Thyristors and Triacs Control Gate Trigger Circuits
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UCC27531 35-V Gate Driver for Sic MOSFET Applications (Rev. A)
(1) Application Report SLUA770A–March 2016–Revised May 2018 UCC27531 35-V Gate Driver for SiC MOSFET Applications Richard Herring........................................................................................... High Power Driver Solutions ABSTRACT SiC MOSFETs are gaining popularity in many high-power applications due to their significant switching performance advantages. SiC MOSFETs are also available with attractive voltage ratings and current capabilities. However, the characteristics of SiC MOSFETs require consideration of the gate-driver circuit to optimize the switching performance of the SiC device. Although SiC MOSFETs are not difficult to drive properly, many typical MOSFET drivers may result in compromised switching speed performance. The UCC27531 gate driver includes features and has operating parameters that allow for driving SiC power MOSFETs within the recommended optimum drive configuration. This application note reviews the characteristics of SiC MOSFETs and how to drive them to achieve the performance improvement that SiC can bring at the system level. The features of UCC27531 to achieve optimal performance of SiC are explained and results from a demonstration circuit are provided. 1 Introduction In the past, the majority of applications such as uninterruptible power supplies (UPS), photovoltaic (PV) inverters, and motor drive have utilized IGBTs for the power devices due to the combination of high- voltage ratings exceeding 1 kV and high current capability. Usable switching frequency of IGBTs has typically been limited to 20–30 kHz, due to the high turnoff losses caused by the long turnoff current tail. Design comparisons have shown that SiC MOSFET designs can operate at considerably higher switching frequency and achieve the same or better efficiency. Although the device cost of the SiC MOSFETs are higher than the equivalent IGBTs, the significant savings in transformer, capacitor, and enclosure size results in a lower system cost. -
Egan® Ics for Low Voltage DC-DC Applications Egan® Ics for Low Voltage DC-DC Applications EFFICIENT POWER CONVERSION
APPLICATION NOTE: AN025 eGaN® ICs for Low Voltage DC-DC Applications eGaN® ICs for Low Voltage DC-DC Applications EFFICIENT POWER CONVERSION Michael de Rooij, Ph.D., Vice President of Applications Engineering , Yuanzhe Zhang, Ph.D., Director of Applications Engineering eGaN® FETs from EPC have repeatedly demonstrated higher performance over Monolithic integration of the gate driver to the MOSFET counterparts in many applications [1]. The lateral structure and material FET offers the lowest possible common source properties of eGaN FETs make it possible to monolithically integrate a number of FETs inductance (CSI) as it is moved to within the as demonstrated by products such as the EPC2107 [2]. The next phase in the eGaN IC structure. Furthermore the gate driver has been optimized for the FET being driven to offer FET and IC evolution includes gate driver integration. Integrating the gate driver with maximum performance under any operating the FET offers a number of additional advantages over discrete gate driver and FET condition. These benefits are on top of the well- solutions such as extremely low common source inductance, matched gate driver established low capacitance and inductance, and to FET, and ease of design. All the traditional eGaN FET benefits such as significantly zero reverse recovery charge (QRR) that enable lower capacitance and inductance with zero reverse recovery charge (QRR) in a smaller efficient operation at high switching frequencies even under hard switching conditions. The key footprint for a given on-resistance (RDS(on)) than comparable MOSFETs are retained. However, the combined effect of the new characteristics and benefits ensures an ever characteristics of the EPC2112 are given in table 1. -
Resonant Gate-Drive Circuits for High-Frequency Power Converters
Resonant Gate-Drive Circuits for High-Frequency Power Converters A dissertation submitted in partial fulfillment of the requirements for the degree of Doctor of Philosophy By Hur Jedi B. S., University of Baghdad, Baghdad, Iraq, 2003 M. S., University Putra Malaysia, Selangor, Malaysia, 2010 2018 Wright State University WRIGHT STATE UNIVERSITY GRADUATE SCHOOL November 16, 2018 I HEREBY RECOMMEND THAT THE DISSERTATION PREPARED UNDER MY SUPERVISION BY Hur Jedi ENTITLED Resonant Gate-Drive Circuits for High-Frequency Power Converters BE ACCEPTED IN PARTIAL FULFILLMENT OF THE REQUIREMENTS FOR THE DEGREE OF Doctor of Philosophy. Marian K. Kazimierczuk, Ph.D. Dissertation Director Arnab Shaw, Ph.D. Director, Electrical Engineering Ph.D. Program Barry Milligan, Ph.D. Interim Dean of the Graduate School Committee on Final Examination Marian K. Kazimierczuk, Ph.D. Ray Siferd, Ph.D. Henry Chen, Ph.D. Saiyu Ren, Ph.D. Yan Zhuang, Ph.D. Abstract Jedi, Hur. Ph.D., Electrical Engineering Ph.D. Program, Department of Electrical Engineering, Wright State University, 2018. Resonant Gate-Drive Circuits for High- Frequency Power Converters. The development trend of power converters motivates the pursuit with high den- sity, high efficiency, and low cost. Increasing the frequency can improve the power density and lead to small passive elements and a fast dynamic response. Each one of these power converters must be driven by a gate-drive circuit to operate efficiently. Conventional gate-drivers are used up to frequencies of about 5 MHz and suffer from switching losses. Therefore, the development of switch-mode power supplies (SMPS) operating at high frequencies requires high-speed gate drivers. -
