Diabetic Breathalyzer New and Noninvasive
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Diabetic Breathalyzer New and Noninvasive Department of Electrical Engineering and Computer Science University of Central Florida Group 13 Jonathan Brown Electrical Engineer Christine Sleppy Electrical Engineer Noah Spenser Electrical Engineer Edert Geffrard Electrical Engineer Table of Contents 1.0 Executive Summary ...................................................................................... 1 2.0 Project Description ........................................................................................ 2 2.1 Project Motivation and Goals ........................................................................ 2 2.2 Project Objectives ......................................................................................... 4 2.3 Requirements and Specifications ................................................................. 5 3.0 Research and Investigations ...................................................................... 11 3.1 Research Related to Project Definition ....................................................... 11 3.1.1 Research in Breath Analysis ................................................................ 11 3.1.2 Advantages and Disadvantages of Breath Analysis ............................ 13 3.2 Project Based Research ............................................................................. 14 3.2.1 University of Pittsburgh ........................................................................ 14 3.2.2 Western New England University ......................................................... 15 3.2.3 Stony Brook University ......................................................................... 16 3.3 Existing Similar Projects and Comparison .................................................. 17 3.3.1 Breathometer ....................................................................................... 17 3.3.2 The Floome .......................................................................................... 19 3.3.3 BAC Breathalyzer ................................................................................. 19 3.4 Parts and Components Research .............................................................. 21 3.4.1 Temperature and Humidity Sensor ...................................................... 21 3.4.2 High Concentration VOC Sensor ......................................................... 22 3.4.3 Low Concentration VOC Sensor .......................................................... 23 3.4.4 Wireless Communication ..................................................................... 23 3.4.5 Microcontroller Unit .............................................................................. 24 3.4.6 Power ................................................................................................... 25 3.4.7 PCB Vendor Info .................................................................................. 25 4.0 Standards and Constraints ......................................................................... 30 4.1 Project Related Standards .......................................................................... 30 4.1.1 FDA standards ..................................................................................... 30 4.1.2 CE standard ......................................................................................... 31 4.1.3 FCC standard ....................................................................................... 33 4.1.4 IEEE standard ...................................................................................... 33 4.2 Realistic Design Constraints ....................................................................... 36 4.2.1 Parts, Component and Testing Constraints ......................................... 36 4.2.2 Economic and Time constraints ........................................................... 38 4.2.3 Environmental, Social, and Political Constraints .................................. 39 4.2.4 Ethical, Health, and Safety Constraints ................................................ 40 4.2.5 Technical Constraints ........................................................................... 41 4.2.6 Manufacturability and Sustainability constraints .................................. 43 5.0 Project Hardware and Software Design .................................................... 44 5.1 Initial Hardware Design .............................................................................. 45 5.1.1 Power ................................................................................................... 45 5.1.2 Control Unit .......................................................................................... 48 5.1.3 Communication .................................................................................... 50 5.1.4 Sensors ................................................................................................ 51 5.1.5 Physical Design .................................................................................... 54 5.2 Software Design ......................................................................................... 58 5.2.1 Device/Input Code ................................................................................ 60 5.2.2 Phone Application Code ....................................................................... 61 5.2.3 Device Communication ........................................................................ 64 5.2.4 Sensor Calibration Coding ................................................................... 66 6.0 Prototype Construction ............................................................................... 69 6.1 Master Parts List ......................................................................................... 69 6.2 BOM and parts acquisition ......................................................................... 70 6.3 PCB Specs ................................................................................................. 84 6.3.1 PCB Design .......................................................................................... 88 6.3.2 PCB Vendor Info .................................................................................. 90 6.4 Code Layout ............................................................................................... 90 6.4.1 Phone Application Framework ............................................................. 91 6.4.2 Conversion Code Layout ...................................................................... 93 6.4.3 Device Code Layout ............................................................................. 95 7.0 Project Prototype Testing ........................................................................... 98 7.1 Hardware Prototype Environment .............................................................. 98 7.1.1 Breadboard Design .............................................................................. 99 7.1.2 Testing Procedure .............................................................................. 104 7.1.3 PCB Testing ....................................................................................... 106 7.2 Software Prototype Environment .............................................................. 107 7.2.1 IDE Used ............................................................................................ 107 7.2.2 ISP Programmer Setup ...................................................................... 108 7.2.3 Testing Procedure .............................................................................. 108 8.0 Administrative Content ............................................................................. 111 8.1 Initial Budget and Finances Discussion .................................................... 111 8.2 Initial Milestone Discussion ...................................................................... 115 9.0 Project Summary and Conclusions ......................................................... 125 9.1 Project Feasibility ..................................................................................... 125 9.2 Project Operation ...................................................................................... 126 9.3 Project Conclusions .................................................................................. 126 Appendices ...................................................................................................... 129 A: Software Use .............................................................................................. 129 B: References and Citations ........................................................................... 129 C: Permissions ............................................................................................... 133 List of Tables and Figures: Table 1: Relationship between project objectives, engineering requirements, and specifications .................................................................................................. 7 Table 2: The relationship between breath and disease has been is a well-known part of diagnosis ........................................................................................... 12 Table 3: Advantages versus disadvantages of breath analysis ........................... 14 Table 4: Comparison of the possible PCB vendors and their corresponding features ......................................................................................................... 28 Table 5 : Specified power ratings from datasheets. 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