Product Change Notification (Pcn)

5215 Hellyer Avenue #110, San Jose, CA 95138-1007 408.360.0200 Phone • 408.360.0222 Fax www.adlinktech.com

PRODUCT CHANGE NOTIFICATION (PCN)

Release Date: October 26th, 2018 Product Category: Express-IB Models Aﬀected: Express-IB Series, Accessories and Semi-Custom Deriva�ves Purpose of No�ﬁca�on: Product End of Lifecycle Status

Change of Lifecycle Status – End of Life Transi�on

In accordance with the Lifecycle Solu�onsSM program for ADLINK products, ADLINK announces that the product models listed in this no�fica�on and all its semi-custom deriva�ves are being transi�oned from Con�nued Availability to End of Life status. Affected by Intel’s Product Change No�fica�on (PCN, #116430-00) on August 18, 2018, Express-IB Series, Accessories and Semi-Custom Deriva�ves will no longer be available for sale.

Material EOL:

Descrip�on: Intel® BD82QM77 Pla�orm Controller Hub . Manufacturer: Intel . Product Code: BD82QM77 (QM77)

6853783 1 OF 6

5215 Hellyer Avenue #110, San Jose, CA 95138-1007 408.360.0200 Phone • 408.360.0222 Fax www.adlinktech.com

List of Affected Models:

Model Description Recommended Successor Product(s)

COM Express® Basic Size Type 6 Module with Intel® Express-IB-1020E Celeron® 1020E at 2.2GHz

COM Express® Basic Size Type 6 Module with Intel® Express-IB-1047UE Celeron®1047UE 1.4 GHz

COM Express® Basic Size Type 6 Module with Intel® Express-IB-i7-3615QE Core™ i7-3615QE SV at 2.3 GHz Express-SL Series COM Express Basic Size Type 6 Module with 6th Gen COM Express® Basic Size Type 6 Module with Intel® Intel® Core™, Xeon® and Celeron® Processors Express-IB-i7-3612QE Core™ i7-3612QE SV at 2.1 GHz (formerly codename: Skylake)

COM Express® Basic Size Type 6 Module with Intel® Express-IB-927UE Celeron® 927UE 1.5 GHz Express-KL Series COM Express® Basic Size Type 6 Module with Intel® COM Express Basic Size Type 6 Module with 7th Gen Express-IB-i7-3555LE Core™ i7-3555LE LV at 2.5 GHz Intel® Core™ 7000 series and Intel® Xeon® Processors (formerly codename: Kaby Lake) COM ExpressR Basic Size Type 6 Module with IntelR Express-IB-i5-3610ME Core? i5- 3610ME SV 2.7 GHz *Please refer to product datasheets enclosed at COM Express® Basic Size Type 6 Module with Intel® the end of this PCN Express-IB-i7-3517UE Core™ i7-3517UE ULV at 1.7 GHz

COM Express® Basic Size Type 6 Module with Intel® Express-IB-i3-3120ME Core™ i3-3120ME SV at 2.4 GHz

COM Express® Basic Size Type 6 Module with Intel® Express-IB-i3-3217UE Core™ i3-3217UE ULV at 1.6 GHz

6853783 2 OF 6

5215 Hellyer Avenue #110, San Jose, CA 95138-1007 408.360.0200 Phone • 408.360.0222 Fax www.adlinktech.com

Express-IB Functional Diagram:

6853783 3 OF 6

5215 Hellyer Avenue #110, San Jose, CA 95138-1007 408.360.0200 Phone • 408.360.0222 Fax www.adlinktech.com

Express-SL Functional Diagram:

6853783 4 OF 6

5215 Hellyer Avenue #110, San Jose, CA 95138-1007 408.360.0200 Phone • 408.360.0222 Fax www.adlinktech.com

Express-KL Functional Diagram:

6853783 5 OF 6

5215 Hellyer Avenue #110, San Jose, CA 95138-1007 408.360.0200 Phone • 408.360.0222 Fax www.adlinktech.com

Key Dates:

Last �me buy date: July 19th, 2019 Last �me ship date: June 12th, 2020

ADLINK will accept orders for Express-IB product series un�l July 19th, 2019. Last �me ship date is June 12th, 2020. Orders for these products will be non-cancelable and non-returnable (NCNR) and dependent upon demand; these products may be subject to a minimum order quan�ty.

