DOCSLIB.ORG

Spotlight on Ansys 12.0

Total Page：16

File Type：pdf, Size：1020Kb

Download full-text PDF Read full-text
Spotlight on Ansys 12.0 TM EXCELLENCE IN ENGINEERING SIMULATION ADVANTAGEVOLUME III ISSUE 1 2009 SPOTLIGHT ON ANSYS 12.0 FRAMEWORK MULTIPHYSICS HIGH-PERFORMANCE PAGE 6 PAGE 11 COMPUTING PAGE 25 EDITORIAL Engineering Simulation: t pa Needed Now © iStockphoto.com/Atra More Than Ever In a tough economy, forward-thinking companies are investing in leading-edge simulation technology to drive top-line revenue growth and bottom-line savings. Time and cost benefits of engineering simulation are this simulation method has the potential to reduce crack well documented. Predicting product performance and growth analysis time by over 90 percent compared determining optimal solutions early in the design phase help with manual methods. The productivity gain will enable to avoid late-stage problems and to eliminate trial-and-error engineers to analyze more designs annually, thus keeping testing cycles that drive up costs and bog down schedules. up with increased demand for turbochargers around the Simulation enables engineers to perform what-if studies world and strengthening the company’s leadership and to compare alternatives, processes that otherwise position in this competitive industry sector. would be impractical. Indeed, bottom-line savings are The prediction method is based on improved fracture one key benefit that prompts most companies to implement mechanics capabilities for calculating J integrals, one of simulation, and are most readily quantified in return-on- the many enhancements in ANSYS 12.0. Previewed in the investment calculations. Spotlight section of this issue, the release is a milestone A second, and potentially greater, benefit is boosting for the software supplier and a huge step forward for the top-line revenue growth. With simulation, companies can CAE industry in terms of advancements in individual develop innovative, winning products that stand apart from physics (structural, fluid, thermal and electromagnetics) others, make the status quo obsolete or create entirely new and integration of this functionality into a unified multi- market opportunities. Brand value can be enhanced physics framework for Simulation Driven Product by tuning product performance to specific performance Development — an approach leading to top-line revenue characteristics. Revenue streams may be expanded by growth and bottom-line savings for many companies. increasing design throughput of new products or tackling Discussion of the business value of simulation is projects that otherwise would not be attempted. particularly relevant in today’s world as manufacturers How specific companies leverage simulation in face the toughest economic climate of a lifetime. Indeed, achieving these benefits depends on their unique products, with their survival at stake, forward-thinking companies engineering challenges and business requirements. The recognize the need to invest in engineering simulation now possibilities are limitless. Case in point is detailed in this more than ever to withstand the current market turbulence issue’s article “Predicting 3-D Fatigue Cracks without a and to strengthen their long-term competitive position, Crystal Ball” from Honeywell Turbo Technologies. Engineers brand value and profitability as conditions improve in the used software from ANSYS to predict thermomechanical coming years. ■ fatigue cracks in turbochargers for internal combustion engines. Predicting crack failures early enables engineers to optimize designs upfront and helps to avoid qualification test failures that lead to additional rounds of tests — which can be very expensive and take weeks to complete. Further, John Krouse, Senior Editor and Industry Analyst www.ansys.com ANSYS Advantage • Volume III, Issue 1, 2009 1 CONTENTS Table of Contents SPOTLIGHT ON ANSYS 12.0 4 ANSYS 12.0 Launching a New Era of Smart Engineering Simulation A full generation ahead of other solutions, ANSYS 12.0 takes product design and development to the next level. 6 FRAMEWORK 4 Introducing ANSYS Workbench 2.0 Proven simulation technology is delivered in a truly innovative integration framework. 8 GEOMETRY AND MESHING Taking Shape in 12.0 ANSYS combines depth of simulation with industry experience to provide geometry and meshing tools that realize simulation results faster. 