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Global Capital, the State, and Chinese Workers: the Foxconn Experience
MCX38410.1177/0097700 447164412447164Pun and ChanModern China © 2012 SAGE Publications Reprints and permission: sagepub.com/journalsPermissions.nav Articles Modern China 38(4) 383 –410 Global Capital, the State, © 2012 SAGE Publications Reprints and permission: and Chinese Workers: sagepub.com/journalsPermissions.nav DOI: 10.1177/0097700412447164 The Foxconn Experience http://mcx.sagepub.com Pun Ngai1 and Jenny Chan2 Abstract In 2010, a startling 18 young migrant workers attempted suicide at Foxconn Technology Group production facilities in China. This article looks into the development of the Foxconn Corporation to understand the advent of capi- tal expansion and its impact on frontline workers’ lives in China. It also pro- vides an account of how the state facilitates Foxconn’s production expansion as a form of monopoly capital. Foxconn stands out as a new phenomenon of capital expansion because of the incomparable speed and scale of its capital accumulation in all regions of China. This article explores how the workers at Foxconn, the world’s largest electronics manufacturer, have been subjected to work pressure and desperation that might lead to suicides on the one hand but also open up daily and collective resistance on the other hand. Keywords global capital, Chinese state, student workers, rural migrant workers, Foxconn Technology Group When Time magazine nominated workers in China as the runners-up for the 2009 Person of the Year, the editor commented that Chinese workers have brightened the future of humanity by “leading the world to economic 1Hong Kong Polytechnic University, Kowloon, Hong Kong 2Royal Holloway, University of London, Surrey, UK Corresponding Author: Pun Ngai, Department of Applied Social Sciences, Hong Kong Polytechnic University, Kowloon, Hong Kong Email: [email protected] 384 Modern China 38(4) recovery” (Time, Dec. -
Apple U1 Ultra Wideband (UWB) Analysis
Apple U1 Ultra Wideband (UWB) Analysis Product Brief – October 2019 techinsights.com All content © 2019. TechInsights Inc. All rights reserved. GLOBAL LEADER IN IP & TECHNOLOGY INTELLIGENCE By revealing the innovation others can’t inside advanced technology products, we prove patent value and drive the best Intellectual Property (IP) and technology investment decisions Technology Intelligence Intellectual Property Services We help decision makers in semiconductor, system, financial, We help IP Professionals in global technology companies, and communication service provider companies: licensing entities and legal firms to: • Discover what products are winning in the highest- • Build higher quality, more effective patents growth markets and why • Identify patents of value and gather evidence of use to • Spot or anticipate disruptive events, including the demonstrate this value entrance of new players • Obtain accurate data for planning a potential defensive • Understand state-of-the-art technology strategy or assertion case through independent, objective analysis • Make better portfolio management decisions to invest, • Make better, faster product decisions with greater abandon, acquire or divest confidence • Understand their competition, identify strategic partners, • Understand product costs and bill of materials acquisition targets and business threats 2 All content © 2019. TechInsights Inc. All rights reserved. TechInsights has been publishing technology analysis for 30 years, enabling our customers to advance their intellectual property -
Operational Highlights
078 079 5.1 Business Activities 5.2 Technology Leadership ●Developed integrated fan-out on substrate (InFO-oS) Gen-3, which provides more chip partition integration with larger 5.1.1 Business Scope 5.2.1 R&D Organization and Investment package size and higher bandwidth As the founder and a leader of the dedicated semiconductor foundry segment, TSMC provides a full range of integrated In 2020, TSMC continued to invest in research and ●Expanded 12-inch Bipolar-CMOS-DMOS (BCD) technology semiconductor foundry services, including the most advanced process technologies, leading specialty technologies, the most development, with total R&D expenditures