Customers of the Express-IB product series are encouraged to migrate to Express-SL product series or Express-KL product series. Samples of the Express-SL and Express-KL are available immediately.

An important part of the Lifecycle Solu�ons program for ADLINK products is to provide customers with no�ce of any changes that might affect long-term product usage or availability. Except for circumstances requiring immediate changes, ADLINK normally provides a few months advance no�ce of changes that affect the form, fit, or func�on of the product. If you have any ques�ons or concerns about this no�ce, please contact your ADLINK sales representa�ve.

If you have technical ques�ons about this product no�ﬁca�on, please contact your ADLINK Field Applica�ons Engineer directly. Otherwise, you can call ADLINK at 1-800-966-5200 or 408-360-0200. For online technical support, please visit our Ask an Expert page at h�p://askanexpert.adlinktech.com/AAE/Answers.aspx and click the tab labeled “Ask a Ques�on”.

6853783 6 OF 6

Product Change Notification

Change Notification #: 116430 - 00 Change Title: Select Intel® Platform Controller Hubs, PCN 116430-00, Product Discontinuance, End of Life Date of Publication: August 18, 2018

Key Characteristics of the Change: Product Discontinuance

Forecasted Key Milestones: Product Discontinuance Program Support Begins: August 18, 2018 Last Product Discontinuance Order Date: August 23, 2019 Orders for Discontinued Products Become Non-Cancelable: August 23, 2019 Last Product Discontinuance Shipment Date: February 21, 2020

Description of Change to the Customer: Intel will discontinue the manufacturing of select products listed in the "Products Affected/Intel Ordering Codes" table below and the products will become unavailable for additional orders after August 23, 2019.

Customer Impact of Change and Recommended Action: Please determine your remaining demand for the products listed in the "Products Affected/Intel Ordering Codes" table and place your "Last Product Discontinuance Order" in accordance with the "Key Milestones" listed above.

Functional Analysis Correlation Request (FA/CR) support for the products listed in the "Products Affected/Intel Ordering Codes" table will follow standard FA/CR support timelines.

Please contact your Intel Field Sales Representative with any questions, requests or concerns.

Products Affected / Intel Ordering Codes: Marketing Name Product Platform Spec MM# Code Code

Intel® BD82QM67 Platform Controller Hub BD82QM67 Mobile SLJ4M 914325 Intel® BD82HM65 Platform Controller Hub BD82HM65 Mobile SLJ4P 914377 Intel® BD82B65 Platform Controller Hub BD82B65 Desktop SLJ4A 914379 Intel® BD82H61 Platform Controller Hub BD82H61 Desktop SLJ4B 914380 Intel® BD82Q67 Platform Controller Hub BD82Q67 Desktop SLJ4D 914397 Intel® BD82C206 Platform Controller Hub BD82C206 Server SLJ4G 914417

Page 1 of PCN #116430 - 00 3 Intel® BD82QM77 Platform Controller Hub BD82QM77 Mobile SLJ8A 915663 Intel® BD82HM76 Platform Controller Hub BD82HM76 Mobile SLJ8E 915666 Intel® BD82Q77 Platform Controller Hub BD82Q77 Desktop SLJ83 915673 Intel® BD82B75 Platform Controller Hub BD82B75 Desktop SLJ85 915675 Intel® BD82C216 Platform Controller Hub BD82C216 Server SLJ8H 915680

PCN Revision History: Date of Revision: Revision Number: Reason: August 18, 2018 00 Originally Published PCN

Page 2 of PCN #116430 - 00 3

Product Change Notification 116430 - 00

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.

