New Developments in Gaas-Based Quantum Cascade Lasers
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Accomplishments in Nanotechnology
U.S. Department of Commerce Carlos M. Gutierrez, Secretaiy Technology Administration Robert Cresanti, Under Secretaiy of Commerce for Technology National Institute ofStandards and Technolog}' William Jeffrey, Director Certain commercial entities, equipment, or materials may be identified in this document in order to describe an experimental procedure or concept adequately. Such identification does not imply recommendation or endorsement by the National Institute of Standards and Technology, nor does it imply that the materials or equipment used are necessarily the best available for the purpose. National Institute of Standards and Technology Special Publication 1052 Natl. Inst. Stand. Technol. Spec. Publ. 1052, 186 pages (August 2006) CODEN: NSPUE2 NIST Special Publication 1052 Accomplishments in Nanoteciinology Compiled and Edited by: Michael T. Postek, Assistant to the Director for Nanotechnology, Manufacturing Engineering Laboratory Joseph Kopanski, Program Office and David Wollman, Electronics and Electrical Engineering Laboratory U. S. Department of Commerce Technology Administration National Institute of Standards and Technology Gaithersburg, MD 20899 August 2006 National Institute of Standards and Teclinology • Technology Administration • U.S. Department of Commerce Acknowledgments Thanks go to the NIST technical staff for providing the information outlined on this report. Each of the investigators is identified with their contribution. Contact information can be obtained by going to: http ://www. nist.gov Acknowledged as well, -
Federico Capasso “Physics by Design: Engineering Our Way out of the Thz Gap” Peter H
6 IEEE TRANSACTIONS ON TERAHERTZ SCIENCE AND TECHNOLOGY, VOL. 3, NO. 1, JANUARY 2013 Terahertz Pioneer: Federico Capasso “Physics by Design: Engineering Our Way Out of the THz Gap” Peter H. Siegel, Fellow, IEEE EDERICO CAPASSO1credits his father, an economist F and business man, for nourishing his early interest in science, and his mother for making sure he stuck it out, despite some tough moments. However, he confesses his real attraction to science came from a well read children’s book—Our Friend the Atom [1], which he received at the age of 7, and recalls fondly to this day. I read it myself, but it did not do me nearly as much good as it seems to have done for Federico! Capasso grew up in Rome, Italy, and appropriately studied Latin and Greek in his pre-university days. He recalls that his father wisely insisted that he and his sister become fluent in English at an early age, noting that this would be a more im- portant opportunity builder in later years. In the 1950s and early 1960s, Capasso remembers that for his family of friends at least, physics was the king of sciences in Italy. There was a strong push into nuclear energy, and Italy had a revered first son in En- rico Fermi. When Capasso enrolled at University of Rome in FREDERICO CAPASSO 1969, it was with the intent of becoming a nuclear physicist. The first two years were extremely difficult. University of exams, lack of grade inflation and rigorous course load, had Rome had very high standards—there were at least three faculty Capasso rethinking his career choice after two years. -
DFB Lasers Between 760 Nm and 16 Μm for Sensing Applications
Sensors 2010, 10, 2492-2510; doi:10.3390/s100402492 OPEN ACCESS sensors ISSN 1424-8220 www.mdpi.com/journal/sensors Review DFB Lasers Between 760 nm and 16 µm for Sensing Applications Wolfgang Zeller *, Lars Naehle, Peter Fuchs, Florian Gerschuetz, Lars Hildebrandt and Johannes Koeth nanoplus Nanosystems and Technologies GmbH, Oberer Kirschberg 4, 97218 Gerbrunn, Germany; E-Mails: [email protected] (L.N.); [email protected] (P.F.); [email protected] (F.G.); [email protected] (L.H.); [email protected] (J.K.) * Author to whom correspondence should be addressed; E-Mail: [email protected]; Tel.: +49-931-90827-10; Fax: +49-931-90827-19. Received: 20 January 2010; in revised form: 22 February 2010 / Accepted: 6 March 2010 / Published: 24 March 2010 Abstract: Recent years have shown the importance of tunable semiconductor lasers in optical sensing. We describe the status quo concerning DFB laser diodes between 760 nm and 3,000 nm as well as new developments aiming for up to 80 nm tuning range in this spectral region. Furthermore we report on QCL between 3 µm and 16 µm and present new developments. An overview of the most interesting applications using such devices is given at the end of this paper. Keywords: DFB; laser; QCL; sensing Classification: PACS 42.55.Px; 42.62.Fi; 42.62.