amounting to 8.2% portfolio on 90nm, 55nm and 22nm, targeting a variety of comprehensive design ecosystem support, excellent manufacturing productivity and quality, advanced mask technologies, and of revenue, a level that equals or exceeds the R&D investment fast-growing applications of mobile power management ICs 3DFabricTM advanced packaging and silicon stacking technologies, to meet a growing variety of customer needs. The Company of many other leading high-tech companies. with various levels of integration strives to provide the best overall value to its customers and views customer success as TSMC’s own success. As a result, TSMC has ●Achieved technical qualification of 28nm eFlash for gained customer trust from around the world and has experienced strong growth and success of its own. Faced with the increasingly difficult challenge to continue automobile electronics and micro controller units (MCU) extending Moore’s Law, which calls for the doubling of applications 5.1.2 Customer Applications semiconductor computing power every two years, TSMC has ●Began production of 28nm resistive random access memory focused its R&D efforts on offering customers first-to-market, (RRAM) as a low-cost solution for the price sensitive IoT TSMC manufactured 11,617 different products for 510 customers in 2020. -
Compal Electronics, Inc. and Subsidiaries
1 Stock Code:2324 COMPAL ELECTRONICS, INC. AND SUBSIDIARIES Consolidated Financial Statements With Independent Auditors’ Review Report For the Nine Months Ended September 30, 2019 and 2018 Address: No.581 & 581-1, Ruiguang Rd., Neihu District, Taipei, Taiwan Telephone: (02)8797-8588 2 Table of contents Contents Page 1. Cover Page 1 2. Table of Contents 2 3. Independent Auditors’ Review Report 3 4. Consolidated Balance Sheets 4 5. Consolidated Statements of Comprehensive Income 5 6. Consolidated Statements of Changes in Equity 6 7. Consolidated Statements of Cash Flows 7 8. Notes to the Consolidated Financial Statements (1) Company history 8 (2) Approval date and procedures of the consolidated financial statements 8 (3) New standards, amendments and interpretations adopted 8~11 (4) Summary of significant accounting policies 11~21 (5) Significant accounting assumptions and judgments, and major sources 21 of estimation uncertainty (6) Explanation of significant accounts 21~63 (7) Related-party transactions 63~65 (8) Pledged assets 65 (9) Commitments and contingencies 66 (10) Losses due to major disasters 66 (11) Subsequent events 66 (12) Other 66~67 (13) Other disclosures (a) Information on significant transactions 67, 69~79 (b) Information on investees 68, 80~85 (c) Information on investment in Mainland China 68, 86~88 (14) Segment information 68 3 Independent Auditors’ Review Report To COMPAL ELECTRONICS, INC.: Introduction We have reviewed the accompanying consolidated balance sheets of COMPAL ELECTRONICS, INC. (the “Company”) and its subsidiaries (the “Group”) as of September 30, 2019 and 2018, and the related consolidated statements of comprehensive income for the three months and nine months then ended, as well as the changes in equity and cash flows for the nine months then ended, and notes to the consolidated financial statements, including a summary of significant accounting policies. -
Taiwan's Top 50 Corporates
Title Page 1 TAIWAN RATINGS CORP. | TAIWAN'S TOP 50 CORPORATES We provide: A variety of Chinese and English rating credit Our address: https://rrs.taiwanratings.com.tw rating information. Real-time credit rating news. Credit rating results and credit reports on rated corporations and financial institutions. Commentaries and house views on various industrial sectors. Rating definitions and criteria. Rating performance and default information. S&P commentaries on the Greater China region. Multi-media broadcast services. Topics and content from Investor outreach meetings. RRS contains comprehensive research and analysis on both local and international corporations as well as the markets in which they operate. The site has significant reference value for market practitioners and academic institutions who wish to have an insight on the default probability of Taiwanese corporations. (as of June 30, 2015) Chinese English Rating News 3,440 3,406 Rating Reports 2,006 