DOCSLIB.ORG

Download Processed Material Guide in PDF Format

Total Page：16

File Type：pdf, Size：1020Kb

Download full-text PDF Read full-text
Download Processed Material Guide in PDF Format GUIDE TO MATERIALS TOP SEIKO CO., LTD. Application Metals with Tungsten • Filaments for illumination, crucible; high melting • Vacuum furnace for heaters as well as (W) Atomic number: 74 point construction materials; • All kinds of electrodes for discharge lamps, electrical contacts; Properties • Heat screen material, (the highest Melting point (ºC) 3387 TIG welding electrodes; from all metals) • Source components for Thermal conductivity 172 semiconductor ions; ・ (W/(m K)) • Sputtering targets; Thermal expansion (the lowest 4.5 • Balance weight coefficient (×10⁻⁶) from all metals) Specific gravity 19.3 (equal to gold) Carbide: extremely hard (WC) Hardness (Hv) (GPa) 4.2 Young's modulus (GPa) 345 ◇Heat-resistant, high heat conductivity, high specific gravity Molybdenum Application (Mo) Atomic number: 42 • Illumination parts, light bulb filament support wire; • Heaters used in hot water kilns as well as Properties shields; Melting point (ºC) 2623 • Crucible, sinter board; Thermal conductivity 142 • Parts for power devices; (W/(m・K)) • Magnetron parts used in microwave ovens; Thermal expansion 5.3 • Sputtering targets material coefficient (×10⁻⁶) Specific gravity 10.2 Hardness (Hv) (GPa) 2.6 Young's modulus (GPa) 276 ◇Heat-resistant, high heat conductivity Tantalum (Ta) Atomic number: 73 Application • Parts for heat exchanger; • High temperature reactor components; Properties • Source components for semiconductor ions Melting point (ºC) 2990 Thermal conductivity Powder: condenser, target materials; 57.5 (W/(m・K)) Oxide: optical lenses' additive; Thermal expansion Carbide: cemented carbide tool 6.3 coefficient (×10⁻⁶) Specific gravity 16.7 Hardness (Hv) (GPa) 0.7 Young's modulus (GPa) 185 ◇Heat-resistant Niobium (Nb) Atomic number: 41 Application • Iron and steel additive Properties Carbide: cemented carbide tool; Melting point (ºC) 2415 Intermetallic compound: superconducting Thermal conductivity 54 magnet; ・ (W/(m K)) Compound metal: sputtering target material Thermal expansion 7.0 coefficient (×10⁻⁶) Specific gravity 8.6 Hardness (Hv) (GPa) 0.8 Young's modulus (GPa) 107 ◇Heat-resistant Universal Silver Application metal (Ag) Atomic number: 47 • Electric lines (low electric resistance); • Audio cables; • Wiring handling high frequency; Properties • Tableware, jewels, dentist treatment; Melting point (ºC) 960 • Water purifiers (sterilization); Thermal conductivity 420 (W/(m・K)) Can be used as a compound metal Thermal expansion 19.0 coefficient (×10⁻⁶) Specific gravity 10.5 Hardness (Hv) (GPa) 0.9 Young's modulus (GPa) 73 ◇High heat conductivity, high electric conductivity Copper Application (Cu) Atomic number: 29 • Wiring materials for electric appliances; • Electric lines (electric resistance is low and it is cheaper than silver); Properties • Coins, building materials; Melting point (ºC) 1084 Thermal conductivity 398 Can be used as a compound metal brass (W/(m・K)) products etc. Thermal expansion 16.6 coefficient (×10⁻⁶) Specific gravity 8.9 Hardness (Hv) (GPa) 0.8 Young's modulus (GPa) 130 ◇High heat conductivity, high electric conductivity Aluminum (Al) Atomic number: 13 Application • Coins, beverage cans, pots and pans; • Building materials, car parts; Properties • Petrol engines; Melting point (ºC) 660 • Universal machine parts Thermal conductivity 237 (W/(m・K)) Can be used as a compound metal duralumin Thermal expansion etc. 23.2 coefficient (×10⁻⁶) Specific gravity 2.7 Hardness (Hv) (GPa) 0.5 Young's modulus (GPa) 71 ◇Light weight Application Stainless steel • Austenite type: (SUS) steel alloy kitchen equipment, tableware, utensils used in chemical medicine, universal machine parts; Properties • Martensite type: Melting point (ºC) 1450 kitchen knives, Thermal conductivity high-durability quenching machine 16.3 (W/(m・K)) parts; Thermal expansion • Ferrite type: 18.0 coefficient (×10⁻⁶) pots using electromagnetic cooker, etc. Specific gravity 7.9 Hardness (Hv) (GPa) 2.0 Young's modulus (GPa) 200 ◇Corrosion-resistant Alumina Ceramics 1 Application (Aluminum oxide) Al2O3 • Insulators, parts insulating electricity; • Furnace walls, furnace parts, jigs; Properties • Nozzles, spinning tube; Melting point (ºC) 2054 • Reaction crucible, reaction vessels; Thermal Shock • Semiconductor-related parts; 200 Resistance (ºC) • Liquid crystal production parts; Thermal conductivity • Electron tube parts, pumps, 30 (W/(m・K)) grinding materials Thermal expansion 5.3 coefficient (×10⁻⁶) Specific gravity 3.9 Hardness (Hv) (GPa) 18 ◇High intensity, abrasion-resistant, heat-resistant, corrosion-resistant Aluminum nitride Application AlN • Crucible; • Components for heat sink, heat- resistant sheets; Properties • Semiconductor devices' parts: Melting point (ºC) 2200 heaters, ESC, Thermal Shock dummy wafers, 400 Resistance (ºC) susceptor rings, Thermal conductivity shower plates, 160 (W/(m・K)) chambers, Thermal expansion RF-windows 2.4 coefficient (×10⁻⁶) Specific gravity 3.3 Hardness (Hv) (GPa) 13 ◇High heat conductivity Silicon nitride Si N 3 4 Application • Parts for engines; • Gas turbine parts; Properties • Bearing, guide rolls; Melting point (ºC) 1600 • Cutting tools, pulverizer parts; Thermal Shock 650 • Gas burner parts; Resistance (ºC) • Mixing blades Thermal conductivity 13 (W/(m・K)) Thermal expansion 1.5 coefficient (×10⁻⁶) Specific gravity 3.2 Hardness (Hv) (GPa) 16 ◇High intensity, abrasion resistive, thermal shock-resistant Silicon carbide SiC Application • Parts using hot water; Properties • Slide parts: Melting point (ºC) 2730 bearing, Thermal Shock mechanical seals 450 Resistance (ºC) Thermal conductivity DPF components (filters collecting dust) 150 (W/(m・K)) Thermal expansion 2.9 coefficient (×10⁻⁶) Specific gravity 3.1 Hardness (Hv) (GPa) 24 ◇High solidity, high rigidity, high heat conductivity Ceramics 2 Zirconia (Zirconium dioxide) ZrO2 Application • Industrial purposes cutlery; • Scissors, kitchen knife; Properties • Gauges: Melting point (ºC) 2715 pin gauge, block gauge, Thermal Shock 280 wrecking ball; º Resistance ( C) • Various wear resistant parts Thermal conductivity 3 (W/(m・K)) Thermal expansion 7.7 coefficient (×10⁻⁶) Specific gravity 6.0 Hardness (Hv) (GPa) 13 ◇High tenacity, high intensity, abrasion-resistant Boron nitride BN Application • High temperature atmospheric furnace insulator; Properties • Various semiconductors; Melting point (ºC) 2700 • Compound semiconductor crucible; Thermal Shock • Electrical part assembly jigs; 1500 Resistance (ºC) • Heat sinks Thermal conductivity 63 Powder: high temperature lubrication additive, (W/(m・K)) Thermal expansion release agent cosmetic products 1.4 coefficient (×10⁻⁶) Specific gravity 1.8 Hardness (Hv) (GPa) 0.8 ◇High temperature insulation resistance, thermal shock-resistant Silicon Semi-metal (Si) Atomic number : 14 Application Properties • Semi-conductor parts; Melting point (ºC) 1400 • Semi-conductor manufacturing Thermal Shock - equipment parts; Resistance (ºC) • Solar battery Thermal conductivity 148 (W/(m・K)) Thermal expansion 4.2 coefficient (×10⁻⁶) Specific gravity 2.3 Hardness (Mohs) 6.5 Application Glass Quartz glass • Optics: optical lens and prisms, various lasers lenses; Properties • Chemistry: Melting point (ºC) 1700 solvent distilling container, Thermal Shock chemical experiment 1000 Resistance (ºC) equipment; Thermal conductivity • Semi conductor industrial uses: 1.4 (W/(m・K)) CVD, all kinds of furnace tube Thermal expansion for diffusion purposes, 0.5 coefficient (×10⁻⁶) photomasks and etc. Specific gravity 2.2 Hardness (Hv) (GPa) 9 ◇Thermal shock-resistant, low expansion Metal Material Properties Table 1 ※Published data is for reference only Material Metals with high melting point Alloys Heavy alloy Alloy Alloy Sealing alloy Sealing alloy Data Unit Tungsten Molybdenum Tantalum Niobium Titan Heavy metal (W-Cu) (Mo-Cu) (Kovar) (Kovar) (W-) FeNiCo FeNiCo Material symbol W Mo Ta Nb Ti W-Cu Mo-Cu W:90% (sintered) (HIP) ～ ～ ～ Ni:29% Co:17% Fe:53.5% Ni:29% Co:17% Fe:53.5% Component amount [%] 99.9% 99.99% 99.9% 99.99% 99.9% 99.99% 99.8% 99.98% W:89% Cu:11% Mo:65% Cu:35% W:90% Mn:0.3% Si: 0.2% Mn:0.3% Si: 0.2% Density [g/cm3] 19.3 10.2 16.6 8.47 4.54 17.00 9.70 17.0 8.0 8.35 Vickers hardness 1.30(1 type-HB) 1.60(2 type-HB) 1.70 < 3.20(Hv30) Hardness Hv1 [GPa] 4.20 2.60 0.69～1.20 0.50～0.80 2.00(3 type-HB) 3.00 1.60 1.50 2.30(4 type-HB) ※rolled sheet 26(HRC) （load=9.807N） 20℃ [MPa] 207 124 270～410(1 type-RT) > 480 > 280 590 540 540 690 600℃ [MPa] 200(100℃) 340～510(2 type-RT) (Compressive Tensile strength 2.0 800℃ [MPa] 175(200℃) 480～620(3 type-RT) impact value 1000℃ [MPa] 160(250℃) 550～750(4 type-RT) Machining >165(1 type-RT) properties >215(2 type-RT) Yield strength [MPa] 138 85 >345(3 type-RT) 510 270 270 >485(4 type-RT) >27(1type-RT) >15(2 type-RT) Dilation [%] 20 25 >18(3 type-RT) 0.4 35 35 >485(4 type-RT) Flexural rigidity [GPa] 1900 1.4 Young's modulus [GPa] 403 327 185 103 106 330 220 280 159 159 Poisson's ratio - 0.32 0.35 0.38 0.34 Depending on Max. use temp. [℃] 3000 1900 700 and more atmosphere Recrystallization temperature [℃] 1150～1350 900～1200 900～1400 Melting point [℃] 3387 2623 3017 2468 1668 1450 1450 Boiling point [℃] 5527 4827 RT [*10-6/℃] 5.10 5.2(200℃) 5.2(200℃) RT～100℃ [*10-6/℃] 4.5 5.2 7.1 8.4 6.1 8.6 6.0 Linear 5.1(300℃) 5.1(300℃) 4.9(400℃) 4.9(400℃) expansion RT～500℃ [*10-6/℃] 4.6 5.7 3.6 6.4(300℃) 9.2(300℃) 6.2(300℃) 5.3(450℃) 5.3(450℃) Thermal coefficient RT～1000℃ [*10-6/℃] 4.6 5.75 6.7(450℃) 9.6(450℃) 6.2(450℃) 6.2(500℃) 6.2(500℃) properties 5.4(2000℃) RT～1500℃ [*10-6/℃] 6.51 6.0 6.6(3000℃) 20℃ [W/(m･K)] 168 142 17 180 210 90
Load more

Recommended publications
  • Thermal Shock
    TEACHER INSTRUCTIONS Thermal Shock Objective: To illustrate thermal expansion and thermal shock. Background Information: In physics, thermal expansion is the tendency of matter to increase in volume or pressure when heated. For liquids and solids, the amount of expansion will normally vary depending on the material’s coefficient of thermal expansion. When materials contract, tensile forces are created. When things expand, compressive forces are created. Thermal shock is the name given to cracking as a result of rapid temperature change. From the laboratory standpoint, there are three main types of glass used today: borosilicate, quartz, and soda lime or flint glass. Borosilicate glass is made to withstand thermal shock better than most other glass through a combination of reduced expansion coefficient and greater strength, though fused quartz outperforms it in both respects. Some glass-ceramic materials include a controlled proportion of material with a negative expansion coefficient, so that the overall coefficient can be reduced to almost exactly zero over a reasonably wide range of temperatures. Improving the shock resistance of glass and ceramics can be achieved by improving the strength of the materials or by reducing its tendency to uneven expansion. One example of success in this area is Pyrex, the brand name that is well known to most consumers as cookware, but which is also used to manufacture laboratory glassware. Pyrex traditionally is made with a borosilicate glass with the addition of boron, which prevents shock by reducing the tendency of glass to expand. Demo description: Three different types of glass rods will be heated so that students can observe the amount of thermal shock that occurs.
