performance. Designed to satisfy the most demanding gamers, media creators, and technology enthusiasts, Intel® SSDs bring a high level of performance and reliability to notebook and desktop PC storage. Faster load times and improved graphics performance such as increased detail in textures, higher resolution geometry, smoother animation, and more characters on the screen make for a better gaming experience. Developers are now taking advantage of these features in their new game designs. SCREAMING LOAD TiMES AND SMOOTH GRAPHICS With no moving parts, high reliability, and a longer life span than traditional hard drives, Intel Solid-State Drives (SSDs) dramatically improve the computer gaming experience. Load times are substantially faster. When compared with Western Digital VelociRaptor* 10K hard disk drives (HDDs), gamers experienced up to 78 percent load time improvements using Intel SSDs. Graphics are smooth and uninterrupted, even at the highest graphics settings. To see the performance difference in a head-to- head video comparing the Intel® X25-M SATA SSD with a 10,000 RPM HDD, go to www.intelssdgaming.com. When comparing frame-to-frame coherency with the Western Digital VelociRaptor 10K HDD, the Intel X25-M responds with zero hitching while the WD VelociRaptor shows hitching seven percent of the time. This means gamers experience smoother visual transitions with Intel SSDs. -
Lecture 1: CS/ECE 3810 Introduction
Lecture 1: CS/ECE 3810 Introduction • Today’s topics: . Why computer organization is important . Logistics . Modern trends 1 Why Computer Organization 2 Image credits: uber, extremetech, anandtech Why Computer Organization 3 Image credits: gizmodo Why Computer Organization • Embarrassing if you are a BS in CS/CE and can’t make sense of the following terms: DRAM, pipelining, cache hierarchies, I/O, virtual memory, … • Embarrassing if you are a BS in CS/CE and can’t decide which processor to buy: 4.4 GHz Intel Core i9 or 4.7 GHz AMD Ryzen 9 (reason about performance/power) • Obvious first step for chip designers, compiler/OS writers • Will knowledge of the hardware help you write better and more secure programs? 4 Must a Programmer Care About Hardware? • Must know how to reason about program performance and energy and security • Memory management: if we understand how/where data is placed, we can help ensure that relevant data is nearby • Thread management: if we understand how threads interact, we can write smarter multi-threaded programs Why do we care about multi-threaded programs? 5 Example 200x speedup for matrix vector multiplication • Data level parallelism: 3.8x • Loop unrolling and out-of-order execution: 2.3x • Cache blocking: 2.5x • Thread level parallelism: 14x Further, can use accelerators to get an additional 100x. 6 Key Topics • Moore’s Law, power wall • Use of abstractions • Assembly language • Computer arithmetic • Pipelining • Using predictions • Memory hierarchies • Accelerators • Reliability and Security 7 Logistics -
Design of a Microelectronic Manufacturing Laboratory
2006-1635: DESIGN OF A MICROELECTRONIC MANUFACTURING LABORATORY Stilson Applin, Montana State University Todd Kaiser, Montana State University Page 11.407.1 Page © American Society for Engineering Education, 2006 Design of a Microelectronic Manufacturing Laboratory Abstract The design of an undergraduate microelectronic manufacturing laboratory for teaching will be described in the following paper. This laboratory emphasizes learning the processes of semiconductor manufacturing and clean room protocol. The laboratory is housed in a 500 square foot, class 10,000 facility. In the laboratory the students, with a junior standing and a science based background, will use a pre-made six mask set to create P and N type transistors as well as inverters and diodes. The students will be conducting oxidization, RCA clean, photolithography, etching, diffusion, metallization and other processes. A brief description of these processes and the methods used to teach them will also be described. In addition to these processes students will also learn about clean room protocol, chemical safety, and testing devices. All of these skills will be marketable to future employers and graduate schools. These same skills and processes will be covered in a seminar course for educators, with the main purpose of inspiring the high school teachers to teach about semiconductor manufacturing. The cost effective design is what makes the laboratory unique. The expenditure control is important due to the size of the Electrical Engineering department. The department has only 250 undergraduates and 40 graduate students, thus internal funding is difficult to obtain. A user fee paid by the students will cover the funding. This fee will be small and manageable for any college student. -
Linux on Ipaq
Linux on iPAQ Jamey Hicks Cambridge Research Laboratory, HP Labs February 9, 2004 hp Outline • Why Linux? • iPAQ Linux • Handheld Linux Products • Developing for ARM Linux • CRL Mercury BackPAQ February 2004 IPAQ Linux slide 2 Why Linux? • Full source/binary availability • Freedom to change any part of the system • Advanced networking – IPv6, MIPv6, IPSEC • Advanced security – ssh, sshd • Complete GUI flexibility – GTK and Qt – Microwindows, picogui, ... • Java 2 SE and ME it’s a full-fledged computer February 2004 IPAQ Linux slide 3 Why Linux? • More stable operating system – Protected process environment – User/kernel separation • Yields uptimes of 6-9 months when we last surveyed • Same software as laptop or server – Same kernel • Supports all protocols, filesystems • Subset of IO devices, though – Same API's • Not subset/superset – Same tools and utilities, python, perl, ruby, ... February 2004 IPAQ Linux slide 4 iPAQ Linux Constraints • Adjust for storage space (32MB) – This can be a problem – Can be helped by CF storage cards • Adjust for screen size (320x240 12 to 16 bit color) – GUI's need to be refactored • Adjust for lack of keyboard • Input methods: stylus, xkbd, xstroke, serial cable, remote input via X, ssh February 2004 IPAQ Linux slide 5 Linux on Linux on iPAQ • Bochs x86 emulator running on iPAQ • February 2004 IPAQ Linux slide 6 Linux Capabilities • Linux 2.4.19 and 2.6.1 • Networking – WLAN, WWAN – IPSEC and other VPN – IPv6, Mobile IP • Filesystems – JFFS2: compressed journaling flash filesystem – EXT3 on conventional drives Not just a zippy PDA, but a pocket workstation February 2004 IPAQ Linux slide 7 Hardware Support (February, 2004) • iPAQ H31xx, H36xx, H37xx, H38xx, H39xx, H5xxx – H22xx, H19[34]x in progress • Dell Axim • Toshiba e74x • Siemens Simpad • Jornada 560/720 • Keyboards: Stowaway, MicroKeyboard, etc. -
Introduction to Micro Electromechanical Systems”, F
A not so short Introduction to Micro Electromechanical Systems Franck CHOLLET, Haobing LIU 1 Please note that this work is published under a : Attribution-NonCommercial 2.5 You are free: • to copy, distribute, display, and perform the work • to make derivative works Under the following conditions: Attribution. Please attribute this work using: “A not so short Introduction to Micro Electromechanical Systems”, F. Chollet, HB. Liu, Jan. 2006, Noncommercial. You may not use this work for commercial purposes. • For any reuse or distribution, you must make clear to others the license terms of this work. • Any of these conditions can be waived if you get permission from the copyright holder. Your fair use and other rights are in no way affected by the above. This is a human-readable summary of the Legal Code (http://creativecommons.org/licenses/by-nc/2.5/legalcode). Table of Content 1. Why MEMS?.................................................................................................................4 1.1. What is MEMS and comparison with microelectronics .....................................4 1.2. Why MEMS technology .....................................................................................4 1.2.1. Advantages offered...................................................................................4 1.2.2. Diverse products and markets ..................................................................5 1.2.3. Economy of MEMS manufacturing and applications ..............................6 1.3. Major drivers for MEMS technology..................................................................8