A "Mission Critical Application" is any application in which failure of the Intel Product could result, directly or indirectly, in personal injury or death. SHOULD YOU PURCHASE OR USE INTEL'S PRODUCTS FOR ANY SUCH MISSION CRITICAL APPLICATION, YOU SHALL INDEMNIFY AND HOLD INTEL AND ITS SUBSIDIARIES, SUBCONTRACTORS AND AFFILIATES, AND THE DIRECTORS, OFFICERS, AND EMPLOYEES OF EACH, HARMLESS AGAINST ALL CLAIMS COSTS, DAMAGES, AND EXPENSES AND REASONABLE ATTORNEYS' FEES ARISING OUT OF, DIRECTLY OR INDIRECTLY, ANY CLAIM OF PRODUCT LIABILITY, PERSONAL INJURY, OR DEATH ARISING IN ANY WAY OUT OF SUCH MISSION CRITICAL APPLICATION, WHETHER OR NOT INTEL OR ITS SUBCONTRACTOR WAS NEGLIGENT IN THE DESIGN, MANUFACTURE, OR WARNING OF THE INTEL PRODUCT OR ANY OF ITS PARTS.

Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined". Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information.

The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request.

Should you have any issues with the timeline or content of this change, please contact the Intel Representative(s) for your geographic location listed below. No response from customers will be deemed as acceptance of the change and the change will be implemented pursuant to the key milestones set forth in this attached PCN.

Americas Contact: [email protected] Asia Pacific/PRC Contact: [email protected] Europe Email: [email protected] Japan Email: [email protected]

3D XPoint, Axxia, Basis, Basis Peak, BlueMoon, BunnyPeople, Celeron, Centrino, Cilk, Curie, Flexpipe, Intel, the Intel logo, Intel Atom, Intel CoFluent, Intel Core, Intel. Experience What's Inside, the Intel. Experience What's Inside logo, Intel Inside, the Intel Inside logo, Intel Insider, Intel Joule, Intel RealSense, Intel SingleDriver, Intel SpeedStep, Intel Unite, Intel vPro, Intel Xeon Phi, Intel XScale, InTru, the InTru logo, the InTru Inside logo, InTru soundmark, Iris, Itanium, MCS, MMX, Optane, Ostro, Pali, Pentium, picoArray, Picochip, picoXcell, Puma, Quark, SMARTi, Soletta, Sound Mark, StarPro, Stay With It, the Engineering Stay With It logo, StreamSight, Tarari, The Journey Inside, Thunderbolt, the Thunderbolt logo, Transcede, True Key, Ultrabook, VTune, Xeon, X-GOLD, XMM, X-PMU and XPOSYS are trademarks of Intel Corporation or its subsidiaries in the U.S. and/or other countries.

Microsoft, Windows, and the Windows logo are trademarks, or registered trademarks of Microsoft Corporation in the United States and/or other countries. Java is a registered trademark of Oracle and/or its affiliates. Bluetooth is a trademark owned by its proprietor and used by Intel Corporation under license. Intel Corporation uses the Palm OS* Ready mark under license from Palm, Inc. OpenCL and the OpenCL logo are trademarks of Apple Inc. used by permission by Khronos. Learn how to use Intel Trademarks and Brands correctly at http://www.intel.com/intel/legal/tmusage2.htm.

