Silvermont CPU Overview

Total Page:16

File Type:pdf, Size:1020Kb

Silvermont CPU Overview Introducing Next Generation Low Power Microarchitecture: Silvermont Dadi Perlmutter Executive Vice President General Manager, Intel Architecture Group Chief Product Officer Risk Factors •Today’s presentations contain forward-looking statements. All statements made that are not historical facts are subject to a number of risks and uncertainties, and actual results may differ materially. Please refer to our most recent earnings release, Form 10-Q and 10-K filing available for more information on the risk factors that could cause actual results to differ. •If we use any non-GAAP financial measures during the presentations, you will find on our website, intc.com, the required reconciliation to the most directly comparable GAAP financial measure. Rev. 4/16/13 Legal Disclaimers Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. For more information go to: http://www.intel.com/performance . Intel, Intel Atom and the Intel logo are trademarks of Intel Corporation in the United States and other countries. 1 Based on the geometric mean of a variety of power and performance measurements across various benchmarks. Benchmarks included in this geomean are measurements on browsing benchmarks and workloads including SunSpider* and page load tests on Internet Explorer*, FireFox*, & Chrome*; Dhrystone*; EEMBC* workloads including CoreMark*; Android* workloads including CaffineMark*, AnTutu*, Linpack* and Quadrant* as well as measured estimates on SPECint* rate_base2000 & SPECfp* rate_base2000; on Silvermont preproduction systems compared to Atom processor Z2580. Individual results will vary. SPEC* CPU2000* is a retired benchmark. * Other names and brands may be claimed as the property of others. 2 Based on a geometric mean of the projected power and performance of SPECint* rate_base2000 on Silvermont compared to expected configurations of main ARM*-based mobile competitors using descriptions of the architectures; assumes similar configurations. Numbers may be subject to change once verified with the actual parts. Individual results will vary. SPEC* CPU2000* is a retired benchmark; results are estimates. * Other names and brands may be claimed as the property of others 3 Results have been estimated based on internal Intel analysis and are provided for informational purposes only. Any difference in system hardware or software design or configuration may affect actual performance. Introducing Silvermont Next Gen 22nm SoC Microarchitecture Process ~3X Higher ~5X Lower Performance1 Power1 1 Based on the geometric mean of a variety of power and performance measurements across various benchmarks. Benchmarks included in this geomean are measurements on browsing benchmarks and workloads including SunSpider* and page load tests on Internet Explorer*, FireFox*, & Chrome*; Dhrystone*; EEMBC* workloads including CoreMark*; Android* workloads including CaffineMark*, AnTutu*, Linpack* and Quadrant* as well as measured estimates on SPECint* rate_base2000 & SPECfp* rate_base2000; on Silvermont preproduction systems compared to Atom processor Z2580. Individual results will vary. SPEC* CPU2000* is a retired benchmark. * Other names and brands may be claimed as the property of others. Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. For more information go to: http://www.intel.com/performance . Silvermont Best In Class Performance • Out of Order Execution engine • New multi-core and system fabric architecture – Capable of delivering 8 cores • Higher single thread performance • New IA instructions and core technologies Best In Class Power & Power Efficiency • Wider dynamic power operating range • Enhanced power management • Fast standby entry/exit Great Scalability Across Multiple Market Segments Architecture & Microarchitecture Definitions Example Analogy Engine Type Architecture Intel® 64 IA-32 Instruction Set Definition Engine Schematic Microarchitecture Ivy Bridge Haswell Saltwell Silvermont HW Implementation for ISA Crypto Audio Type of Vehicle SoC (System on a Chip) Storage CPU Haswell Video Cloverview Single die with integrated IPs Graphics Display The Constantly Evolving Intel Architecture Performance Power Efficiency Media Manageability Security SSE Extensions Thermal Monitoring Multimedia Instructions Intel® Virtualization Intel® Anti-Theft AVX Instructions Technologies Intel® Quick Sync Video Technology Technology Idle States Intel® vPro Technology Intel® Trusted Execution AES-NI Intel® HD Graphics Intel® Smart Idle Intel® CIRA Technology Technology Smart Caches Intel® HD Audio Intel® SpeedStep® Intel® AMT Intel® Secure Key Turbo Boost Technology Intel® Clear Video HD Technology Intel® Remote PC Assist Intel® Run Secure Intel® Hyper-Threading Intel® Flexible Display Intel® Demand Based Technolgy Intel® Remote Wake Execute Disable Bit Intel® Matrix Storage Switching Intel® Insider™ . Intel® Solutions