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Bootstomp: on the Security of Bootloaders in Mobile Devices
BootStomp: On the Security of Bootloaders in Mobile Devices Nilo Redini, Aravind Machiry, Dipanjan Das, Yanick Fratantonio, Antonio Bianchi, Eric Gustafson, Yan Shoshitaishvili, Christopher Kruegel, and Giovanni Vigna, UC Santa Barbara https://www.usenix.org/conference/usenixsecurity17/technical-sessions/presentation/redini This paper is included in the Proceedings of the 26th USENIX Security Symposium August 16–18, 2017 • Vancouver, BC, Canada ISBN 978-1-931971-40-9 Open access to the Proceedings of the 26th USENIX Security Symposium is sponsored by USENIX BootStomp: On the Security of Bootloaders in Mobile Devices Nilo Redini, Aravind Machiry, Dipanjan Das, Yanick Fratantonio, Antonio Bianchi, Eric Gustafson, Yan Shoshitaishvili, Christopher Kruegel, and Giovanni Vigna fnredini, machiry, dipanjan, yanick, antoniob, edg, yans, chris, [email protected] University of California, Santa Barbara Abstract by proposing simple mitigation steps that can be im- plemented by manufacturers to safeguard the bootloader Modern mobile bootloaders play an important role in and OS from all of the discovered attacks, using already- both the function and the security of the device. They deployed hardware features. help ensure the Chain of Trust (CoT), where each stage of the boot process verifies the integrity and origin of 1 Introduction the following stage before executing it. This process, in theory, should be immune even to attackers gaining With the critical importance of the integrity of today’s full control over the operating system, and should pre- mobile and embedded devices, vendors have imple- vent persistent compromise of a device’s CoT. However, mented a string of inter-dependent mechanisms aimed at not only do these bootloaders necessarily need to take removing the possibility of persistent compromise from untrusted input from an attacker in control of the OS in the device. -
Stochastic Modeling and Performance Analysis of Multimedia Socs
Stochastic Modeling and Performance Analysis of Multimedia SoCs Balaji Raman, Ayoub Nouri, Deepak Gangadharan, Marius Bozga, Ananda Basu, Mayur Maheshwari, Jérôme Milan, Axel Legay, Saddek Bensalem, Samarjit Chakraborty To cite this version: Balaji Raman, Ayoub Nouri, Deepak Gangadharan, Marius Bozga, Ananda Basu, et al.. Stochastic Modeling and Performance Analysis of Multimedia SoCs. SAMOS XIII - Embedded Computer Sys- tems: Architectures, Modeling, and Simulation, Jul 2013, Agios konstantinos, Samos Island, Greece. pp.145-154, 10.1109/SAMOS.2013.6621117. hal-00878094 HAL Id: hal-00878094 https://hal.archives-ouvertes.fr/hal-00878094 Submitted on 29 Oct 2013 HAL is a multi-disciplinary open access L’archive ouverte pluridisciplinaire HAL, est archive for the deposit and dissemination of sci- destinée au dépôt et à la diffusion de documents entific research documents, whether they are pub- scientifiques de niveau recherche, publiés ou non, lished or not. The documents may come from émanant des établissements d’enseignement et de teaching and research institutions in France or recherche français ou étrangers, des laboratoires abroad, or from public or private research centers. publics ou privés. Stochastic Modeling and Performance Analysis of Multimedia SoCs Balaji Raman1, Ayoub Nouri1, Deepak Gangadharan2, Marius Bozga1, Ananda Basu1, Mayur Maheshwari1, Jerome Milan3, Axel Legay4, Saddek Bensalem1, and Samarjit Chakraborty5 1 VERIMAG, France, 2 Technical Univeristy of Denmark, 3 Ecole Polytechnique, France, 4 INRIA Rennes, France, 5 Technical University of Munich, Germany. E-mail: [email protected] Abstract—Quality of video and audio output is a design-time to estimate buffer size for an acceptable output quality. The constraint for portable multimedia devices. -
Mac Labs. More Creativity
