WSP-3263

Inside Plant Grounding and Bonding Standard

Revision 1.0

Inside Plant Grounding and Bonding Standard WSP-3263 Revision 1.0

Copyright Notice

Copyright © 2001 Windstream ® Incorporated. All rights reserved. The entire contents of this document are protected under the United States copyright laws. You may print and download portions of material from this document for your own internal, non-commercial use. For any other copying, redistribution, retransmission or publication of any downloaded material; you must have the express written prior consent of Windstream Incorporated. “Windstream”, the Windstream logo, and all related products and service names, marks, and slogans are trademarks of Windstream Incorporated. Misuse of the trademarks or any other content in this publication is strictly prohibited.

Windstream Proprietary and Confidential ii Inside Plant Grounding and Bonding Standard WSP-3263 Revision 1.0 Table of Contents

Table of Contents

List of Figures ...... v Document Purpose ...... vi Revision History ...... vi Areas Affected ...... vii Approval ...... vii

1. OVERVIEW ...... 1 2. BONDING AND GROUNDING SYSTEMS ...... 2 2.1. Master Ground Bar (MGB) ...... 4 2.1.1. Purpose of the MGB ...... 4 A. Surge Producers (The "P" Section of the MGB) ...... 4 B. Surge Absorbers (The "A" section of the MGB) ...... 4 C. Non-IGZ Grounds (The "N" section of MGB) ...... 5 D. IGZ Conductors (The "I" section of the MGB) ...... 5 2.2. Facility Equipment To Be Bonded to the MGB ...... 5 2.2.1. Cable Entrance Ground Bar (CEGB) ...... 5 2.2.2. Cable Entrance Lightning Protection ...... 5 2.2.3. Main Distributing Frame Ground Bar (MDFGB) ...... 5 2.2.4. Radio and Microwave Equipment Grounds ...... 5 2.2.5. Outdoor Standby Power Plant Enclosure Ground ...... 5 2.2.6. Multi-grounded Neutral (MGN) ...... 5 2.2.7. Site Ground Field ...... 6 2.2.8. Lightning Rod Ground Field ...... 6 2.2.9. Radio/Microwave Tower Fence Ground ...... 6 2.2.10. Facility Metallic Water System...... 6 2.2.11. Building Structural Ground ...... 6 2.2.12. Bonding Cable Tray ...... 6 2.2.13. Bonding DC Power Room ...... 7 2.3. Equipment Outside Isolated Ground Zones ...... 7 2.4. Rack-Mounted Equipment Grounding ...... 7 2.4.1. Rack-Mounted Shelf Without Ground Terminal ...... 7 2.4.2. Rack-Mounted Shelf With Ground Terminal ...... 7

3. MGB GROUND RESISTANCE OBJECTIVE ...... 9 4. IGZ GROUND WINDOW BAR (GWB) ...... 10 4.1. Equipment Grounds Originating inside IGZ ...... 10 4.2. Bond GWB to the MGB ...... 10 4.3. Metallic Equipment Grounds in the IGZ ...... 10 4.3.1. Exposed Metallic Surfaces within the IGZ ...... 10 4.3.2. Receptacles in IGZ ...... 10

Windstream Proprietary and Confidential iii Inside Plant Grounding and Bonding Standard WSP-3263 Revision 1.0 Table of Contents

4.3.3. Racked AC Equipment in IGZ ...... 11 4.3.4. IGZ Racks Insulated from the Building ...... 11 4.3.5. Racks Not Insulated from the Building ...... 11 4.3.6. Lighting Fixtures in IGZ ...... 11 4.3.7. Other Equipment in IGZ ...... 11

5. NON -STANDARD EQUIPMENT ...... 12 6. BONDING CONDUCTOR SIZING ...... 13 6.1. Sizing Protective Grounding Conductors ...... 13 6.1.1. Small Office with Short Bonding conductor Runs ...... 13 6.1.2. Medium-Size Office with Longer Bonding Conductor Runs ...... 13 6.1.3. Large Office with Long Bonding Conductor Runs ...... 13 6.2. Sizing Conductor from MGB to GWB ...... 14 6.3. Sizing Conductor from MGB to Multi-Grounded Neutral ...... 14 7. PLANNING AND INSTALLING BONDING AND GROUNDING SYSTEMS ...... 15 7.1. Vertical Risers in Multistory Buildings ...... 15 7.2. Method for Distributing Grounding to Equipment ...... 17 8. GROUNDING RECEPTACLE CIRCUITS INSIDE THE IGZ ...... 20 9. DEFINITIONS ...... 23 10. REFERENCES ...... 27 11. APPENDIX A ...... 28 12. APPENDIX B ...... 29 13. APPENDIX C ...... 30

Windstream Proprietary and Confidential iv Inside Plant Grounding and Bonding Standard WSP-3263 Revision 1.0 List of Figures

List of Figures

Figure 1 - Central Office Ground System ...... 3 Figure 2 – Master Ground Bar Details ...... 4 Figure 3 - Isolated Ground Zone ...... 10 Figure 4 – Example: Short Main-Aisle Feeder and Aisle Conductor Sizes ...... 13 Figure 5 – Example: Longer Main-Aisle and Aisle Conductor Sizes ...... 13 Figure 6 – Vertical Riser for Multi-Story Building ...... 16 Figure 7 – Typical Frame Ground Distribution Method ...... 17 Figure 8 – Rack Ground Installation Details ...... 18 Figure 9 – Improper Rack Grounding Methods ...... 19 Figure 10 – Inverter inside the IGZ ...... 20 Figure 11 – Inverter outside the IGZ ...... 21 Figure 12 – Conventional Receptacle Circuit in IGZ ...... 22

Windstream Proprietary and Confidential v Inside Plant Grounding and Bonding Standard WSP-3263 Revision 1.0 Document Purpose

Document Purpose

This document provides guidelines for designing a system of grounding and bonding conductors. Revision History

Version: 1.0 Release Date: 10/1/12 Summary of Changes: Initial Release Author: James Ellis Subject Matter Expert: Bruce Heater, Raymond Shreffler File Name: WSP3685_1-0.doc

Windstream Proprietary and Confidential vi Inside Plant Grounding and Bonding Standard WSP-3263 Revision 1.0 Areas Affected

Areas Affected

Network Engineering Facilities Engineering Network Operations

Approval

Technical Standards Development Committee which is made up of members from Engineering, Installation, and Operations review and approve all WSPs.

List of approvals available upon request.