For All Segments Intel® Atom™ Datacenter and HPC Ultrabook™ Tablets Phones Intelligent Systems From TERAFLOPS to MILLIWATTS Intel® Solutions For All Segments Intel® Atom™ Datacenter and HPC Ultrabook™ Tablets Phones Intelligent Systems From TERAFLOPS to MILLIWATTS Enabling a Full Spectrum of Mobile Products Ultrabooks™ Convertible Tablet Smartphone Mobility Spectrum Best Performance and Outstanding Battery Life Best Visuals Best Battery Life Thinnest and Lightest Form Factors Intel® Atom™ As Well as Datacenter and Intelligent Systems Solutions Server Network Storage Embedded IVI Highest Performance Best Performance/Watt Highest Density Designs Intel® Atom™ Lowest Power Silvermont Microarchitecture in Next Generation Intel Products From DATACENTER to DEVICES Avoton Rangeley Baytrail Merrifield TBA Port of Choice Enabling Exceptional Experiences * Other names and brands may be claimed as the property of others. Committed Leadership Roadmap 45nm 32nm 22nm 14nm 14nm Silvermont; The First in a Family of Yearly Refreshes Intel’s IDM Advantage PROCESS TECHNOLOGY INTEL ARCHITECTURE PRODUCT DESIGN Common Common Tools Goals SOFTWARE MANUFACTURING PACKAGING Silvermont Technical Overview Belli Kuttanna Intel Fellow Intel Architecture Group Key Messages • Next Generation Low Power Microarchitecture • Manufactured in custom Intel® 22nm SOC process technology • Present in a wide range of low power products from Phones to Servers • ~3x peak performance1 improvement or the same performance at ~5x lower power1 over the current generation Atom™ core • Leading performance and performance per watt efficiency2 • First in a family of cores that will be refreshed every year 1 Based on the geometric mean of a variety of power and performance measurements across various benchmarks. Benchmarks included in this geomean are measurements on browsing benchmarks and workloads including SunSpider* and page load tests on Internet Explorer*, FireFox*, & Chrome*; Dhrystone*; EEMBC* workloads including CoreMark*; Android* workloads including CaffineMark*, AnTutu*, Linpack* and Quadrant* as well as measured estimates on SPECint* rate_base2000 & SPECfp* rate_base2000; on Silvermont preproduction systems compared to Atom processor Z2580. Individual results will vary. SPEC* CPU2000* is a retired benchmark. * Other names and brands may be claimed as the property of others. 2 Based on a geometric mean of the projected power and performance of SPECint* rate_base2000 on Silvermont compared to expected configurations of main ARM*-based mobile competitors using descriptions of the architectures; assumes similar configurations. Numbers may be subject to change once verified with the actual parts. Individual results will vary. SPEC* CPU2000* is a retired benchmark; results are estimates. * Other names and brands may be claimed as the property of others. Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. For more information go to: http://www.intel.com/performance . Silvermont Highlights Full Advantage of Intel® Better Better Power 22nm SoC Process Performance Efficiency Technology • Out of Order Execution engine • Wider dynamic operating range • 3-D Tri-gate transistors tuned for SoC products • New multi-core and system fabric • Enhanced active and idle power architecture management • Architecture
Recommended publications
  • Wind River Vxworks Platforms 3.8
    Wind River VxWorks Platforms 3.8 The market for secure, intelligent, Table of Contents Build System ................................ 24 connected devices is constantly expand- Command-Line Project Platforms Available in ing. Embedded devices are becoming and Build System .......................... 24 VxWorks Edition .................................2 more complex to meet market demands. Workbench Debugger .................. 24 New in VxWorks Platforms 3.8 ............2 Internet connectivity allows new levels of VxWorks Simulator ....................... 24 remote management but also calls for VxWorks Platforms Features ...............3 Workbench VxWorks Source increased levels of security. VxWorks Real-Time Operating Build Configuration ...................... 25 System ...........................................3 More powerful processors are being VxWorks 6.x Kernel Compatibility .............................3 considered to drive intelligence and Configurator ................................. 25 higher functionality into devices. Because State-of-the-Art Memory Host Shell ..................................... 25 Protection ..................................3 real-time and performance requirements Kernel Shell .................................. 25 are nonnegotiable, manufacturers are VxBus Framework ......................4 Run-Time Analysis Tools ............... 26 cautious about incorporating new Core Dump File Generation technologies into proven systems. To and Analysis ...............................4 System Viewer ........................