Mac labs. More creativity. More engagement. More learning. Every Mac comes ready for 21st-century learning. Mac OS X Server creates the ultimate lab environment. Creativity and innovation are critical skills in the modern Mac OS X Server includes simplified tools for creating wikis and workplace, which makes them critical skills to teach today’s blogs, so students and staff can set up and manage them with students. Apple offers comprehensive lab solutions for your little or no help from IT. The Spotlight Server feature makes it school or university that will creatively engage students and easy for students collaborating on projects to find and view motivate them to take an interest in their own learning. The content stored anywhere on the network. Of course, access iLife ’09 suite of applications comes standard on every Mac, controls are built in, so they only get the search results they’re so students can immediately begin creating podcasts, editing authorised to see. Mac OS X Server also allows for real-time videos, composing music, producing photo essays and more. streaming of audio and video content, which lets everyone get right to work instead of waiting for downloads – saving major Mac or PC? Have both. storage across your network. Now one lab really can solve all your computing needs. Every Mac is powered by an Intel processor and features Launch careers from your Mac lab. Mac OS X – the world’s most advanced operating system. As an Apple Authorised Training Centre for Education, your Mac OS X comes with an amazing dual-boot feature called school can build a bridge between students and real-world Boot Camp that lets students run Windows XP or Vista natively careers. -
Intel Corporation
US RESEARCH | PUBLISHED BY RAYMOND JAMES & ASSOCIATES INTEL CORPORATION (INTC-NASDAQ) JULY 26, 2021 | 8:27 PM EDT Semiconductors COMPANY BRIEF Chris Caso | (212) 856-4893 | [email protected] Melissa Fairbanks | (727) 567-1081 | [email protected] Underperform 4 New Names, Same Problems Suitability M/ACC Intel hosted its "Intel Accelerated" manufacturing roadmap update Monday evening, detailing their process roadmap through 2025. The presentation laid a path through which Intel hopes to MARKET DATA Current Price (Jul-26-21) $54.31 have achieved parity with TSMC (and by extension, AMD) by 2024, and a goal of process leadership Market Cap (mln) $221,802 by 2025. This is no different from the goals laid out by Intel’s new CEO when he came on board Current Net Debt (mln) $10,552 a quarter ago, but the company did provide more details about how they intend to achieve that Enterprise Value (mln) $232,354 Shares Outstanding (mln) 4,084.0 goal. Attaining leadership by 2025 requires Intel to introduce a full process node improvement 30-Day Avg. Daily Value (mln) $1,362.7 each year for the next 4 years – an aggressive assumption given the production missteps from Dividend $1.39 the past several years. What Intel didn’t disclose were the costs of this roadmap, which we Dividend Yield 2.6% 52-Week Range $43.61 - $68.49 expect them to discuss during the November analyst day. And while there is great uncertainty BVPS $14.76 about Intel’s ability to achieve these targets, what’s less uncertain is a requirement for higher Long-Term Debt (mln) $24,632 capital intensity. -
An Emerging Architecture in Smart Phones
International Journal of Electronic Engineering and Computer Science Vol. 3, No. 2, 2018, pp. 29-38 http://www.aiscience.org/journal/ijeecs ARM Processor Architecture: An Emerging Architecture in Smart Phones Naseer Ahmad, Muhammad Waqas Boota * Department of Computer Science, Virtual University of Pakistan, Lahore, Pakistan Abstract ARM is a 32-bit RISC processor architecture. It is develop and licenses by British company ARM holdings. ARM holding does not manufacture and sell the CPU devices. ARM holding only licenses the processor architecture to interested parties. There are two main types of licences implementation licenses and architecture licenses. ARM processors have a unique combination of feature such as ARM core is very simple as compare to general purpose processors. ARM chip has several peripheral controller, a digital signal processor and ARM core. ARM processor consumes less power but provide the high performance. Now a day, ARM Cortex series is very popular in Smartphone devices. We will also see the important characteristics of cortex series. We discuss the ARM processor and system on a chip (SOC) which includes the Qualcomm, Snapdragon, nVidia Tegra, and Apple system on chips. In this paper, we discuss the features of ARM processor and Intel atom processor and see which processor is best. Finally, we will discuss the future of ARM processor in Smartphone devices. Keywords RISC, ISA, ARM Core, System on a Chip (SoC) Received: May 6, 2018 / Accepted: June 15, 2018 / Published online: July 26, 2018 @ 2018 The Authors. Published by American Institute of Science. This Open Access article is under the CC BY license. -