    [Show full text]
  • Ocean Drilling Program Initial Reports Volume
    Sigurdsson, H., Leckie, R.M., Acton, G.D., et al., 1997 Proceedings of the Ocean Drilling Program, Initial Reports, Vol. 165 2. EXPLANATORY NOTES1 Shipboard Scientific Party2 INTRODUCTION Shipboard Scientific Procedures Numbering of Sites, Holes, Cores, and Samples In this chapter, we have assembled information that documents our scientific methods. This information concerns only shipboard Drilling sites are numbered consecutively from the first site methods described in the site reports in the Initial Reports volume of drilled by the Glomar Challenger in 1968. A site number refers to the Leg 165 Proceedings of the Ocean Drilling Program (ODP). one or more holes drilled while the ship was positioned over one Methods for shore-based analyses of Leg 165 data will be described acoustic beacon. Multiple holes may be drilled at a single site by pull- in the individual scientific contributions to be published in the Scien- ing the drill pipe above the seafloor (out of the hole), moving the ship tific Results volume. some distance from the previous hole, and then drilling another hole. Coring techniques and core handling, including the numbering of In some cases, the ship may return to a previously occupied site to sites, holes, cores, sections, and samples were the same as those re- drill additional holes. ported in previous Initial Reports volumes of the Proceedings of the For all ODP drill sites, a letter suffix distinguishes each hole Ocean Drilling Program with two exceptions: The core sections drilled at the same site. For example, the first hole drilled is assigned from Holes 1002D and 1002E in the Cariaco Basin were not split dur- the site number modified by the suffix "A," the second hole takes the ing Leg 165; instead, they were transported to the Gulf Coast Repos- site number and suffix "B," and so forth.
    [Show full text]
  • Effects of Thermal Annealing on Femtosecond Laser Micromachined Glass Surfaces
    micromachines Article Effects of Thermal Annealing on Femtosecond Laser Micromachined Glass Surfaces Federico Sala 1,2 , Petra Paié 2,* , Rebeca Martínez Vázquez 2 , Roberto Osellame 1,2 and Francesca Bragheri 2 1 Department of Physics, Politecnico di Milano, Piazza Leonardo da Vinci 32, 20133 Milano, Italy; [email protected] (F.S.); [email protected] (R.O.) 2 Istituto di Fotonica e Nanotecnologie, CNR, Piazza Leonardo da Vinci 32, 20133 Milano, Italy; [email protected] (R.M.V.); [email protected] (F.B.) * Correspondence: [email protected] Abstract: Femtosecond laser micromachining (FLM) of fused silica allows for the realization of three- dimensional embedded optical elements and microchannels with micrometric feature size. The performances of these components are strongly affected by the machined surface quality and residual roughness. The polishing of 3D buried structures in glass was demonstrated using different thermal annealing processes, but precise control of the residual roughness obtained with this technique is still missing. In this work, we investigate how the FLM irradiation parameters affect surface roughness and we characterize the improvement of surface quality after thermal annealing. As a result, we achieved a strong roughness reduction, from an average value of 49 nm down to 19 nm. As a proof of concept, we studied the imaging performances of embedded mirrors before and after thermal polishing, showing the capacity to preserve a minimum feature size of the reflected image lower than 5 µm. These results allow for us to push forward the capabilities of this enabling fabrication technology, and they can Citation: Sala, F.; Paié, P.; Martínez be used as a starting point to improve the performances of more complex optical elements, such as Vázquez, R.; Osellame, R.; Bragheri, F.