2,145 TRC Local Analysis 462 458 S&P Greater China Region Analysis 76 77 Contact Us Iris Chu; (886) 2 8722-5870; [email protected] TAIWAN RATINGS CORP. | TAIWAN'S TOP 50 CORPORATESJenny Wu (886) 2 872-5873; [email protected] We warmly welcome you to our latest study of Taiwan's top 50 corporates, covering the island's largest corporations by revenue in 2014. Our survey of Taiwan's top corporates includes an assessment of the 14 industry sectors in which these companies operate, to inform our views on which sectors are most vulnerable to the current global (especially for China) economic environment, as well as the rising strength of China's domestic supply chain. -
TSMC Integrated Fan-Out (Info) Package Apple A10
Electronic Costing & Technology Experts 21 rue la Nouë Bras de Fer 44200 Nantes – France Phone : +33 (0) 240 180 916 email : [email protected] www.systemplus.fr September 2016 – Version 1 – Written by Stéphane ELISABETH DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners. © 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 1 Return to TOC Glossary 1. Overview / Introduction 4 – A10 Die Analysis 57 – Executive Summary – A10 Die View, Dimensions & Marking – Reverse Costing Methodology – A10 Die Cross-Section – A10 Die Process Characteristics 2. Company Profile 7 – Comparison with previous generation 65 – Apple Inc. – A9 vs. A10 PoP – Apple Series Application processor – A9 vs. A10 Process – Fan-Out Packaging – TSMC Port-Folio 4. Manufacturing Process Flow 70 – TSMC inFO packaging – Chip Fabrication Unit – Packaging Fabrication Unit 3. Physical Analysis 15 – inFO Reconstitution Flow – Physical Analysis Methodology – iPhone 7 Plus Teardown 17 5. Cost Analysis 81 – A10 Die removal – Synthesis of the cost analysis – A10 Package-on-Package Analysis 23 – Main steps of economic analysis – A10 Package View, Dimensions – Yields Hypotheses – A10 Package XRay View – Die Cost Analysis 86 – A10 Package Opening – Wafer Cost – A10 Package Marking – Die Cost – A10 Package Cross-Section – inFO Packaging Cost Analysis 90 – A10 Package Cross-Section – Adhesive & Passivation – Packaging Wafer Cost – A10 package cross-Section - TIVs – Packaging Cost per process Steps – A10 package cross-Section – Solder Balls – Component Cost – A10 package cross-Section – RDL – Land-Side Decoupling Capacitor Analysis 48 6. -
TSMC Investement in Arizona
Michael R. Splinter Chairman of the Board Senator Robert Menendez Senator Lisa A. Murkowski Honorary Co-Chair Honorary Co-Chair Rupert J. Hammond-Chambers President INTERNAL COMMENTARY: THE STRATEGIC IMPORTANCE OF THE TSMC ARIZONA INVESTMENT MAY 15, 2020 RUPERT J. HAMMOND-CHAMBERS PRESIDENT Taiwan Semiconductor Manufacturing Company (TSMC) is the world’s largest contract chip manufacturer. A key link in the global technology supply chain, it is the most important company most people have never heard of. TSMC, based in Taiwan, is now doubling down on its relationship with the United States in a big way. On Friday, May 15, 2020 TSMC announced the most important technology news of the year; the company committed to building a cutting-edge 5nm fabrication plant (fab) to produce semiconductor chips in Arizona. Its U.S. customers for the chips produced here will not only include U.S. tech companies, but will also include the Pentagon, defense contractors, and the national security community. The visionary founder of TSMC, Morris Chang, imagined a world where fabless semiconductor companies would absorb the financial burden of designing chips, but would outsource their actual production to his TSMC. His vision created a monster that dominates the sector he created - the foundry manufacturing sector – making almost 50% of all chips produced by foundries globally. TSMC’s state-of-the-art process technology and CAPEX investment of approximately US$15 billion/year ensures that it has few, if any, peers. Successive Taiwan governments have continued to nurture TSMC through prioritized access to land, power, and water, thereby allowing it to serve as the beating heart of Taiwan’s technology miracle. -
Compal Electronics, Inc. and Subsidiaries