-b 1. Introduction In recent years the importance of lasers in optical sensing has been continuously increasing [1]. Many apparatus use long-known techniques like fluorescence measurements after excitation by photons, e.g., to detect petroleum contamination in soils [2]. -
Binary and Ternary Transition-Metal Phosphides As Hydrodenitrogenation Catalysts
Research Collection Doctoral Thesis Binary and ternary transition-metal phosphides as hydrodenitrogenation catalysts Author(s): Stinner, Christoph Publication Date: 2001 Permanent Link: https://doi.org/10.3929/ethz-a-004378279 Rights / License: In Copyright - Non-Commercial Use Permitted This page was generated automatically upon download from the ETH Zurich Research Collection. For more information please consult the Terms of use. ETH Library Diss. ETH No. 14422 Binary and Ternary Transition-Metal Phosphides as Hydrodenitrogenation Catalysts A dissertation submitted to the Swiss Federal Institute of Technology Zurich for the degree of Doctor of Natural Sciences Presented by Christoph Stinner Dipl.-Chem. University of Bonn born February 27, 1969 in Troisdorf (NRW), Germany Accepted on the recommendation of Prof. Dr. Roel Prins, examiner Prof. Dr. Reinhard Nesper, co-examiner Dr. Thomas Weber, co-examiner Zurich 2001 I Contents Zusammenfassung V Abstract IX 1 Introduction 1 1.1 Motivation 1 1.2 Phosphides 4 1.2.1 General 4 1.2.2 Classification 4 1.2.3 Preparation 5 1.2.4 Properties 12 1.2.5 Applications and Uses 13 1.3 Scope of the Thesis 14 1.4 References 16 2 Characterization Methods 1 2.1 FT Raman Spectroscopy 21 2.2 Thermogravimetric Analysis 24 2.3 Temperature-Programmed Reduction 25 2.4 X-Ray Powder Diffractometry 26 2.5 Nitrogen Adsorption 28 2.6 Solid State Nuclear Magnetic Resonance Spectroscopy 28 2.7 Catalytic Test 33 2.8 References 36 3 Formation, Structure, and HDN Activity of Unsupported Molybdenum Phosphide 37 3.1 Introduction -
Quantum Cascade Laser-Based Substance Detection: Approaching the Quantum Noise Limit
Quantum cascade laser-based substance detection: approaching the quantum noise limit Peter C. Kuffnera, Kathryn J. Conroya, Toby K. Boysona, Greg Milford,a Mohamed A. Mabrok,a Abhijit G. Kallapura, Ian R. Petersena, Maria E. Calzadab, Thomas G. Spence,c Kennith P. Kirkbrided and Charles C. Harb a a School of Engineering and Information Technology, University College, The University of New South Wales, Canberra, ACT, 2600, Australia. b Department of Mathematical Sciences, Loyola University New Orleans, New Orleans, LA, 70118, USA. c Department of Chemistry, Loyola University New Orleans, New Orleans, LA, 70118, USA. d Forensic and Data Centres, Australian Federal Police, Weston, ACT, 2611, Australia. ABSTRACT A consortium of researchers at University of New South Wales (UNSW@ADFA), and Loyola University New Orleans (LU NO), together with Australian government security agencies (e.g., Australian Federal Police), are working to develop highly sensitive laser-based forensic sensing strategies applicable to characteristic substances that pose chemical, biological and explosives (CBE) threats. We aim to optimise the potential of these strategies as high-throughput screening tools to detect prohibited and potentially hazardous substances such as those associated with explosives, narcotics and bio-agents. Keywords: Quantum Cascade laser, Trace gas detection, Cavity Ringdown Spectroscopy, IR detection, Foren- sics 1. INTRODUCTION Analysis of bulk organic explosives is a straightforward task for well-equipped forensic laboratories, but it is more difficult to analyse trace amounts of organic explosive residues (particularly in highly-contaminated post- blast samples); this usually requires an elaborate sequence of solvent extraction from swabs and some form of chromatographic or electrophoretic separation. -