    [Show full text]
  • Ultradeep Fused Silica Glass Etching with an HF- Resistant Photosensitive Resist for Optical Imaging Applications
    Ultradeep fused silica glass etching with an HF- resistant photosensitive resist for optical imaging applications John M Nagarah and Daniel A Wagenaar Broad Fellows Program and Division of Biology California Institute of Technology 1200 E. California Blvd. MC 216-76 Pasadena, CA 91125 [email protected] [email protected] Abstract Microfluidic and optical sensing platforms are commonly fabricated in glass and fused silica (quartz) because of their optical transparency and chemical inertness. Hydrofluoric acid (HF) solutions are the etching media of choice for deep etching into silicon dioxide substrates, but processing schemes become complicated and expensive for etching times greater than 1 hour due to the aggressiveness of HF migration through most masking materials. We present here etching into fused silica more than 600 μm deep while keeping the substrate free of pits and maintaining a polished etched surface suitable for biological imaging. We utilize an HF-resistant photosensitive resist (HFPR) which is not attacked in 49% HF solution. Etching characteristics are compared for substrates masked with the HFPR alone and the HFPR patterned on top of Cr/Au and polysilicon masks. We used this etching process to fabricate suspended fused silica membranes, 8–16 μm thick, and show that imaging through the membranes does not negatively affect image quality of fluorescence microscopy of biological tissue. Finally, we realize small through-pore arrays in the suspended membranes. Such devices will have applications in planar electrophysiology platforms, especially where optical imaging is required. 1. Introduction Glass and fused silica are appealing materials for constructing microelectromechanical systems (MEMS), lab-on-a-chip, and microfluidic platforms due to their chemical inertness, biocompatibility, optical transparency, mechanical rigidity, high melting point, electrical insulation, gas impermeability, and ability to bond to silicon, glass, and polydimethylsiloxane (PDMS) [1-3].
    [Show full text]
  • Investigation of Light Output Uniformity and Performance Using a UV
    Investigation of light output uniformity and performance using a UV transmitting glass optic to improve cure quality Brian Jasenak, Rachel Willsey, Adam Willsey, James Forish Kopp Glass 2108 Palmer Street Pittsburgh, PA 15218 ABSTRACT Ultraviolet light-emitting diode (UV LED) adoption is accelerating; they are being used in new applications such as UV curing, germicidal irradiation, nondestructive testing, and forensic analysis. In many of these applications, it is critically important to produce a uniform light distribution and consistent surface irradiance. Flat panes of fused quartz, silica, or glass are commonly used to cover and protect multi-UV LED arrays. However, they don’t offer the advantages of an optical lens design. An investigation was conducted to determine the effect of a secondary glass optic on the uniformity of the light distribution and irradiance. Glass optics capable of transmitting UV-A, UV-B, and UV-C wavelengths can improve light distribution and intensity. In this study, a UV transmitting glass formulation and secondary linear optic were designed and manufactured to demonstrate their effects on achievable irradiance intensity and uniformity. Prismatic patterning on the light source surface of the lens was used to minimize reflection losses on the incident surface of the glass. Fresnel optics were molded into the opposite side of the UV transmitting glass to control the refraction of the light and to gain the desired light intensity distribution from two multi-UV LED arrays. A 20% increase in relative irradiance was observed while maintaining the same coverage area. This work discusses the optical design and the resulting benefits of controlled light output on UV LED systems, which include reduced driving current, decreased thermal deterioration, improved energy efficiency, and longer LED lifetime.
