Spotlight on Ansys 12.0
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FEA Newsletter October 2011
October Issue - 11th Anniversary Issue PreSys™ R3 Release BETA CAE Systems S.A. FE Modeling Tool release ANSA v13.2.0 ESI engineer David Prono transatlantic boat race The Stealth LLNL M. King (left) and physicist W. Moss B-2 Spirit compression test helmet pad TABLE OF CONTENTS 2. Table of Contents 4. FEA Information Inc. Announcements 5. Participant & Industry Announcements 6. Participants 7. BETA CAE Systems S.A. announces the release of ANSA v13.2.0 11. Making A Difference Guenter & Margareta Mueller 13. LLNL researchers find way to mitigate traumatic brain injury 16. ESI sponsors in-house engineer David Prono for a transatlantic boat race 18. ETA - PreSys™ R3 Release FE Modeling Tool Now Offers ‘Part Groups’ Function 20. Toyota Collaborative Safety Research Center 23. LSTC SID-IIs-D FAST - Finite Element Model 27. Website Showcase The Snelson Atom 28. New Technology - “Where You At?” 29. SGI - Benchmarks- Top Crunch.org 35. Aerospace - The Stealth 2 36. Reference Library - Available Books 38. Solutions - PrePost Processing - Model Editing 39. Solutions - Software 40. Cloud Services – SGI 42. Cloud Services – Gridcore 43. Global Training Courses 50. FEA - CAE Consulting/Consultants 53. Software Distributors 57. Industry News - MSC.Software 59. Industry News – SGI 60. Industry News - CRAY 3 FEA Information Inc. Announcements Welcome to our 11th Anniversary Issue. A special thanks to a few of our first participant’s that supported, and continue to support FEA Information Inc.: Abe Keisoglou and Cathie Walton, (ETA) US, Brian Walker, Oasys, UK Christian Tanasecu, SGI, Guenter and Margareta Mueller, CADFEM Germany, Sam Saltiel, BETA CAE Systems SA, Greece Companies - JSOL - LSTC With this issue we will be adding new directions, opening participation, and have brought on additional staff. -
GPU Developments 2018
GPU Developments 2018 2018 GPU Developments 2018 © Copyright Jon Peddie Research 2019. All rights reserved. Reproduction in whole or in part is prohibited without written permission from Jon Peddie Research. This report is the property of Jon Peddie Research (JPR) and made available to a restricted number of clients only upon these terms and conditions. Agreement not to copy or disclose. This report and all future reports or other materials provided by JPR pursuant to this subscription (collectively, “Reports”) are protected by: (i) federal copyright, pursuant to the Copyright Act of 1976; and (ii) the nondisclosure provisions set forth immediately following. License, exclusive use, and agreement not to disclose. Reports are the trade secret property exclusively of JPR and are made available to a restricted number of clients, for their exclusive use and only upon the following terms and conditions. JPR grants site-wide license to read and utilize the information in the Reports, exclusively to the initial subscriber to the Reports, its subsidiaries, divisions, and employees (collectively, “Subscriber”). The Reports shall, at all times, be treated by Subscriber as proprietary and confidential documents, for internal use only. Subscriber agrees that it will not reproduce for or share any of the material in the Reports (“Material”) with any entity or individual other than Subscriber (“Shared Third Party”) (collectively, “Share” or “Sharing”), without the advance written permission of JPR. Subscriber shall be liable for any breach of this agreement and shall be subject to cancellation of its subscription to Reports. Without limiting this liability, Subscriber shall be liable for any damages suffered by JPR as a result of any Sharing of any Material, without advance written permission of JPR. -
CTL RFP Proposal
