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Z10 EC System Overview Level 06B, February 2011

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System z10 Enterprise Class System Overview SA22-1084-06 Level 06b, February 2011 System z10 Enterprise Class System Overview SA22-1084-06 Level 06b, February 2011 Level 06b, February 2011 Note Before using this information and the product it supports, read the information in “Safety” on page xi, Appendix D, “Notices,” on page 151, and IBM Systems Environmental Notices and User Guide, Z125-5823. | This edition, SA22-1084-06, applies to the IBM System z10 Enterprise Class (z10 EC) server. This edition replaces | SA22-1084-05. Technical changes to the text are indicated by a vertical bar (|) to the left of the change. There might be a newer version of this document in a PDF file available on Resource Link.Goto http://www.ibm.com/servers/resourcelink and click Library on the navigation bar. A newer version is indicated by a lowercase, alphabetic letter following the form number suffix (for example: 00a, 00b, 01a, 01b). © Copyright IBM Corporation 2008, 2011. US Government Users Restricted Rights – Use, duplication or disclosure restricted by GSA ADP Schedule Contract with IBM Corp. Level 06b, February 2011 Contents Figures ..............vii Power sequence controller .........31 Additional features/functions supported ....31 Tables ...............ix Monitoring and estimating CPC power consumption and temperature .......31 Preplanning and setting up the Storage Area Safety ...............xi Network (SAN) environment .......32 Safety notices ..............xi World trade safety information .......xi Chapter 3. Software support .....33 Laser safety information ..........xi z/OS ................34 Laser compliance ...........xi z/VM ................35 z/VSE ................35 About this publication ........xiii Linux on System z ............36 What is included in this publication ......xiii TPF.................36 Revisions ..............xiii Prerequisite publications..........xiii Chapter 4. Channel subsystem (CSS) Related publications ...........xiii Parallel Sysplex publications .......xiv structure ..............37 OSA publications ...........xv IOCP channel and link definitions .......38 Cryptographic publications ........xv Coupling link peer channels ........39 Miscellaneous publications ........xv Subchannel connectivity ..........40 Related websites.............xv Guidelines for maximum availability ......40 Additional online information .......xvi InfiniBand and ICB-4 configurations ......43 Engineering change (EC) level considerations . xvi Planning for channel subsystem .......44 How to send your comments ........xvi PCHID assignments ..........44 AID assignments ...........46 Summary of changes ........xix PCHID report ............47 CHPID Mapping Tool ..........47 Multiple Image Facility (MIF) ........48 Chapter 1. Introduction ........1 Spanned channels ............48 z10 EC highlights.............2 Internal coupling and HiperSockets channels . 49 z10 EC models.............7 IOCP considerations ...........49 Performance .............8 LPAR definition ............49 Resource Link .............8 Channel path definition .........50 Fiber optic cabling ...........9 I/O device definition ..........50 z/Architecture ..............9 Hardware Configuration Definition (HCD) Upgrade progression ...........11 considerations .............50 Unsupported features/functions .......11 Chapter 5. I/O connectivity ......53 Chapter 2. Hardware characteristics . 13 FICON and FCP channels .........53 System frame configuration .........13 FICON Express8 features .........53 Central Processor Complex (CPC) ......14 FICON Express4 features .........54 I/O cages ..............22 FICON Express2 features .........55 Support Element............25 FICON Express features .........55 System power supply ..........26 Name server registration .........55 Internal Battery Feature .........26 High Performance FICON for System z (zHPF) 55 Internet Protocol Version 6 .........27 Improved performance at extended distance . 56 Cooling equipment ............27 MIDAW facility ............56 Multiple Subchannel Sets (MSS) .......27 Multipath Initial Program Load (IPL) .....56 LPAR mode ..............27 Purge path extended ..........56 Processor units ............28 Fibre channel analysis ..........56 Storage ...............28 Fibre Channel Protocol (FCP) for SCSI devices. 