    [Show full text]
  • Lecture #16 Glass-Ceramics: Nature, Properties and Processing Edgar Dutra Zanotto Federal University of São Carlos, Brazil [email protected] Spring 2015
    Glass Processing Lecture #16 Glass-ceramics: Nature, properties and processing Edgar Dutra Zanotto Federal University of São Carlos, Brazil [email protected] Spring 2015 Lectures available at: www.lehigh.edu/imi Sponsored by US National Science Foundation (DMR-0844014) 1 Glass-ceramics: nature, applications and processing (2.5 h) 1- High temperature reactions, melting, homogeneization and fining 2- Glass forming: previous lectures 3- Glass-ceramics: definition & applications (March 19) Today, March 24: 4- Composition and properties - examples 5- Thermal treatments – Sintering (of glass powder compactd) or -Controlled nucleation and growth in the glass bulk 6- Micro and nano structure development April 16 7- Sophisticated processing techniques 8- GC types and applications 9- Concluding remmarks 2 Review of Lecture 15 Glass-ceramics -Definition -History -Nature, main characteristics -Statistics on papers / patents - Properties, thermal treatments micro/ nanostructure design 3 Reading assignments E. D. Zanotto – Am. Ceram. Soc. Bull., October 2010 Zanotto 4 The discovery of GC Natural glass-ceramics, such as some types of obsidian “always” existed. René F. Réaumur – 1739 “porcelain” experiments… In 1953, Stanley D. Stookey, then a young researcher at Corning Glass Works, USA, made a serendipitous discovery ...… 5 <rms> 1nm Zanotto 6 Transparent GC for domestic uses Zanotto 7 Company Products Crystal type Applications Photosensitive and etched patterned Foturan® Lithium-silicate materials SCHOTT, Zerodur® β-quartz ss Telescope mirrors Germany
    [Show full text]
  • VSMOW Triple Point of Water Cells: Borosilicate Versus Fused-Quartz
    VSMOW Triple Point of Water Cells: Borosilicate versus Fused- Quartz M. Zhao1,3 and G. F. Strouse 2 1 Fluke Corporation, Hart Scientific Division, American Fork, Utah 84003, U.S.A. 2 National Institute of Standards and Technology, Gaithersburg, Maryland 20899, U.S.A. 3 To whom correspondence should be addressed. E-mail: [email protected] ABSTRACT To investigate an ideal container material for the triple point of water (TPW) cell, and reduce the influence to the triple-point temperature due to the deviation of the isotopic composition of the water, we developed and tested both borosilicate and fused-quartz glass shelled TPW cells with isotopic composition substantially matching that of Vienna Standard Mean Ocean Water (VSMOW). Through a specially designed manufacturing system, the isotopic composition, δD and δ18O, of the water in the TPW cell could be controlled within ±10‰ (per mil) and ±1.5‰ respectively, resulting in control of the isotopic temperature correction to better than ±8 µK. Through an ampoule attached to the cell, the isotopic composition of the water in the cell could be analyzed individually. After manufacture, the initial triple-point temperature of the two types of cell were measured and compared to assess the quality of the cells and manufacturing process. Cells fabricated with the new system agree to within 50 µK. Two innovatively-designed borosilicate and fused-quartz TPW cells were made, each with six attached ampoules. We removed one ampoule every six months to track any changes in purity of the water over time. KEY WORDS: isotopic composition; ITS-90, TPW cell; Vienna standard mean ocean water; VSMOW; water impurities; water triple point.
