Light Emitting Diodes Reliability Review ⇑ Moon-Hwan Chang A, Diganta Das A, P.V
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Application Note AN-1057
Application Note AN-1057 Heatsink Characteristics Table of Contents Page Introduction.........................................................................................................1 Maximization of Thermal Management .............................................................1 Heat Transfer Basics ..........................................................................................1 Terms and Definitions ........................................................................................2 Modes of Heat Transfer ......................................................................................2 Conduction..........................................................................................................2 Convection ..........................................................................................................5 Radiation .............................................................................................................9 Removing Heat from a Semiconductor...........................................................11 Selecting the Correct Heatsink........................................................................11 In many electronic applications, temperature becomes an important factor when designing a system. Switching and conduction losses can heat up the silicon of the device above its maximum Junction Temperature (Tjmax) and cause performance failure, breakdown and worst case, fire. Therefore the temperature of the device must be calculated not to exceed the Tjmax. To design a good -
LP5520 RGB Backlight LED Driver Datasheet
Product Sample & Technical Tools & Support & Folder Buy Documents Software Community LP5520 SNVS440B –MAY 2007–REVISED MARCH 2016 LP5520 RGB Backlight LED Driver 1 Features 3 Description The LP5520 is an RGB backlight LED driver for small 1• Temperature Compensated LED Intensity and Color format color LCDs. RGB backlights enable better colors on the display and power savings compared • Individual Calibration Coefficients for Each Color with white LED backlights. The device offers a small • Color Accuracy ΔX and ΔY ≤ 0.003 and simple driver solution without need for optical • 12-Bit ADC for Measurement of 2 Sensors feedback. Calibration in display module production can be done in one temperature. The LP5520 • Adjustable Current Outputs for Red, Green, and produces true white light over a wide temperature Blue (RGB) LED range. Three independent LED drivers have accurate • 0.2% Typical LED Output Current Matching programmable current sinks and PWM modulation • PWM Control Inputs for Each Color control. Using internal calibration memory and external temperature sensor, the RGB LED currents • SPI™ and I2C-Compatible Interface are adjusted for perfect white balance independent of • Stand-Alone Mode With One-Wire Control the brightness setting or temperature. The user • Sequential Mode for One Color at a Time programmable calibration memory has intensity vs • Magnetic High Efficiency Boost Converter temperature data for each color. This white balance calibration data can be programmed to the memory • Programmable Output Voltage from 5 V to 20 V on the production line of a backlight module. • Adaptive Output Voltage Control Option The device has a magnetic boost converter that • < 2-µA Typical Shutdown Current creates a supply voltage of up to 20 V LED from the battery voltage. -
An Analysis of Power Consumption in a Smartphone
An Analysis of Power Consumption in a Smartphone Josh Hildebrand Introduction l Mobile devices derive the energy required to operate from batteries that are limited by the size of the device. l The ability to manage energy usage requires a good understanding of where and how the energy is being used. l The advancing functionality of modern smartphones is increasing the pressure on battery lifetime, and increases the need for effective energy management. l Goal is to break down a modern smartphone and measure the power consumption of the devices major subsystems, under a range of usage scenarios. l Results from the breakdown of energy consumption will be validated against two additional mobile devices. l Finally, an analysis of the energy consumption will be performed, and an energy model will be created to allow us to model usage patterns. Methodology / Device Under Test l The approach is to take physical power measurements at the component level on a piece of real hardware. l Three elements to the experimental setup, the device under test, a hardware data acquisition (DAQ) system, and a host computer. l Device under test is the Openmoko Neo Freerunner 2.5G smartphone. Experimental Setup l To measure power to each component, supply voltage and current must be measured. l Current is measured by placing sense resistors on the power supply rails of each component. Resistors were selected such that the voltage drop did not exceed 10mV, less than 1% of the supply voltage. l Voltages were measured using a National Instruments PCI-6229 DAQ. Software l The device was running the Freerunner port of Android 1.5, using the Linux v2.6.29 kernel. -
Three-Dimensional Integrated Circuit Design: EDA, Design And