State of Maine Department of Education in coordination with the National Association of State Procurement Officials PROPOSAL COVER PAGE RFP # 201210412 MULTI-STATE LEARNING TECHNOLOGY INITIATIVE Bidder’s Organization Name: CTL Chief Executive - Name/Title: Erik Stromquist / COO Tel: 800.642.3087 x 212 Fax: 503.641.5586 E-mail: [email protected] Headquarters Street Address: 3460 NW Industrial St. Headquarters City/State/Zip: Portland, OR 97210 (provide information requested below if different from above) Lead Point of Contact for Proposal - Name/Title: Michael Mahanay / GM, Sales & Marketing Tel: 800.642.3087 x 205 Fax: 503.641.5586 E-mail: [email protected] Street Address: 3460 NW Industrial St. City/State/Zip: Portland, OR 97219 Proposed Cost: $294/yr. The proposed cost listed above is for reference purposes only, not evaluation purposes. In the event that the cost noted above does not match the Bidder’s detailed cost proposal documents, then the information on the cost proposal documents will take precedence. This proposal and the pricing structure contained herein will remain firm for a period of 180 days from the date and time of the bid opening. No personnel on the multi-state Sourcing Team or any other involved state agency participated, either directly or indirectly, in any activities relating to the preparation of the Bidder’s proposal. No attempt has been made or will be made by the Bidder to induce any other person or firm to submit or not to submit a proposal. The undersigned is authorized to enter into contractual obligations on behalf of the above-named organization. -
ANSYS Contact Technology Guide
ANSYS Contact Technology Guide ANSYS Release 9.0 002114 November 2004 ANSYS, Inc. is a UL registered ISO 9001: 2000 Company. ANSYS Contact Technology Guide ANSYS Release 9.0 ANSYS, Inc. Southpointe 275 Technology Drive Canonsburg, PA 15317 [email protected] http://www.ansys.com (T) 724-746-3304 (F) 724-514-9494 Copyright and Trademark Information Copyright © 2004 SAS IP, Inc. All rights reserved. Unauthorized use, distribution or duplication is prohibited. ANSYS, DesignSpace, CFX, DesignModeler, DesignXplorer, ANSYS Workbench environment, AI*Environment, CADOE and any and all ANSYS, Inc. product names referenced on any media, manual or the like, are registered trademarks or trademarks of subsidiaries of ANSYS, Inc. located in the United States or other countries. ICEM CFD is a trademark licensed by ANSYS, Inc. All other trademarks and registered trademarks are property of their respective owners. ANSYS, Inc. is a UL registered ISO 9001: 2000 Company. ANSYS Inc. products may contain U.S. Patent No. 6,055,541. Microsoft, Windows, Windows 2000 and Windows XP are registered trademarks of Microsoft Corporation. Inventor and Mechanical Desktop are registered trademarks of Autodesk, Inc. SolidWorks is a registered trademark of SolidWorks Corporation. Pro/ENGINEER is a registered trademark of Parametric Technology Corporation. Unigraphics, Solid Edge and Parasolid are registered trademarks of Electronic Data Systems Corporation (EDS). ACIS and ACIS Geometric Modeler are registered trademarks of Spatial Technology, Inc. FLEXlm License Manager is a trademark of Macrovision Corporation. This ANSYS, Inc. software product and program documentation is ANSYS Confidential Information and are furnished by ANSYS, Inc. under an ANSYS software license agreement that contains provisions concerning non-disclosure, copying, length and nature of use, warranties, disclaimers and remedies, and other provisions. -
AMD EPYC™ 7371 Processors Accelerating HPC Innovation
AMD EPYC™ 7371 Processors Solution Brief Accelerating HPC Innovation March, 2019 AMD EPYC 7371 processors (16 core, 3.1GHz): Exceptional Memory Bandwidth AMD EPYC server processors deliver 8 channels of memory with support for up The right choice for HPC to 2TB of memory per processor. Designed from the ground up for a new generation of solutions, AMD EPYC™ 7371 processors (16 core, 3.1GHz) implement a philosophy of Standards Based AMD is committed to industry standards, choice without compromise. The AMD EPYC 7371 processor delivers offering you a choice in x86 processors outstanding frequency for applications sensitive to per-core with design innovations that target the performance such as those licensed on a per-core basis. evolving needs of modern datacenters. No Compromise Product Line Compute requirements are increasing, datacenter space is not. AMD EPYC server processors offer up to 32 cores and a