11 MULTIPHYSICS Multiphysics for the Real World 8 In ANSYS 12.0, multiphysics capabilities continue to increase in flexibility, application and ease of use. 14 ELECTROMAGNETICS ANSYS Emag 12.0 Generates Solutions Improved accuracy, speed and platform integration advance the capabilities of low-frequency electromagnetic simulation. 15 FLUIDS A Flood of Fluids Developments A new integrated environment and technology enhancements make fluids simulation faster, more intuitive and more accurate. 11 18 STRUCTURAL MECHANICS Designing with Structure Advancements in structural mechanics allow more efficient and higher-fidelity modeling of complex structural phenomena. 22 EXPLICIT DYNAMICS Explicit Dynamics Goes Mainstream ANSYS 12.0 brings native explicit dynamics to ANSYS Workbench and provides the easiest explicit software for nonlinear dynamics. 23 EIGENSOLVER Introducing the Supernode Eigensolver A new eigensolver in ANSYS 12.0 determines large numbers of natural frequency modes more quickly and efficiently than conventional methods. 15 25 HIGH-PERFORMANCE COMPUTING The Need for Speed From desktop to supercomputer, high-performance computing with ANSYS 12.0 continues to race ahead. 28 FUTURE DIRECTIONS Foundations for the Future The many advanced features of ANSYS 12.0 were designed to solve today’s challenging engineering problems and to deliver a platform for tomorrow’s simulation technology. 22 2 ANSYS Advantage • Volume III, Issue 1, 2009 www.ansys.com CONTENTS SIMULATION @ WORK DEPARTMENTS 31 AUTOMOTIVE 47 TIPS AND TRICKS Predicting 3-D Fatigue Cracks without Reusing Legacy Meshes a Crystal Ball ANSYS tools enable users to work with finite element models ANSYS tools quickly predict 3-D thermomechanical fatigue in various formats for performing simulations as well as cracking in turbocharger components. making changes to part geometry. 33 HEALTHCARE 49 ACADEMIC Electromagnetics in Medicine Expanding Stent Knowledge Electromagnetic and thermal simulations find use in medical Simulation provides the medical industry with a closer look applications. at stent procedures. 36 ELECTRONICS Keeping Cool in the Field A communications systems company gains millions of dollars by using thermal simulation to bring tactical radios to market faster. 38 BUILT ENVIRONMENT Designing Against the Wind Simulation helps develop screen enclosures that can better withstand hurricane-force winds. 40 ENVIRONMENT Stabilizing Nuclear Waste Fluid simulation solidifies its role in the radioactive waste 38 treatment process. 42 OPTIMIZATION Topology Optimization and Casting: A Perfect Combination Using topology optimization and structural simulation helps a casting company develop better products faster. 44 MARINE Fighting Fire with Simulation The U.K. Ministry of Defence uses engineering simulation to find alternatives to ozone-depleting substances for 49 fire suppression. For ANSYS, Inc. sales information, call 1.866.267.9724, or visit www.ansys.com. For address changes, contact AdvantageAddressChange@ansys.com. To subscribe to ANSYS Advantage, go to www.ansys.com/subscribe. Executive Editor Editors Ad Sales Manager Circulation Manager About the Cover Fran Hensler Erik Ferguson Helen Renshaw Sharon Everts ANSYS introduces release 12.0, Shane Moeykens the next-generation technology Managing Editor Mark Ravenstahl Editorial Advisor for Simulation Driven Product Chris Reeves Kelly Wall Development. The spotlight Contributors begins on page 4. Senior Editor and Susan Wheeler Designer Industry Analyst Marty Mundy Miller Creative Group John Krouse ANSYS Advantage is published for ANSYS, Inc. customers, partners and others interested in the field of design and analysis applications. Neither ANSYS, Inc. nor the senior editor nor Miller Creative Group guarantees or warrants accuracy or completeness of the material contained in this publication. ANSYS, ANSYS Workbench, Ansoft Designer, CFX, AUTODYN, FLUENT, GAMBIT, POLYFLOW, Airpak, DesignSpace, FIDAP, Flotran, Iceboard, Icechip, Icemax, Icepak, FloWizard, FLOWLAB, G/Turbo, MixSim, Nexxim, Q3D Extractor, Maxwell, Simplorer, Mechanical, Professional, Structural, DesignModeler, TGrid, AI*Environment, ASAS, AQWA, AutoReaGas, Blademodeler, DesignXplorer, Drop Test, ED, Engineering Knowledge Manager, Emag, Fatigue, Icepro, Icewave, Mesh Morpher, ParaMesh, TAS, TASSTRESS, TASFET, TurboGrid, Vista, VT Accelerator, CADOE, CoolSim, SIwave, Turbo Package Analyzer, RMxprt, PExprt, HFSS, Full-Wave SPICE, Simulation Driven Product Development, Smart Engineering Simulation and any and all