1 Stock Code:2324 COMPAL ELECTRONICS, INC. AND SUBSIDIARIES Consolidated Financial Statements With Independent Auditors’ Review Report For the Three Months Ended March 31, 2020 and 2019 Address: No.581 & 581-1, Ruiguang Rd., Neihu District, Taipei, Taiwan Telephone: (02)8797-8588 2 Table of contents Contents Page 1. Cover Page 1 2. Table of Contents 2 3. Independent Auditors’ Review Report 3 4. Consolidated Balance Sheets 4 5. Consolidated Statements of Comprehensive Income 5 6. Consolidated Statements of Changes in Equity 6 7. Consolidated Statements of Cash Flows 7 8. Notes to the Consolidated Financial Statements (1) Company history 8 (2) Approval date and procedures of the consolidated financial 8 statements (3) New standards, amendments and interpretations adopted 8~9 (4) Summary of significant accounting policies 9~16 (5) Significant accounting assumptions and judgments, and major 16~17 sources of estimation uncertainty (6) Explanation of significant accounts 17~56 (7) Related-party transactions 56~58 (8) Pledged assets 59 (9) Commitments and contingencies 59 (10) Losses due to major disasters 59 (11) Subsequent events 59 (12) Other 60 (13) Other disclosures (a) Information on significant transactions 60~61, 62~72 (b) Information on investees 61, 73~78 (c) Information on investment in mainland China 61, 79~81 (d) Major shareholders 61 (14) Segment information 61 3 Independent Auditors’ Review Report To COMPAL ELECTRONICS, INC.: Introduction We have reviewed the accompanying consolidated balance sheets of COMPAL ELECTRONICS, INC. and its subsidiaries (the “Group”) as of March 31, 2020 and 2019, and the related consolidated statements of comprehensive income, changes in equity and cash flows for the three months ended March 31, 2020 and 2019, and notes to the consolidated financial statements, including a summary of significant accounting policies. -
Semiconductors: a Changing of the Guard
Semiconductors: A Changing of the Guard Richard Spalton MA, CFA Investment Manager Semiconductors: A Changing of the Guard “While an early chip from the 1970s could fit thousands of micrometre-sized transistors, today’s most advanced chips are a complex web of billions of transistors, the smallest of which are just 10nm. To get some idea of how small that is: your fingernails grew 10nm in the time it took to read the previous sentence.”1 Background One of the key enablers of technological progress has been the constantly shrinking size of the transistors on semiconductor chips. Smaller transistors mean that the same number of computations can be completed faster, more efficiently and at lower cost. This concept was famously outlined by Gordon Moore, co-founder of Intel, who in 1965 wrote what became known as Moore’s Law. The manufacturing process for a particular size of transistor is called a process node. Shifting to a new node is highly complex and involves significant capital expenditure. In July 2020 Intel announced that their transition to the 7 nanometre node was running a year behind schedule. This delay will have a significant impact on Intel and its competitors. This announcement marks a changing of the guard in the semiconductor market, with leadership shifting away from Intel towards Taiwan Semiconductor Manufacturing Company (TSMC) and Samsung Electronics. Scale Matters Assessing the future prospects of a company requires an assessment of its industry. Manufacturing semiconductors is highly capital intensive – the industry spends USD 100bn per annum on capital expenditure. Companies also need to spend substantial amounts on R&D because each process node is more complex than the last. -
指數etf (2805) 截至 31/01/2014 2805
領航富時亞洲(日本除外)指數ETF (2805) 截至 31/01/2014 2805 成分股數目 669 證券百分比 99.66% 現金及現金等類百分比 0.34% 其他 0.00% 證券名稱 證券代號 交易所 資產淨值百分比 Samsung Electronics Co. Ltd. 005930 XKRX 4.36% Taiwan Semiconductor Manufacturing Co. Ltd. 2330 XTAI 2.82% Tencent Holdings Ltd. 700 XHKG 2.20% AIA Group Ltd. 1299 XHKG 1.91% China Construction Bank Corp. 939 XHKG 1.78% China Mobile Ltd. 941 XHKG 1.69% Industrial & Commercial Bank of China Ltd. 1398 XHKG 1.59% Hyundai Motor Co. 005380 XKRX 1.14% Bank of China Ltd. 3988 XHKG 1.13% Hon Hai Precision Industry Co. Ltd. 2317 XTAI 1.13% Hutchison Whampoa Ltd. 13 XHKG 0.98% Infosys Ltd. INFY XNSE 0.97% CNOOC Ltd. 883 XHKG 0.84% Oversea-Chinese Banking Corp. Ltd. O39 XSES 0.74% Housing Development Finance Corp. HDFC XNSE 0.73% DBS Group Holdings Ltd. D05 XSES 0.72% Reliance Industries Ltd. RELIANCE XNSE 0.72% Galaxy Entertainment Group Ltd. 27 XHKG 0.72% China Life Insurance Co. Ltd. 2628 XHKG 0.71% Singapore Telecommunications Ltd. Z74 XSES 0.70% PetroChina Co. Ltd. 857 XHKG 0.70% POSCO 005490 XKRX 0.69% Shinhan Financial Group Co. Ltd. 055550 XKRX 0.69% Hong Kong Exchanges and Clearing Ltd. 388 XHKG 0.68% China Petroleum & Chemical Corp. 386 XHKG 0.68% Hyundai Mobis 012330 XKRX 0.67% Cheung Kong Holdings Ltd. 1 XHKG 0.66% Sands China Ltd. 1928 XHKG 0.62% Sun Hung Kai Properties Ltd. 16 XHKG 0.62% United Overseas Bank Ltd. U11 XSES 0.62% SK Hynix Inc. -