    [Show full text]
  • Intel® Architecture Instruction Set Extensions and Future Features Programming Reference
    Intel® Architecture Instruction Set Extensions and Future Features Programming Reference 319433-037 MAY 2019 Intel technologies features and benefits depend on system configuration and may require enabled hardware, software, or service activation. Learn more at intel.com, or from the OEM or retailer. No computer system can be absolutely secure. Intel does not assume any liability for lost or stolen data or systems or any damages resulting from such losses. You may not use or facilitate the use of this document in connection with any infringement or other legal analysis concerning Intel products described herein. You agree to grant Intel a non-exclusive, royalty-free license to any patent claim thereafter drafted which includes subject matter disclosed herein. No license (express or implied, by estoppel or otherwise) to any intellectual property rights is granted by this document. The products described may contain design defects or errors known as errata which may cause the product to deviate from published specifica- tions. Current characterized errata are available on request. This document contains information on products, services and/or processes in development. All information provided here is subject to change without notice. Intel does not guarantee the availability of these interfaces in any future product. Contact your Intel representative to obtain the latest Intel product specifications and roadmaps. Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling 1- 800-548-4725, or by visiting http://www.intel.com/design/literature.htm. Intel, the Intel logo, Intel Deep Learning Boost, Intel DL Boost, Intel Atom, Intel Core, Intel SpeedStep, MMX, Pentium, VTune, and Xeon are trademarks of Intel Corporation in the U.S.
    [Show full text]
  • Intel® Atom™ Processor E6x5c Series-Based Platform for Embedded Computing
    PlAtfOrm brief Intel® Atom™ Processor E6x5C Series Embedded Computing Intel® Atom™ Processor E6x5C Series-Based Platform for Embedded Computing Platform Overview Available with industrial and commercial The Intel® Atom™ processor E6x5C series temperature ranges, this processor series delivers, in a single package, the benefits of provides embedded lifecycle support and the Intel® Atom™ processor E6xx combined is supported by the broad Intel® archi- with a Field-Programmable Gate Array tecture ecosystem as well as standard (FPGA) from Altera. This series offers Altera development tools. Additionally, a exceptional flexibility to incorporate a compatible, dedicated Power Management wide range of standard and user-defined Integrated Circuit (PMIC) solution may be I/O interfaces, high-speed connectivity, obtained from leading PMIC suppliers to memory interfaces, and process accelera- help minimize platform part count and tion to meet the requirements of a variety reduce bill of material costs and design of embedded applications in industrial, medi- complexity. Options include separate PMIC cal, communication, vision systems, voice and clock generator chips (available from over Internet protocol (VoIP), military, high- ROHM Co., Ltd.) or a single-chip solution performance programmable logic control- that integrates the voltage regulator and lers (PLCs) and embedded computers. clock generator (available from Dialog Semiconductor). The Intel Atom processor E6x5C series is a multi-chip, single-package device that Product Highlights reduces board footprint, lowers compo- • Single-package: A compact 37.5 x nent count, and simplifies inventory 37.5 mm, 0.8 mm ball pitch, multi-chip control and manufacturing. This compact device internally connects the Intel Atom design offers single-vendor support while processor E6xx with a user-programma- providing Intel Atom processors for ble FPGA.