ANSYS, Inc. brand, product, service, and feature names, logos and slogans are registered trademarks or trademarks of ANSYS, Inc. or its subsidiaries located in the United States or other countries. ICEM CFD is a trademark licensed by ANSYS, Inc. All other brand, product, wwwservice.ansys.com and feature names or trademarks are the property of their respective owners. ANSYS Advantage • Volume III, Issue 1, 2009 3 © 2009 ANSYS, Inc. All rights reserved. ANSYS 12.0: Launching a New Era of Smart Engineering Simulation A full generation ahead of other solutions, ANSYS 12.0 takes product design and development to the next level. By Jim Cashman, President and CEO, ANSYS, Inc. The current economic climate has completely changed simulation in much the
Load more

Recommended publications
  • FEA Newsletter October 2011
    October Issue - 11th Anniversary Issue PreSys™ R3 Release BETA CAE Systems S.A. FE Modeling Tool release ANSA v13.2.0 ESI engineer David Prono transatlantic boat race The Stealth LLNL M. King (left) and physicist W. Moss B-2 Spirit compression test helmet pad TABLE OF CONTENTS 2. Table of Contents 4. FEA Information Inc. Announcements 5. Participant & Industry Announcements 6. Participants 7. BETA CAE Systems S.A. announces the release of ANSA v13.2.0 11. Making A Difference Guenter & Margareta Mueller 13. LLNL researchers find way to mitigate traumatic brain injury 16. ESI sponsors in-house engineer David Prono for a transatlantic boat race 18. ETA - PreSys™ R3 Release FE Modeling Tool Now Offers ‘Part Groups’ Function 20. Toyota Collaborative Safety Research Center 23. LSTC SID-IIs-D FAST - Finite Element Model 27. Website Showcase The Snelson Atom 28. New Technology - “Where You At?” 29. SGI - Benchmarks- Top Crunch.org 35. Aerospace - The Stealth 2 36. Reference Library - Available Books 38. Solutions - PrePost Processing - Model Editing 39. Solutions - Software 40. Cloud Services – SGI 42. Cloud Services – Gridcore 43. Global Training Courses 50. FEA - CAE Consulting/Consultants 53. Software Distributors 57. Industry News - MSC.Software 59. Industry News – SGI 60. Industry News - CRAY 3 FEA Information Inc. Announcements Welcome to our 11th Anniversary Issue. A special thanks to a few of our first participant’s that supported, and continue to support FEA Information Inc.: Abe Keisoglou and Cathie Walton, (ETA) US, Brian Walker, Oasys, UK Christian Tanasecu, SGI, Guenter and Margareta Mueller, CADFEM Germany, Sam Saltiel, BETA CAE Systems SA, Greece Companies - JSOL - LSTC With this issue we will be adding new directions, opening participation, and have brought on additional staff.
    [Show full text]
  • GPU Developments 2018
    GPU Developments 2018 2018 GPU Developments 2018 © Copyright Jon Peddie Research 2019. All rights reserved. Reproduction in whole or in part is prohibited without written permission from Jon Peddie Research. This report is the property of Jon Peddie Research (JPR) and made available to a restricted number of clients only upon these terms and conditions. Agreement not to copy or disclose. This report and all future reports or other materials provided by JPR pursuant to this subscription (collectively, “Reports”) are protected by: (i) federal copyright, pursuant to the Copyright Act of 1976; and (ii) the nondisclosure provisions set forth immediately following. License, exclusive use, and agreement not to disclose. Reports are the trade secret property exclusively of JPR and are made available to a restricted number of clients, for their exclusive use and only upon the following terms and conditions. JPR grants site-wide license to read and utilize the information in the Reports, exclusively to the initial subscriber to the Reports, its subsidiaries, divisions, and employees (collectively, “Subscriber”). The Reports shall, at all times, be treated by Subscriber as proprietary and confidential documents, for internal use only. Subscriber agrees that it will not reproduce for or share any of the material in the Reports (“Material”) with any entity or individual other than Subscriber (“Shared Third Party”) (collectively, “Share” or “Sharing”), without the advance written permission of JPR. Subscriber shall be liable for any breach of this agreement and shall be subject to cancellation of its subscription to Reports. Without limiting this liability, Subscriber shall be liable for any damages suffered by JPR as a result of any Sharing of any Material, without advance written permission of JPR.