Page 3 of PCN #116430 - 00 3 Express-SL/SLE COM Express Basic Size Type 6 Module with 6th Gen Intel® Core™, Intel® Xeon® and Celeron® Processor

Features New

® ® ® ® ● 6th Gen Intel Core™, Intel Xeon and Celeron Processor ● Up to 32 GB Dual Channel DDR4 at 1867/2133 MHz (supports both ECC and non-ECC memory) ● 3x DDI channels, 1x LVDS (or 4 lanes eDP) supports up to 3 independent displays ● 8x PCIe x1 (Gen3) and 1x PCIe x16 (Gen3) ● GbE, 4x SATA 6 Gb/s, 4x USB 3.0 and 4x USB 2.0 ® ● Supports Smart Embedded Management Agent (SEMA ) functions ● Extreme Rugged operating temperature: -40°C to +85°C (build option)

Specifications ● Core System CPU Debug Headers Mobile Intel® Xeon®, Core™ and Celeron® Processors - 14nm 40-pin flat cable connector for use with DB-40 debug module providing BIOS Xeon® E3-1515M v5 2.8/3.7GHz (Turbo), 45W (4C/GT4e) POST code LED, BMC access, SPI BIOS flashing, power testpoints, debug LEDs Xeon® E3-1505M v5 2.8/3.7GHz (Turbo), 45W (4C/GT2) 60-pin XDP header for ICE debug of CPU/chipset Xeon® E3-1505L v5 2.0/2.8GHz (Turbo), 25W (4C/GT2) Core™ i7-6820EQ 2.8/3.5GHz (Turbo), 45W (4C/GT2) ● Video Core™ i7-6822EQ 2.0/2.8GHz (Turbo), 25W (4C/GT2) GPU Feature Support ® Core™ i5-6440EQ 2.7/3.4GHz (Turbo), 45W (4C/GT2) Intel Generation 9 LP Graphics Core Architecture, supporting 3 independent and simultaneous display combinations of DisplayPort/HDMI/LVDS or eDP Core™ i5-6442EQ 1.9/2.7GHz (Turbo), 25W (4C/GT2) outputs Core™ i3-6100E 2.7GHz (no Turbo), 35W (2C/GT2) Core™ i3-6102E 1.9GHz (no Turbo), 25W (2C/GT2) Hardware encode/transcode Celeron® G3900E 2.4GHz (no Turbo), 35W (2C/GT1) HD content (including HEVC) DirectX 12, DirectX 11.2, DirectX 11.1, DirectX Supports: Intel® VT, Intel® TXT, Intel® SSE4.2, Intel® HT Technology, Intel® 64 11, DirectX 10.1, DirectX 10, DirectX 9 support OpenGL 4.4/4.3 and ES 2.0 Architecture, Execute Disable Bit, Intel® Turbo Boost Technology 2.0, Intel® support AVX2, Intel® AES-NI, PCLMULQDQ Instruction, Intel® Secure Key and Intel® TSX. OpenCL 2.1, 2.0/1.2 support Note: Availability of the features may vary between processor SKUs. Digital Display Interface Memory DDI1/2/3 supporting DisplayPort/HDMI/DVI Dual channel 1867/2133 MHz DDR4 memory up to 32GB in dual SODIMM

sockets (ECC/non-ECC support dependent on selected CPU/PCH) LVDS Single/dual channel 18/24-bit LVDS from eDP-to-LVDS IC Embedded BIOS

AMI EFI with CMOS backup in 16MB SPI BIOS with Intel® AMT 11.0 support eDP 4 lane support optional, in place of LVDS Cache 8MB for Xeon® and Core™ i7, 6MB for Core™ i5, 3MB for Core™ i3, 2MB for Celeron® ● Audio Chipset PCH Intel® HD Audio integrated in chipset CM236 (supports ECC memory, Intel® AMT) QM170 (supports non-ECC, Intel® AMT) Audio Codec HM170 (supports non-ECC, no Intel® AMT support) located on carrier Express-BASE6 (ALC886 standard supported)

Expansion Busses ● Ethernet PCIe x16 or 2 PCIe x8 or 1 PCIe x8 with 2 PCIe x4 (Gen3) Intel® MAC/PHY: i219LM/V (LM with AMT 11.0 support) 6 PCI Express x1 (Gen3); AB connector, Lanes 0/1/2/3/4/5 Interface: 10/100/1000 GbE connection 2 PCI Express x2 (Gen3): CD connector, Lanes 6/7 LPC bus, SMBus (system) , I2C (user)

Note: “build option” indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that these “build option” part numbers will need to be newly created and this will result in production lead times.