Integrated Circuits and Systems Series Editor Anantha Chandrakasan, Massachusetts Institute of Technology Cambridge, Massachusetts For other titles published in this series, go to http://www.springer.com/series/7236 Yuan Xie · Jason Cong · Sachin Sapatnekar Editors Three-Dimensional Integrated Circuit Design EDA, Design and Microarchitectures 123 Editors Yuan Xie Jason Cong Department of Computer Science and Department of Computer Science Engineering University of California, Los Angeles Pennsylvania State University [email protected] [email protected] Sachin Sapatnekar Department of Electrical and Computer Engineering University of Minnesota [email protected] ISBN 978-1-4419-0783-7 e-ISBN 978-1-4419-0784-4 DOI 10.1007/978-1-4419-0784-4 Springer New York Dordrecht Heidelberg London Library of Congress Control Number: 2009939282 © Springer Science+Business Media, LLC 2010 All rights reserved. This work may not be translated or copied in whole or in part without the written permission of the publisher (Springer Science+Business Media, LLC, 233 Spring Street, New York, NY 10013, USA), except for brief excerpts in connection with reviews or scholarly analysis. Use in connection with any form of information storage and retrieval, electronic adaptation, computer software, or by similar or dissimilar methodology now known or hereafter developed is forbidden. The use in this publication of trade names, trademarks, service marks, and similar terms, even if they are not identified as such, is not to be taken as an expression of opinion as to whether or not they are subject to proprietary rights. Printed on acid-free paper Springer is part of Springer Science+Business Media (www.springer.com) Foreword We live in a time of great change. -
Catalog-Web-ONYX-And-STAX.Pdf
1 ABOUT NEXT LED Table of Contents Our Focus Next LED is a leading American manufacturer of 2 About Next LED commercial, billboard, sports, and indoor LED displays. We pour the quality and work ethic of 4 LED 101 the heartland into every sign we engineer and assemble from our headquarters in Wichita, 6 Pitch / Dealer Tools Kansas. As the LED signage industry matures and businesses and organizations around the world realize the benefits of dynamic marketing 8 Commercial Signs through digital signs, it is our sole focus to provide the most reliable products and related services 10 Franchise / Dynamic Data that go beyond the physical components of the display. In a word, every Next LED product comes 12 Billboards loaded with VALUE. 14 Sports Highest Quality Parts While all LED signs aren’t created equal, they are, 16 Operating Software for the most part, created using the same types of components, often supplied by the exact same OEM companies. Next LED uses the highest quality 18 Custom Content LED diodes, lamps, ribbon cables, power supplies, data, and aluminum cabinetry to create a rugged, Questions? Call us at: reliable product for both on and off premise use. 2 888.263.6530 5 Year Parts, Labor, & Brightness Warranty Experience the Best Warranty in the Industry 5 YEARS It’s one thing to say you’ve got a great product; it’s another to stand behind it. Next LED’s industry leading warranty guarantees that you won’t have TM NO PARTS LABOR BRIGHTNESS anything to worry about for up to five years. -
Recommendation to Handle Bare Dies
Recommendation to handle bare dies Rev. 1.3 General description This application note gives recommendations on how to handle bare dies* in Chip On Board (COB), Chip On Glass (COG) and flip chip technologies. Bare dies should not be handled as chips in a package. This document highlights some specific effects which could harm the quality and yield of the production. *separated piece(s) of semiconductor wafer that constitute(s) a discrete semiconductor or whole integrated circuit. International Electrotechnical Commission, IEC 62258-1, ed. 1.0 (2005-08). A dedicated vacuum pick up tool is used to manually move the die. Figure 1: Vacuum pick up tool and wrist-strap for ESD protection Delivery Forms Bare dies are delivered in the following forms: Figure 2: Unsawn wafer Application Note – Ref : APN001HBD1.3 FBC-0002-01 1 Recommendation to handle bare dies Rev. 1.3 Figure 3: Unsawn wafer in open wafer box for multi-wafer or single wafer The wafer is sawn. So please refer to the E-mapping file from wafer test (format: SINF, eg4k …) for good dies information, especially when it is picked from metal Film Frame Carrier (FFC). Figure 4: Wafer on Film Frame Carrier (FFC) Figure 5: Die on tape reel Figure 6: Waffle pack for bare die Application Note – Ref : APN001HBD1.3 FBC-0002-01 2 Recommendation to handle bare dies Rev. 1.3 Die Handling Bare die must be handled always in a class 1000 (ISO 6) clean room environment: unpacking and inspection, die bonding, wire bonding, molding, sealing. Handling must be reduced to the absolute minimum, un-necessary inspections or repacking tasks have to be avoided (assembled devices do not need to be handled in a clean room environment since the product is already well packed) Use of complete packing units (waffle pack, FFC, tape and reel) is recommended and remaining quantities have to be repacked immediately after any process (e.g. -
From Sand to Circuits