    [Show full text]
  • Specialty Glass Technical Capabilities
    SpecialtySpecialty GlassGlass TechnicalTechnical CapabilitiesCapabilities 07/1307/13 Web: www.abrisatechnologies.com - E–mail: [email protected] - Tel: (877) 622-7472 Page 1 Specialty Glass Products Technical Reference Document 07/13 It all starts with the basic element, the glass. Each substrate has unique and specific qualities which are matched to the application and specifications that your unique project requires. Abrisa Technologies offers: High Ion-Exchange (HIE) Thin Glass High Ion-Exchange (HIE) Aluminosilicate Thin Glass - (Page 3) Asahi Dragontrail™ - (Pages 4 & 5) Corning® Gorilla® Glass - (Pages 6 & 7) SCHOTT Xensation™ Cover Glass - (Page 8) Soda-Lime Soda-Lime (Clear & Tinted) - (Page 9) Soda-Lime (Low Iron) - (Page 10) Soda-Lime (Anti-Glare Reducing Etched Glass) - (Page 11) Patterned Glass for Light Control - (Page 12 & 13) Soda-Lime Low Emissivity (Low-E) Glass - (Page 14) Soda-Lime (Heat Absorbing Float Glass) - (Page 15) Borosilicate SCHOTT BOROFLOAT® 33 Multi-functional Float Glass - (Pages 16 & 17) SCHOTT BOROFLOAT Infrared (IRR) - (Page 18) SCHOTT SUPREMAX® Rolled Borosilicate - (Pages 19 & 20) SCHOTT D263 Colorless Thin Glass - (Pages 21 & 22) SCHOTT Duran® Lab Glass - (Pages 24 & 25) Ceramic/Glass SCHOTT Robax® Transparent Ceramic Glass - (Page 26) SCHOTT Pyran® Fire Rated Glass Ceramic - (Page 27) Quartz/Fused Silica Corning® 7980 Fused Silica - (Page 28) GE 124 Fused Quartz - (Page 309 Specialty Glass Corning® Eagle XG LCD Glass Free of Heavy Metals - (Page 30 & 31) Laminated Glass - Safety Glass - (Page 32) SCHOTT Superwhite B270® Flat Glass - (Page 33) Weld Shield - (Page 354 White Flashed Opal - (Page 35) X-Ray Glass (Radiation Shielding Glass) - (Page 376 Web: www.abrisatechnologies.com - E–mail: [email protected] - Tel: (877) 622-7472 Page 2 Specialty Glass Products Technical Reference Document 07/13 High Ion-Exchange (HIE) High Ion-Exchange (HIE) Chemically Strengthened Aluminosilicate Thin Glass High Ion-Exchange (HIE) thin glass is strong, lightweight and flexible.
    [Show full text]
  • SUPTEV007 Poster Submission.Pdf
    Development of a system for coating SRF cavities using Remote Plasma CVD (Chemical Vapor Deposition) Gabriel Gaitan, Zeming Sun, Adam Holic, Gregory Kulina, Matthias Liepe, James Sears, Paul Bishop (CLASSE) Setup Background • Samples are loaded on Moly boats and • Thin-film surfaces employing Nb3Sn, NbN, NbTiN, and introduced in the system for other compound superconductors are destined to annealing/CVD Clean Room allow reaching superior RF performance levels in SRF • Fused Quartz tube suitable to 1100C Turbopump cavities • An RF source will create plasma from the & VQM • Optimized, advanced deposition processes are precursors and this will reduce processing Quartz tube required to enable high-quality films of such materials temperature and promote precursor on large and complex shaped cavities. In doing this, decomposition Cornell University is developing a remote plasma- • Clean room is used for minimizing enhanced chemical vapor deposition (CVD) system contaminants in the furnace Furnace Furnace that facilitates coating on complicated geometries • Heat shields protect the O-rings on the controls with a high deposition rate. end flanges from overheating. Plasma source Cold trap Furnace offers independent control of heating for all 3 • Loading and unloading system is being designed to allow processing of small VQM is important for monitoring carbon and hydrogen zones of the furnace. Maximum furnace temperature samples and cavities of 2.6GHz and 3.9GHz. contamination that might affect cavity performance 1500C. Moly boats Maximum safe
    [Show full text]
  • Quartz Properties
    Quartz Properties http://www.quartz.com/mpmdata.html Fused Quartz Properties & Usage Guide MPM Type 214, 214LD and 124 Momentive Quartz Plant - Willoughby, OH Properties Index Material Types ... Use Guidelines ... Physical Properties ... Chemical Composition ... Electrical Properties ... Mechanical Properties ... Permeability ... Thermal Properties ... Trace Elements ... Optical Properties ... Semiconductor Grade Fused Quartz Tubing In the semiconductor industry a combination of extreme purity and excellent high temperature properties make fused quartz tubing an ideal furnace chamber for processing silicon wafers. The material can tolerate the wide temperature gradients and high heat rates of the process. And its purity creates the low contamination environment required for achieving high wafer yields. The advent of eight inch wafers combined with today's smaller chip sizes has increased chip production by a factor of four compared to technology in place just a few years ago. These developments have impacted heavily on quartz produced, requiring both large diameter tubing and significantly higher levels of purity. GE Quartz. has responded on both counts. Quartz tubing is available in a full range of sizes, including diameters of 400mm and larger. Diameter and wall thickness dimensions are tightly controlled. Special heavy wall thicknesses are available on request. By finding new and better sources of raw material, expanding and modernizing our production facilities, and upgrading our quality control functions, GE has reduced contaminants levels in its fused quartz tubing to less than 25 ppm, with alkali levels below 1 ppm. Grade 214LD This is the large diameter grade of industry standard 214 quartz tubing. For all but the highly specialized operations, this low cost tubing offers the levels of purity, sag resistance, furnace life and other properties that diffusion and CVD processes require.