Specifications ● I/O Interfaces ● Mechanical and Environmental USB: 4x USB v. 3.0 (USB 0,1,2,3) and 4x USB 2.0 (USB 4,5,6,7) Form Factor: PICMG COM.0, Rev 2.1 Type 6 SATA: Four ports SATA 6Gb/s (SATA0,1,2,3) Dimension: Basic size, 125 mm x 95 mm Serial: 2 UART ports with console redirection Operating Temperature GPIO: 4 GPO and 4 GPI Standard: 0°C to 60°C Extreme Ruggeed: -40°C to +85°C (build option for Core™ & Celeron® 25W ● Super I/O TDP SKUs) Supported on carrier if needed (standard support for W83627DHG-P) Humidity ● TPM 5-90% RH operating, non-condensing Chipset: Atmel AT97SC3204 5-95% RH storage (and operating with conformal coating) Type: TPM1.2/2.0 (TPM 2.0 support with project basis) Shock and Vibration ● Power IEC 60068-2-64 and IEC-60068-2-27 MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Standard Input: ATX = 12V±5% / 5Vsb ±5% or AT = 12V±5% Table 214-I, Condition D Wide Input: ATX = 8.5-20 V / 5Vsb ±5% or AT = 8.5 ~20V (Standard temp. only) Management: ACPI 5.0 compliant, Smart Battery support HALT Power States: C1-C6, S0, S1, S3, S4, S5 , S5 ECO mode (Wake-on-USB S3/S4, Thermal Stress, Vibration Stress, Thermal Shock and Combined Test WOL S3/S4/S5) ECO mode: Supports deep S5 mode for power saving ● Intelligent Middleware SEMA® ● Operating Systems Local management, control of embedded computer systems Standard Support Extended EAPI for monitoring, controlling and analytics applications Windows 10/8.1 64-bit, Windows 7 32/64-bit, Linux 64-bit, VxWorks Multiple OS support and across platforms (x86, ARM) Extended Support (BSP) WES 7 32/64-bit, Linux 64-bit, VxWorks

Functional Diagram

SODIMM 1 XDP 1867/2133 MHz 60 4-16 GB DDR4 Mobile Intel® Xeon® DDI 1 DP/HDMI/DVI SODIMM 2 ® 1867/2133 MHz 6th Gen Intel Core™ 4-16 GB DDR4 i7/i5/i3 Processor DDI 2 DP/HDMI/DVI Intel® Celeron® DDI 3 single/dual eDP - LVDS DP/HDMI/DVI 18/24 bit LVDS Processor

PCIe x16 (Gen3) eDP x4 lanes (optional) (formerly “Skylake-H”) 2 x8 or 1 x8 + 2 x4 UM I

6x PCIex1 (Gen3) 2x PCIe x1 (Gen3) (port 0-5) (port 6/7)

LAN PCIe x1 I219

4x SATA 6Gb/s (port 0/1/2/3) 8x USB 2.0 Mobile Intel® QM170/HM170/ HD Audio 4x USB 3.0 (port 0/1/2/3) CM236 UART0/1 LPC to UART Chipset

Debug TPM header LPC bus

SMBus

GPIO SPI 0 BIOS SMBus

4x GPO, 4x GPI SPI 1 New BIOS GP I2C SEMA BMC DDC I2C SPI_CS# LM73 Sensor SPI Ordering Information Accessories