Igbts (Insulated Gate Bipolar Transistor) Application Note
IGBTs (Insulated Gate Bipolar Transistor) Application Note IGBTs (Insulated Gate Bipolar Transistor) Description This document describes the basic structures, ratings, and electrical characteristics of IGBTs. It also provides usage considerations for IGBTs. © 2018 1 2018-09-01 Toshiba Electronic Devices & Storage Corporation IGBTs (Insulated Gate Bipolar Transistor) Application Note Table of Contents Description ............................................................................................................................................ 1 Table of Contents ................................................................................................................................. 2 1. Device structure and characteristics of IGBTs ............................................................................. 6 1.1. Basic structure of the IGBT ................................................................................................................ 6 1.2. Comparison of different types of transistors (bipolar transistors, MOSFETs, and IGBTs) ....... 8 2. Different types of IGBTs and their structures ............................................................................ 11 2.1. Gating structures ................................................................................................................................11 2.2. IGBT classification based on the vertical structure ...................................................................... 12 2.2.1. Punch-through (PT) IGBTs ................................................................................................................12 -
VCSEL Pulse Driver Designs for Tof Applications
Vixar Application Note VCSEL Pulse Driver Designs for ToF Applications 1 Introduction ............................................................................................................................. 2 2 Design Theory ......................................................................................................................... 2 2.1 Schematic Components .................................................................................................... 2 2.2 Design Inductance ............................................................................................................ 3 2.3 Rise and Fall Time ........................................................................................................... 5 2.4 Timing Delay.................................................................................................................... 5 3 Low Power Driver Design ...................................................................................................... 5 4 High Power Driver Design...................................................................................................... 7 4.1 GaN FETs ......................................................................................................................... 7 4.2 Gate Drivers ..................................................................................................................... 7 5 VCSEL Performance .............................................................................................................. 8 6 Conclusions -
TRIAC Overvoltage Protection Using a Transil™
AN1966 Application note TRIAC overvoltage protection using a Transil™ Introduction In most of their applications, TRIACs are directly exposed to overvoltages coming from the mains, as described in IEC 61000-4-5 or IEC 61000-4-4 standards. When TRIACs are used to drive resistive loads (ex: temperature regulation), it is essential to provide them with efficient overvoltage protection to prevent any turn-on in breakover mode that could lead to device damage. A traditional method to clamp the voltage is to use a varistor in parallel across the TRIAC. But with high power loads (a few kW), the current through the varistor is very high in case of surge voltages (a few hundred amperes). The varistor is then not efficient enough, due to its dynamic resistor, to limit the TRIAC voltage to a low value. We present here a solution that can be used for these kinds of applications and also for all applications where TRIAC voltage protection is required. It should be noted that the overvoltages could also come from the overvoltages that appear at device turn-off due to the TRIAC holding current. This phenomenon occurs mainly with TRIACs controlling low rms current (15-50 mA), high inductive loads like valves. For more information about such behavior, please refer to AN1172. Contents 1 Why overvoltage protection is required . 2 2 Overvoltage protection solution . 3 3 Transil choice for efficient TRIAC voltage protection . 6 3.1 Normal operation: check VRM voltage . 6 3.2 Surge voltage clamping: check max VCL voltage . 6 4 Experimental validation example . 8 5 Conclusion . -