Windstream Proprietary and Confidential vii Inside Plant Grounding and Bonding Standard WSP-3263 Revision 1.0 Overview

1. OVERVIEW This WSP covers the complex subject of designing and installing grounding and bonding systems for Windstream telecommunications equipment. A properly installed grounding and bonding system will reduce electrocution hazards for Windstream staff and will improve the reliability of the communications equipment they maintain. The bonding and grounding system discussed here is primarily designed for single-floor office buildings. Proper application of these principles may be extended to multi-floor installations. This standard does not require the immediate updating of a facility ground many facilities and the ground systems are Grand-fathered in. If an issue arises with a facility that is determined to be grounding related and grounding audit must be performed. All possible defects that are found are reviewed by the responsible Windstream Engineering Group to develop a plan for corrective action if required.

Windstream Proprietary and Confidential 1 Inside Plant Grounding and Bonding Standard WSP-3263 Revision 1.0 Bonding and Grounding Systems

2. BONDING AND GROUNDING SYSTEMS The Master Ground Bar (MGB) bonding conductor system shown in Figure 1 (on the next page) provides maximum protection for personnel and for equipment. This system must be maintained for all Windstream sites. Since most transient currents seek earth (lightning and some power system faults), the Central Office Ground System concentrates surge producing sources at one end of the MGB (the P- area) and concentrates most transient absorption in the A-area adjacent to the P-area. Both the P and A areas have direct earth connections. This configuration allows most transient currents to dissipate to earth with little or no impact on the equipment connected to the N-area or the I-area of the MGB. These areas of the MGB will be discussed in more detail in section 2.1. The MGB bonding and grounding conductor system showed in Figure 1 lists resistance objectives for each lead that connects to the MGB. The resistance objective value was developed by a consortium of digital switch manufacturers and several governmental agencies with the purpose of minimizing damage to sensitive digital electronics as a result of lightning, power system transients and Nuclear Electromagnetic Pulses (NEMP). Strict adherence to these resistance objectives will minimize electronic equipment failures.

Windstream Proprietary and Confidential 2 Inside Plant Grounding and Bonding Standard WSP-3263 Revision 1.0 Bonding and Grounding Systems Inverters

Only 1 Only ground acrossthis line

RRXXX.XX RRXXX.XX or Larger or

IGZ Area IGZ 2/0 AWG 2/0 Chargers

GWB

RRXXX.XX RRXXX.XX + IsolatedGround Zone Batteries

+ 500 MCM or larger or MCM 500 Battery ReturnBattery (+) Bar Board (MPDF) By ElectricianBy MainPower

Legend

RRXXX.XX RRXXX.XX 0.005 Ω 0.005 FGB

Non-IGZ Non-IGZ Area

RRXXX.XX RRXXX.XX (All equipment(All outside the IGZ) Integrated Ground Plane Floor Panel Neutral Bar

Service Panel

Panel Neutral Bar

Service Entrance RRXXX.XX RRXXX.XX Master Master BarGround (MGB) Green Wire Bar Green Wire Bar System

Underground Metallic PipeWater

Absorber Absorber Area Ω 0.01

or less or each larger, or 0.005 Ω Ω 0.005 2/0 − 2

0.01 Ω 0.01 0.01 Ω 0.01

0.01 Ω 0.01 0.01 Ω 0.01

FootingSteel

0.01 Ω 0.01

Producer Area Producer Ω 0.01 0.01 Ω 0.01 same same building) (CEGB) Bar Bar (MDFGB) Standby Generator Frame (inFrame Generator Standby Fencing Radio Radio Cabinets Perimeter (If Installed) CentalOffice Rod Rod Ground Field BuildingLightning Main Distributing Frame Ground Ground Frame Distributing Main Ground(COGF) Field Cable Entrance Ground Ground Bar Cable Entrance Tower GroundRodField

Figure 1 - Central Office Ground System

Windstream Proprietary and Confidential 3 Inside Plant Grounding and Bonding Standard WSP-3263 Revision 1.0 Bonding and Grounding Systems

2.1. Master Ground Bar (MGB)

2.1.1. Purpose of the MGB The MGB is the hub of the basic site grounding system. It is the common point of connection for the surge producers (P) and surge absorbers (A), and equipment bonding conductors to both the Non-isolated (N) and Isolated (I) equipment areas. 1 and 2 may be used to size grounding and bonding conductors to be connected to the MGB. Figure 2 shows the relationship between the P, A, N and I sections of the MGB. The MGB must be located near the point of entry of the electric service and the site ground fields.

Figure 2 – Master Ground Bar Details

A. Surge Producers (The "P" Section of the MGB) The P-section of the MGB is the required connection point for surge producers that are exposed to indirect transient currents and power contact. The following are sources of indirect transient currents: • Communications antennas bring secondary lightning transient currents to radio cabinets within the facility. • Communications cables from outside the facility (telephone cables and fiber optic cables) bring both lightning and power system indirect currents into the facility. • Exposed facilities equipment (generator housings, meter poles, above-ground fiber and paired cable pedestals, air conditioners, site fences and other outdoor metallic objects) are sources of indirect transient currents. B. Surge Absorbers (The "A" section of the MGB) The MGB is the mandatory connection point for the three primary surge absorbers. They are: • power system multi-grounded neutral • site ground field • metallic water system

Windstream Proprietary and Confidential 4 Inside Plant Grounding and Bonding Standard WSP-3263 Revision 1.0 Bonding and Grounding Systems

Bonding of the power neutral and water pipe, on the MGB does not replace the requirements of the National Electrical Code (NEC) for separately bonding the commercial power service. C. Non-IGZ Grounds (The "N" section of MGB) The “N” section bonds each non-Isolated Ground Zone (IGZ) Ground Window Bar (GWB) to a single point. The single point connection helps minimize voltage differences between groups of equipment racks and other exposed metallic surfaces in the non-IGZ area. The bond between the “N” section and the Battery plant Battery Return Bus (+) does not normally carry DC power current. It helps stabilize the voltage relationship between battery return and station ground. D. IGZ Conductors (The "I" section of the MGB) Each IGZ GWB bonding conductor terminates on the “I” section of the MGB. No other types of connections to the “I” area are permitted.