From sand to circuits By continually advancing silicon technology and moving the industry forward, we help empower people to do more. To enhance their knowledge. To strengthen their connections. To change the world. How Intel makes integrated circuit chips www.intel.com www.intel.com/museum Copyright © 2005Intel Corporation. All rights reserved. Intel, the Intel logo, Celeron, i386, i486, Intel Xeon, Itanium, and Pentium are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. *Other names and brands may be claimed as the property of others. 0605/TSM/LAI/HP/XK 308301-001US From sand to circuits Revolutionary They are small, about the size of a fingernail. Yet tiny silicon chips like the Intel® Pentium® 4 processor that you see here are changing the way people live, work, and play. This Intel® Pentium® 4 processor contains more than 50 million transistors. Today, silicon chips are everywhere — powering the Internet, enabling a revolution in mobile computing, automating factories, enhancing cell phones, and enriching home entertainment. Silicon is at the heart of an ever expanding, increasingly connected digital world. The task of making chips like these is no small feat. Intel’s manufacturing technology — the most advanced in the world — builds individual circuit lines 1,000 times thinner than a human hair on these slivers of silicon. The most sophisticated chip, a microprocessor, can contain hundreds of millions or even billions of transistors interconnected by fine wires made of copper. Each transistor acts as an on/off switch, controlling the flow of electricity through the chip to send, receive, and process information in a fraction of a second. -
How Air Velocity Affects the Thermal Performance of Heat Sinks: a Comparison of Straight Fin, Pin Fin and Maxiflowtm Architectures
How Air Velocity Affects The Thermal Performance of Heat Sinks: A Comparison of Straight Fin, Pin Fin and maxiFLOWTM Architectures Introduction A device’s temperature affects its op- erational performance and lifetime. To Air, Ta achieve a desired device temperature, Heat sink the heat dissipated by the device must be transferred along some path to the Rhs environment [1]. The most common method for transferring this heat is by finned metal devices, otherwise known Rsp as heat sinks. Base Resistance to heat transfer is called TIM thermal resistance. The thermal resis- RTIM tance of a heat sink decreases with . Component case, Tc Q Component more heat transfer area. However, be- cause device and equipment sizes are decreasing, heat sink sizes are also Figure 1. Exploded View of a Straight Fin Heat Sink with Corresponding Thermal Resis- tance Diagram. growing smaller. On the other hand, . device heat dissipation is increasing. heat sink selection criteria. Q RTIM, as shown in Equation 2. Therefore, designing a heat transfer The heat transfer rate of a heat sink, , . path in a limited space that minimizes depends on the difference between the Q = (Thot - Tcold)/Rt = (Tc - Ta)/Rt (1) thermal resistance is critical to the ef- component case temperature, Tc, and fective design of electronic equipment. the air temperature, Ta, along with the where total thermal resistance, Rt. This rela- This article discusses the effects of air tionship is shown in Equation 1. For Rt = RTIM + Rsp + Rhs (2) flow velocity on the experimentally de- a basic heat sink design, as shown in termined thermal resistance of different Figure 1, the total thermal resistance Therefore, to compare different heat heat sink designs. -
Guide for the Use of the International System of Units (SI)
Guide for the Use of the International System of Units (SI) m kg s cd SI mol K A NIST Special Publication 811 2008 Edition Ambler Thompson and Barry N. Taylor NIST Special Publication 811 2008 Edition Guide for the Use of the International System of Units (SI) Ambler Thompson Technology Services and Barry N. Taylor Physics Laboratory National Institute of Standards and Technology Gaithersburg, MD 20899 (Supersedes NIST Special Publication 811, 1995 Edition, April 1995) March 2008 U.S. Department of Commerce Carlos M. Gutierrez, Secretary National Institute of Standards and Technology James M. Turner, Acting Director National Institute of Standards and Technology Special Publication 811, 2008 Edition (Supersedes NIST Special Publication 811, April 1995 Edition) Natl. Inst. Stand. Technol. Spec. Publ. 811, 2008 Ed., 85 pages (March 2008; 2nd printing November 2008) CODEN: NSPUE3 Note on 2nd printing: This 2nd printing dated November 2008 of NIST SP811 corrects a number of minor typographical errors present in the 1st printing dated March 2008. Guide for the Use of the International System of Units (SI) Preface The International System of Units, universally abbreviated SI (from the French Le Système International d’Unités), is the modern metric system of measurement. Long the dominant measurement system used in science, the SI is becoming the dominant measurement system used in international commerce. The Omnibus Trade and Competitiveness Act of August 1988 [Public Law (PL) 100-418] changed the name of the National Bureau of Standards (NBS) to the National Institute of Standards and Technology (NIST) and gave to NIST the added task of helping U.S. -
New Display Technologies (Crts), Displays Have Become Ubiquitous and Have Taken Many Different Forms