    [Show full text]
  • CTL RFP Proposal
    State of Maine Department of Education in coordination with the National Association of State Procurement Officials PROPOSAL COVER PAGE RFP # 201210412 MULTI-STATE LEARNING TECHNOLOGY INITIATIVE Bidder’s Organization Name: CTL Chief Executive - Name/Title: Erik Stromquist / COO Tel: 800.642.3087 x 212 Fax: 503.641.5586 E-mail: estromquist@ctl.net Headquarters Street Address: 3460 NW Industrial St. Headquarters City/State/Zip: Portland, OR 97210 (provide information requested below if different from above) Lead Point of Contact for Proposal - Name/Title: Michael Mahanay / GM, Sales & Marketing Tel: 800.642.3087 x 205 Fax: 503.641.5586 E-mail: mmahanay@ctl.net Street Address: 3460 NW Industrial St. City/State/Zip: Portland, OR 97219 Proposed Cost: $294/yr. The proposed cost listed above is for reference purposes only, not evaluation purposes. In the event that the cost noted above does not match the Bidder’s detailed cost proposal documents, then the information on the cost proposal documents will take precedence. This proposal and the pricing structure contained herein will remain firm for a period of 180 days from the date and time of the bid opening. No personnel on the multi-state Sourcing Team or any other involved state agency participated, either directly or indirectly, in any activities relating to the preparation of the Bidder’s proposal. No attempt has been made or will be made by the Bidder to induce any other person or firm to submit or not to submit a proposal. The undersigned is authorized to enter into contractual obligations on behalf of the above-named organization.
    [Show full text]
  • ANSYS Contact Technology Guide
    ANSYS Contact Technology Guide ANSYS Release 9.0 002114 November 2004 ANSYS, Inc. is a UL registered ISO 9001: 2000 Company. ANSYS Contact Technology Guide ANSYS Release 9.0 ANSYS, Inc. Southpointe 275 Technology Drive Canonsburg, PA 15317 ansysinfo@ansys.com http://www.ansys.com (T) 724-746-3304 (F) 724-514-9494 Copyright and Trademark Information Copyright © 2004 SAS IP, Inc. All rights reserved. Unauthorized use, distribution or duplication is prohibited. ANSYS, DesignSpace, CFX, DesignModeler, DesignXplorer, ANSYS Workbench environment, AI*Environment, CADOE and any and all ANSYS, Inc. product names referenced on any media, manual or the like, are registered trademarks or trademarks of subsidiaries of ANSYS, Inc. located in the United States or other countries. ICEM CFD is a trademark licensed by ANSYS, Inc. All other trademarks and registered trademarks are property of their respective owners. ANSYS, Inc. is a UL registered ISO 9001: 2000 Company. ANSYS Inc. products may contain U.S. Patent No. 6,055,541. Microsoft, Windows, Windows 2000 and Windows XP are registered trademarks of Microsoft Corporation. Inventor and Mechanical Desktop are registered trademarks of Autodesk, Inc. SolidWorks is a registered trademark of SolidWorks Corporation. Pro/ENGINEER is a registered trademark of Parametric Technology Corporation. Unigraphics, Solid Edge and Parasolid are registered trademarks of Electronic Data Systems Corporation (EDS). ACIS and ACIS Geometric Modeler are registered trademarks of Spatial Technology, Inc. FLEXlm License Manager is a trademark of Macrovision Corporation. This ANSYS, Inc. software product and program documentation is ANSYS Confidential Information and are furnished by ANSYS, Inc. under an ANSYS software license agreement that contains provisions concerning non-disclosure, copying, length and nature of use, warranties, disclaimers and remedies, and other provisions.