● Express-SLE-E3-1515M v5 Heat Spreaders Basic COM Express Type 6 module with Intel® Xeon® E3-1515M v5 and GT4e level graphics, CM236 chipset, support ECC ● HTS-SL-B Heatspreader for Express-SL with threaded standoffs for ● Express-SLE-E3-1505M v5 bottom mounting Basic COM Express Type 6 module with Intel® Xeon® E3-1505M v5 and GT2 level graphics, CM236 chipset, support ECC ● HTS-SL-BT ● Express-SLE-E3-1505L v5 Heatspreader for Express-SL with through hole standoffs for Basic COM Express Type 6 module with Intel® Xeon® E3-1505L top mounting v5 and GT2 level graphics, CM236 chipset, support ECC Passive Heatsinks ● Express-SL-i7-6820EQ ® Basic COM Express Type 6 module with Intel Core™ i7-6820EQ ● THS-SL-BL and GT2 level graphics, QM170 chipset Low profile heatsink for Express-SL with threaded standoffs for ● Express-SL-i7-6822EQ bottom mounting ® Basic COM Express Type 6 module with Intel Core™ i7-6822EQ, ● THS-SL-BT and GT2 level graphics, QM170 chipset Low profile heatsink for Express-SL with through hole standoffs ● Express-SL-i5-6440EQ for top mounting Basic COM Express Type 6 module with Intel® Core™ i5-6440EQ ● THSH-SL-BL and GT2 level graphics, QM170 chipset High profile heatsink for Express-SL with threaded standoffs ● Express-SL-i5-6442EQ for bottom mounting Basic COM Express Type 6 module with Intel® Core™ i5-6442EQ and GT2 level graphics, QM170 chipset Active Heatsink ● Express-SL-i3-6100E ● THSF-SL-BL Basic COM Express Type 6 module with Intel® Core™ i3-6100E and GT2 level graphics, HM170 chipset High profile heatsink with fan for Express-SL with threaded standoffs for bottom mounting ● Express-SL-i3-6102E Basic COM Express Type 6 module with Intel® Core™ i3-6102E and GT2 level graphics, HM170 chipset Starter Kit ● Express-SL-G3900E Basic COM Express Type 6 module with Intel® Celeron® G3900E ● Starterkit-COM Express 6 PLUS and GT1 level graphics, HM170 chipset COM Express formfactor starter kit with Express-BASE6 board, power supply, and accessory kit

www.adlinktech.com All products and company name listed are trademarks or trade names of their respective companies. Updated Feb. 08, 2018. ©2018 ADLINK Technology, Inc. All Rights Reserved. All specifications are subject to change without further notice. Express-KL/KLE COM Express Basic Size Type 6 Module with 7th Gen Intel® Core™, Intel® Xeon® Processor

Features

® ® ® ● 7th Gen Intel Core™, Intel Xeon Processor ● Up to 32 GB Dual Channel DDR4 at 1867/2133 MHz (supports both ECC and non-ECC memory) ● 3x DDI channels, 1x LVDS (or 4 lanes eDP) supports up to 3 independent displays ● 8x PCIe x1 (Gen3) and 1x PCIe x16 (Gen3) ● GbE, 4x SATA 6 Gb/s, 4x USB 3.0 and 4x USB 2.0 ® ● Supports Smart Embedded Management Agent (SEMA ) functions ● Extreme Rugged operating temperature: -40°C to +85°C (build option)