    [Show full text]
  • Intel Atom® Processor C2000 Product Family for Microservers
    Intel® Atom™ Processor C2000 Product Family for Microservers PRODUCT BRIEF Maximize Efficiency for Your Lightweight Scale-Out Workloads Extreme Density and Energy-Efficiency for Low-End, Scale-Out Workloads With a need to rapidly deliver new services, cope with massive data growth, and contain costs, cloud service providers and hosters seek increasingly efficient ways to handle the demands on their infrastructure. Today’s servers based on Intel® Xeon® processors provide leadership performance and performance per watt with the flexibility to handle a wide range of workloads and peak demands. 2nd generation 64-bit However, certain lightweight, scale-out workloads—such as basic dedicated hosting, low-end static Intel® Atom™ Processor web serving, and simple content delivery can sometimes be hosted more efficiently on larger C2000 Product Family numbers of smaller servers built for extreme power efficiency. for microservers To address this need, Intel worked with a broad giving you the flexibility to right-size your infra- • Up to 7x higher7 perfor- ecosystem of leading server manufacturers to structure without limiting software mobility and mance, up to 6x better8 develop and deliver a variety of extreme low-power interoperability as your applications evolve. systems to support an emerging server category— performance/watt Optimized Platform Support microservers. With up to a 1,000 nodes1 per Intel provides complete microserver platform 9 rack and shared power, cooling, and networking • 6-20 watt TDP solutions that simplify implementation, improve resources, microservers can help you improve data overall efficiency and enable higher node density. • Up to 1000+ server center efficiency by right-sizing infrastructure for New innovations include: 10 relatively light processing requirements.
    [Show full text]
  • A Superscalar Out-Of-Order X86 Soft Processor for FPGA
    A Superscalar Out-of-Order x86 Soft Processor for FPGA Henry Wong University of Toronto, Intel [email protected] June 5, 2019 Stanford University EE380 1 Hi! ● CPU architect, Intel Hillsboro ● Ph.D., University of Toronto ● Today: x86 OoO processor for FPGA (Ph.D. work) – Motivation – High-level design and results – Microarchitecture details and some circuits 2 FPGA: Field-Programmable Gate Array ● Is a digital circuit (logic gates and wires) ● Is field-programmable (at power-on, not in the fab) ● Pre-fab everything you’ll ever need – 20x area, 20x delay cost – Circuit building blocks are somewhat bigger than logic gates 6-LUT6-LUT 6-LUT6-LUT 3 6-LUT 6-LUT FPGA: Field-Programmable Gate Array ● Is a digital circuit (logic gates and wires) ● Is field-programmable (at power-on, not in the fab) ● Pre-fab everything you’ll ever need – 20x area, 20x delay cost – Circuit building blocks are somewhat bigger than logic gates 6-LUT 6-LUT 6-LUT 6-LUT 4 6-LUT 6-LUT FPGA Soft Processors ● FPGA systems often have software components – Often running on a soft processor ● Need more performance? – Parallel code and hardware accelerators need effort – Less effort if soft processors got faster 5 FPGA Soft Processors ● FPGA systems often have software components – Often running on a soft processor ● Need more performance? – Parallel code and hardware accelerators need effort – Less effort if soft processors got faster 6 FPGA Soft Processors ● FPGA systems often have software components – Often running on a soft processor ● Need more performance? – Parallel
    [Show full text]
  • Debuggers, Programmers and Erasers Products May Be Rohs Compliant
