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(12) Patent Application Publication (10) Pub. No.: US 2009/0284911 A1 Morehead (43) Pub

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(12) Patent Application Publication (10) Pub. No.: US 2009/0284911 A1 Morehead (43) Pub US 20090284.911A1 (19) United States (12) Patent Application Publication (10) Pub. No.: US 2009/0284911 A1 Morehead (43) Pub. Date: Nov. 19, 2009 (54) PELTIER-ASSISTED LIQUID-COOLED Related U.S. Application Data COMPUTERENCLOSURE (60) Provisional application No. 60/779,129, filed on Mar. (75) Inventor: Graham Andrew Morehead, 6, 2006. Waltham, MA (US) Publication Classification Correspondence Address: (51) Int. Cl. Graham Morehead H05K 7/20 (2006.01) 1770 Massachusetts Ave if 10 (52) U.S. Cl. ................................................... 361 f679.47 Cambridge, MA 02140 (US) (57) ABSTRACT (73) Assignee: Graham Morehead Disclosed is a design for a computer enclosure. Heat is passed from the heat-generating components directly to a non-con (21) Appl. No.: 11/712,142 ductive liquid coolant. Some of the heat is expelled directly to the environment via a heatsink "chimney', and some is (22) Filed: Feb. 28, 2007 expelled with the help of a thermoelectric heat pump. ANC E VIEW Patent Application Publication Nov. 19, 2009 Sheet 2 of 44 US 2009/0284911 A1 A iOOOOOOO wr uro c5 AZ m in t D W. W. Patent Application Publication Nov. 19, 2009 Sheet 3 of 44 US 2009/0284911A1 Patent Application Publication Nov. 19, 2009 Sheet 4 of 44 US 2009/0284911A1 Patent Application Publication Nov. 19, 2009 Sheet 5 of 44 US 2009/0284911A1 IIM IM Patent Application Publication Nov. 19, 2009 Sheet 7 of 44 US 2009/0284.911A1 The D. Patent Application Publication Nov. 19, 2009 Sheet 8 of 44 US 2009/0284911 A1 s E E E. E Patent Application Publication Nov. 19, 2009 Sheet 9 of 44 US 2009/0284911 A1 Patent Application Publication Nov. 19, 2009 Sheet 10 of 44 US 2009/0284911 A1 Patent Application Publication Nov. 19, 2009 Sheet 11 of 44 US 2009/0284911A1 Patent Application Publication Nov. 19, 2009 Sheet 12 of 44 US 2009/0284911A1 s Patent Application Publication Nov. 19, 2009 Sheet 13 of 44 US 2009/0284911 A1 Patent Application Publication Nov. 19, 2009 Sheet 14 of 44 US 2009/0284911A1 Patent Application Publication Nov. 19, 2009 Sheet 16 of 44 US 2009/0284911A1 ww.msawwaarsseraarurusewemwemawmwww.msassuum unusummammammaspaleathiesaertwarehamnardi porpsesarewmemmasawadawaaaaaaaamawadweappywmpenMummumwawsreewszewer www.amnomm apwm-Malaweswarup-Aerosawaewewram Patent Application Publication Nov. 19, 2009 Sheet 17 of 44 US 2009/0284911 A1 Patent Application Publication Nov. 19, 2009 Sheet 18 of 44 US 2009/0284911A1 Patent Application Publication Nov. 19, 2009 Sheet 19 of 44 US 2009/0284911A1 Patent Application Publication Nov. 19, 2009 Sheet 21 of 44 US 2009/0284911 A1 C5 - N C5 Patent Application Publication Nov. 19, 2009 Sheet 22 of 44 US 2009/0284911A1 po A <g t c5 Patent Application Publication Nov. 19, 2009 Sheet 23 of 44 US 2009/0284911A1 Patent Application Publication Nov. 19, 2009 Sheet 24 of 44 US 2009/0284911A1 sC 2.w Patent Application Publication Nov. 19, 2009 Sheet 25 of 44 US 2009/0284911A1 Patent Application Publication Nov. 19, 2009 Sheet 26 of 44 US 2009/0284911A1 Patent Application Publication Nov. 19, 2009 Sheet 27 of 44 US 2009/0284911A1 &ss & wa & : ro--~ ww8 & e -. : Patent Application Publication Nov. 19, 2009 Sheet 28 of 44 US 2009/0284911A1 X. 8. s sc Patent Application Publication Nov. 19, 2009 Sheet 29 of 44 US 2009/0284911A1 & Patent Application Publication Nov. 19, 2009 Sheet 30 of 44 US 2009/0284911A1 É & sw 2s s s Patent Application Publication Nov. 19, 2009 Sheet 31 of 44 US 2009/0284911A1 Patent Application Publication Nov. 19, 2009 Sheet 32 of 44 US 2009/0284911A1 w s ;s : : x * s 2x, 2i. Patent Application Publication Nov. 19, 2009 Sheet 33 of 44 US 2009/0284911A1 NOIJIVYH[]{OIHINOOTVOIRILOGITIGH Patent Application Publication Nov. 19, 2009 Sheet 34 of 44 US 2009/0284911A1 NOIJIVYHOOIHNOOTVOIOOTI Patent Application Publication NOIJIVYH[]{OIHINOOLNVTOOO Patent Application Publication Nov. 19, 2009 Sheet 36 of 44 US 2009/0284911A1 3;&$$$$$$$$$$$$$$ Patent Application Publication Nov. 19, 2009 Sheet 37 of 44 US 2009/0284911A1 & 4. 8: : 38 s : X Patent Application Publication Nov. 19, 2009 Sheet 38 of 44 US 2009/0284911A1 was Favvisor Friassissa Fafia aaaasawis AAAAAA.F8FAAAAat Air vrry treessivity Patent Application Publication Nov. 19, 2009 Sheet 39 of 44 US 2009/0284911A1 (suonoouuoouuenuodu?) Patent Application Publication Nov. 19, 2009 Sheet 40 of 44 US 2009/0284911A1 Patent Application Publication Nov. 19, 2009 Sheet 41 of 44 US 2009/0284911A1 Patent Application Publication Nov. 19, 2009 Sheet 42 of 44 US 2009/0284911A1 Patent Application Publication Nov. 19, 2009 Sheet 43 of 44 US 2009/0284911A1 s's g & sixs s E - 2 Patent Application Publication Nov. 19, 2009 Sheet 44 of 44 US 2009/0284911A1 Arnuwupho}}}\,(uoneum?uuoo?eudonu)z US 2009/02849 11 A1 Nov. 19, 2009 PELTIER-ASSISTED LIQUID-COOLED where it was cooled by a continuous source of chilled water. COMPUTERENCLOSURE