Intel Quartus Prime Pro Edition: Version 21.2 Software and Device Support Send Feedback Release Notes 2 RN-01082-21.2.0 | 2021.06.21
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Media Contacts
Media Contacts: Sarika Patel GolinHarris 972-341-2504 [email protected] Debbie Shemony Texas Instruments 301-407-9338 [email protected] (Please do not publish these numbers or e-mail addresses.) A better way to cloud: TI’s new KeyStone multicore SoCs revitalize cloud applications Announcement quote sheet 3L Ltd. “Supporting TI’s new KeyStone-based multicore SoCs is a natural extension for us, as we have been simplifying the development of solutions involving multiple processing elements for over 20 years,” said Peter Robertson, President and TechFounder, 3L Ltd. “Together with TI, we’re making designing with multicore easier for developers by automating the interconnection management when tasks are removed between cores or devices. The end result of our collaboration is making the development processes easier, faster and more efficient for designers.” 6WIND “We are delighted to support TI as it broadens its KeyStone-based SoC product line into additional markets with critical network performance requirements,” said Eric Carmès, CEO, 6WIND. “As one of the first members of the TI Design Network to announce support for the KeyStone multicore architecture, we look forward to providing the proven 6WINDGate™ packet processing software to our mutual customers. The combination of the 6WINDGate software and the newest KeyStone architecture-based SoCs represent an ideal system solution for the demanding network performance challenges faced in today’s mobile and cloud infrastructure markets.” Advantech “With TI’s new KeyStone-based multicore SoCs, Advantech is able to expand its product lines from existing DSP-based signal and media processing centric solutions to hybrid designs that leverage multiple ARM and DSP cores in a seamless integration for control and data processing,” said David Lin, senior director of DSP and video solutions, Advantech. -
Nios II Custom Instruction User Guide
Nios II Custom Instruction User Guide Subscribe UG-20286 | 2020.04.27 Send Feedback Latest document on the web: PDF | HTML Contents Contents 1. Nios II Custom Instruction Overview..............................................................................4 1.1. Custom Instruction Implementation......................................................................... 4 1.1.1. Custom Instruction Hardware Implementation............................................... 5 1.1.2. Custom Instruction Software Implementation................................................ 6 2. Custom Instruction Hardware Interface......................................................................... 7 2.1. Custom Instruction Types....................................................................................... 7 2.1.1. Combinational Custom Instructions.............................................................. 8 2.1.2. Multicycle Custom Instructions...................................................................10 2.1.3. Extended Custom Instructions................................................................... 11 2.1.4. Internal Register File Custom Instructions................................................... 13 2.1.5. External Interface Custom Instructions....................................................... 15 3. Custom Instruction Software Interface.........................................................................16 3.1. Custom Instruction Software Examples................................................................... 16 -
1A APPENDIX a UNITED STATES COURT of APPEALS for THE
1a APPENDIX A UNITED STATES COURT OF APPEALS FOR THE FEDERAL CIRCUIT ___________________ MENTOR GRAPHICS CORPORATION, AN OREGON CORPORATION, Plaintiff-Cross-Appellant v. EVE-USA, INC., A DELAWARE CORPORA- TION, SYNOPSYS EMULATION AND VERIFI- CATION S.A.S., FORMED UNDER THE LAWS OF FRANCE, SYNOPSYS, INC., A DELAWARE CORPORATION, Defendants-Appellants ___________________ 2015-1470, 2015-1554, 2015-1556 ___________________ Appeals from the United States District Court for the District of Oregon in Nos. 3:10-cv-00954-MO, 3:12-cv-01500-MO, 3:13-cv-00579-MO, Judge Michael W. Mosman. ___________________ Decided: March 16, 2017 ___________________ MARK E. MILLER, O’Melveny & Myers LLP, San Francisco, CA, argued for plaintiff-cross-appellant. 2a Also represented by ANNE E. HUFFSMITH, LUANN LO- RAINE SIMMONS. E. JOSHUA ROSENKRANZ, Orrick, Herrington & Sutcliffe LLP, New York, NY, argued for defendants- appellants. Also represented by DANIEL A. RUBENS, ANDREW D. SILVERMAN; ROBERT M. LOEB, ERIC SHUM- SKY, Washington, DC; INDRA NEEL CHATTERJEE, VICKI L. FEEMAN, TRAVIS JENSEN, SCOTT T. LONARDO, Menlo Park, CA; WILLIAM H. WRIGHT, Los Angeles, CA. SEAN C. CUNNINGHAM, DLA Piper LLP (US), San Diego, CA, for amici curiae Hewlett-Packard Com- pany, Aruba Networks, Inc., NETGEAR, Inc., Newegg Inc., Oracle America, Inc., Ruckus Wireless, Inc., Safeway Inc., SAS Institute Inc., Varian Medical Sys- tems, Inc., VeriFone, Inc., VIZIO, Inc. ________________________ Before LOURIE, MOORE, and CHEN, Circuit Judges. MOORE, Circuit Judge. The present appeal arises from litigation in the District of Oregon between Mentor Graphics Corp. (“Mentor”) and Synopsys, Inc., Synopsys Emulation and Verification S.A.S., and EVE-USA, Inc. -