Triac Control with a Microcontroller Powered from a Positive Supply
AN440 Application note Triac control with a microcontroller powered from a positive supply Introduction This application note explains how to implement a control circuit to drive an AC switch (Triac, ACS or ACST) in case the microcontroller unit (MCU) is supplied with a positive voltage. The driving circuit will also depends on the kind of Triac used and also if other supplies (positive or negative) are available. We also deal about the case of insulated or non-insulated supplies. It is recommended to refer to AN4564 which explains why positive supplies are usually implemented and how simple solutions can be implemented to get a negative supply. Refer also to AN3168 for information about AC switch control circuits in case the microcontroller is supplied with a negative power supply. AN440 - Rev 4 - March 2020 www.st.com For further information contact your local STMicroelectronics sales office. AN440 Positive supply defintion and AC switch triggering quadrants 1 Positive supply defintion and AC switch triggering quadrants 1.1 Positive power supply A positive power supply is a supply where its reference level (VSS) is connected to the mains (line or neutral). The VDD level is then above the mains terminal as shown in Figure 1. If the supply is a 5 V power supply, then VDD is 5 V above the mains reference. This is why such a supply is called a positive supply (compared to a negative supply as shown in AN3168). Figure 1. Positive supply basic schematic 1.2 AC switch triggering quadrants To switch-on an AC switch, like any bipolar device, a gate current must be applied between its gate pin (G) and its drive reference terminal (refer also to AN3168). -
An Application of TRIAC to Capacitor Motor for Hermetic Compressor K
Purdue University Purdue e-Pubs International Compressor Engineering Conference School of Mechanical Engineering 1984 An Application of TRIAC to Capacitor Motor for Hermetic Compressor K. Nakane Y. Tozaki H. Sakamoto Follow this and additional works at: https://docs.lib.purdue.edu/icec Nakane, K.; Tozaki, Y.; and Sakamoto, H., "An Application of TRIAC to Capacitor Motor for Hermetic Compressor" (1984). International Compressor Engineering Conference. Paper 449. https://docs.lib.purdue.edu/icec/449 This document has been made available through Purdue e-Pubs, a service of the Purdue University Libraries. Please contact [email protected] for additional information. Complete proceedings may be acquired in print and on CD-ROM directly from the Ray W. Herrick Laboratories at https://engineering.purdue.edu/ Herrick/Events/orderlit.html AN APPLICA'l'ION OF 'l'RIAC TO CAPACI'l'OR 1-10'l'OR FOR lll~Rt~IC'riC COMPRSSO!l Ka.zuhiro Nakane, Yasuhiro To?.nki,. Ilirota.ka Sakamoto Shizuoka. Worlw, Mitsubishi Electri.c Corporation Shizuoka City , Ja.pan ABSTRACT oncy and output rati.ngo are 100 V ,50/60 J!v. and 100 11. It is a. 1mi 1 t-in motor for the rotary type This paper refers to a.n n.pplication study of 'l'lUAC hermetic compressor shown in Ji'ie;. 2. 'l'hore are to PSC motor for thft hermetic compessor. It is three types of the wirings of the starting device 1-1ell lcnown that 'l'HIAC rlel nys pharJa ane,le of the for thifl motor,as shown i.n lcig, 3. A shows CSR current and has no losses if it is consider(\ as moto:r,n shows P'l'C asoist CSR motor and C sho~1s ideal flwitch. -
LM3445 Triac Dimmable Offline LED Driver
LM3445 Triac Dimmable Offline LED Driver February 19, 2010 LM3445 Triac Dimmable Offline LED Driver General Description Features The LM3445 is an adaptive constant off-time AC/DC buck ■ Triac dim decoder circuit for LED dimming (step-down) constant current controller designed to be com- ■ Application voltage range 80VAC – 277VAC patible with triac dimmers. The LM3445 provides a constant Capable of controlling LED currents greater than 1A current for illuminating high power LEDs and includes a triac ■ dim decoder. The dim decoder allows wide range LED dim- ■ Adjustable switching frequency ming using standard triac dimmers. The high frequency ca- ■ Low quiescent current pable architecture allows the use of small external passive ■ Adaptive programmable off-time allows for constant ripple components. The LM3445 includes a bleeder circuit to ensure current proper triac operation by allowing current flow while the line ■ Thermal shutdown voltage is low to enable proper firing of the triac. A passive No 120Hz flicker PFC circuit ensures good power factor by drawing current di- ■ rectly from the line for most of the cycle, and provides a ■ Low profile 10 pin MSOP Package or 14 pin SOIC constant positive voltage to the buck regulator. Additional ■ Patent pending drive architecture features include thermal shutdown, current limit and VCC un- der-voltage lockout. Applications ■ Retro Fit Triac Dimming ■ Solid State Lighting ■ Industrial and Commercial Lighting ■ Residential Lighting Typical LM3445 LED Driver Application Circuit 30060305 30060301 © 2010 National Semiconductor Corporation 300603 www.national.com Connection Diagrams LM3445 Top View Top View 30060303 10-Pin MSOP NS Package Number MUB10A 30060373 14-Pin SOIC NS Package Number M14A Ordering Information Order Number Spec. -