Like in the Cray-2, the present invention transfers its heat to a liquid coolant which comes in direct contact with the heat PARENT CASE TEXT generating components. The invention can use FC-77, or another Substance called perfluoro-hexane, or any other liq 0001. This patent application claims the benefit of priority uid that is non-conductive and non-corrosive. The ideal liquid under the U.S. Provisional Patent Application No. 60/779, coolant would have a high thermal transmittivity, be chemi 129, titled “Compact multiprocessor Peltier-assisted liquid cally stable below 150C, and neither react with nor dissolve cooled standard-component computer, filed at a U.S. Post plastics, metals, nor adhesives. Office on Mar. 1, 2006, and received at the USPTO on Mar. 6, 0008 Unlike the Cray, the present invention does not 2006. require a constant Supply of chilled water. Heat is both con vexed and radiated to the environment by methods described FIELD OF THE INVENTION below. The expression of heat to the environment is aug 0002. The field of the invention includes electronics, cool mented with the help of solid-state thermoelectric coolers. ing systems, and Supercomputing. The invention is a 0009. The present invention relies on the Peltier effect to machine: a small-footprint Supercomputer which maximizes boost the efficiency of its heat transference system. The the capabilities of standard hardware. Peltier effect was discovered by Jean Charles Athanase Peltier in 1834. He described how a temperature differential BACKGROUND OF THE INVENTION can be created by an electric current flowing through certain 0003 Supercomputing is a field that attempts to take the combination of materials. These combinations became best of presently available technology and with it build a known as thermoelectric coolers, or heat pumps. The amount device that will enable the processing of logic on a scale not of heat that is moved through a Peltier-effect device is pro previously available. The most well-known names connected portional to the current. It is the inverse of the phenomenon to Supercomputing include ENIAC, Cray. Thinking discovered by Thomas Johann Seebeck in 1821. The usage of Machines, IBM Deep Blue, and the Earth Simulator built by Peltier-effect devices to cool electronic components wasn't NEC in Yokohama. Each of these represent a step forward in prevalent until the 1950's oncea better understanding of these top-end Supercomputing. materials was available. The present invention is different 0004. Like other supercomputers, the present invention is from prior art because of its combination of the usage of a useful for solving mathematical problems that would be too thermoelectric cooler with direct liquid convection cooling of cumbersome for less-powerful computers. These problems computer components and the vertical cooling passages, may come from Science, economics, pure math, or a multi which will be called “heatsink chimneys” from here on. More tude of other sources. The ENIAC was used to calculate specifically, each heatsink chimney has two parts: the “cool trajectories. The Earth Simulator will hopefully be able to ant chimney' and the “air chimney'. These will be described predict hurricanes. The present invention is a multipurpose later. This invention enables two very desirable qualities: computer—it would be very useful, for example, in enacting quiet and speed. The invention is quieter than air-cooled calculations of protein folding, market modeling, artificial computers because of their heavy reliance on fans. The inven intelligence, fluid dynamics, and any other parallelizable tion can use fans in certain embodiments, but it does not mathematical problem. require as much assistance from fans. The invention is faster 0005 Most researchers in this field work using the prin than air-cooled Supercomputers because liquid-cooling opens ciple of parallel processing: multiple processors each work up the possibility of overclocking (a procedure where the ing on a separate part of a problem. The present invention also CPU is reprogrammed to run faster than the factory defaults). works on this principle. It is different from prior art because of Overclocking in an air-cooled computer usually results in a the design of the enclosure. Its design enables the Supercom burnt-out CPU. puter to be uniquely compact, quiet, and fast. Definitions 0006 All high-end semiconductor-based computers have one or more major heat-generating components. Conven 0010) 64-bit processor: A processor that takes input tional computers are air cooled using finned heatsinks and chunks of 64 bits each. fans. Many high-end computers are liquid cooled—typically air chimney: A chamber with extruded fins on the inside by a circulation of water which comes in thermal contact with designed to allow air to pass from the bottom and out the top. the main heat-generating components, without actually com The main body is constructed from a material with high ing in contact with them. Because of water's conductive and thermal conductivity.
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