2.2. Facility Equipment To Be Bonded to the MGB

2.2.1. Cable Entrance Ground Bar (CEGB) All Outside Plant (OSP) cable sheaths must be bonded to the CEGB at the point of entry into the building. The CEGB must be bonded to the MGB by the shortest possible route using an insulated conductor sized according to Figure 1 or Table 1 and Table 2. 2.2.2. Cable Entrance Lightning Protection All Outside Plant (OSP) copper cables must be protected against transient currents produced by lightning. Protection will be provided by terminating each individual copper wires to a wall mounted Protected Entrance Terminal (PET). The PET will use either gas or solid state transient protectors for suppression, and will need to be grounded to the facility ground with at least 6 awg green cable. For detailed part numbers and procedures, refer to the IPACK.

2.2.3. Main Distributing Frame Ground Bar (MDFGB) If the communications facility has many paired cables brought to the site, then a MDFGB is required. The MDFGB must be bonded to the MGB by the shortest possible route using an insulated conductor sized according to Figure 1 or Table 1 and Table 2. 2.2.4. Radio and Microwave Equipment Grounds Connect all indoor cabinets of the radio and microwave equipment directly to the MGB. No connections should be made to the GWB or other facility ironwork. 2.2.5. Outdoor Standby Power Plant Enclosure Ground The generator frame and enclosure must be grounded to minimize touch potential and step potential hazards. Install ground rods at each corner of the enclosure and bond them together with Cad Welded stranded 2/0 or larger bare conductor. Extend one tail (NEC Article 250- 122, 2/0 minimum) from the generator ring ground field to the generator frame and one tail (2/0 minimum) to the “P” section of the MGB. 2.2.6. Multi-grounded Neutral (MGN)

Windstream Proprietary and Confidential 5 Inside Plant Grounding and Bonding Standard WSP-3263 Revision 1.0 Bonding and Grounding Systems

The MGN with its multiple connections to earth throughout the power systems normally has low impedance to earth ground. Because of its low impedance ground connected to the MGB, the MGN may occasionally become a momentary surge producer because of nearby lightning strikes or power systems transients. Occasionally, a non-MGN system ( e.g . delta or un-grounded wye system) will be encountered. A bond is still required between the facility power service-grounding electrode and the MGB. Non-MGN systems do not qualify as primary surge absorbers. Therefore Non- MGN systems have to be excluded from the calculations of ground resistance. 2.2.7. Site Ground Field The facility ground field should be bonded to the MGB in the position shown in Figure 1. The tails from the ground field should enter the building through a nonmetallic conduit. The unspliced conductors should be routed to the MGB with little or no bends. If a bend is needed to make the building entry, then maintain a minimum bend radius of 12 inches. 2.2.8. Lightning Rod Ground Field Lightning rod systems are grounded via a separate dedicated ground field. A bond should be installed between the site ground field and the lightning rod ground field. The bond is required to minimize inductive noise coupling, reduce the chance of flashover, and to protect personnel and equipment. See Figure 1. 2.2.9. Radio/Microwave Tower Fence Ground Bonds should be made between the site ground field and the radio/microwave tower and fence ground for the same reasons discussed above. Where lightning rod, tower and fence ground systems are present on-site, all systems must be connected to the site ground field as shown in Figure 1. 2.2.10. Facility Metallic Water System When the facility has a Windstream owned metallic water system that meets the requirements of NEC 250-50(a), it must be bonded to the MGB. But the water pipe must NOT be considered a primary ground source for the facility. With the Utilities using PVC piping the water pipe has become an unreliable main ground source. When no water system is present in the building or non-metallic pipe isolates the building from the buried metallic water pipe distribution system, this bonding connection is omitted. 2.2.11. Building Structural Ground While not considered a primary surge absorber in the past, the building’s concrete enclosed footing steel is important to help dissipate transients and to equalize voltage differences between the floor and equipment. See NEC 250-50(c). The building structural steel connection is now considered one of the two primary surge absorber connections or Facility Main Ground connection. During the phase of building construction, footing reinforcing bar (rebar) should also be bonded together and to steel column footings. Cad Welded ground wire connections should be made directly to the rebar during construction of new reinforced concrete buildings. 2.2.12. Bonding Cable Tray

Windstream Proprietary and Confidential 6 Inside Plant Grounding and Bonding Standard WSP-3263 Revision 1.0 Bonding and Grounding Systems

Verify that all sections of cable tray are bonded together with continuity clips or other suitable bonding means in the IGZ ONLY. Cable Ladder in the None IGZ or Transport / Data Equipment areas are NOT required to be bonded together. 2.2.13. Bonding DC Power Room All racks and metallic racking system supporting DC battery banks in the DC power room must be DC Frame bonded to the MGB by the shortest possible route using an insulated conductor sized according to Appendix C. NEC requires that all exposed noncurrent carry metal parts of fixed equipment likely to become energized, be grounded when located within 8 feet vertically or 5 feet horizontally of ground or grounded metal objects that personnel may come into contact with. All Cable ladder within this zone in the DC Power area or room which would commonly be at the Main DC Power Termination Bars, will be bonded together the full length of the Main Term Bars and at least 8 feet past the bars in both directions. The cable shall be sized per Appendix C of this document. The bonding of cable ladder in the DC Power room only pertains to those Main Termination Bars that are fully exposed OUTSIDE of the power bay. The DC Frame ground of the DC Power Bay is sufficient for the enclosed Main Termination bar as long as the DC Frame ground is sized per Appendix C.

2.3. Equipment Outside Isolated Ground Zones All metallic telephony-related equipment must be directly grounded as follows: • By bonding directly to a Floor Ground Bar (FGB) or MGB. • By bonding to an Aisle Ground Feeder. • By securely bolting to an equipment rack that is bonded to an Aisle Ground Feeder, FGB, or MGB.

2.4. Rack-Mounted Equipment Grounding All rack-mounted communications equipment shelves must be grounded. Shelves that do not have AC or DC feeds shall be considered grounded when properly installed in the grounded rack. All other powered shelves should be grounded as described below. 2.4.1. Rack-Mounted Shelf Without Ground Terminal If rack-mounted shelf does not have a frame ground terminal screw, the equipment shelf must be bonded as follows: • Prepare two grounding screw positions by removing the paint at one slot on each side of the shelf. • Burnish each grounding screw locations with non-silica based abrasive pad. • Treat the abraded area with a protective jelly as in a thin coat of No-Ox. • Install the shelf using Square-Dish lock washers under each of two pan-head rack screws. 2.4.2. Rack-Mounted Shelf With Ground Terminal If the rack-mounted shelf has a frame ground terminal, the shelf ground terminal must be grounded to the rack ground bar or to the rack. The jumper from the shelf ground terminal to

Windstream Proprietary and Confidential 7 Inside Plant Grounding and Bonding Standard WSP-3263 Revision 1.0 Bonding and Grounding Systems

the rack ground bar or the rack should be the size stated in the manufacture documentation or at least a #14 AWG installed with ring lugs.