    Debuggers, Programmers and Erasers Products may be RoHS compliant. Check mouser.com for RoHS status. USB2Wiggler Features: DEVELOPMENT PROGRAMMERS • Universal Serial Bus interface for JTAG and BDM debugging TopMaxII Programmer • Faster than the classic parallel port Wiggler • Fully compatible with all Macraigor Systems software Features: • Operates up to Hi-Speed USB rates (480Mb/s) • High speed device programmer and TTL/LOGIC/DRAM tester • One side interfaces to USB port of host IBM compatible PC, other • PC driven: USB 2.0 interface side connects to OCD (On-Chip Debug) port of target system • Device libraries > 18000 • Port may be JTAG, E-JTAG, OnCE, COP, BDM, or any of several • Standard 48-pin DIL ZIF socket other types of connections • Supported devices: EPROM, EEPROM, FLASH (NOR/NAND) Programmers memory, PLD, FPGA, Serial PROM, Parallel PROM, CMOS USB2Demon Features: PROM, PIC and microcontrollers • Interfaces to USB 1.1 or USB 2.0 port of host PC on one side, other • B/P/V takes 65 sec. for 64Mbit flash memory • External start key for auto programming mode side connects to OCD (On-Chip Debug) port on target system • All socket adapters are available in stock (USA): PLCC, SOP, • Win 95/98/NT/2000/XP/Vista/Windows 7 • Simultaneously debugs up to 255 devices on a single scan chain SOIC, QFP, TSOP, SON, BGA, TSSOP, and TSOPII • Approved by CE • Supports configurable JTAG/BDM clock rates up to 20MHz • Supported low-voltages: 1.8/2.0/2.7/3.0/3.3/5.0 volt • Made in USA • Compatible with Windows and Linux hosts • Built-in AC (110-240) power supply • Free software update for lifetime • Supported versions of Linux: Red Hat 7.2-9 and Fedora Core 2 For quantities greater than listed, call for quote.
    [Show full text]
  • Intel® Industrial Iot Workshop Security for Industrial Platforms
    Intel® Industrial IoT workshop Security for industrial platforms Gopi K. Agrawal Security Architect IOTG Technical Sales & Marketing Intel Corporation Legal © 2018 Intel Corporation No license (express or implied, by estoppel or otherwise) to any intellectual property rights is granted by this document. Intel disclaims all express and implied warranties, including without limitation, the implied warranties of merchantability, fitness for a particular purpose, and non-infringement, as well as any warranty arising from course of performance, course of dealing, or usage in trade. This document contains information on products, services and/or processes in development. All information provided here is subject to change without notice. Contact your Intel representative to obtain the latest Intel product specifications and roadmaps. Intel technologies' features and benefits depend on system configuration and may require enabled hardware, software or service activation. Performance varies depending on system configuration. No computer system can be absolutely secure. Check with your system manufacturer or retailer or learn more at www.intel.com. Intel, the Intel logo, are trademarks of Intel Corporation in the U.S. and/or other countries. *Other names and brands may be claimed as the property of others. All information provided here is subject to change without notice. Contact your Intel representative to obtain the latest Intel product specifications and roadmaps No license (express or implied, by estoppel or otherwise) to any intellectual property rights is granted by this document. Intel technologies’ features and benefits depend on system configuration and may require enabled hardware, software or service activation. Performance varies depending on system configuration. No computer system can be absolutely secure.