Red-Light Leds for Next-Generation Displays 6 July 2020
Red-light LEDs for next-generation displays 6 July 2020 indium gallium nitride (InGaN) semiconductors. Integrating two material systems is difficult. "Creating RGB displays requires the mass transfer of the separate blue, green and red LEDs together," says KAUST researcher Zhe Zhuang. An easier solution would be to create different-colored LEDs all on a single semiconductor chip. Optimizing the geometry, fabrication and electrical contacts is vital to maximizing the efficiency of the LED. Credit: Zhuag et al. Novel red LEDs are more temperature stable than those made using the conventional semiconductor of choice. In efforts to optimize the performance of light- emitting diodes (LEDs), King Abdullah University of Science and Technology researchers are looking at every aspect of the design, fabrication and operation of these devices. Now, they have succeeded in fabricating red LEDs, based on the The team developed an InGaN red LED structure where naturally blue-emitting semiconductor indium the output power is more stable than that of InGaP red gallium nitride, that are as stable as those based LEDs. Credit: Zhe Zhuang on indium gallium phosphide. LEDs are optical sources made from semiconductors that offer improvements on Since InGaP semiconductors are unable to emit conventional visible-light sources in terms of blue or green light, the only solution to making energy saving, smaller size and longer lifetimes. monolithic RGB micro-LEDs is to use InGaN. This LEDs can emit across the spectrum, from the material has the potential to shift its emission from ultraviolet to blue (B), green (G), red (R) and into blue to green, yellow and red by introducing more the infrared. -
Reducing Bow of Ingap on Silicon Wafers
94 Technology focus: III-Vs on silicon Reducing bow of InGaP on silicon wafers Researchers use strain engineering without impacting dislocation density. esearchers based in Singapore and the USA have been working to control the wafer bow of Rindium gallium phosphide (InGaP) epitaxial lay- ers on 200mm silicon (Si) wafers [Bing Wang et al, Semicond. Sci. Technol., vol32, p125013, 2017]. “Based on these Wafer bow is caused by observations, we can stress arising mainly conclude that the from mismatches of threading dislocation coefficients of thermal expansion between densities of the InGaP InGaP, or other III-V wafers are not compound semiconduc- affected by the lattice tors, and silicon. The mismatch. Our Ge bow (more than 200µm buffers have similar in one recent report of gallium arsenide on threading dislocation 300mm silicon wafer) is density of 3x107/cm2. introduced when the The hetero-epitaxy of material cools after high- GaAs buffers and temperature epitaxial Figure 1. Epitaxial layer structure of three InGaP/Si deposition. Bowing InGaP films did not wafers. adversely affects wafer- increase the scale processing, partic- threading dislocation was by metal-organic chemical vapor deposition ularly for large-diameter density, which (MOCVD). The germanium on silicon template layer substrates. Wafer-scale was prepared separately in a two-step low/high-tem- indicates very good equipment typically perature process, using germane (GeH4) precursor. restricts the permitted epitaxy quality.” Plan-view transmission electron microscopy (PV-TEM) bow to less than 50µm. The team believes and etch pit density (EPD) analysis gave an estimate of 7 2 The team from the that the technique dislocation density of the order 3x10 /cm . -
Supporting Information For: Solution Phase Synthesis of Indium Gallium Phosphide Alloy Nanowires Nikolay Kornienko , Desiré D