Windstream Proprietary and Confidential 8 Inside Plant Grounding and Bonding Standard WSP-3263 Revision 1.0 MGB Ground Resistance Objective

3. MGB GROUND RESISTANCE OBJECTIVE The resistance to earth with all grounding elements bonded to the MGB must be 5.0 ohms or less. The combined site ground resistance of the site ground field, the MGN and the site metallic water pipe system must be less than 5.0 ohms. Where all three primary surge absorbers are present at a site if at all possible, the site MUST have no fewer than two primary absorber connections and the five-ohm or less objective should be met when any two of the grounds are connected. For site buildings where the underground metallic water pipe does or does not exist, the site ground field must measure 5.0 ohms or less for each of the two primary ground conductors. ATTENTION if a switch site, Super POP or Regen site (other than a shelter) has less than two primary absorber connections (two ground field connections at opposite sides of the build are considered as fulfilling this requirement) the site should be considered to have a grounding audit performed in the near future.

Windstream Proprietary and Confidential 9 Inside Plant Grounding and Bonding Standard WSP-3263 Revision 1.0 IGZ Ground Window Bar (GWB)

4. IGZ GROUND WINDOW BAR (GWB)

4.1. Equipment Grounds Originating inside IGZ The communications equipment vendor generally bonds all equipment grounds that originate inside the IGZ to a vendor provided GWB. If the vendor does not provide isolation between the floor and the equipment and between the equipment and cable racks, the bonding conductor to the MGB must not be connected to the “I” zone, but should be connected to the “N” zone.

Lights, ventilation ducts, other metallic Ceili devices outside IGZ. ng

Bonded to MGB, FGB, Isle Bonded to MGB, FGB, Isle Ground Feeder or Ground Feeder or grounded equipment rack. Top Tray Top Tray Top Tray grounded equipment rack. Middle tray Middle tray Middle tray Low Tray Low Tray Low Tray 1 Keyed Notes

G 1 Jumper across tray-ends with #6 AWG. W B 2 All metal surfaces within IGZ shall be bonded to GWB.

of the MSGB theof 3 Isolated Ground Zone (IGZ). Six foot horizontal

Isolated zone (I) zone Isolated 2 separation from Non-IGZ equipment. 4 4 Metallic conduit outside IGZ. Only non- metallic conduit within IGZ.

6' Rack Rack Rack 6' (N) Non-metallic Conduit Inside IGZ. - 1 2 N - 30" 0"3 Legend: Insulating material Non-Isolated Area Non-Isolated All floor surfaces are to be considered as grounded Absorber Area (A) AreaAbsorber

Figure 3 - Isolated Ground Zone

4.2. Bond GWB to the MGB Bond each GWB to the MGB as directed by the equipment vendor or with a 2/0 or larger cable. Use Figure 1 or Table 1 and Table 2 to size the conductor to meet the 0.005 ohms objective. Install the bonding conductor using the shortest route and with few bends.

4.3. Metallic Equipment Grounds in the IGZ The frame grounds of all equipment located in the IGZ should be connected to the GWB. 4.3.1. Exposed Metallic Surfaces within the IGZ All metal components within the IGZ, including cabinets, isolated cable trays, anti-static mats, and other conductive surfaces must be bonded to the IGZ. The manufacturer’s recommendations for establishing these connections must be followed. 4.3.2. Receptacles in IGZ The NEC “green wire” conductors for convenience receptacles and other AC powered equipment should be sized according to the NEC criteria.

Windstream Proprietary and Confidential 10 Inside Plant Grounding and Bonding Standard WSP-3263 Revision 1.0 IGZ Ground Window Bar (GWB)

Each green wire-end should be tagged to indicate that the green wire is a GWB isolated ground wire. The manufacturer's recommendation for the metallic racks within the IGZ will determine how the green wire is installed in the IGZ. See Section 8, Figure 10, Figure 11 and Figure 12 for details. 4.3.3. Racked AC Equipment in IGZ The metallic racks may be insulated from the concrete floors and reinforcing steel or connected to the green wire, depending on the manufacturer’s recommendation. Routing the ac conduit and protective green wire ground in the manner described below ensures compliance with National Electrical Code requirements. 4.3.4. IGZ Racks Insulated from the Building The conduit carrying 120 Volt ac conductors into the IGZ should be routed to a junction box located adjacent to the GWB. The green wire should be solidly connected to the junction box and to the GWB. See Figure 12 for details. Use of metallic or non-metallic conduit for extending and bonding the ac conductors into the IGZ is at the option of the manufacturer. Where metallic conduit is used, care should be taken during installation to assure it is insulated from foreign grounds (building structural steel and reinforced concrete members) from the GWB into the IGZ area. Isolated orange convenience receptacles are not required within the IGZ. 4.3.5. Racks Not Insulated from the Building The conduit carrying 120-volt ac conductors into the IGZ should be routed directly to the metallic cabinet or rack. Do not connect the green wire or conduit to the GWB. Isolated ac ground convenience receptacles may be installed as required by the manufacturer. Equipment within the IGZ should be isolated from the intentionally grounded metallic racks. 4.3.6. Lighting Fixtures in IGZ Where overhead lighting fixtures located in the IGZ are in electrical contact with the equipment frames, the associated green protective ground wires must be connected to the GWB. All fixtures connected to the GWB system must be isolated from building structural steel and reinforced concrete members. Green wires associated with lighting fixtures having no electrical contact with the equipment frames must be grounded at the serving distribution panel per the NEC. 4.3.7. Other Equipment in IGZ The protective grounds for facsimile machines, computer monitors and test equipment must be powered from properly grounded IGZ receptacles. Use only UL listed 3 wire cords without adaptation and without 2 wire adapters. Every precaution should be taken to ensure the integrity of the IGZ. No foreign grounds should be permitted to come into contact with any equipment within the IGZ except through the GWB.

Windstream Proprietary and Confidential 11 Inside Plant Grounding and Bonding Standard WSP-3263 Revision 1.0 Non-Standard Equipment

5. NON-STANDARD EQUIPMENT Equipment that uses an internal ground plane as both battery return and as equipment ground shall not be installed in Windstream Communications facilities. Every effort shall be made to discourage Vendor’s use of equipment with battery return and equipment ground bonded together inside the equipment.