    [Show full text]
  • AMD EPYC™ 7371 Processors Accelerating HPC Innovation
    AMD EPYC™ 7371 Processors Solution Brief Accelerating HPC Innovation March, 2019 AMD EPYC 7371 processors (16 core, 3.1GHz): Exceptional Memory Bandwidth AMD EPYC server processors deliver 8 channels of memory with support for up The right choice for HPC to 2TB of memory per processor. Designed from the ground up for a new generation of solutions, AMD EPYC™ 7371 processors (16 core, 3.1GHz) implement a philosophy of Standards Based AMD is committed to industry standards, choice without compromise. The AMD EPYC 7371 processor delivers offering you a choice in x86 processors outstanding frequency for applications sensitive to per-core with design innovations that target the performance such as those licensed on a per-core basis. evolving needs of modern datacenters. No Compromise Product Line Compute requirements are increasing, datacenter space is not. AMD EPYC server processors offer up to 32 cores and a consistent feature set across all processor models. Power HPC Workloads Tackle HPC workloads with leading performance and expandability. AMD EPYC 7371 processors are an excellent option when license costs Accelerate your workloads with up to dominate the overall solution cost. In these scenarios the performance- 33% more PCI Express® Gen 3 lanes. per-dollar of the overall solution is usually best with a CPU that can Optimize Productivity provide excellent per-core performance. Increase productivity with tools, resources, and communities to help you “code faster, faster code.” Boost AMD EPYC processors’ innovative architecture translates to tremendous application performance with Software performance. More importantly, the performance you’re paying for can Optimization Guides and Performance be matched to the appropriate to the performance you need.
    [Show full text]
  • Mass-Producing Your Certified Cluster Solutions
    Mass-Producing Your Certified Cluster Solutions White Paper The Intel® Cluster Ready program is designed to help you make the most of your engineering Intel® Cluster Ready resources. The program enables you to sell several different types of clusters from each solution High-Performance you design, by varying the hardware while maintaining the same software stack. You can gain a Computing broader range of cluster products to sell without engineering each one “from scratch.” As long as the software stack remains the same and works on each one of the hardware configurations, you can be confident that your clusters will interoperate with registered Intel Cluster Ready applications. Your customers can purchase your clusters with that same confidence, knowing they’ll be able to get their applications up and running quickly on your systems. Intel® Cluster Ready: Mass-Producing Your Certified Cluster Solutions Table of Contents Overview of Production-Related Activities � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � 3 Creating and certifying recipes � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � 3 Maintaining recipes � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � 3 Mass-producing recipes � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � �
    [Show full text]
  • Ansys, Inc. BUY Company Update : Software
    March 9, 2020 Ansys, Inc. BUY Company Update : Software Let there be light Ansys has announced the acquisition of Lumerical, a privately- held developer of photonic design and simulation tools. The company, based in Vancouver, was founded in 2003. Jay Vleeschhouwer jvleeschhouwer@griffinsecurities.com Two decades ago, we asked EDA managements about the 646-442-4251 possible or eventual role of photons in computing, and the answer was that it was something to consider but that it was or would be on the horizon (or event horizon, as it were) for some time . They were Stock Symbol NASDAQ: ANSS right but that role now seems much closer to being meaningful Current Price $228.70 or necessary, though it is premature to quantify (or quanta-fy) in 12 mos. Target Price $284.00 terms of revenues, not to mention what will likely have to be a good Market Cap $19,075.7 mln gestation period vis-à-vis duly modifying or updating customers’ Shares O/S 87.0 mln design and engineering processes and techniques (meaning this acquisition is for strategic positioning as the engineering software Avg Daily Vol. (3 mos.) 472,288 shs. market evolves, as it will in this and in other respects). 52-Week Price Low/High $174.25 - $299.06 P/B 6.8x This acquisition fits with Ansys' history of acquiring physics- Price/ FCF 0.5x based software and IP, and will be part of the physics business unit (rather than, for instance, the semiconductor unit) inasmuch Fiscal Year End Dec as photonics will have a role in addressing multiple simulation ROE 19% types and application/end-market uses, i.e., multi-physics to EPS complement existing simulation functions in the portfolio.