Mediatek Linkit™ Development Platform for RTOS Get Started Guide
MediaTek LinkIt™ Development Platform for RTOS Get Started Guide Version: 3.0 Release date: 30 June 2016 © 2015 - 2016 MediaTek Inc. This document contains information that is proprietary to MediaTek Inc. (“MediaTek”) and/or its licensor(s). MediaTek cannot grant you permission for any material that is owned by third parties. You may only use or reproduce this document if you have agreed to and been bound by the applicable license agreement with MediaTek (“License Agreement”) and been granted explicit permission within the License Agreement (“Permitted User”). If you are not a Permitted User, please cease any access or use of this document immediately. Any unauthorized use, reproduction or disclosure of this document in whole or in part is strictly prohibited. THIS DOCUMENT IS PROVIDED ON AN “AS-IS” BASIS ONLY. MEDIATEK EXPRESSLY DISCLAIMS ANY AND ALL WARRANTIES OF ANY KIND AND SHALL IN NO EVENT BE LIABLE FOR ANY CLAIMS RELATING TO OR ARISING OUT OF THIS DOCUMENT OR ANY USE OR INABILITY TO USE THEREOF. Specifications contained herein are subject to change without notice. MediaTek LinkIt™ Development Platform for RTOS Get Started Guide Document Revision History Revision Date Description 1.0 24 March 2016 Initial version. 2.0 17 May 2016 Move the contents relative to flash, HDK, and build comments to corresponding documents. Add the support of Keil 3.0 30 June 2016 Add the support of IAR. Refine the architecture and provide more information on the SDK usage. © 2015 - 2016 MediaTek Inc. Page i of v This document contains information that is proprietary to MediaTek Inc. -
Integrated Step-Down Converter with SVID Interface for Intel® CPU
Product Order Technical Tools & Support & Folder Now Documents Software Community TPS53820 SLUSE33 –FEBRUARY 2020 Integrated Step-Down Converter with SVID Interface for Intel® CPU Power Supply 1 Features 3 Description The TPS53820 device is D-CAP+ mode integrated 1• Single chip to support Intel VR13.HC SVID POL applications step-down converter for low current SVID rails of Intel CPU power supply. It provides up to two outputs to • Two outputs to support VCCANA (5.5 A) and power the low current SVID rails such as VCCANA P1V8 (4 A) (5.5 A) and P1V8 (4 A). The device employs D-CAP+ • D-CAP+™ Control for Fast Transient Response mode control to provide fast load transient • Wide Input Voltage (4.5 V to 15 V) performance. Internal compensation allows ease of use and reduces external components. • Differential Remote Sense • Programmable Internal Loop Compensation The device also provides telemetry, including input voltage, output voltage, output current and • Per-Phase Cycle-by-Cycle Current Limit temperature reporting. Over voltage, over current and • Programmable Frequency from 800 kHz to 2 MHz over temperature protections are provided as well. 2 • I C System Interface for Telemetry of Voltage, The TPS53820 device is packaged in a thermally Current, Output Power, Temperature, and Fault enhanced 35-pin QFN and operates between –40°C Conditions and 125°C. • Over-Current, Over-Voltage, Over-Temperature (1) protections Table 1. Device Information • Low Quiescent Current PART NUMBER PACKAGE BODY SIZE (NOM) • 5 mm × 5 mm, 35-Pin QFN, PowerPAD Package TPS53820 RWZ (35) 5 mm × 5 mm (1) For all available packages, see the orderable addendum at 2 Applications the end of the data sheet. -
Introduction to Intel® FPGA IP Cores