Windstream Proprietary and Confidential 12 Inside Plant Grounding and Bonding Standard WSP-3263 Revision 1.0 Bonding Conductor Sizing

6. BONDING CONDUCTOR SIZING

6.1. Sizing Protective Grounding Conductors To determine the appropriate bonding conductor size, choose Main-Aisle and Aisle bonding conductors from Section 6.1.1, Section 6.1.2 or Section 6.1.3 for small, medium or large offices, respectively. 6.1.1. Small Office with Short Bonding conductor Runs Use Table 2 below to select combinations of 2/0 Main Aisle Feeders and Aisle Ground Feeders.

Aisle feeder “H”-tapped at 30 ft from MGB.

40 ft Main-Aisle Feeder MGB Aisle Feeder (2/0 AWG - 30 ft maximum) From Table 1: 40 ft Main-Aisle feeder must be 2/0 AWG or larger "H" tap at 30 ft permits 2/0 AWG Aisle feeder of 30 ft maximum.

Figure 4 – Example: Short Main-Aisle Feeder and Aisle Conductor Sizes

6.1.2. Medium-Size Office with Longer Bonding Conductor Runs Use the table below if the longest Main Aisle Ground Feeder is 60 feet to 90 feet long. Use 4/0 AWG conductor Main Aisle feeder and 2/0 AWG Aisle feeder as shown in Table 2.

Aisle feeder “H”-tapped at 30 ft from MGB.

77 ft Main-Aisle Feeder MGB

Aisle Feeder (2/0 AWG - 41 ft maximum)

From Table 2: 77 ft Main-Aisle feeder must be 4/0 AWG or larger. "H" tap at 30 ft permits 2/0 AWG Aisle feeder of 41 ft maximum.

Figure 5 – Example: Longer Main-Aisle and Aisle Conductor Sizes

6.1.3. Large Office with Long Bonding Conductor Runs For offices with Main Aisle Ground feeders in excess of 80 feet, use the table look-up procedure listed below. The following tables are used to size bonding and ground conductors conservatively for large communications facilities. This method works equally well for small and medium-sized facilities. The procedure for obtaining wire size is as follows:

Windstream Proprietary and Confidential 13 Inside Plant Grounding and Bonding Standard WSP-3263 Revision 1.0 Bonding Conductor Sizing

Referencing Figure 1 or Table 1, determine the resistive objective for a bonding conductor and Table 2 to determine maximum conductor lengths.

Table 1 – Resistance Objective

Type of Device To Be Bonded To the MGB Maximum Resistance IGZ Bar to MGB 0.005 ohms Non-IGZ Bar to MGB 0.005 ohms Multi-grounded Neutral (MGN) to MGB 0.005 ohms (2/0 or larger) Central Office Ground Field (COGF) to MGB 0.005 ohms (2/0 or larger) Cable Entrance Ground Bar (CEGB) to MGB 0.01 ohms Main Distribution Ground Bar (MDFB) to MGB 0.01 ohms Underground Water Pipe Bond to MGB 0.01 ohms All Other Bonds to MGB 0.01 ohms

Table 2 – Maximum Conductor Lengths

Ohms per Kilofoot at Maximum Length at Maximum Length at Wire Size 25 °°°C 0.005 Ohms 0.01 Ohms #6 AWG 0..4110 ohms 12 ft 24 ft #4 AWG 0..2548 ohms 19 ft 38 ft #2 AWG 0..1625 ohms 30 ft 61ft #1 AWG 0..1289 ohms 38 ft 77ft 1/0 AWG 0.1022 ohms 48 ft 97ft 2/0 AWG 0..0802 ohms 62ft 124ft 4/0 AWG 0.0505ohms 99ft 198ft 250 MCM 0.0440 ohms 113 ft 227ft 350 MCM 0.0314 ohms 159ft 318ft 500 MCM 0.0220 ohms 227ft 454ft 750 MCM 0.0147 ohms 340 ft 680ft

6.2. Sizing Conductor from MGB to GWB The conductor between the MGB and GWB must be not less than 4/0 AWG and must meet the resistance objective shown in Table 1 and Table 2. Note: Size per main services feeds or 4/0 AWG, whichever is larger.

6.3. Sizing Conductor from MGB to Multi-Grounded Neutral The conductor between the MGB and the neutral bar in the AC service entrance panel board must be not less than 4/0 AWG and must meet the resistance objective shown in Table 1and Table 2.

Windstream Proprietary and Confidential 14 Inside Plant Grounding and Bonding Standard WSP-3263 Revision 1.0 Planning and Installing Bonding and Grounding systems

7. PLANNING AND INSTALLING BONDING AND GROUNDING SYSTEMS Proper installation is critical to making an effective grounding system. Guidelines for installation of the bonding and grounding system conductors include: • Grounding conductors should be insulated to permit integrity testing. • Conductors must also be free of splices. • Grounding conductors should be routed in a manner that will avoid sharp or right angle bends. Routes should follow the most direct path with 12" internal bend radii. Larger bend radii offer lower inductive reactance than sharp turns. Lower reactance reduces the end-to-end voltage drop during a transient event. • Where grounding conductors must be installed in conduit, use Schedule 40 of Schedule 80 RNMC (Rigid Non Metallic Conduit). If a grounding conductor must be routed through metallic conduit, both ends of the conduit must be bonded to the grounding conductor at the point of entry and exit of the conduit. • Grounding conductors should not be completely encircled with metal components. An example of encircling metal components would be passing a grounding conductor between rungs on a cable tray. The encircling metal causes a large increase in the effective inductance of the conductor. • Wire-to-wire and wire-to-ground rod connections should be made only with exothermic connections. Compression connectors approved for direct burial may be used where permitting agencies do not approve exothermic connections. Solder joints shall not be used in Windstream facilities. • Wire-to-metallic surface connections should be made with ANSI two-bolt compression lugs. • Permanent adhesive labels or tags should be provided on ground wire leads at all bus bars to identify the origin of each conductor per WSP3039. • The designated P, A, N and I segments of the MGB should be clearly identified.

7.1. Vertical Risers in Multistory Buildings When communications equipment is installed in multistory buildings, the grounding system must be extended to each floor via a vertical riser. Figure 6 shows a method of installing the vertical riser. If required, the vertical riser may be tapped on each floor establish a floor ground bar on each floor.