consistent feature set across all processor models. Power HPC Workloads Tackle HPC workloads with leading performance and expandability. AMD EPYC 7371 processors are an excellent option when license costs Accelerate your workloads with up to dominate the overall solution cost. In these scenarios the performance- 33% more PCI Express® Gen 3 lanes. per-dollar of the overall solution is usually best with a CPU that can Optimize Productivity provide excellent per-core performance. Increase productivity with tools, resources, and communities to help you “code faster, faster code.” Boost AMD EPYC processors’ innovative architecture translates to tremendous application performance with Software performance. More importantly, the performance you’re paying for can Optimization Guides and Performance be matched to the appropriate to the performance you need. -
Mass-Producing Your Certified Cluster Solutions
Mass-Producing Your Certified Cluster Solutions White Paper The Intel® Cluster Ready program is designed to help you make the most of your engineering Intel® Cluster Ready resources. The program enables you to sell several different types of clusters from each solution High-Performance you design, by varying the hardware while maintaining the same software stack. You can gain a Computing broader range of cluster products to sell without engineering each one “from scratch.” As long as the software stack remains the same and works on each one of the hardware configurations, you can be confident that your clusters will interoperate with registered Intel Cluster Ready applications. Your customers can purchase your clusters with that same confidence, knowing they’ll be able to get their applications up and running quickly on your systems. Intel® Cluster Ready: Mass-Producing Your Certified Cluster Solutions Table of Contents Overview of Production-Related Activities � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � 3 Creating and certifying recipes � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � 3 Maintaining recipes � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � 3 Mass-producing recipes � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � -
Ansys, Inc. BUY Company Update : Software
March 9, 2020 Ansys, Inc. BUY Company Update : Software Let there be light Ansys has announced the acquisition of Lumerical, a privately- held developer of photonic design and simulation tools. The company, based in Vancouver, was founded in 2003. Jay Vleeschhouwer [email protected] Two decades ago, we asked EDA managements about the 646-442-4251 possible or eventual role of photons in computing, and the answer was that it was something to consider but that it was or would be on the horizon (or event horizon, as it were) for some time . They were Stock Symbol NASDAQ: ANSS right but that role now seems much closer to being meaningful Current Price $228.70 or necessary, though it is premature to quantify (or quanta-fy) in 12 mos. Target Price $284.00 terms of revenues, not to mention what will likely have to be a good Market Cap $19,075.7 mln gestation period vis-à-vis duly modifying or updating customers’ Shares O/S 87.0 mln design and engineering processes and techniques (meaning this acquisition is for strategic positioning as the engineering software Avg Daily Vol. (3 mos.) 472,288 shs. market evolves, as it will in this and in other respects). 52-Week Price Low/High $174.25 - $299.06 P/B 6.8x This acquisition fits with Ansys' history of acquiring physics- Price/ FCF 0.5x based software and IP, and will be part of the physics business unit (rather than, for instance, the semiconductor unit) inasmuch Fiscal Year End Dec as photonics will have a role in addressing multiple simulation ROE 19% types and application/end-market uses, i.e., multi-physics to EPS complement existing simulation functions in the portfolio. -
NVM Express and the PCI Express* SSD Revolution SSDS003
