Profiler II Operation Manual
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QUARTER-3-CSS-9-MODULE-7.Pdf
Republic of the Philippines Department of Education Regional Office IX, Zamboanga Peninsula Zest for Progress Zeal of Partnership 9 TLE/TVL Computer Systems Servicing Quarter 3- Module 7 Terminate /Connect Electrical Wiring/ Electronic Circuits Name of Learner: _____________________ Grade & Section: _____________________ Name of School: ______________________ 1 TLE/TVL– Grade 9 Computer System Servicing Alternative Delivery Mode Quarter III – Module 7: Terminate/ Connect electrical wiring/electronic circuits First Edition, 2020 Republic Act 8293, section 176 states that: No copyright shall subsist in any work of the Government of the Philippines. However, prior approval of the government agency or office wherein the work is created shall be necessary for exploitation of such work for profit. Such agency or office may, among other things, impose as a condition the payment of royalties. Borrowed materials (i.e., songs, stories, poems, pictures, photos, brand names, trademarks, etc.) included in this module are owned by their respective copyright holders. Every effort has been exerted to locate and seek permission to use these materials from their respective copyright owners. The publisher and authors do not represent nor claim ownership over them. Published by the Department of Education Secretary: Leonor Magtolis Briones Undersecretary: Diosdado M. San Antonio Development Team of the Module Writer: Hazel P. Bacasmo Reviewer: Evelyn C. Labad EdD, Nilda Y. Galaura EdD Editor: James L. Colaljo MAEM Illustrators: Myrlan R. Realiza Jezel Joy D. Cabrera Layout Artist: Myrlan R. Realiza Jezel Joy D. Cabrera Management Team: SDS: Ma. Liza R. Tabilon EdD, CESO V ASDS: Judith V. Romaguera EdD OIC-ASDS: Ma. Judelyn J. Ramos EdD OIC-ASDS: Armando P. -
Introduction to Subsea Engineering for Electrical Engineers
PDHonline Course E443 (4 PDH) Introduction to Subsea Engineering for Electrical Engineers Anthony K. Ho, P.E. 2017 PDH Online | PDH Center 5272 Meadow Estates Drive Fairfax, VA 22030-6658 Phone & Fax: 703-988-0088 www.PDHonline.org www.PDHcenter.com An Approved Continuing Education Provider www.PDHcenter.com PDHonline Course E443 www.PDHonline.org Table of Content 1. Introduction ........................................................................................................................... 2 2. Subsea Production Systems ................................................................................................... 4 3. Multiplexed Electro-Hydraulic Control System ..................................................................... 7 4. Subsea Control Module (SCM) ............................................................................................... 9 5. Electric Submersible Pump (ESP) ......................................................................................... 11 6. Subsea Electrical Connectors ............................................................................................... 15 7. Electrical Flying Leads (EFL) ................................................................................................. 17 7.1 Construction ............................................................................................................... 18 7.2 Installation .................................................................................................................. 19 8. Subsea Electrical -
Electrical Interconnect Products
Electrical Interconnect Products Table of Contents Introduction . .8-2 Typical SolderSleeve Device/Installation . 