Windstream Proprietary and Confidential 15 Inside Plant Grounding and Bonding Standard WSP-3263 Revision 1.0 Planning and Installing Bonding and Grounding systems

Floor Ground Bar Isle Ground Feeder

Power Board Ground Bus

Second or Last Floor Above Third

First Floor Above Third

Strain Relief 20 foot Minimum Every Third Floor Above

To the Floors Below Every Third PVC Sleeving Typical Throughout

750 MCM Vertical Riser To Floors Above OPGP

PANI OPGP (MGB)

MAIN AC PANEL

ACEG Driven Rod Ground Field Green Wire or Chemrod Field

Neutral

Water Pipe

Bldg Steel

Generator Frame NEC 250-24

Figure 6 – Vertical Riser for Multi-Story Building

Windstream Proprietary and Confidential 16 Inside Plant Grounding and Bonding Standard WSP-3263 Revision 1.0 Planning and Installing Bonding and Grounding systems

7.2. Method for Distributing Grounding to Equipment Figure 7 illustrates how a grounding conductor may be extended to equipment on each floor. The main-aisle feeder (also known as horizontal equalizer) is routed down the length of the building to be tapped as required to extend the grounding to each aisle via cross-aisle feeders and aisle feeders.

Aisle Feeder with Cap at end of each Isle 2.03.04 2.03.03 2.02.03 2.02.04

Green Aisle Feeder OtherAisle Feeder #6 AWG Other Aisle Feeders 2.02.02

Green 2/0 AWG 2.03.01

Cross-Aisle Main Feeder Main-Aisle Feeder

Green 4/0 or larger

H-Taps only To Local DC Board Ground Bar, unbroken, no taps

To Vertical Riser Main-AisleFeeder To Secondary Floor (from MGB) Ground Bar (more than 30 ft.)

Floor Ground Bar Facility Wall

Figure 7 – Typical Frame Ground Distribution Method

Windstream Proprietary and Confidential 17 Inside Plant Grounding and Bonding Standard WSP-3263 Revision 1.0 Planning and Installing Bonding and Grounding systems

Figure 8 illustrates proper and improper methods of attaching frame-grounding conductors to aisle feeders.

Aisle Ground This way to MGB

! ONG WR Wrong Direction Equipment Framework

WRO NG!

Aisle Ground This way to MGB

This way to MGB

Equipment Framework R Wrong ig h t! Don't Loop

This way to MGB Aisle Ground

Correct with "Lazy S" Bends

Equipment Framework

Figure 8 – Rack Ground Installation Details

Windstream Proprietary and Confidential 18 Inside Plant Grounding and Bonding Standard WSP-3263 Revision 1.0 Planning and Installing Bonding and Grounding systems

Figure 9 illustrates the many wrong ways to distribute ground to communications equipment. Each of the red conductors is wrong.

Aisle Ground

To Local DC Board Ground Bar, unspliced, no taps.

To Cold Water Pipe Bond To Grounding Electrode Conductor / OPGP To Main AC PNL Neutral Bond To Bond to Building Steel To Main AC PNL ACEG To Emergency. Gen. Frame Ground

COGB Facility Wall

Figure 9 – Improper Rack Grounding Methods

Windstream Proprietary and Confidential 19 Inside Plant Grounding and Bonding Standard WSP-3263 Revision 1.0 Grounding Receptacle Circuits Inside the IGZ

8. GROUNDING RECEPTACLE CIRCUITS INSIDE THE IGZ A great amount of engineering judgment must be applied before making a decision to install a receptacle circuit within the IGZ. Several levels of reasoning must be satisfied in the following order. • Is the receptacle truly necessary, or would it just be “nice to have”? • What are the alternatives to installing a receptacle circuit inside the IGZ? • Will the installation meet the life safety requirements mandated by the NEC Article 250? • Will the installation method provide service without injecting transient voltages or currents into the IGZ? • Will the installation invalidate the equipment manufacturer's warranty? If the preceding analysis indicates that a receptacle circuit is still required, then there are three methods to obtain the power for the circuit. The three methods offer widely varying levels of protection for the equipment in the IGZ.

Warning – Before Installing Inverter Circuits in IGZ Environment, the switch equipment manufacturer must concur in writing with the installation methods and materials prior to installing receptacle circuits inside the IGZ. Failure to obtain a written statement of concurrence may invalidate the manufacturer's warranty. The three methods are: • Preferred Method– Install inverter within the IGZ . See Figure 10. This method Meets the NEC Article 250 grounding requirements and provides the greatest protection for personnel and for the equipment within the IGZ. The method allows the use of metallic conduit within the IGZ.

Equipment Racks

Cable Trays (I) Bar

Other Metallic objects at the MSGB theat Isolated zone Isolated Ground Window Ground

Note: The Inverter and the Power Distribuiton Inverter power distribution panel in IGZ Frame must be within the

(N) IGZ. 15A Black at the MSGB theat PDF Neg.

Non-Isolated zone Non-Isolated Static Inverter Green in Pos. Switch GWG IGZ Neutral White BLK Grn WHT

Metallic or non-metallic Conduit at the MSGB theat

Absorber Area(A) Absorber Metallic conduit outside IGZ & non-metallic conduit Inside IGZ.

Standby power from distribution panel

Figure 10 – Inverter inside the IGZ • Alternate Method – Install inverter outside the IGZ. See Figure 11 on the next page. This method meets the NEC Article 250 grounding requirements but may invalidate the manufacturer’s warranty because the receptacle green wire is not bonded to the GWB at the IGZ boundary.

Windstream Proprietary and Confidential 20 Inside Plant Grounding and Bonding Standard WSP-3263 Revision 1.0 Grounding Receptacle Circuits Inside the IGZ

IGZ extends 6 ft horizontally and 3 ft vertically from equipment surfaces.

Ground Window Bar Equipment Racks at theMSGB at

Isolatedzone (I) Metallic Junction Box Cable Trays at IGZ boundary Inverter power other metallic objects Inverter distribution panel 15A Black

Static Inverter GWG Green Switch White Neutral

at theMSGB at DC Input Non-Isolatedzone (N) Metallic Standby AC Conduit Orange Receptacle Input Floor Ground Bar

Non-metallic conduit beyond this point. Closest non-IGZ ground bar

Note:

Note: DC input from Floor PDF or from All Equipment in the IGZ Must be isolated from the floor, cable trays, Main Power Distribution Frame (MPDF) electrical conduits, structural steel, light fixtures, air conditioning ducts and all other conductive surfaces that are in contact with earth. at theMSGB at AbsorberArea(A)

Figure 11 – Inverter outside the IGZ

This requires using insulated conduit (low smoke PVC conduit and boxes) for all receptacle circuits within the IGZ. Non-metallic conduit and boxes are smoke producers that may not be permitted by some Fire Code Authorities. • Last Resort Method – Use unconditioned power . See Figure 12 on the next page. This method Meets the NEC Article 250 grounding requirements but may invalidate the manufacturer’s warranty because the receptacle green wire is not bonded to the GWB at the IGZ boundary.