Uwlink Interface / Development Platform
UWLink Interface / Development platform UWLink Mainboard User Guide Hardware / Tool description User Guide 1.0, 2010-06-01 Wireless Control Edition 2010-07-16 Published by Infineon Technologies AG 81726 Munich, Germany © 2010 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain -
Intel Quartus Prime Pro Edition User Guide: Programmer Send Feedback
Intel® Quartus® Prime Pro Edition User Guide Programmer Updated for Intel® Quartus® Prime Design Suite: 21.2 Subscribe UG-20134 | 2021.07.21 Send Feedback Latest document on the web: PDF | HTML Contents Contents 1. Intel® Quartus® Prime Programmer User Guide..............................................................4 1.1. Generating Primary Device Programming Files........................................................... 5 1.2. Generating Secondary Programming Files................................................................. 6 1.2.1. Generating Secondary Programming Files (Programming File Generator)........... 7 1.2.2. Generating Secondary Programming Files (Convert Programming File Dialog Box)............................................................................................. 11 1.3. Enabling Bitstream Security for Intel Stratix 10 Devices............................................ 18 1.3.1. Enabling Bitstream Authentication (Programming File Generator)................... 19 1.3.2. Specifying Additional Physical Security Settings (Programming File Generator).............................................................................................. 21 1.3.3. Enabling Bitstream Encryption (Programming File Generator).........................22 1.4. Enabling Bitstream Encryption or Compression for Intel Arria 10 and Intel Cyclone 10 GX Devices.................................................................................................. 23 1.5. Generating Programming Files for Partial Reconfiguration......................................... -
Introduction to Intel® FPGA IP Cores
Introduction to Intel® FPGA IP Cores Updated for Intel® Quartus® Prime Design Suite: 20.3 Subscribe UG-01056 | 2020.11.09 Send Feedback Latest document on the web: PDF | HTML Contents Contents 1. Introduction to Intel® FPGA IP Cores..............................................................................3 1.1. IP Catalog and Parameter Editor.............................................................................. 4 1.1.1. The Parameter Editor................................................................................. 5 1.2. Installing and Licensing Intel FPGA IP Cores.............................................................. 5 1.2.1. Intel FPGA IP Evaluation Mode.....................................................................6 1.2.2. Checking the IP License Status.................................................................... 8 1.2.3. Intel FPGA IP Versioning............................................................................. 9 1.2.4. Adding IP to IP Catalog...............................................................................9 1.3. Best Practices for Intel FPGA IP..............................................................................10 1.4. IP General Settings.............................................................................................. 11 1.5. Generating IP Cores (Intel Quartus Prime Pro Edition)...............................................12 1.5.1. IP Core Generation Output (Intel Quartus Prime Pro Edition)..........................13 1.5.2. Scripting IP Core Generation.................................................................... -
Siemens EDA / Mentor Graphics License Usage Reports