56 Channels ..............29 ESCON channels ............62 LPAR time offset support.........29 Multipath Initial Program Load (IPL) .....62 Server Time Protocol (STP) .........30 ESCON converter operation ........62 Hardware Management Console .......30 I/O operations control..........64 Bolt-down kit..............31 I/O interface protocol ..........66 © Copyright IBM Corp. 2008, 2011 iii Level 06b, February 2011 ESCON channel performance .......69 Chapter 8. Cabling .........105 OSA channels..............71 Fiber Quick Connect (FQC) for ESCON and FICON Supported CHPID types .........72 LX cabling ..............106 OSA/SF ..............72 Cabling responsibilities ..........106 OSA-Express3 features..........73 Cable ordering .............107 OSA-Express2 features..........75 Cabling report .............108 OSA-Express3 and OSA-Express2 supported functions ..............76 Chapter 9. Hardware Management HiperSockets ..............78 Console and Support Element ....111 Broadcast support ...........78 IPv6 support .............78 Hardware Management Console Application VLAN support ............78 (HWMCA) ..............112 HiperSockets Network Concentrator .....78 Hardware Management Console and Support HiperSockets Network Traffic Analyzer ....79 Element enhancements for System z10 EC ....112 Layer 2 (Link Layer) support .......79 Hardware Management Console and Support Multiple Write Facility..........80 Element network connection ........113 Hardware Management Console (HMC) features Chapter 6. Sysplex functions .....81 and functions .............113 Customization of the HMC or SE......113 Parallel Sysplex .............81 Status reporting ...........113 Parallel Sysplex coupling link connectivity ....82 Service Required state .........114 Peer mode..............83 Degrade indicator ...........114 ISC-3 links..............83 Hardware messages ..........115 ICB-4 links .............84 Operating system messages........115 InfiniBand (IFB) links ..........85 Problem analysis and reporting ......115 IC links...............86 Virtual RETAIN ...........116 Timing-only links ...........86 Licensed Internal Code (LIC) .......116 Coupling facility.............87 Remote I/O configuration and IOCDS CFCC considerations ..........87 management.............116 Coupling connection considerations .....89 Scheduled operations ..........116 Server Time Protocol (STP) .........89 Remote Support Facility (RSF) .......117 System-managed CF structure duplexing ....92 Automation and API support .......118 Geographically Dispersed Parallel Sysplex (GDPS) 93 CPC activation ............118 GDPS/PPRC .............93 NTP client/server support on the HMC . 119 GDPS/XRC .............94 z/VM integrated systems management ....119 GDPS/Global Mirror ..........94 Installation support for z/VM using the HMC 119 Intelligent Resource Director (IRD) ......94 User authentication ..........119 LPAR CPU management (clustering) .....95 Network protocols...........119 I/O priority queuing (IOPQ) .......95 Customizable console date and time.....120 Dynamic channel path management (DCM) . 96 System I/O configuration analyzer (SIOA) . 120 Workload manager (WLM) ........96 Network analysis tool for Support Element EAL5 certification ............97 communications ...........120 Instant messaging facility ........120 Chapter 7. Cryptography .......99 Screen capture function .........120 CP Assist for Cryptographic Function (CPACF) . 99 Call-home servers selection........120 Protected key CPACF..........100 User interface ............120 Enablement and disablement of DEA key and User authority ............121 AES key functions...........100 Available media ...........121 Crypto Express2 and Crypto Express3 .....100 Security considerations ..........121 Crypto Express2 ...........100 Change management considerations ......122 Crypto Express3 ...........101 Remote operations and remote access .....123 User-defined extensions ..........101 Remote manual operations ........124 Trusted Key Entry (TKE) .........102 Remote automated operations .......125 Trusted Key Entry (TKE) with Smart Card Readers ..............103 Chapter 10. Reliability, Availability, Wizard for migrating cryptographic and Serviceability (RAS).......127 configuration data ...........103 Reliability ..............127 RMF monitoring ............103 Availability ..............127 FIPS certification ............104 Concurrent book add (CBA) .......127 Remote loading of ATM and POS keys .....104 Enhanced book availability ........127 Redundant I/O interconnect .......127 iv z10 EC System Overview Level 06b, February 2011 Flexible memory ...........128 Geographically Dispersed Parallel Sysplex Plan ahead features ..........128 (GDPS) ..............137 Enhanced driver maintenance .......129 Concurrent undo CBU .........137 Dynamic oscillator switchover.......129 Fiber optic cabling...........137 Program directed re-IPL .........129 CHPID Mapping Tool .........138 Processor unit (PU) sparing .......129 Multipath initial program load ......138 Processor design ...........130 Point to point SMP network .......138 Support Element (SE)..........130 System-initiated CHPID reconfiguration . 138 Hardware Management Console ......130 Link aggregation support ........138 Attaching to IBM
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