Warning – This installation method may not pass all electrical inspections because a strict interpretation of the NEC requires that the receptacle frame be bonded to the enclosure.

Windstream Proprietary and Confidential 21 Inside Plant Grounding and Bonding Standard WSP-3263 Revision 1.0 Grounding Receptacle Circuits Inside the IGZ

IGZ extends 6 ft horizontally and 3 ft vertically from equipment surfaces.

Equipment Racks (I)

Cable Trays

Metallic Junction Box Bar GroundWindow at the MSGB the at Isolated zone Isolated Floor (intermediate) panel at IGZ boundary other metallic surfaces Service Entrance Panel

Black

GWG Green

Neutral White (N) at the MSGB the at Metallic Non-Isolated zone Non-Isolated Conduit Convenience Receptacles within IGZ

Utility Company Non-metallic conduit beyond this point. Transformer Note: All Equipment in the IGZ Must be isolated from the floor, cable trays, electrical conduits, structural steel, light fixtures, air conditioning ducts and all other conductive surfaces that are in contact with earth. at the MSGB the at Absorber Area (A) Area Absorber

Figure 12 – Conventional Receptacle Circuit in IGZ

This method requires using insulated conduit (low smoke PVC conduit and boxes) for all receptacle circuits within the IGZ. Non-metallic conduit and boxes are smoke producers that may not be permitted by some Fire Code Authorities.

Windstream Proprietary and Confidential 22 Inside Plant Grounding and Bonding Standard WSP-3263 Revision 1.0 Definitions

9. DEFINITIONS

Term/Acronym Definition Building Structural Ground A grounding electrode source provided by structural steel and reinforcing steel rods contained within the building walls, roofs, floors, footing, and foundations. Cable Entrance Ground Bar An isolated copper ground bar to terminate incoming (CEGB) paired and fiber optic cable shields on a common connection point. The bar must be located at the entrance location. Central Office Ground Field A series of interconnected ground rods, buried (COGF) perimeter cable or metallic well casing to produce a low impedance path to earth. Collocated Communications Two or more communications facilities that share a Systems common operating area. Electrostatic Discharge (ESD) The protection of electronic components from static Protection voltage discharges. Moving air and static-generating clothing generate static charges when the relative humidity is low. Discharge plates and semiconductive flooring assist in discharging static build-up. Floor Ground Bar (FGB) A ground bar fed from a vertical riser in a multistory building. In a single floor building, the MGB may also be considered a FGB. Green Wire Ground A normally non-current-carrying conductor that protects personnel and equipment through bonding to the Multi-grounded Neutral (MGN). The green color code is mandated by the NEC to identify the conductor as a safety ground. They are normally non-current carrying. Ground Loop Ground loops exist when there is more than one electrical path to ground. Ground loops are permissible when they occur while bonding non-sensitive equipment to the MGN. Ground loops are not permitted for equipment located within Isolated Ground Zones (IGZ). Ground Window Bar (GWB) An isolated copper bar for the common connection of all equipment located in the IGZ. See Green Wire Ground, Master Ground Bar. Grounding Electrode A grounding electrode source provided by structural steel and reinforcing steel rods contained within the building walls, roofs, floors, footing, and foundations.

Windstream Proprietary and Confidential 23 Inside Plant Grounding and Bonding Standard WSP-3263 Revision 1.0 Definitions

Term/Acronym Definition Insulating Joints Non-conducting inserts in metal framework of equipment located in the IGZ. These inserts insulate the IGZ equipment from outside ground connections. Integrated Ground Plane (IGP) Those areas outside of Isolated ground Zones (IGZ). The intent of the IGP is to provide many parallel paths for noise currents and transient currents to return the their source. Each path will carry only a small portion of the total current. No effort should be made to isolate DAX equipment, fiber optic equipment, LAN equipment, battery chargers or other radiating equipment, from the floor, walls, ceiling, electrical conduit, cable trays and other metallic equipment. Intermediate Ground Bar (IGB) An isolated copper bar used to distribute a low impedance ground from the MGB to a group of equipment. The IGB is located near to a group of several non-IGZ racks to provide a convenient ground source. Depending upon the equipment layout, several IGB bars may be needed to ground isolated groups of equipment. Isolated Ground Zone (IGZ) An IGZ is dedicated area within an office building where all equipment is electrically bonded to the MGB but insulated from all other equipment. The isolated area should preferably extend six feet on all sides from the equipment frames and framework. The IGZ will normally house sensitive electronic components. See Figure 3 for general details of installing IGZ equipment. Main Distributing Frame (MDF) A distributing frame where paired outside plant cables are terminated on vertical protection assemblies. Master Ground Bar (MGB) An isolated copper bar used as single point connection for surge producers, surge absorbers, non-IGZ Also known as OPGP and MSGB equipment grounds, and IGZ equipment grounds. The MGB is normally non-current carrying. A typical MGB style is the Newton 2100360010. MDF Ground Bar (MDFGB) An isolated copper bar commonly found at the bottom of the MDF for the connection of paired cables shields and MDF protector assemblies. It may be used as a connection point for MDF ironwork. Metallic Water Pipe An outdoor section of buried metallic water pipe at least 10 feet (3.0 meters) in length and owned by Windstream.