Siemens EDA / Mentor Graphics License Usage Reports Siemens EDA (formerly Mentor Graphics) is a US-based Effectively optimize your electronic design automation multinational corporation for Siemens EDA / Mentor Graphics electrical engineering and electronics. licenses and ensure all resource requirements are met. Tracking usage across the organization (location, team, etc.) is critical for optimizing license selection and expenditures. Product Suites: Optimize Siemens EDA (formerly Mentor Graphics) licenses All IC Products that your team uses by taking a look at patterns of historical All PCB Software All IC Packaging Software usage: Calibre Design Tanner EDA Groups and Projects Solid Edge License Denials And more License Efficiency License Harvesting License Pool - Total number of Siemens EDA (formerly Mentor Graphics) licenses and Users Real-Time / Actual usage Checkout times - Times and frequency Alerts Set up alerts to stay informed about the status of Siemens 1 EDA (formerly Mentor Graphics) licenses (See here). 2 0 2 . 5 1 . Generate Reports 6 - We have a full suite of reports available (more here). A D Our reports can also help you to look at license usage E m statistics according to organizational units. a e T Looking for a license optimization tool for growth and monitoring Siemens EDA / Mentor Graphics license servers? Looking to control access to high-cost, advanced features licenses offered by one of TeamEDA, Inc. the Siemens EDA / Mentor Graphics license servers? (603) 656-5200 [email protected] “License Asset Manager” and “LAMUM” are trademark names of TeamEDA and are products solely of TeamEDA.. -
Intel® Arria® 10 Device Overview
Intel® Arria® 10 Device Overview Subscribe A10-OVERVIEW | 2020.10.20 Send Feedback Latest document on the web: PDF | HTML Contents Contents Intel® Arria® 10 Device Overview....................................................................................... 3 Key Advantages of Intel Arria 10 Devices........................................................................ 4 Summary of Intel Arria 10 Features................................................................................4 Intel Arria 10 Device Variants and Packages.....................................................................7 Intel Arria 10 GX.................................................................................................7 Intel Arria 10 GT............................................................................................... 11 Intel Arria 10 SX............................................................................................... 14 I/O Vertical Migration for Intel Arria 10 Devices.............................................................. 17 Adaptive Logic Module................................................................................................ 17 Variable-Precision DSP Block........................................................................................18 Embedded Memory Blocks........................................................................................... 20 Types of Embedded Memory............................................................................... 21 Embedded Memory Capacity in -
Intro to T3ster
MicReDMicReD Hardware Hardware Products Products ThermalThermal Transient Transient Test Test and and Measurement Measurement MECHANICAL ANALYSIS www.mentor.com What our customers say about T3Ster “In our lab today the T3Ster is mainly used to measure the thermal resistance of our packages in customer-specific environments. Thanks to the T3Ster, these measurements are very quick and easy to perform. With the help of the T3Ster- Master software we are not only able to give customers strong confidence that our compact thermal models are correct, but also give them insights into how the heat can be dissipated to the environment and the impact of possible faults that may occur during board assembly. Furthermore, for determining the properties of SOI materials, we also measure special test chips with T3Ster, yielding reliable data for thermal simulations of our own SOI chips. T3Ster is a highly versatile piece of equipment. I am sure that we will find other application areas in the near future.” - Ir. John H.J. Janssen, Manager Virtual Prototyping, Senior Principal, NXP Semiconductors, Nijmegen, The Netherlands “As LEDs become more powerful, more attention should be paid to thermal management, which is essential to ensure “To reliably measure the interface resistance we needed a stable LED performance and long lifetime. This is why OSRAM transient measuring method. We chose the T3Ster is devoting considerable attention to thermal design. T3Ster’s because of its compactness and ease of use, allowing us accuracy and repeatability enable us to verify our thermal to improve data acquisition and processing of the designs and confirm the stability and reliability of our transient thermal data. -
Intel FPGA Product Catalog Devices: 10 Nm Device Portfolio Intel Agilex FPGA and Soc Overview