Specifications ● Core System CPU Debug Headers Mobile Intel® Xeon®, Core™ Processors - 14nm 40-pin flat cable connector for use with DB-40 debug module providing BIOS Xeon® E3-1505M v6 3.0/4.0GHz (Turbo), 45W (4C/GT2) POST code LED, BMC access, SPI BIOS flashing, power testpoints, debug LEDs Xeon® E3-1505L v6 2.2/3.0GHz (Turbo), 25W (4C/GT2) 60-pin XDP header for ICE debug of CPU/chipset Core™ i7-7820EQ 3.0/3.7GHz (Turbo), 45W (4C/GT2) Core™ i5-7440EQ 2.9/3.6GHz (Turbo), 45W (4C/GT2) ● Video Core™ i5-7442EQ 2.1/2.9GHz (Turbo), 25W (4C/GT2) GPU Feature Support ® Core™ i3-7100E 2.9GHz (no Turbo), 35W (2C/GT2) Intel Generation 9 LP Graphics Core Architecture, supporting 3 independent and simultaneous display combinations of DisplayPort/HDMI/LVDS or eDP Core™i3-7102E 2.1GHz (no Turbo), 25W (2C/GT2) outputs Supports: Intel® VT, Intel® TXT, Intel® SSE4.2, Intel® HT Technology, Intel® 64 Architecture, Execute Disable Bit, Intel® Turbo Boost Technology 2.0, Intel® Hardware encode/transcode ® ® ® AVX2, Intel AES-NI, PCLMULQDQ Instruction, Intel Secure Key and Intel TSX. HD content (including HEVC) DirectX 12, DirectX 11.2, DirectX 11.1, DirectX Note: Availability of the features may vary between processor SKUs. 11, DirectX 10.1, DirectX 10, DirectX 9 support OpenGL 4.4/4.3 and ES 2.0 support Memory OpenCL 2.1, 2.0/1.2 support Dual channel 1867/2133 MHz DDR4 memory up to 32GB in dual SODIMM sockets (ECC/non-ECC support dependent on selected CPU/PCH) Digital Display Interface DDI1/2/3 supporting DisplayPort/HDMI/DVI Embedded BIOS AMI EFI with CMOS backup in 16MB SPI BIOS with Intel® AMT 11.6 support LVDS Single/dual channel 18/24-bit LVDS from eDP-to-LVDS IC Cache 8MB for Xeon® and Core™ i7, 6MB for Core™ i5, 3MB for Core™ i3 eDP 4 lane support optional, in place of LVDS PCH CM238 (supports ECC memory, Intel AMT) ● Audio QM175 (supports non-ECC, Intel AMT) Chipset HM175 (supports non-ECC, no Intel AMT support) Intel® HD Audio integrated in chipset Expansion Busses Audio Codec PCIe x16 or 2 PCIe x8 or 1 PCIe x8 with 2 PCIe x4 (Gen3) located on carrier Express-BASE6 (ALC886 standard supported) 6 PCI Express x1 (Gen3); AB connector, Lanes 0/1/2/3/4/5 2 PCI Express x2 (Gen3): CD connector, Lanes 6/7 ● Ethernet LPC bus, SMBus (system) , I2C (user) Intel® MAC/PHY: i219LM/V (LM with AMT 11.0 support) Interface: 10/100/1000 GbE connection

Specifications ● I/O Interfaces ● Mechanical and Environmental USB: 4x USB v. 3.0 (USB 0,1,2,3) and 4x USB 2.0 (USB 4,5,6,7) Form Factor: PICMG COM.0, Rev 2.1 Type 6 SATA: Four ports SATA 6Gb/s (SATA0,1,2,3) Dimension: Basic size, 125 mm x 95 mm Serial: 2 UART ports with console redirection Operating Temperature GPIO: 4 GPO and 4 GPI Standard: 0°C to 60°C ● Super I/O Extreme Ruggeed: -40°C to +85°C (build option for 25W TDP SKUs) Supported on carrier if needed (standard support for W83627DHG-P) Humidity 5-90% RH operating, non-condensing ● TPM 5-95% RH storage (and operating with conformal coating) Chipset: Infineon Type: TPM 2.0 Shock and Vibration IEC 60068-2-64 and IEC-60068-2-27 ● Power MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D Standard Input: ATX = 12V±5% / 5Vsb ±5% or AT = 12V±5% Wide Input: ATX = 8.5-20 V / 5Vsb ±5% or AT = 8.5 ~20V (Standard temp. only) HALT Management: ACPI 5.0 compliant, Smart Battery support Thermal Stress, Vibration Stress, Thermal Shock and Combined Test Power States: C1-C6, S0, S1, S3, S4, S5 , S5 ECO mode (Wake-on-USB S3/S4, WOL S3/S4/S5) ● Intelligent Middleware ECO mode: Supports deep S5 mode for power saving SEMA® Local management, control of embedded computer systems ● Operating Systems Extended EAPI for monitoring, controlling and analytics applications Standard Support Multiple OS support and across platforms (x86, ARM) Windows 10 64-bit, Linux 64-bit, VxWorks Extended Support (BSP) Linux 64-bit, VxWorks