Fundamentals of MOSFET and IGBT Gate Driver Circuits
Application Report SLUA618A–March 2017–Revised October 2018 Fundamentals of MOSFET and IGBT Gate Driver Circuits Laszlo Balogh ABSTRACT The main purpose of this application report is to demonstrate a systematic approach to design high performance gate drive circuits for high speed switching applications. It is an informative collection of topics offering a “one-stop-shopping” to solve the most common design challenges. Therefore, it should be of interest to power electronics engineers at all levels of experience. The most popular circuit solutions and their performance are analyzed, including the effect of parasitic components, transient and extreme operating conditions. The discussion builds from simple to more complex problems starting with an overview of MOSFET technology and switching operation. Design procedure for ground referenced and high side gate drive circuits, AC coupled and transformer isolated solutions are described in great details. A special section deals with the gate drive requirements of the MOSFETs in synchronous rectifier applications. For more information, see the Overview for MOSFET and IGBT Gate Drivers product page. Several, step-by-step numerical design examples complement the application report. This document is also available in Chinese: MOSFET 和 IGBT 栅极驱动器电路的基本原理 Contents 1 Introduction ................................................................................................................... 2 2 MOSFET Technology ...................................................................................................... -
Driving Egantm Transistors for Maximum Performance
Driving eGaNTM Transistors for Maximum Performance Johan Strydom: Director of Applications, Efficient Power Conversion Corporation Alex Lidow: CEO, Efficient Power Conversion Corporation The recent introduction of enhancement mode MOSFET development, silicon has approached GaN transistors (eGaN™) as power MOSFET/ its theoretical limits. In contrast, GaN is young in IGBT replacements in power management its life cycle, and will see significant improvement applications enables many new products that in the years to come. promise to add great system value. In general, an eGaN transistor behaves much like a power MOSFET with a quantum leap in performance, but to extract all of the newly-available eGaN transistor performance requires designers to understand the differences in drive requirements. eGaN Power Transistor Characteristics As with silicon power MOSFETs, applying a positive bias to the gate relative to the source of an eGaN power transistor causes a field effect, which attracts electrons that complete a Figure 1. Theoretical resistance times die area limits of GaN, silicon, and silicon carbide versus voltage. bidirectional channel between the drain and the source. When the bias is removed from the gate, the electrons under it are dispersed into the GaN, Figure of Merit (FOM) recreating the depletion region and, once again, giving it the capability to block voltage. The FOM is a useful method for comparing power devices and has been used by MOSFET To obtain a higher-voltage device, the distance manufactures to show both generational between the drain and gate is increased. Doing improvements and to compare their parts to so increases the on-resistance of the transistor. -
Thyristors & Triacs
APPLICATION NOTE Thyristors & Triacs - Ten Golden Rules for Success In Your Application. This Technical Publication aims to provide an threshold current IGT, within a very short time known as interesting, descriptive and practical introduction to the the gate-controlled turn-on time, tgt, the load current can golden rules that should be followed in the successful flow from ’a’ to ’k’. If the gate current consists of a very use of thyristors and triacs in power control applications. narrow pulse, say less than 1µs, its peak level will have to increase for progressively narrower pulse widths to Thyristor guarantee triggering. A thyristor is a controlled rectifier where the When the load current reaches the thyristor’s latching unidirectional current flow from anode to cathode is current IL, load current flow will be maintained even after initiated by a small signal current from gate to cathode. removal of the gate current. As long as adequate load current continues to flow, the thyristor will continue to akconduct without the gate current. It is said to be latched ON. Note that the VGT,IGT and IL specifications given in data g are at 25 ˚C. These parameters will increase at lower temperatures, so the drive circuit must provide adequate Fig. 1. Thyristor. voltage and current amplitude and duration for the The thyristor’s operating characteristic is shown in lowest expected operating temperature. Fig. 2. Rule 1. To turn a thyristor (or triac) ON, a gate current On-state ≥ Forward IGT must be applied until the load current is current characteristic ≥ IL. This condition must be met at the lowest expected operating temperature.