• Cover TBD INTEL® FPGA PRODUCT CATALOG Version 19.3 CONTENTS Overview Acceleration Platforms and Solutions Intel® FPGA Solutions Portfolio 1 Intel FPGA Programmable Acceleration Overview 61 Devices Intel Acceleration Stack for Intel Xeon® CPU with FPGAs 62 Intel FPGA Programmable Acceleration Cards 63 10 nm Device Portfolio - Intel AgilexTM - Intel Programmable Acceleration Card with 63 FPGA and SoC Overview 2 Intel Arria 10 GX FPGA - Intel Agilex FPGA Features 4 - Intel FPGA Programmable Acceleration Card D5005 64 Generation 10 Device Portfolio - Intel FPGA Programmable Acceleration Card N3000 65 - Generation 10 FPGAs and SoCs 6 - Intel FPGA Programmable Acceleration Card 66 - Intel Stratix® 10 FPGA and SoC Overview 7 Comparison - Intel Stratix 10 FPGA Features 9 Accelerated Workload Solutions 67 - Intel Stratix 10 SoC Features 11 - Intel Stratix 10 TX Features 13 - Intel Stratix 10 MX Features 15 Design Tools, OS Support, and Processors - Intel Stratix 10 DX Features 17 Intel Quartus® Prime Software 68 - Intel Arria® 10 FPGA and SoC Overview 20 DSP Builder for Intel FPGAs 71 - Intel Arria 10 FPGA Features 21 Intel FPGA SDK for OpenCL™ 72 - Intel Arria 10 SoC Features 23 - Intel Cyclone® 10 FPGA Overview 25 Intel SoC FPGA Embedded Development Suite 73 - Intel Cyclone 10 GX FPGA Features 26 SoC Operating System Support 74 - Intel Cyclone 10 LP FPGA Features 27 Nios® II Processor 75 - Intel MAX® 10 FPGA Overview 29 - Intel MAX 10 FPGA Features 30 Nios II Processor Embedded Design Suite 76 Nios II Processor Operating System Support 28 -
Intel FPGA SDK for Opencl Pro Edition: Programming Guide Send Feedback
Intel® FPGA SDK for OpenCL™ Pro Edition Programming Guide Updated for Intel® Quartus® Prime Design Suite: 21.2 Subscribe UG-OCL002 | 2021.06.23 Send Feedback Latest document on the web: PDF | HTML Contents Contents 1. Intel® FPGA SDK for OpenCL™ Overview......................................................................... 7 1.1. Intel FPGA SDK for OpenCL Pro Edition Programming Guide Prerequisites......................7 1.2. Intel FPGA SDK for OpenCL FPGA Programming Flow..................................................8 2. Intel FPGA SDK for OpenCL Offline Compiler Kernel Compilation Flows........................ 10 2.1. One-Step Compilation for Simple Kernels................................................................ 11 2.2. Multistep Intel FPGA SDK for OpenCL Pro Edition Design Flow.................................... 12 3. Obtaining General Information on Software, Compiler, and Custom Platform...............16 3.1. Displaying the Software Version (version)............................................................... 16 3.2. Displaying the Compiler Version (-version).............................................................. 16 3.3. Listing the Intel FPGA SDK for OpenCL Utility Command Options (help).......................17 3.3.1. Displaying Information on an Intel FPGA SDK for OpenCL Utility Command Option (help <command_option>)............................................................. 17 3.4. Listing the Intel FPGA SDK for OpenCL Offline Compiler Command Options (no argument, -help, or -h)......................................................................................17 -
Intel® Arria® 10 FPGA Performance Benchmarking Methodology and Results
WHITE PAPER FPGA Intel® Arria® 10 FPGA Performance Benchmarking Methodology and Results Intel Arria 10 FPGAs deliver more than a speed grade faster core performance † and up to a 20% fMAX advantage for publicly available OpenCore designs. Authors Introduction Martin S. Won This paper presents a rigorous methodology for evaluating and benchmarking the Senior Member of Technical Staff core performance of the Intel® Arria® 10 FPGA programmable logic product family, Intel Programmable Solutions Group with the goal of transparently presenting the methods and data such that any interested party can reproduce and analyze the results.† To this end, ten publicly- Madhu Monga available designs from OpenCores representing a variety of functions were Applications Engineer implemented in a device from the Intel Arria 10 FPGA family and a device from the Intel Programmable Solutions Group closest competitor: the Xilinx* UltraScale* family. The benchmark results show that Intel Arria 10 FPGAs deliver up to 20% higher performance than Xilinx UltraScale devices, as measured by the maximum clock frequencies achieved in the example designs across a range of device utilization.† Background: evaluating the performance of Intel FPGA and Table of Contents SoC products Introduction ....................1 The programmable logic industry does not have a standard benchmarking Background: evaluating the methodology. Therefore, Intel employs rigorous internal analysis using a broad performance of Intel FPGA and combination of customer and internally-generated designs to understand and SoC products .................1 quantify the performance of its programmable logic products relative to prior- generation Intel products and competing products. The designs are collected from Increasing transparency via a variety of market segments, such as high-performance computing, image and OpenCore-based performance video processing, wired and wireless communications, and consumer products.