1.0 Introduction Mini Briefing Electronic displays are one of the fastest-growing worldwide technologies. Once reserved for televisions and computers, and composed of large cathode-ray tubes New Display Technologies (CRTs), displays have become ubiquitous and have taken many different forms. Flat-panel displays are overtaking the CRT and are being used in larger quantities for Steve Statham portable computers, a variety of handheld devices, desktop computers and televisions, as well as tiny microdisplays, which are being used in projection televisions, for near-eye applications, where a virtual screen is presented to the viewer. The world of displays is Advances in new display technologies are rapidly changing to meet the evolving needs of the beginning to open up many new possibilities to electronic-device user. consumers and manufacturers. Unfortunately there is always a large time lag between the discoveries made, and the time when practical applications 2.0 Applications finally appear. Even once they have been incorporated into everyday items, they are The electronic-display device industry caters mainly for the sometimes expensive. automation and electronics appliance industries. Characteristic of OEM products, the growth of the display However, major developments are now taking industry is directly linked to the demand trends in end-user place in a variety of display materials with the markets. Display manufacturers, mainly concentrated in potential to enable handheld computers and mobile Japan and East Asian countries, account for over 80% of phones to be more functional and user-friendly, total display production. which could greatly aid in the convergence of functionality and convenience that these products The end-user market (which includes televisions, are intended to deliver. -
Is the Thermal Resistance Coefficient of High-Power Leds Constant? Lalith Jayasinghe, Tianming Dong, and Nadarajah Narendran
Is the Thermal Resistance Coefficient of High-power LEDs Constant? Lalith Jayasinghe, Tianming Dong, and Nadarajah Narendran Lighting Research Center Rensselaer Polytechnic Institute, Troy, NY 12180 www.lrc.rpi.edu Jayasinghe, L., T. Dong, and N. Narendran. 2007. Is the thermal resistance coefficient of high-power LEDs constant? Seventh International Conference on Solid State Lighting, Proceedings of SPIE 6669: 666911. Copyright 2007 Society of Photo-Optical Instrumentation Engineers. This paper was published in the Seventh International Conference on Solid State Lighting, Proceedings of SPIE and is made available as an electronic reprint with permission of SPIE. One print or electronic copy may be made for personal use only. Systematic or multiple reproduction, distribution to multiple locations via electronic or other means, duplication of any material in this paper for a fee or for commercial purposes, or modification of the content of the paper are prohibited. Is the Thermal Resistance Coefficient of High-power LEDs Constant? Lalith Jayasinghe*, Tianming Dong, and Nadarajah Narendran Lighting Research Center, Rensselaer Polytechnic Institute 21 Union St., Troy, New York, 12180 USA ABSTRACT In this paper, we discuss the variations of thermal resistance coefficient from junction to board (RӨjb) for high-power light-emitting diodes (LEDs) as a result of changes in power dissipation and ambient temperature. Three-watt white and blue LED packages from the same manufacturer were tested for RӨjb at different input power levels and ambient temperatures. Experimental results show that RӨjb increases with increased input power for both LED packages, which can be attributed to current crowding mostly and some to the conductivity changes of GaN and TIM materials caused by heat rise. -
Thermal-Electrical Analogy: Thermal Network
Chapter 3 Thermal-electrical analogy: thermal network 3.1 Expressions for resistances Recall from circuit theory that resistance �"#"$ across an element is defined as the ratio of electric potential difference Δ� across that element, to electric current I traveling through that element, according to Ohm’s law, � � = "#"$ � (3.1) Within the context of heat transfer, the respective analogues of electric potential and current are temperature difference Δ� and heat rate q, respectively. Thus we can establish “thermal circuits” if we similarly establish thermal resistances R according to Δ� � = � (3.2) Medium: λ, cross-sectional area A Temperature T Temperature T Distance r Medium: λ, length L L Distance x (into the page) Figure 3.1: System geometries: planar wall (left), cylindrical wall (right) Planar wall conductive resistance: Referring to Figure 3.1 left, we see that thermal resistance may be obtained according to T1,3 − T1,5 � �, $-./ = = (3.3) �, �� The resistance increases with length L (it is harder for heat to flow), decreases with area A (there is more area for the heat to flow through) and decreases with conductivity �. Materials like styrofoam have high resistance to heat flow (they make good thermal insulators) while metals tend to have high low resistance to heat flow (they make poor insulators, but transmit heat well). Cylindrical wall conductive resistance: Referring to Figure 3.1 right, we have conductive resistance through a cylindrical wall according to T1,3 − T1,5 ln �5 �3 �9 $-./ = = (3.4) �9 2��� Convective resistance: The form of Newton’s law of cooling lends itself to a direct form of convective resistance, valid for either geometry.