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WSP-3263 Inside Plant Grounding and Bonding Standard

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WSP-3263 Inside Plant Grounding and Bonding Standard WSP-3263 Inside Plant Grounding and Bonding Standard Revision 1.0 Inside Plant Grounding and Bonding Standard WSP-3263 Revision 1.0 Copyright Notice Copyright © 2001 Windstream ® Incorporated. All rights reserved. The entire contents of this document are protected under the United States copyright laws. You may print and download portions of material from this document for your own internal, non-commercial use. For any other copying, redistribution, retransmission or publication of any downloaded material; you must have the express written prior consent of Windstream Incorporated. “Windstream”, the Windstream logo, and all related products and service names, marks, and slogans are trademarks of Windstream Incorporated. Misuse of the trademarks or any other content in this publication is strictly prohibited. Windstream Proprietary and Confidential ii Inside Plant Grounding and Bonding Standard WSP-3263 Revision 1.0 Table of Contents Table of Contents List of Figures ................................................................................................................................................ v Document Purpose ....................................................................................................................................... vi Revision History ............................................................................................................................................ vi Areas Affected ............................................................................................................................................. vii Approval ....................................................................................................................................................... vii 1. OVERVIEW ....................................................................................................................... 1 2. BONDING AND GROUNDING SYSTEMS ................................................................................ 2 2.1. Master Ground Bar (MGB) ............................................................................................................. 4 2.1.1. Purpose of the MGB ......................................................................................................................... 4 A. Surge Producers (The "P" Section of the MGB) .............................................................................................. 4 B. Surge Absorbers (The "A" section of the MGB) ............................................................................................... 4 C. Non-IGZ Grounds (The "N" section of MGB) ................................................................................................... 5 D. IGZ Conductors (The "I" section of the MGB) .................................................................................................. 5 2.2. Facility Equipment To Be Bonded to the MGB ............................................................................ 5 2.2.1. Cable Entrance Ground Bar (CEGB) ............................................................................................... 5 2.2.2. Cable Entrance Lightning Protection ................................................................................................ 5 2.2.3. Main Distributing Frame Ground Bar (MDFGB) ............................................................................... 5 2.2.4. Radio and Microwave Equipment Grounds ...................................................................................... 5 2.2.5. Outdoor Standby Power Plant Enclosure Ground ............................................................................ 5 2.2.6. Multi-grounded Neutral (MGN) ......................................................................................................... 5 2.2.7. Site Ground Field .............................................................................................................................. 6 2.2.8. Lightning Rod Ground Field .............................................................................................................. 6 2.2.9. Radio/Microwave Tower Fence Ground ........................................................................................... 6 2.2.10. Facility Metallic Water System.......................................................................................................... 6 2.2.11. Building Structural Ground ............................................................................................................... 6 2.2.12. Bonding Cable Tray .......................................................................................................................... 6 2.2.13. Bonding DC Power Room ................................................................................................................ 7 2.3. Equipment Outside Isolated Ground Zones ................................................................................ 7 2.4. Rack-Mounted Equipment Grounding .......................................................................................... 7 2.4.1. Rack-Mounted Shelf Without Ground Terminal ................................................................................ 7 2.4.2. Rack-Mounted Shelf With Ground Terminal ..................................................................................... 7 3. MGB GROUND RESISTANCE OBJECTIVE ........................................................................... 9 4. IGZ GROUND WINDOW BAR (GWB) ................................................................................ 10 4.1. Equipment Grounds Originating inside IGZ .............................................................................. 10 4.2. Bond GWB to the MGB ................................................................................................................ 10 4.3. Metallic Equipment Grounds in the IGZ ..................................................................................... 10 4.3.1. Exposed Metallic Surfaces within the IGZ ...................................................................................... 10 4.3.2. Receptacles in IGZ ......................................................................................................................... 10 Windstream Proprietary and Confidential iii Inside Plant Grounding and Bonding Standard WSP-3263 Revision 1.0 Table of Contents 4.3.3. Racked AC Equipment in IGZ ........................................................................................................ 11 4.3.4. IGZ Racks Insulated from the Building ........................................................................................... 11 4.3.5. Racks Not Insulated from the Building ........................................................................................... 11 4.3.6. Lighting Fixtures in IGZ .................................................................................................................. 11 4.3.7. Other Equipment in IGZ .................................................................................................................. 11 5. NON -STANDARD EQUIPMENT .......................................................................................... 12 6. BONDING CONDUCTOR SIZING ........................................................................................ 13 6.1. Sizing Protective Grounding Conductors .................................................................................. 13 6.1.1. Small Office with Short Bonding conductor Runs ........................................................................... 13 6.1.2. Medium-Size Office with Longer Bonding Conductor Runs ........................................................... 13 6.1.3. Large Office with Long Bonding Conductor Runs .......................................................................... 13 6.2. Sizing Conductor from MGB to GWB ......................................................................................... 14 6.3. Sizing Conductor from MGB to Multi-Grounded Neutral ......................................................... 14 7. PLANNING AND INSTALLING BONDING AND GROUNDING SYSTEMS ..................................... 15 7.1. Vertical Risers in Multistory Buildings ....................................................................................... 15 7.2. Method for Distributing Grounding to Equipment .................................................................... 17 8. GROUNDING RECEPTACLE CIRCUITS INSIDE THE IGZ ....................................................... 20 9. DEFINITIONS .................................................................................................................. 23 10. REFERENCES ................................................................................................................. 27 11. APPENDIX A ................................................................................................................... 28 12. APPENDIX B ................................................................................................................... 29 13. APPENDIX C ................................................................................................................... 30 Windstream Proprietary and Confidential iv Inside Plant Grounding and Bonding Standard WSP-3263 Revision 1.0 List of Figures List of Figures Figure 1 - Central Office Ground System ................................................................................................ 3 Figure 2 – Master
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