    [Show full text]
  • SCHOTT Technical Glasses
    SCHOTT Technical Glasses Physical and technical properties Foreword part from its application in optics, glass as a technical material exerted a A formative influence on the development of important technological fields such as chemistry, pharmaceutics, automotive, optoelectronics and renewable energy such as solar thermal or photovoltaics. Traditional areas of technical application for glass, such as laboratory apparatus, flat panel displays and light sources with their various requirements on chemicophysical properties, led to the development of a great variety of special glass types. By new fields of application, particularly in optoelectronics, this variety of glass types and their modes of application have been continually enhanced, and new forming processes have been developed. The hermetic encapsulation of electronic components gave decisive impetus to development activities. Finally, the manufacture of high-quality glass ceramics from glass has opened entirely new dimensions, setting new standards for various technical applications. To continuously optimize all commercial glasses and glass articles for existing applications and to develop glasses and processes for new applications is the constant endeavor of SCHOTT research. For such dynamic development it is mandatory to be in close contact with the customers and to keep them as well informed as possible about glass. SCHOTT Technical Glasses offers pertinent information in concise form. It contains general information for the determination and evaluation of important glass properties and also informs about specific chemical and physical characteristics and possible applications of the commercial technical glasses produced by SCHOTT. With this brochure we intend to assist scientists, engineers, and design- ers in making the appropriate choice and optimum use of SCHOTT products.
    [Show full text]
  • Stability of Materials for Use in Space-Based Interferometric Missions
    STABILITY OF MATERIALS FOR USE IN SPACE-BASED INTERFEROMETRIC MISSIONS By ALIX PRESTON A DISSERTATION PRESENTED TO THE GRADUATE SCHOOL OF THE UNIVERSITY OF FLORIDA IN PARTIAL FULFILLMENT OF THE REQUIREMENTS FOR THE DEGREE OF DOCTOR OF PHILOSOPHY UNIVERSITY OF FLORIDA 2010 1 °c 2010 Alix Preston 2 This is dedicated to all who were told they would fail, only to prove them wrong 3 ACKNOWLEDGMENTS Much of this work would not have been made possible if it were not for the help of many graduate and undergraduate students, faculty, and sta®. I would like to thank Ira Thorpe, Rachel Cruz, Vinzenz Vand, and Josep Sanjuan for their help and thoughtful discussions that were instrumental in understanding the nuances of my research. I would also like to thank Gabriel Boothe, Aaron Spector, Benjamin Balaban, Darsa Donelon, Kendall Ackley, and Scott Rager for their dedication and persistence to getting the job done. A special thanks is due for the physics machine shop, especially Marc Link and Bill Malphurs, who spent many hours on the countless projects I needed. Lastly, I would like to thank my advisor, Dr. Guido Mueller, who put up with me, guided me, and supported me in my research. 4 TABLE OF CONTENTS page ACKNOWLEDGMENTS ................................. 4 LIST OF TABLES ..................................... 9 LIST OF FIGURES .................................... 10 KEY TO ABBREVIATIONS ............................... 17 KEY TO SYMBOLS .................................... 19 ABSTRACT ........................................ 20 CHAPTER 1 INTRODUCTION .................................. 22 1.1 Space-Based Missions .............................. 23 1.2 GRACE ..................................... 23 1.3 GRACE Follow-On ............................... 25 1.4 LISA ....................................... 26 1.4.1 Introduction ............................... 26 1.4.2 Sources .................................. 27 1.4.2.1 Cosmological background sources .............
    [Show full text]