Introduction to Intel® FPGA IP Cores Updated for Intel® Quartus® Prime Design Suite: 20.3 Subscribe UG-01056 | 2020.11.09 Send Feedback Latest document on the web: PDF | HTML Contents Contents 1. Introduction to Intel® FPGA IP Cores..............................................................................3 1.1. IP Catalog and Parameter Editor.............................................................................. 4 1.1.1. The Parameter Editor................................................................................. 5 1.2. Installing and Licensing Intel FPGA IP Cores.............................................................. 5 1.2.1. Intel FPGA IP Evaluation Mode.....................................................................6 1.2.2. Checking the IP License Status.................................................................... 8 1.2.3. Intel FPGA IP Versioning............................................................................. 9 1.2.4. Adding IP to IP Catalog...............................................................................9 1.3. Best Practices for Intel FPGA IP..............................................................................10 1.4. IP General Settings.............................................................................................. 11 1.5. Generating IP Cores (Intel Quartus Prime Pro Edition)...............................................12 1.5.1. IP Core Generation Output (Intel Quartus Prime Pro Edition)..........................13 1.5.2. Scripting IP Core Generation.................................................................... -
Introducing the New 11Th Gen Intel® Core™ Desktop Processors
Product Brief 11th Gen Intel® Core™ Desktop Processors Introducing the New 11th Gen Intel® Core™ Desktop Processors The 11th Gen Intel® Core™ desktop processor family puts you in control of your compute experience. It features an innovative new architecture for reimag- ined performance, immersive display and graphics for incredible visuals, and a range of options and technologies for enhanced tuning. When these advances come together, you have everything you need for fast-paced professional work, elite gaming, inspired creativity, and extreme tuning. The 11th Gen Intel® Core™ desktop processor family gives you the power to perform, compete, excel, and power your greatest contributions. Product Brief 11th Gen Intel® Core™ Desktop Processors PERFORMANCE Reimagined Performance 11th Gen Intel® Core™ desktop processors are intelligently engineered to push the boundaries of performance. The new processor core architecture transforms hardware and software efficiency and takes advantage of Intel® Deep Learning Boost to accelerate AI performance. Key platform improvements include memory support up to DDR4-3200, up to 20 CPU PCIe 4.0 lanes,1 integrated USB 3.2 Gen 2x2 (20G), and Intel® Optane™ memory H20 with SSD support.2 Together, these technologies bring the power and the intelligence you need to supercharge productivity, stay in the creative flow, and game at the highest level. Product Brief 11th Gen Intel® Core™ Desktop Processors Experience rich, stunning, seamless visuals with the high-performance graphics on 11th Gen Intel® Core™ desktop -
Intel® Omni-Path Architecture (Intel® OPA) for Machine Learning
Big Data ® The Intel Omni-Path Architecture (OPA) for Machine Learning Big Data Sponsored by Intel Srini Chari, Ph.D., MBA and M. R. Pamidi Ph.D. December 2017 mailto:[email protected] Executive Summary Machine Learning (ML), a major component of Artificial Intelligence (AI), is rapidly evolving and significantly improving growth, profits and operational efficiencies in virtually every industry. This is being driven – in large part – by continuing improvements in High Performance Computing (HPC) systems and related innovations in software and algorithms to harness these HPC systems. However, there are several barriers to implement Machine Learning (particularly Deep Learning – DL, a subset of ML) at scale: • It is hard for HPC systems to perform and scale to handle the massive growth of the volume, velocity and variety of data that must be processed. • Implementing DL requires deploying several technologies: applications, frameworks, libraries, development tools and reliable HPC processors, fabrics and storage. This is www.cabotpartners.com hard, laborious and very time-consuming. • Training followed by Inference are two