    [Show full text]
  • NVM Express and the PCI Express* SSD Revolution SSDS003
    NVM Express and the PCI Express* SSD Revolution Danny Cobb, CTO Flash Memory Business Unit, EMC Amber Huffman, Sr. Principal Engineer, Intel SSDS003 Agenda • NVM Express (NVMe) Overview • New NVMe Features in Enterprise & Client • Driver Ecosystem for NVMe • NVMe Interoperability and Plugfest Plans • EMC’s Perspective: NVMe Use Cases and Proof Points The PDF for this Session presentation is available from our Technical Session Catalog at the end of the day at: intel.com/go/idfsessions URL is on top of Session Agenda Pages in Pocket Guide 2 Agenda • NVM Express (NVMe) Overview • New NVMe Features in Enterprise & Client • Driver Ecosystem for NVMe • NVMe Interoperability and Plugfest Plans • EMC’s Perspective: NVMe Use Cases and Proof Points 3 NVM Express (NVMe) Overview • NVM Express is a scalable host controller interface designed for Enterprise and client systems that use PCI Express* SSDs • NVMe was developed by industry consortium of 80+ members and is directed by a 13-company Promoter Group • NVMe 1.0 was published March 1, 2011 • Product introductions later this year, first in Enterprise 4 Technical Basics • The focus of the effort is efficiency, scalability and performance – All parameters for 4KB command in single 64B DMA fetch – Supports deep queues (64K commands per Q, up to 64K queues) – Supports MSI-X and interrupt steering – Streamlined command set optimized for NVM (6 I/O commands) – Enterprise: Support for end-to-end data protection (i.e., DIF/DIX) – NVM technology agnostic 5 NVMe = NVM Express NVMe Command Execution 7 1
    [Show full text]
  • Michael Raad 5667 Clouds Mill Drive, Alexandria, VA, 22310 | (571) 685-0009 | Michelraad11@Gmail.Com
    Michael Raad 5667 Clouds Mill Drive, Alexandria, VA, 22310 | (571) 685-0009 | michelraad11@gmail.com Education BACHELOR OF ENGINEERING | MECHANICAL ENGINEERING | CLASS OF 2019 Experience Mechanical Engineer Intern | Consolidated Contractors Company (CCC) | June 2018 – July 2018 . Learned various processes and techniques that streamline communication on big scale projects . Worked under the supervision of engineers from different departments, familiarizing me to various engineering tasks such as Design, Procurement, Quality Assurance and Quality Control . Worked on the technical drawings and validated their accordance to many specifications such as the Qatar Constructions Specifications . Represented CCC under Quality Control by supervising technical and safety tests of elevators . Handled work orders with sub-contractors and clients on the site as part of Quality Assurance, working for 60 hours a week under temperatures exceeding 115 Maintenance Engineer | PepsiCo | January 2018 . Oversaw manufacturing processes in a large scale production facility under strict international food safety standards . Supervised maintenance work over heavy machinery . Researched for means to recover heat losses in boiler setups Engineering Intern | BMW | August 2016 . Familiarized through hands-on experience with the different systems in a vehicle . Repaired different mechanisms such as brakes, gearboxes and engine components Projects SAE SUPERMILEAGE . Designed a hyper-efficient single seater vehicle . Carried stress and CFD analysis on the vehicle that were crucial for the development of the project car using Fluent . Reduced the weight of the engine mount by performing optimization techniques using ANSYS . Developed the vehicle’s powertrain and remodeled the carbon fiber monocoque . Negotiated sponsorship proposals with several companies within the education, oil and gas and logistics industries.
    [Show full text]
  • The H1B Records Below List the Companies That Have Submitted the Greatest Number of H1B Visa Petitions for This Location
    The H1B records below list the companies that have submitted the greatest number of H1B visa petitions for this location. This information was gathered directly from Department of Labor (DOL) records, which is the government agency responsible for all H1B submissions. Every quarter, DOL makes available a listing of all companies who have submitted H1B visa applications for the most recent 3 months for which records are available. The records contained in Going Global's H1B Plus database contains the most recent 12-month period of records available. Sort by Company | Petitions MASTECH, INC., A MASTECH HOLDINGS, 4339 INC. COMPANY MASTECH RESOURCING, INC. 1393 MASTECH ALLIANCE, INC., A MASTECH 1040 HOLDINGS COMPANY NESS USA, INC. 693 UNIVERSITY OF PITTSBURGH 169 UHCP D/B/A UPMC MEP 144 COGENT INFOTECH CORPORATION 131 SDLC MANAGEMENT, INC. 123 FIRST CONSULTING GROUP, LLC 104 ANSYS, INC. 100 COMPUTER ENTERPRISES, INC. 97 CARNEGIE MELLON UNIVERSITY 96 INTELLECT DESIGN ARENA INC. 95 ACCION LABS US, INC. 63 HM HEALTH SOLUTIONS INC. 57 UNIVERSITY OF PITTSBURGH PHYSICIANS 44 H.J. HEINZ COMPANY 40 CV CONSULTING INC 36 THE BANK OF NEW YORK MELLON 36 INFOYUGA TECHNOLOGIES, INC. 36 BAYER BUSINESS AND TECHNOLOGY 31 SERVICES, LLC UPMC EMERGENCY MEDICINE, INC. 28 GALAX-ESYSTEMS CORPORATION 26 HIGHMARK, INC. 25 SEVEN HILLS SOFTWARE TECHNOLOGIES 25 INC VELAGA ASSOCIATES, INC 24 UPMC PRESBYTERIAN SHADYSIDE 22 DVI TECHNOLOGES, INC. 21 ALLEGHENY CLINIC 20 GENCO I. INC. 17 SRI MOONLIGHT SOFTWARE SOLUTIONS 17 LLC BAYER MATERIALSCIENCE, LLC 16 BAYER HEALTHCARE PHARMACEUTICALS, 16 INC. VISVERO, INC. 16 CYBYTE, INC. 15 BOMBARDIER TRANSPORTATION 15 (HOLDINGS) USA, INC.