8-2 Product Selection . .8-3, 8-4 Wire-to-Wire Splicing Introduction . .8-5 SolderSleeve Wire Splices . .8-6 to 8-11 SolderGrip Closed End Connector Splices . .8-12 to 8-17 DuraSeal Heat-Shrinkable, Environmentally-Sealed, Nylon-Insulated Crimp Splices . .8-18, 8-19 PolyCrimp Heat-Shrinkable Polyethylene Crimp Splices . .8-20, 8-21 MiniSeal High-Performance, Immersion-Resistant Crimp Splices . .8-22 to 8-25 Insulated Terminals and Disconnects Introduction . .8-26 DuraSeal Heat-Shrinkable, Environmentally-Sealed, Nylon-Insulated Crimp Terminals and Disconnects . .8-27 to 8-32 SolderGrip Self-Fixturing Insulated Terminals . .8-33 to 8-37 Wire Termination to Pin/Post/Tab Introduction . .8-38 SolderSleeve Discrete Wire Terminators . .8-39 to 8-42 Shield Termination Introduction . .8-43 SolderSleeve Shield Terminators . .8-44 to 8-49 Coaxial Cable Termination Introduction . .8-50 SolderSleeve Coaxial Cable Terminators . .8-51, 8-52 SolderSleeve PCB/Coaxial Cable Terminators . .8-53, 8-54 RF One-Step BNC/TNC Connectors . .8-55 to 8-60 Cable-to-Cable Splicing Introduction . .8-61 SolderShield Shielded and Coaxial Cable Splices . .8-62 to 8-65 8 Shielded Contacts Electrical Interconnect Products Introduction . .8-66 SolderTacts shielded one-piece solder contacts . .8-67 to 8-75 Data Bus (MIL-STD-1553B) Components Introduction . .8-76 Cables . 8-77, 8-78 In-Line Micr ocouplers: One- and Two- Stub . .8-79 to 8-81 Ultra Lightweight In-Line Microcouplers 1- Through 6-Stub . .8-82 to 8-84 Box Couplers . -
Raychem Wire and Cable, Harnessing and Protection Products
Electrical Interconnect Products Table of Contents Introduction . .8-2 Typical Solder Sleeve Device/Installation . 8-2 Product Selection . .8-3, 8-4 Wire-to-Wire Splicing Introduction . .8-5 Solder Sleeve Wire Splices . .8-6 to 8-11 SolderGrip Closed End Connector Splices . .8-12 to 8-17 DuraSeal Heat-Shrinkable, Environmentally-Sealed, Nylon-Insulated Crimp Splices . .8-18 , 8-19 MiniSeal High-Performance, Immersion-Resistant Crimp Splices . .8-20 to 8-23 Insulated Terminals and Disconnects Introduction . .8-24 DuraSeal Heat-Shrinkable, Environmentally-Sealed, Nylon-Insulated Crimp Terminals and Disconnects . .8-25 to 8-30 SolderGrip Self-Fixturing Insulated Terminals . .8-31 to 8-35 Wire Termination to Pin/Post/Tab Introduction . .8-36 SolderSleeve Discrete Wire Terminators . .8-37 to 8-40 Shield Termination Introduction . .8-41 SolderSleeve Shield Terminators . .8-42 to 8-47 Coaxial Cable Termination Introduction . .8-48 SolderSleeve Coaxial Cable Terminators . .8-49, 8-50 SolderSleeve PCB/Coaxial Cable Terminators . .8-51, 8-52 RF One-Step BNC/TNC Connectors . .8-53 to 8-58 Cable-to-Cable Splicing Introduction . .8-59 SolderShield Sheilded and Coaxial Cable Splices . .8-60 to 8-63 8 Shielded Contacts Introduction . .8-64 SolderTacts shielded one-piece solder contacts . .8-65 to 8-73 Data Bus (MIL-STD-553B) Components Introduction . .8-74 Cables . .8-75, 8-76 In-Line Microcouplers: One- and Two- Stub . .8-77 to 8-79 Ultra Lightweight In-Line Microcouplers 1- Through 6-Stub . .8-80 to 8-82 Box Couplers . .8-83, 8-84 Discrete Connectors . .8-85, 8-86 Accessories . .8-87 to 8-91 Triaxial Size 8 Contacts . -
Project Manual Stage Lighting Upgrade At
PROJECT MANUAL STAGE LIGHTING UPGRADE AT EISENHOWER & NIMITZ H.S. for Aldine Independent School District Issued for Competitive Bids February 15,2019 Pre-Bid Conference 9999 Veterans Memorial Dr., Houston, TX 77038 February 27, 2019 at 11:00 a.m. Bids Due March 21, 2019 at 2:00 p.m. S. Chu Architects, Inc. PROJECT MANUAL STAGE LIGHTING UPGRADE AT EISENHOWER & NIMITZ H.S. for Aldine Independent School District February 15,2019 Consultants MEP Lighting Stanton Engineering Group, LLC Bos Lighting Design 1300 W. Sam Houston Parkway S., Suite 121 1245 W 18 th Street Houston, Texas 77042 Houston, Texas 77008 713-300-9292 713-968-9559 S. Chu Architects, Inc. STAGE LIGHTING INSTRUCTIONS TO BIDDERS AISD Package No. PCKRP 18-17 SECTION 00 10 00 Aldine ISD Stage Lighting Upgrade @ Eisenhower and Nimitz H.S. Bid AE Scope Checklist This checklist is provided as reference for potential contractors and subcontractors and is not intended to be an exhaustive list or to replace bid specifications, drawings, or addenda. This list is provided to verify that these items are accounted for within the base bid scope of work for the ALDINE ISD STAGE LIGHTING UPGRADE AT EISENHOWER AND NIMISTZ H.S.. Each item should be checked and the form should be signed by the bidder acknowledging line by line, every item is accounted for in full. The checklist should be included with the proposal form in the contract documents, the bid should include this list and any additional items in the plans and specifications. Any questions regarding the list should be brought to the attention of the Architect and a resolution posted by addendum prior to bidding. -