NVM Express and the PCI Express* SSD Revolution Danny Cobb, CTO Flash Memory Business Unit, EMC Amber Huffman, Sr. Principal Engineer, Intel SSDS003 Agenda • NVM Express (NVMe) Overview • New NVMe Features in Enterprise & Client • Driver Ecosystem for NVMe • NVMe Interoperability and Plugfest Plans • EMC’s Perspective: NVMe Use Cases and Proof Points The PDF for this Session presentation is available from our Technical Session Catalog at the end of the day at: intel.com/go/idfsessions URL is on top of Session Agenda Pages in Pocket Guide 2 Agenda • NVM Express (NVMe) Overview • New NVMe Features in Enterprise & Client • Driver Ecosystem for NVMe • NVMe Interoperability and Plugfest Plans • EMC’s Perspective: NVMe Use Cases and Proof Points 3 NVM Express (NVMe) Overview • NVM Express is a scalable host controller interface designed for Enterprise and client systems that use PCI Express* SSDs • NVMe was developed by industry consortium of 80+ members and is directed by a 13-company Promoter Group • NVMe 1.0 was published March 1, 2011 • Product introductions later this year, first in Enterprise 4 Technical Basics • The focus of the effort is efficiency, scalability and performance – All parameters for 4KB command in single 64B DMA fetch – Supports deep queues (64K commands per Q, up to 64K queues) – Supports MSI-X and interrupt steering – Streamlined command set optimized for NVM (6 I/O commands) – Enterprise: Support for end-to-end data protection (i.e., DIF/DIX) – NVM technology agnostic 5 NVMe = NVM Express NVMe Command Execution 7 1 -
Michael Raad 5667 Clouds Mill Drive, Alexandria, VA, 22310 | (571) 685-0009 | [email protected]
Michael Raad 5667 Clouds Mill Drive, Alexandria, VA, 22310 | (571) 685-0009 | [email protected] Education BACHELOR OF ENGINEERING | MECHANICAL ENGINEERING | CLASS OF 2019 Experience Mechanical Engineer Intern | Consolidated Contractors Company (CCC) | June 2018 – July 2018 . Learned various processes and techniques that streamline communication on big scale projects . Worked under the supervision of engineers from different departments, familiarizing me to various engineering tasks such as Design, Procurement, Quality Assurance and Quality Control . Worked on the technical drawings and validated their accordance to many specifications such as the Qatar Constructions Specifications . Represented CCC under Quality Control by supervising technical and safety tests of elevators . Handled work orders with sub-contractors and clients on the site as part of Quality Assurance, working for 60 hours a week under temperatures exceeding 115 Maintenance Engineer | PepsiCo | January 2018 . Oversaw manufacturing processes in a large scale production facility under strict international food safety standards . Supervised maintenance work over heavy machinery . Researched for means to recover heat losses in boiler setups Engineering Intern | BMW | August 2016 . Familiarized through hands-on experience with the different systems in a vehicle . Repaired different mechanisms such as brakes, gearboxes and engine components Projects SAE SUPERMILEAGE . Designed a hyper-efficient single seater vehicle . Carried stress and CFD analysis on the vehicle that were crucial for the development of the project car using Fluent . Reduced the weight of the engine mount by performing optimization techniques using ANSYS . Developed the vehicle’s powertrain and remodeled the carbon fiber monocoque . Negotiated sponsorship proposals with several companies within the education, oil and gas and logistics industries. -
The H1B Records Below List the Companies That Have Submitted the Greatest Number of H1B Visa Petitions for This Location
The H1B records below list the companies that have submitted the greatest number of H1B visa petitions for this location. This information was gathered directly from Department of Labor (DOL) records, which is the government agency responsible for all H1B submissions. Every quarter, DOL makes available a listing of all companies who have submitted H1B visa applications for the most recent 3 months for which records are available. The records contained in Going Global's H1B Plus database contains the most recent 12-month period of records available. Sort by Company | Petitions MASTECH, INC., A MASTECH HOLDINGS, 4339 INC. COMPANY MASTECH RESOURCING, INC. 1393 MASTECH ALLIANCE, INC., A MASTECH 