    [Show full text]
  • Multiprocessing Contents
    Multiprocessing Contents 1 Multiprocessing 1 1.1 Pre-history .............................................. 1 1.2 Key topics ............................................... 1 1.2.1 Processor symmetry ...................................... 1 1.2.2 Instruction and data streams ................................. 1 1.2.3 Processor coupling ...................................... 2 1.2.4 Multiprocessor Communication Architecture ......................... 2 1.3 Flynn’s taxonomy ........................................... 2 1.3.1 SISD multiprocessing ..................................... 2 1.3.2 SIMD multiprocessing .................................... 2 1.3.3 MISD multiprocessing .................................... 3 1.3.4 MIMD multiprocessing .................................... 3 1.4 See also ................................................ 3 1.5 References ............................................... 3 2 Computer multitasking 5 2.1 Multiprogramming .......................................... 5 2.2 Cooperative multitasking ....................................... 6 2.3 Preemptive multitasking ....................................... 6 2.4 Real time ............................................... 7 2.5 Multithreading ............................................ 7 2.6 Memory protection .......................................... 7 2.7 Memory swapping .......................................... 7 2.8 Programming ............................................. 7 2.9 See also ................................................ 8 2.10 References .............................................
    [Show full text]
  • Intel Atom® Processor C3000 Series for Embedded and Iot Applications: Product Brief
    Product brief Internet of Things Intel Atom® Processor C3000 Series Expanding Intelligence and Flexibility at the Edge Scalable, dense-compute SoC for demanding IoT workloads From the factory foor to the energy grid, airplanes to supply chains, the sensors, controls, gateways, and other connected devices of Internet of Things (IoT) are driving the next industrial revolution. As IoT continues its explosive growth, the need for intelligent devices for more specialized applications is also growing exponentially. Industrial, energy, aerospace, robotics, public sector, and other customers with demanding IoT workloads want new ways to easily extract value from their data, reduce their time to market, and innovate connected technologies quickly and efciently. Moreover, they increasingly require reliable IoT solutions that bring maximum performance and greater capabilities to an ever-expanding array of challenging locations and operating conditions. The Intel Atom® processor C3000 series extends low-power Intel® architecture into new segments and accelerates IoT innovation across a wide range of demanding environments and use cases. With high performance per watt, low thermal design power (TDP) of 9.5W, and up to 20 confgurable high-speed input/output (HSIO) lanes, and pin-to-pin compatibility, this new system-on-a-chip (SoC) family delivers next-generation, multicore performance and scalability for a broad variety of low-power, high-density, and fanless designs. Multicore scalability With the Intel Atom processor C3000 series, customers are able to scale performance and achieve workload consolidation in situations and use cases that uP to require very low power, high density, and high I/O integration. Designed in an FCBGA 34mm x 28mm compact form factor, this SoC-based CPU is manufactured on Intel’s optimized 14nm process technology, available from 2 to 12 cores from 2.3X 1.6 to 2.0 GHz, and includes up to 256 GB DDR4 2133 MHz ECC (SODIMM, UDIMM, better PerforMANce or RDIMM) of addressable memory.
    [Show full text]
  • Designed to Engage Students and Empower Educators
    PRODUCT BRIEF Intel® classmate PC – Convertible Intel® Celeron® Processors 847/NM70 (dual-core) Part of Intel® Education Solutions Designed to Engage Students and Empower Educators Designed to make learning more fun, creative, and engaging, the Intel® classmate PC – convertible brings together the best of Windows* 8 touch and keyboard experiences, the amazing performance of Intel® Celeron® processors, and Intel® Education Software. The new Intel classmate PC – convertible keeps students excited about learning. With the flip of the display, it quickly transforms from a full-featured PC to convenient tablet—with pen— making it easy to adapt the device to the teaching method and learning task at hand. Whether gathering field data with the