Practice for Ethernet Cabling Systems in Entertainment Lighting Applications Legacy for Recommended
Entertainment Services and Technology Association ESTA installations E & new for Recommended Practicesystems for Ethernet Cabling Systems in Entertainment Lighting Applications legacy for recommended Not Reference CP/96-1057r1 Entertainment Services and Technology Association ESTA installations ENTERTAINMENT SERVICES & TECHNOLOGY ASSOCIATIONnew for Recommended Practicesystems for Ethernet Cabling Systems in Entertainment Lighting Applications CP/96-1057r1legacy for Warning: ESTA recommends against connecting lighting equipment from different manufacturers to the same Ethernet network. In addition, ESTA does not condone connecting non-lighting nodes to a lighting network. The design details of mostrecommended existing Ethernet lighting equipment and the need for large guaranteed communications bandwidths prohibit these situations. Caution: IEEE still has an active committee modifying and improving Ethernet. The contents of this document representNot the best understanding of ESTA at the time this document was written. Changes in the IEEE standard may obsoleteReference parts of this document. ESTA will revise this document as appropriate. © 1996 Entertainment Services and Technology Association First printing: September 1996 All rights reserved. No part of this publication may be reproduced in any material form (including photocopy or electronic media) without the written permission of the Entertainment Services and Tech- nology Association. Published By: For Additional Copies of this Entertainment Services and Document Contact: Technology Association ESTA Publications 875 Sixth Avenue, Suite 1005 New York, NY 10001 USA 6443 Ridings Road, Suite 134 Phone: +1-212-244-1505 Syracuse, NY 13206 USA Fax: +1-212-244-1502 Fax or phone: +1-315-463-6467 Email: [email protected] For Electronic Copies of this Document Contact: ANSI http://webstore.ansi.org installations The ESTA Technical Standards Program The ESTA Technical Standards Program was created to servenew the ESTA Membership and the Entertainment Industry in technical standards related matters. -
NTIA Technical Report TR-82-103 Integrated Services Digital
NTIA Report 82-103 Integrated Services Digital Networks, Standards, and Related Technology D.V. Glen u.s. DEPARTMENT OF COMMERCE Malcolm Baldrige, Secretary Bernard J. Wunder, Jr., Assistant Secretary for Communications and Information June 1982 I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I Preface This report describes Integrated Services Digital Network (ISDN) concepts, status, and technologies. The ISDN is expected to be a major architectural concept in the future. Awareness of the ISDN by the military is important because the commercial sector is already be ginning to evolve in this direction on a national and international scale, and important new technologies are involved. This report is submitted as partial completion of a study being conducted for the U.S. Army's Communications Systems Agency at Ft. Monmouth, New Jersey, under project order number 105 RD. It is one of a series of reports on a multiphase project to analyze requirements and evaluate alternatives for the Defense Communications System in Europe. Administrative and technical monitoring of this pro ject was performed by Mr. R. Brynildsen of CSA. Technical and management supervision of the program at ITS was pro vided by Dr. P. M. McManamon and Mr. R. F. Linfield. Certain commercial names and companies are identified in this report to specify and describe some of the neces sary information. In no case does such identification imply exclusive recommendation or endorsement by the National Telecommunications and Information Administration. -
Stony Brook University