Supporting Information for: Solution Phase Synthesis of Indium Gallium Phosphide Alloy Nanowires Nikolay Kornienko1, Desiré D. Whitmore1, Yi Yu1, Stephen R. Leone1,2,4, Peidong Yang*1,3,5,6 1Department of Chemistry, 2Department of Physics and 3Department of Materials Science Engineering, University of California, Berkeley 94720, United States 4Chemical Sciences Division and 5Materials Sciences Division, Lawrence Berkeley National Lab, Berkeley CA 94720, United States 6Kavli Energy Nanosciences Institute, Berkeley, California 94720, United States * Correspondence to: [email protected] Table of Contents: Figure S1. TEM In/Ga growth seeds ............................................................................................................................. 2 Figure S2. TEM of InP and GaP NWs ............................................................................................................................. 2 Figure S3. Composition and diameter control ......................................................................................................... 3 Figure S4. XRD of InxGa1‐xP NWs .................................................................................................................................. 4 Figure S5. Electron diffraction of InxGa1‐xP NWs ................................................................................................... 5 Figure S6. Raman spectra of InP and GaP .................................................................................................................. 6 -
Arxiv:1010.1610V1 [Physics.Ins-Det] 8 Oct 2010 Ai Mouneyrac, David Emndtetm Osat O H Rpigadde- and Illumination
Detrapping and retrapping of free carriers in nominally pure single crystal GaP, GaAs and 4H-SiC semiconductors under light illumination at cryogenic temperatures David Mouneyrac,1,2 John G. Hartnett,1 Jean-Michel Le Floch,1 Michael E. Tobar,1 Dominique Cros,2 Jerzy Krupka3∗ 1School of Physics, University of Western Australia 35 Stirling Hwy, Crawley 6009 WA Australia 2Xlim, UMR CNRS 6172, 123 av. Albert Thomas, 87060 Limoges Cedex - France 3Institute of Microelectronics and Optoelectronics Department of Electronics, Warsaw University of Technology, Warsaw, Poland (Dated: October 27, 2018) We report on extremely sensitive measurements of changes in the microwave properties of high purity non-intentionally-doped single-crystal semiconductor samples of gallium phosphide, gallium arsenide and 4H-silicon carbide when illuminated with light of different wavelengths at cryogenic temperatures. Whispering gallery modes were excited in the semiconductors whilst they were cooled on the coldfinger of a single-stage cryocooler and their frequencies and Q-factors measured under light and dark conditions. With these materials, the whispering gallery mode technique is able to resolve changes of a few parts per million in the permittivity and the microwave losses as compared with those measured in darkness. A phenomenological model is proposed to explain the observed changes, which result not from direct valence to conduction band transitions but from detrapping and retrapping of carriers from impurity/defect sites with ionization energies that lay in the semicon- ductor band gap. Detrapping and retrapping relaxation times have been evaluated from comparison with measured data. PACS numbers: 72.20.Jv 71.20.Nr 77.22.-d I. -
Electronic Supplementary Information: Low Ensemble Disorder in Quantum Well Tube Nanowires
Electronic Supplementary Material (ESI) for Nanoscale. This journal is © The Royal Society of Chemistry 2015 Electronic Supplementary Information: Low Ensemble Disorder in Quantum Well Tube Nanowires Christopher L. Davies,∗a Patrick Parkinson,b Nian Jiang,c Jessica L. Boland,a Sonia Conesa-Boj,a H. Hoe Tan,c Chennupati Jagadish,c Laura M. Herz,a and Michael B. Johnston.a‡ (a) 3.950 nm (b) GaAs-QW 2.026 nm 2.181 nm 4.0 nm 3.962 nm 50 nm 20 nm GaAs-core Fig. S1 TEM image of top of B50 sample Fig. S2 TEM image of bottom of B50 sample S1 TEM Figure S1(a) corresponds to a low magnification bright field TEM image of a representative cross-section of the sample B50. The thickness of the GaAs QW has been measured in different regions. S2 1D Finite Square Well Model The variations in thickness are found to be around 4 nm and 2 For a semiconductor the Fermi-Dirac distribution for electrons in nm in the edges and in the facets, respectively, confirming the the conduction band and holes in the valence band is given by, disorder in the GaAs QW. In the HR-TEM image performed in 1 one of the edges of the nanowire cross section, figure S1(b), the f = ; (1) e,h exp((E − Ec,v) ) + 1 variation in the QW thickness (marked by white dashed lines) f b between the edge and the facets is clearly visible. c,v where b = 1=kBT, T is the electron temperature and Ef is the Figures S2 and S3 are additional TEM images of sample B50 Fermi energies of the electrons and holes. -