HD camera and notating it with the pen, or analyzing, interpreting, and reporting results using collaborative Intel Education Software, the convertible classmate “The Intel classmate PC – convertible PC is designed for education and engineered for students to develop the 21st century skills needed to succeed in today’s global economy. creates an ecosystem of digital learning which encompasses 1:1 Highlights: technologies, independent learning, • Two devices in one: tablet and full-feature PC digital creativity, device management, • Supports both Windows 8 desktop and touch modes and learning beyond school. It is truly • Together with Intel Education Software, the convertible classmate PC is part of Intel Education Solutions versatile, easily catering for the • High Definition LCD display produces vivid
    [Show full text]
  • Intel Atom® P5900 Processors for 5G Network Edge Acceleration
    PRODUCT BRIEF | Intel Atom® P5900 Processors ADVANCED PERFORMANCE FOR 5G WIRELESS BASE STATIONS As the radio access network (RAN) infrastructure of wireless carriers evolves to meet the intense demands of 5G, additional compute is required at the edge of the network. Careful consideration is critical across the board—from overarching design down to the selection of key components in base transceiver station equipment—for 5G networks to reliably meet the demands of next-generation service opportunities with lower latencies, higher bandwidth, and increased network capacity. RAN INFRASTRUCTURE EVOLUTION Intel has never had a stronger or more comprehensive portfolio of solutions to enable the RAN. From Intel® Xeon® Scalable processors to Intel Atom® processors, FPGAs, ASICS, and more, Intel continues to deliver cutting-edge hardware for 5G infrastructure. Even so, it’s our significant investments in software that enable service providers to make the most of our hardware, from drivers and operating systems up through entire production-quality software stacks. This interconnected platform of hardware and software allows service providers to get to market quickly while still offering the flexibility needed to address various deployment scenarios. Furthermore, with the increasing adoption of innovations found in cloud deployments, service providers are realizing the benefits of extending a platform combining common cloud software with Intel® architecture-based hardware from the core to the edge. A common software ecosystem for platform virtualization and customer applications—using a common Intel instruction set architecture across the infrastructure—enables faster deployment of new software and features while also making new service offerings and revenue models possible. PRODUCT BRIEF | Intel Atom® P5900 Processors AN EXCITING NEW CLASS OF EDGE PROCESSORS Intel Atom P5900 processors are the first of an all-new class of high-throughput, low-latency Intel Atom P processors for high-density network edge and security solutions.
    [Show full text]
  • The Intel X86 Microarchitectures Map Version 2.0
    The Intel x86 Microarchitectures Map Version 2.0 P6 (1995, 0.50 to 0.35 μm) 8086 (1978, 3 µm) 80386 (1985, 1.5 to 1 µm) P5 (1993, 0.80 to 0.35 μm) NetBurst (2000 , 180 to 130 nm) Skylake (2015, 14 nm) Alternative Names: i686 Series: Alternative Names: iAPX 386, 386, i386 Alternative Names: Pentium, 80586, 586, i586 Alternative Names: Pentium 4, Pentium IV, P4 Alternative Names: SKL (Desktop and Mobile), SKX (Server) Series: Pentium Pro (used in desktops and servers) • 16-bit data bus: 8086 (iAPX Series: Series: Series: Series: • Variant: Klamath (1997, 0.35 μm) 86) • Desktop/Server: i386DX Desktop/Server: P5, P54C • Desktop: Willamette (180 nm) • Desktop: Desktop 6th Generation Core i5 (Skylake-S and Skylake-H) • Alternative Names: Pentium II, PII • 8-bit data bus: 8088 (iAPX • Desktop lower-performance: i386SX Desktop/Server higher-performance: P54CQS, P54CS • Desktop higher-performance: Northwood Pentium 4 (130 nm), Northwood B Pentium 4 HT (130 nm), • Desktop higher-performance: Desktop 6th Generation Core i7 (Skylake-S and Skylake-H), Desktop 7th Generation Core i7 X (Skylake-X), • Series: Klamath (used in desktops) 88) • Mobile: i386SL, 80376, i386EX, Mobile: P54C, P54LM Northwood C Pentium 4 HT (130 nm), Gallatin (Pentium 4 Extreme Edition 130 nm) Desktop 7th Generation Core i9 X (Skylake-X), Desktop 9th Generation Core i7 X (Skylake-X), Desktop 9th Generation Core i9 X (Skylake-X) • Variant: Deschutes (1998, 0.25 to 0.18 μm) i386CXSA, i386SXSA, i386CXSB Compatibility: Pentium OverDrive • Desktop lower-performance: Willamette-128
    [Show full text]