SSStttooonnnyyy BBBrrrooooookkk UUUnnniiivvveeerrrsssiiitttyyy The official electronic file of this thesis or dissertation is maintained by the University Libraries on behalf of The Graduate School at Stony Brook University. ©©© AAAllllll RRRiiiggghhhtttsss RRReeessseeerrrvvveeeddd bbbyyy AAAuuuttthhhooorrr... Programmable Ethernet Switches and Their Applications A DISSERTATION PRESENTED BY SRIKANT SHARMA TO THE GRADUATE SCHOOL IN PARTIAL FULFILLMENT OF THE REQUIREMENTS FOR THE DEGREE OF DOCTOR OF PHILOSOPHY IN COMPUTER SCIENCE STONY BROOK UNIVERSITY August 2008 Copyright by Srikant Sharma 2008 Stony Brook University The Graduate School Srikant Sharma We, the dissertation committee for the above candidate for the degree of Doctor of Philosophy, hereby recommend acceptance of this dissertation. Professor Tzi-cker Chiueh, Dissertation Advisor, Department of Computer Science, Stony Brook University Professor Yuanyuan Yang, Chairperson of Defense, Department of Electrical and Computer Engineering, Stony Brook University Professor Erez Zadok, Department of Computer Science, Stony Brook University Professor Jennifer Wong, Department of Computer Science, Stony Brook University Dr. Bruce Montague, Symantec Research Labs, Mountain View, CA This dissertation is accepted by the Graduate School Lawrence Martin Dean of the Graduate School ii Abstract of the Dissertation Programmable Ethernet Switches and Their Applications by Srikant Sharma Doctor of Philosophy in Computer Science Stony Brook University 2008 Simplicity, cost effectiveness, scalability, and economies of scale make Ethernet a popular choice for (a) local area networks (LAN), as well as for (b) storage area networks (SAN), and increasingly (c) metropolitan-area networks (MAN). Appli- cations of Ethernet in the SAN and MAN arena elevate it from a LAN technology to a ubiquitous networking technology. With the expanded applicability of Ethernet there are certain adaptability issues which prompt rethinking of some of its archi- tectural features. -
Universal RS 485 Fiberoptic Repeater OZD 485 G12(-1300) PRO
Manual Universal RS 485 Fiberoptic Repeater OZD 485 G12(-1300) PRO OZD 485 G12 PRO System RM P1 P2 1 2 3 DA/STAT 01 S1 S 2 S 3 S 4 RT+ K1+ K1+ K1- K1- RT- Port 1 RT- K2- K2- K2+ K2+ RT+ Ua2 GND Ua3 Hirschmann. Simply a good Connection. Order Numbers OZD 485 G12 PRO 943 894-321 OZD 485 G12-1300 PRO 943 895-321 Manual 039 555-001 Universal RS 485 Fiberoptic Repeater OZD 485 G12(-1300) PRO The performance features described here are binding Note only if they have been expressly agreed when the con- tract was made. We have checked the content of this We wish to point out that the content of this manual is document for consistency with the hardware and soft- not part of a previous or existing agreement, consent, ware it describes. However, inconsistencies cannot be or legal relationship, or shall not amend same. All the lia- ruled out, and thus we cannot guarantee absolute bilities of Hirschmann result from the respective sales consistency. Nevertheless, the information in the do- contract, which also contains the complete and solely cument is checked regularly. Necessary corrections valid guarantee regulations. These contractual guarantee are contained in the following printings. We are grate- specifications are neither enhanced nor restricted by the ful for any suggested improvements. information in this manual . Technical modifications reserved. We also wish to point out that for reasons of compre- hensibility, not every conceivable problem relating to the This document may not be passed on, copied, nor use of this device can be described in this manual. -
Raychem Wire and Cable, Harnessing and Protection Products
Electrical Interconnect Products Table of Contents Introduction . .8-2 Typical Solder Sleeve Device/Installation . 8-2 Product Selection . .8-3, 8-4 Wire-to-Wire Splicing Introduction . .8-5 Solder Sleeve Wire Splices . .8-6 to 8-11 SolderGrip Closed End Connector Splices . .8-12 to 8-17 DuraSeal Heat-Shrinkable, Environmentally-Sealed, Nylon-Insulated Crimp Splices . .8-18 , 8-19 MiniSeal High-Performance, Immersion-Resistant Crimp Splices . .8-20 to 8-23 Insulated Terminals and Disconnects Introduction . .8-24 DuraSeal Heat-Shrinkable, Environmentally-Sealed, Nylon-Insulated Crimp Terminals and Disconnects . .8-25 to 8-30 SolderGrip Self-Fixturing Insulated Terminals . .8-31 to 8-35 Wire Termination to Pin/Post/Tab Introduction . .8-36 SolderSleeve Discrete Wire Terminators . .8-37 to 8-40 Shield Termination Introduction . .8-41 SolderSleeve Shield Terminators . .8-42 to 8-47 Coaxial Cable Termination Introduction . .8-48 SolderSleeve Coaxial Cable Terminators . .8-49, 8-50 SolderSleeve PCB/Coaxial Cable Terminators . .8-51, 8-52 RF One-Step BNC/TNC Connectors . .8-53 to 8-58 Cable-to-Cable Splicing Introduction . .8-59 SolderShield Sheilded and Coaxial Cable Splices . .8-60 to 8-63 8 Shielded Contacts Introduction . .8-64 SolderTacts shielded one-piece solder contacts . .8-65 to 8-73 Data Bus (MIL-STD-553B) Components Introduction . .8-74 onlinecomponents.comCables . .8-75, 8-76 In-Line Microcouplers: One- and Two- Stub . .8-77 to 8-79 Ultra Lightweight In-Line Microcouplers 1- Through 6-Stub . .8-80 to 8-82 Box Couplers . .8-83, 8-84 Discrete Connectors . .8-85, 8-86 Accessories . -
19930003222.Pdf
ISDN AT NASA LEWIS RESEARCH CENTER Catherine Murphy Bakes* Kent State University Kent, Ohio 44242 Fredric Goldberg Steven W. Eubanks National Aeronautics and Space Administration Lewis Research Center Cleveland, Ohio 44135 Abstract The work described in this paper is an expository investigation of the potential impact of ISDN at NASA Lewis Research Center. To properly frame the subject, the paper con- tains a detailed survey of the components of Narrowband ISDN. The principles and objectives are presented as decreed by the CCITT. The various channel types are delin- eated and their associated service combinations are described. The subscriber-access network functions are explained pictorially via the ISDN reference configuration. A sec- tion on switching techniques is presented to enable the reader to understand the emer- gence of the concept of fast packet switching. This new technology is designed to operate over the high bandwidth, low error rate transmission media that characterizes the Lewis environment. A brief introduction to the next generation of networks is cov- ered with sections on Broadband ISDN (B-ISDN), Asynchronous Transfer Mode (ATM), and Synchronous Optical Networks (SONET). Applications at Lewis are pre- sented, first in terms of targets of opportunity, then in light of compatibility constraints. In-place pilot projects and testing are described that demonstrate actual usage at the Research Center. ISDN AT NASA LEWIS RESEARCH CENTER 1 * Summer Faculty Fellow at NASA Lewis Research Center. Introduction Introduction NASA Lewis Research Center has a long history of providing telecommunication and networking services to its user community. These services have completely encom- passed the traditional elements of data, video, and voice. -
CMOS Logic Ics Usage Considerations
CMOS Logiv ICs Usage Considerations Application Note CMOS Logiv ICs Usage Considerations Outline: This document explains notes on using CMOS logic ICs, methods of prevent latch-up , load- capacitance effects, unstable outputs (hazards and meta-stable outputs), and decreasing various noise effects (switching noise, reflected noise, and crosstalk noise) by pattern design. © 2019-2021 1 2021-01-31 Toshiba Electronic Devices & Storage Corporation CMOS Logiv ICs Usage Considerations Application Note Table of Contents Outline: .................................................................................................................................................... 1 Table of Contents ...................................................................................................................................... 2 1. Latch-up ............................................................................................................................................... 4 1.1. Causes of a latch-up ........................................................................................................................ 4 1.2. Measuring latch-up immunity ............................................................................................................ 5 1.3. Latch-up prevention......................................................................................................................... 6 2. Load capacitance (capacitors connected to a signal line and either VCC or GND) ............................................ 7