    [Show full text]
  • ANSYS Advantage Thermal Managment
    ™ ADVANADVANTAGETAGE| | Excellence in Engineering Simulation VOLUME X ISSUE 1 2016 6 Beat the Heat 13 Cooling Trend 21 Hot Flash elcome to ANSYS Advantage! We hope you Realize Your Product Promise® enjoy these articles by ANSYS customers, ANSYS enables you to predict with confidence that your staff and partners. Want to be part of a products will thrive in the real world. Customers trust our future issue? Contact the editorial team solutions to help ensure the integrity of products and drive with your idea for an article. business success through innovation. Industry leaders use ANSYS to simulate complete virtual prototypes of complex WThe Editorial Staff, ANSYS Advantage products and systems — comprising mechanical, electronics ansys-advantage@ansys.com and embedded software components — that incorporate all the physical phenomena that exist in real-world environments. Executive & Editorial Adviser Managing Editor Tom Smithyman ANSYS, Inc. For ANSYS, Inc. sales information, Chris Reeves Southpointe call +1 844.GO ANSYS Editorial Contributor 2600 ANSYS Drive Email the editorial staff at Senior Editor ANSYS Customer Excellence Canonsburg, PA 15317 ansys-advantage@ansys.com. U.S.A. Tim Palucka North America For address changes, contact Subscribe at AdvantageAddressChange@ansys.com. ansys.com/advantage Editors Art Directors Erik Ferguson Ron Santillo Kara Gremillion Dan Hart Neither ANSYS, Inc. nor DH4 Design guarantees or warrants accuracy or completeness of the material contained in this publication. Thomas Matich Gregg Weber ANSYS, ALinks,
    [Show full text]
  • Previous Mechanical Engineering Industry Employers
    The University of Iowa College of Engineering Professional Development Cooperative Education/Internship Program Previous Mechanical Engineering Industry Employers Company Name Location(s) 3M Various Accenture Chicago, IA AGCO Corp Park Jackson ALCAN, Inc. Des Moines, IA Alcoa Riverside, IA All Power Labs Berkeley, CA Alliant Energy Cedar Rapids, IA, Madison, WI Allsteel Muscatine, IA Amana Commercial Products Cedar Rapids, IA Amcor Rigid Plastics Manchester, MI American Ordnance Manchester, MI Andersen Corporation Des Moines, IA Ansys Canonsburg, PA Archer Daniels Midland Fremont, NE Associated Materials, Inc. Cedar Rapids, IA ASV Inventions Huntington Beach, CA AutoTruck Group Bartlett, IA Baker Group Des Moines, IA BASF Malcom, IA Bemis Company, Inc. Des Moines, IA Boeing Seattle, WA, Philadelphia, PA Boston Scientific Marlborough, MA BPC Group Orlando, FL Brooks Borg Skiles Architecture Engineering Des Moines, IA Burlington Northern Santa Fe Harre, MT Cadbury Loves Park, IL Cargill Various Case New Holland Industrial Burlington, IA Caterpillar Various CDW Government Chicago, IL Centro, Inc. North Liberty, IA Charles Industries, Ltd. Rantoul, IL Chicago Bridge & Iron Company Chicago, IL Citgo Lemont, IL CIVCO Medical Solutions Coralville, IA, Kalona, IA Clark, Richardson, and Biskup Consulting St. Louis, MO Clear Sign Seattle, WA Clifford Jacobs Forging Various Climco Coils, Inc. Morrison, IL Clipper Windpower Cedar Rapids, IA The University of Iowa College of Engineering Professional Development Cooperative Education/Internship Program
    [Show full text]