Functional Diagram

SODIMM 1 XDP 1867/2133 MHz 60 4-16 GB DDR4 Mobile 7th Gen DDI 1 DP/HDMI/DVI SODIMM 2 Intel® Xeon® 1867/2133 MHz 4-16 GB DDR4 ® DDI 2 Intel Core™ DP/HDMI/DVI i7/i5/i3 Processor DDI 3 single/dual eDP - LVDS DP/HDMI/DVI 18/24 bit LVDS (formerly “Kaby Lake-H”)

PCIe x16 (Gen3) eDP x4 lanes (optional) 2 x8 or 1 x8 + 2 x4 UM I

6x PCIex1 (Gen3) 2x PCIe x1 (Gen3) (port 0-5) (port 6/7)

LAN PCIe x1 I219

4x SATA 6Gb/s (port 0/1/2/3) 8x USB 2.0 Mobile Intel®

HD Audio QM175/HM175/CM238 Chipset 4x USB 3.0 (port 0/1/2/3) UART0/1 LPC to UART

Debug TPM header LPC bus

SMBus

GPIO SPI 0 BIOS SMBus

4x GPO, 4x GPI SPI 1 New BIOS GP I2C SEMA BMC DDC I2C SPI_CS# LM73 Sensor SPI Ordering Information Accessories

● Express-KLE-E3-1505M v6 Heat Spreaders Basic Size COM Express® Type 6 module with Intel® Xeon® E3-1505M v6 and GT2 level graphics, CM238 chipset ● HTS-SL-B Heatspreader for Express-SL with threaded standoffs for ● Express-KLE-E3-1505L v6 bottom mounting Basic Size COM Express® Type 6 module with Intel® Xeon® E3-1505M v6 and GT2 level graphics, CM238 chipset ● HTS-SL-BT ● Express-KL-i7-7820EQ Heatspreader for Express-SL with through hole standoffs for Basic Size COM Express® Type 6 module with Intel® Core™ top mounting i7-7820EQ and GT2 level graphics, QM175 chipset Passive Heatsinks ● Express-KL-i5-7440EQ ® ® Basic Size COM Express Type 6 module with Intel Core™ ● THS-SL-BL i5-7440EQ and GT2 level graphics, QM175 chipset Low profile heatsink for Express-SL with threaded standoffs for ● Express-KL-i5-7442EQ bottom mounting ® ® Basic Size COM Express Type 6 module with Intel Core™ ● THS-SL-BT i5-7442EQ and GT2 level graphics, QM175 chipset Low profile heatsink for Express-SL with through hole standoffs ● Express-KL-i3-7100E for top mounting Basic Size COM Express® Type 6 module with Intel® Core™ ● THSH-SL-BL i3-7100E and GT2 level graphics, HM175 chipset High profile heatsink for Express-SL with threaded standoffs ● Express-KL-i3-7102E for top mounting Basic Size COM Express® Type 6 module with Intel® Core™ i3-7102E and GT2 level graphics, HM175 chipset Active Heatsink

● THSF-SL-BL High profile heatsink with Fan for Express-KL with threaded standoffs for bottom mounting

Starter Kit

● Starterkit-COM Express 6 PLUS COM Express formfactor starter kit with Express-BASE6 board, power supply, and accessory kit

www.adlinktech.com All products and company name listed are trademarks or trade names of their respective companies. Updated Jun. 07, 2018. ©2018 ADLINK Technology, Inc. All Rights Reserved. All specifications are subject to change without further notice.