Basic Light Emitting Diodes
The following is for information purposes only and comes with no warranty. See http://www.bristolwatch.com/ Light Emitting Diodes Light Emitting Diodes are made from compound type semiconductor materials such as Gallium Arsenide (GaAs), Gallium Phosphide (GaP), Gallium Arsenide Phosphide (GaAsP), Silicon Carbide (SiC) or Gallium Indium Nitride (GaInN). The exact choice of the semiconductor material used will determine the overall wavelength of the photon light emissions and therefore the resulting color of the light emitted, as in the case of the visible light colored LEDs, (RED, AMBER, GREEN etc). Before a light emitting diode can "emit" any form of light it needs a current to flow through it, as it is a current dependent device. As the LED is to be connected in a forward bias condition across a power supply it should be Current Limited using a series resistor to protect it from excessive current flow. From the table above we can see that each LED has its own forward voltage drop across the PN junction and this parameter which is determined by the semiconductor material used is the forward voltage drop for a given amount of forward conduction current, typically for a forward current of 20mA. In most cases LEDs are operated from a low voltage DC supply, with a series resistor to limit the forward current to a suitable value from say 5mA for a simple LED indicator to 30mA or more where a high brightness light output is needed. Typical LED Characteristics Semiconductor Material Wavelength Color voltage at 20mA GaAs 850-940nm Infra-Red 1.2v GaAsP 630-660nm Red 1.8v GaAsP 605-620nm Amber 2.0v GaAsP:N 585-595nm Yellow 2.2v GaP 550-570nm Green 3.5v SiC 430-505nm Blue 3.6v GaInN 450nm White 4.0v 1 Multi-LEDs LEDs are available in a wide range of shapes, colors and various sizes with different light output intensities available, with the most common (and cheapest to produce) being the standard 5mm Red LED. -
The Low-Temperature Catalyzed Etching of Gallium Arsenide with Hydrogen Chloride Jeffrey L
The low-temperature catalyzed etching of gallium arsenide with hydrogen chloride Jeffrey L. Dupuie and Erdogan Gulari Department of Chemical Engineering, The University of Michiggn, Ann Arbor, Michigan 48109 (Received 18 September 1991; accepted for publication 10 January 1992) A heated tungsten filament has been used to catalyze the gas phase etching of gallium arsenide with hydrogen chloride at a substrate temperature of 563 K. Rapid etch rates, between 1 and 3 microns per minute, were obtained in a pure hydrogen chloride ambient in the pressure range of 3.3 to 20.0 Pascal. Low flow rates of hydrogen quenched the etching reaction, and resulted in degradation of the quality of the etched gallium arsenide surface. Dilution of the hydrogen chloride to 10.5% in helium reduced the etch rate to 63 nanometers per minute. The removal of 83 nm of gallium arsenide with the helium-diluted gas mixture resulted in a specular surface. X-ray photoelectron spectroscopy indicated that the gallium arsenide surface became enriched in gallium after the etch in helium-diluted hydrogen chloride. No tungsten or other metal contamination on the etched gallium arsenide surface was detected by x-ray photoelectron spectroscopy. BACKGROUND We reported previously that high purity aluminum ni- tride and silicon nitride films could be deposited by low- Development of a dielectric deposition scheme for the pressure chemical vapor deposition (LPCVD) at low sub- fabrication of viable gallium arsenide metal-insulator- strate temperatures through the catalytic action of a heated semiconductor devices will probably include an in situ sur- filament.5’6 In this process, a heated tungsten filament is face pretreatment prior to dielectric deposition due to a used to decompose ammonia.