Needham's Semiconductor Expertise What Does The
The Growth Factor - Commentary by John Barr, [email protected] June 23, 2021 - Vol. 32 The Opportunity We See in Semiconductor Manufacturing (6 minute read) 2020 brought an unprecedented economic shutdown. The pandemic accelerated trends that we have been focused on for a long me; we call this the Great Digital and Life Sciences Acceleration. I would like to zero in on the opportunities in semiconductor manufacturing. I’ve long felt the semiconductor industry has moved beyond a cyclical, PC-driven industry to one of strategic importance. The confluence of manufacturing semiconductors for automotive, data center, machine learning, and remote work electronic systems; remaking the supply chain, and securing supplies for geopolitical needs have created a positive scenario for semiconductor manufacturing technology companies. Needham's Semiconductor Expertise Needham Funds have been owners of semiconductor manufacturing companies since our start in 1996. Needham Funds are an affiliate of Needham & Company, which has completed over 580 underwritings and M&A transactions for semiconductor companies since 1985. Addionally, prior to my Wall Street career, I spent 12 years in sales and markeng for Electronic Design Automaon companies, selling to semiconductor and electronic systems companies. I also spent 8 years as a sell-side senior research analyst following semiconductor design and technical soware companies. I served on the board of directors of venture capital-backed Coventor, Inc., which provided simulaon and modeling soluons for semiconductor process technology and was sold to Lam Research, Inc. in 2017. What Does the Opportunity in Semiconductor Manufacturing Mean for Needham Funds? Growth in advanced semiconductor manufacturing has been a dominant investment theme for Needham Funds for over 10 years. -
Annual Report 2002 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD
TSE: 2330 NYSE: TSM Taiwan Semiconductor Manufacturing Company, Ltd. Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor Manufacturing Company, Taiwan Annual Report 2002 121, Park Ave. 3, Science-Based Industrial Park, Hsin-Chu, Taiwan 300-77, R.O.C. Tel: 886-3-578-0221 Fax: 886-3-578-1546 http://www.tsmc.com Taiwan Semiconductor Manufacturing Company, Ltd. Annual Report 2002 • Taiwan Stock Exchange Market Observation Post System: http://mops.tse.com.tw • TSMC annual report is available at http://www.tsmc.com/english/tsmcinfo/c0203.htm Morris Chang, Chairman Printed on March 12, 2003 TABLE OF CONTENTS 3 LETTER TO THE SHAREHOLDERS 7 A BRIEF INTRODUCTION TO TSMC 7 Company Profile 8 Market Overview MAJOR FACILITIES TSMC SPOKESPERSON 9 Organization Corporate Headquarters & FAB 2, FAB 5 Name: Harvey Chang 18 Capital & Shares 121, Park Ave. 3 Title: Senior Vice President & CFO 22 Issuance of Corporate Bonds Science-Based Industrial Park Tel: 886-3-563-6688 Fax: 886-3-563-7000 23 Preferred Shares Hsin-Chu, Taiwan 300-77, R.O.C. Email: [email protected] 24 Issuance of American Depositary Shares Tel: 886-3-578-0221 Fax: 886-3-578-1546 26 Status of Employee Stock Option Plan (ESOP) Acting Spokesperson 26 Status of Mergers and Acquisitions FAB 3 Name: J.H. Tzeng 26 Corporate Governance 9, Creation Rd. 1 Title: Public Relations Department Manager 30 Social Responsibility Information Science-Based Industrial Park Tel: 886-3-563-6688 Fax: 886-3-567-0121 Hsin-Chu, Taiwan 300-77, R.O.C. Email: [email protected] 32 OPERATIONAL HIGHLIGHTS Tel: 886-3-578-1688 Fax: 886-3-578-1548 32 Business Activities AUDITORS 34 Customers FAB 6 Company: T N SOONG & CO 34 Raw Material Supply 1, Nan-Ke North Rd.