Windstream Proprietary and Confidential 24 Inside Plant Grounding and Bonding Standard WSP-3263 Revision 1.0 Definitions

Term/Acronym Definition Multigrounded Neutral (MGN) The MGN is a continuous electrical conductor from the communications facility to an Electric Utility substation. The electric utility places at least 4 grounds per mile of distribution line, not including grounds at individual services along the route. The substation will also have a large ground field. This MGN provides a very low impedance path (usually under 5 ohms) to earth ground for absorbing lightning and other surges. It also provides a return path for unbalanced currents found on three phase power distribution systems. Personnel Discharge Plates and Plates found in equipment areas containing voltage Mats sensitive electronic equipment. These plates are connected to ground and are used to discharge static charge build-up to ground rather than through sensitive electronic components. Single Point Grounding A grounding system using a single point, the MGB, as a zero reference potential to ground for the entire communications facility. While the voltage at this connection point may rise above zero volts-to-earth- ground under fault conditions, the entire communications facility will also rise at the same rate to the same voltage. This helps minimize any circulating transient currents between components from lightning or power surges. Single point grounding at the MGB is a method of systematically bonding electronic and electrical equipment, enclosures and all other exposed metallic objects to a single point. A properly bonded and grounded communications facility will minimize voltage differentials between facility equipment and reduce the shock hazard for operating personnel. Step Potential Step potential is a safety hazard for personnel during lightning strokes and downed high voltage power lines. When transient currents from lightning or downed power lines travels through the earth surface, a voltage drop will exist across the surface. Surge Absorbers (A) Surge absorbers are facility ground fields that exhibit low impedance earth ground. There are three primary surge absorbers: • The central office ground field (COGF). • The power system multigrounded neutral (MGN). • The metallic water pipe system.

Windstream Proprietary and Confidential 25 Inside Plant Grounding and Bonding Standard WSP-3263 Revision 1.0 Definitions

Term/Acronym Definition Surge Producers (P) Sources of lightning and power system surges and transient currents. Sources of lightning and power system surges and transient currents. • Power system surges are the result of instability in the electric utility's distribution system. Power surges generally are slow changing variations in voltage that range from a few hundred milliseconds to minutes. • Transient currents may be injected into the Windstream facilities by nearby (1 mile) lightning strokes to communications towers, at fiber optic cable or paired telephone cable splice points and at electric service poles or conductors. Transient currents generally range from 1 microsecond to 50 microseconds. Touch Potential Touch potential is a safety hazard for personnel during lightning strokes and downed high voltage power lines. When transient currents from lightning or downed power lines travels through the earth surface, a voltage drop will exist between properly grounded equipment and the earth surface within 3 feet of the grounded equipment. Vertical Riser (also known as A conductor that distributes grounding through several Vertical Equalizer) floors of a multistory building.

Windstream Proprietary and Confidential 26 Inside Plant Grounding and Bonding Standard WSP-3263 Revision 1.0 References

10. REFERENCES ANSI/NFPA 70. National Fire Protection Association, National Electrical Code (NEC), 1999 Edition. ANSI/NFPA 101. National Fire Protection Association, Code for Safety to life from Fire in Buildings and Structures. (Life Safety Code). IEEE Std 142-1991. Institute of Electric and Electronic Engineers, IEEE Recommended Practice for Grounding and Bonding of Commercial Power Systems. IEEE Std 1100-1992. Institute of Electric and Electronic Engineers, IEEE Recommended Practice for Powering and Grounding Sensitive Electronic Equipment. ANSI C2-1997. American National Standards Institute, National Electrical Safety Code. 7 CFR 1751F-810. Code of Federal Regulations, Electrical Protection of Digital and Lightwave Telecommunications Equipment. GR-1502-CORE Central Office Environment Detail Engineering Generic Requirements. GR-1275-CORE Central Office Environment Installation/Removal Generic Requirements. WSP-3001 Site Grounding System Standard. WSP-3039 Equipment and Cable Labeling Standard.

Windstream Proprietary and Confidential 27 Inside Plant Grounding and Bonding Standard WSP-3263 Revision 1.0 Appendix A

11. APPENDIX A

Characteristics of Copper Wire at 20C/68F Conductor American Wire Gauge Size No. 6 No. 4 No. 3 No. 2 No. 1

DC

Resistance (Ohms per) .4110 Kilofeet 1.348 Kilometer .2548 Kilofeet .8478 Kilometer .2050 Kilofeet .6726 Kilometer .1625 Kilofeet .5331 Kilofeet .1289 Kilofeet .4229 Kilometer

0.005 ohms 12' 3m 19' 5m 24' 7m 30' 9m 38' 11m

Objective Resist 0.01 ohms 24' 7m 38' 11m 48' 14m 61' 18m 77' 23m

Characteristics of Copper Wire at 20C/68F Conductor American Wire Gauge MCM Size No. 1/0 No. 2/0 No. 3/0 No 4.0 250

DC

Resistance (Ohms per) .1022 Kilofeet .3353 Kilometer .0802 Kilofeet .2631 Kilometer .0636 Kilofeet .2087 Kilometer .0505 Kilofeet .1657 Kilometer .0440 Kilofeet .1444 Kilometer

0.005 ohms 48' 14m 62' 19m 78' 23m 99' 30m 113' 34m

Objective Resist 0.01 ohms 97' 29m 124' 38m 157' 47m 198' 60m 227' 69m

Characteristics of Copper Wire at 20C/68F Conductor MCM Size 300 350 400 500 750

DC

Resistance (Ohms per) .0367 Kilofeet .1204 Kilometer .0314 Kilofeet .1030 Kilometer .0275 Kilofeet .0902 Kilometer .0220 Kilofeet .0722 Kilometer .0147 Kilofeet .0482 Kilometer

0.005 ohms 136' 41m 159' 48m 181' 55m 227' 69m 340' 103m

Objective Resist 0.01 ohms 272' 83m 318' 97m 363' 110m 454' 138m 680' 207m

Windstream Proprietary and Confidential 28 Inside Plant Grounding and Bonding Standard WSP-3263 Revision 1.0 Appendix B

12. APPENDIX B

Approved Lug Manufacturers - Thomas & Betts - Burndy

Proper techniques for installing compression lugs: 1. Determine proper Connector for the cable size being used.

2. Cut and Strip the Insulation a. Use a Ratcheting Cable Cutter to yield minimum conductor distortion b. Take care to avoid nicking or cutting conductors (wire brush if required).

c. Only strip enough insulation required to fully insert the conductors into the connector barrel of the lug. See fig. 2.

3. Select the proper installing die and appropriate tool per lug manufacture specifications. a. Die and tool shall have the same manufacturer as lug unless stated otherwise by lug manufacturer.

4. Locate tool with correct die in proper position on connector and activate tool. a. When making multiple crimps, make the first crimp nearest the tongue and work towards the barrel end.

5. Place properly sized clear heat-shrinkable tubing at conductor connection. a. Ensure that connector die code number is legible to allow for easy inspection.

Windstream Proprietary and Confidential 29 Inside Plant Grounding and Bonding Standard WSP-3263 Revision 1.0 Appendix C

13. APPENDIX C

Windstream Proprietary and Confidential 30