1040 HOLDINGS COMPANY NESS USA, INC. 693 UNIVERSITY OF PITTSBURGH 169 UHCP D/B/A UPMC MEP 144 COGENT INFOTECH CORPORATION 131 SDLC MANAGEMENT, INC. 123 FIRST CONSULTING GROUP, LLC 104 ANSYS, INC. 100 COMPUTER ENTERPRISES, INC. 97 CARNEGIE MELLON UNIVERSITY 96 INTELLECT DESIGN ARENA INC. 95 ACCION LABS US, INC. 63 HM HEALTH SOLUTIONS INC. 57 UNIVERSITY OF PITTSBURGH PHYSICIANS 44 H.J. HEINZ COMPANY 40 CV CONSULTING INC 36 THE BANK OF NEW YORK MELLON 36 INFOYUGA TECHNOLOGIES, INC. 36 BAYER BUSINESS AND TECHNOLOGY 31 SERVICES, LLC UPMC EMERGENCY MEDICINE, INC. 28 GALAX-ESYSTEMS CORPORATION 26 HIGHMARK, INC. 25 SEVEN HILLS SOFTWARE TECHNOLOGIES 25 INC VELAGA ASSOCIATES, INC 24 UPMC PRESBYTERIAN SHADYSIDE 22 DVI TECHNOLOGES, INC. 21 ALLEGHENY CLINIC 20 GENCO I. INC. 17 SRI MOONLIGHT SOFTWARE SOLUTIONS 17 LLC BAYER MATERIALSCIENCE, LLC 16 BAYER HEALTHCARE PHARMACEUTICALS, 16 INC. VISVERO, INC. 16 CYBYTE, INC. 15 BOMBARDIER TRANSPORTATION 15 (HOLDINGS) USA, INC. -
ANSYS Advantage Thermal Managment
™ ADVANADVANTAGETAGE| | Excellence in Engineering Simulation VOLUME X ISSUE 1 2016 6 Beat the Heat 13 Cooling Trend 21 Hot Flash elcome to ANSYS Advantage! We hope you Realize Your Product Promise® enjoy these articles by ANSYS customers, ANSYS enables you to predict with confidence that your staff and partners. Want to be part of a products will thrive in the real world. Customers trust our future issue? Contact the editorial team solutions to help ensure the integrity of products and drive with your idea for an article. business success through innovation. Industry leaders use ANSYS to simulate complete virtual prototypes of complex WThe Editorial Staff, ANSYS Advantage products and systems — comprising mechanical, electronics [email protected] and embedded software components — that incorporate all the physical phenomena that exist in real-world environments. Executive & Editorial Adviser Managing Editor Tom Smithyman ANSYS, Inc. For ANSYS, Inc. sales information, Chris Reeves Southpointe call +1 844.GO ANSYS Editorial Contributor 2600 ANSYS Drive Email the editorial staff at Senior Editor ANSYS Customer Excellence Canonsburg, PA 15317 [email protected]. U.S.A. Tim Palucka North America For address changes, contact Subscribe at [email protected]. ansys.com/advantage Editors Art Directors Erik Ferguson Ron Santillo Kara Gremillion Dan Hart Neither ANSYS, Inc. nor DH4 Design guarantees or warrants accuracy or completeness of the material contained in this publication. Thomas Matich Gregg Weber ANSYS, ALinks, -
Previous Mechanical Engineering Industry Employers
The University of Iowa College of Engineering Professional Development Cooperative Education/Internship Program Previous Mechanical Engineering Industry Employers Company Name Location(s) 3M Various Accenture Chicago, IA AGCO Corp Park Jackson ALCAN, Inc. Des Moines, IA Alcoa Riverside, IA All Power Labs Berkeley, CA Alliant Energy Cedar Rapids, IA, Madison, WI Allsteel Muscatine, IA Amana Commercial Products Cedar Rapids, IA Amcor Rigid Plastics Manchester, MI American Ordnance Manchester, MI Andersen Corporation Des Moines, IA Ansys Canonsburg, PA Archer Daniels Midland Fremont, NE Associated Materials, Inc. Cedar Rapids, IA ASV Inventions Huntington Beach, CA AutoTruck Group Bartlett, IA Baker Group Des Moines, IA BASF Malcom, IA Bemis Company, Inc. Des Moines, IA Boeing Seattle, WA, Philadelphia, PA Boston Scientific Marlborough, MA BPC Group Orlando, FL Brooks Borg Skiles Architecture Engineering Des Moines, IA Burlington Northern Santa Fe Harre, MT Cadbury Loves Park, IL Cargill Various Case New Holland Industrial Burlington, IA Caterpillar Various CDW Government Chicago, IL Centro, Inc. North Liberty, IA Charles Industries, Ltd. Rantoul, IL Chicago Bridge & Iron Company Chicago, IL Citgo Lemont, IL CIVCO Medical Solutions Coralville, IA, Kalona, IA Clark, Richardson, and Biskup Consulting St. Louis, MO Clear Sign Seattle, WA Clifford Jacobs Forging Various Climco Coils, Inc. Morrison, IL Clipper Windpower Cedar Rapids, IA The University of Iowa College of Engineering Professional Development Cooperative Education/Internship Program