separate ML steps. Training traditionally took days/weeks, whereas Inference was near real-time. Increasingly, to make more accurate inferences, faster re-Training on new data is required. So, Training must now be done in a few hours. This requires novel parallel computing methods and large-scale high- performance systems/fabrics. To help clients overcome these barriers and unleash AI/ML innovation, Intel provides a comprehensive ML solution stack with multiple technology options. Intel’s pioneering research in parallel ML algorithms and the Intel® Omni-Path Architecture (OPA) fabric minimize communications overhead and improve ML computational efficiency at scale. -
NXP Semiconductors NV
SECURITIES AND EXCHANGE COMMISSION FORM SC 14D9/A Tender offer solicitation / recommendation statements filed under Rule 14d-9 [amend] Filing Date: 2017-12-13 SEC Accession No. 0000914121-17-001815 (HTML Version on secdatabase.com) SUBJECT COMPANY NXP Semiconductors N.V. Mailing Address Business Address HIGH TECH CAMPUS 60 31 40 27 43704 CIK:1413447| IRS No.: 000000000 EINDHOVEN P7 5656AG Type: SC 14D9/A | Act: 34 | File No.: 005-85657 | Film No.: 171253046 SIC: 3674 Semiconductors & related devices FILED BY ELLIOTT ASSOCIATES, L.P. Mailing Address Business Address 40 WEST 57TH STREET 40 WEST 57TH STREET CIK:904495| IRS No.: 222140975 | State of Incorp.:DE | Fiscal Year End: 1231 30TH FLOOR 30TH FLOOR Type: SC 14D9/A NEW YORK NY 10019 NEW YORK NY 10019 2125062999 Copyright © 2017 www.secdatabase.com. All Rights Reserved. Please Consider the Environment Before Printing This Document UNITED STATES SECURITIES AND EXCHANGE COMMISSION Washington, DC 20549 AMENDMENT NO. 1 to SCHEDULE 14D-9 (RULE 14d-101) SOLICITATION/RECOMMENDATION STATEMENT UNDER SECTION 14(D)(4) OF THE SECURITIES EXCHANGE ACT OF 1934 NXP Semiconductors N.V. (Name of Subject Company) Elliott Associates, L.P. Elliott International, L.P. Paul E. Singer Elliott Capital Advisors, L.P. Elliott Special GP, LLC Braxton Associates, Inc. Elliott Asset Management LLC Elliott International Capital Advisors Inc. Hambledon, Inc. Elliott Management Corporation The Liverpool Limited Partnership Liverpool Associates Ltd. Elliott Advisors (UK) Limited Manchester Securities Corp. (Name of Person(s) Filing Statement) Common Shares, par value EUR 0.20 per share (Title of Class of Securities) N6596X109 (CUSIP Number of Class of Securities) Richard M. -
Comparative Study of Various Systems on Chips Embedded in Mobile Devices
Innovative Systems Design and Engineering www.iiste.org ISSN 2222-1727 (Paper) ISSN 2222-2871 (Online) Vol.4, No.7, 2013 - National Conference on Emerging Trends in Electrical, Instrumentation & Communication Engineering Comparative Study of Various Systems on Chips Embedded in Mobile Devices Deepti Bansal(Assistant Professor) BVCOE, New Delhi Tel N: +919711341624 Email: [email protected] ABSTRACT Systems-on-chips (SoCs) are the latest incarnation of very large scale integration (VLSI) technology. A single integrated circuit can contain over 100 million transistors. Harnessing all this computing power requires designers to move beyond logic design into computer architecture, meet real-time deadlines, ensure low-power operation, and so on. These opportunities and challenges make SoC design an important field of research. So in the paper we will try to focus on the various aspects of SOC and the applications offered by it. Also the different parameters to be checked for functional verification like integration and complexity are described in brief. We will focus mainly on the applications of system on chip in mobile devices and then we will compare various mobile vendors in terms of different parameters like cost, memory, features, weight, and battery life, audio and video applications. A brief discussion on the upcoming technologies in SoC used in smart phones as announced by Intel, Microsoft, Texas etc. is also taken up. Keywords: System on Chip, Core Frame Architecture, Arm Processors, Smartphone. 1. Introduction: What Is SoC? We first need to define system-on-chip (SoC). A SoC is a complex integrated circuit that implements most or all of the functions of a complete electronic system.