p. 6 Editor’s Foreword p. 20 Special Feature Celebrating VME’s VITA Technologies strength and endurance Hall of Fame Let’s face it: what’s probably top of your mind is how to ensure your program stands the best WE INNOVATE. WE DELIVER. chance of success: getting to deployment faster, at lower cost and with less risk. That’s what your YOU SUCCEED. customers are demanding.
At Abaco Systems, that’s our business. We could Find out more at abaco.com talk forever about how everything we do is or follow us @AbacoSys based on industry standards and modular, open architectures – but that’s not so important. It’s just a starting point for our innovation. What’s important is that you work with a company with the experience to back up our promises, and that’s entirely committed to your success.
That company is Abaco Systems. ©2016 Abaco Systems. All rights reserved. All other brands, names or trademarks are property of their respective holders.
portfolio_advert_March2016_v2.indd 1 23/03/2016 11:59
SPRING/SUMMER 2016 | VOLUME 34 | NUMBER 1 @VitaTechnology
On the cover The VITA Technologies 2016 Resource Guide showcases technologies based on VITA standards, including FMC, OpenVPX, XMC/PMC, and related rugged boards, systems, and components. Featured on the cover: Annapolis Micro Systems Wild40 Ecosystem for OpenVPX 3U and Curtiss- Wright Defense Solutions AFT Cooled 3U VPX COTS System.
FMC+ standard propels embedded design to new heights By Jeremy Banks, Curtiss-Wright, ADDITIONAL FEATURES » p. 10 and Jim Everett, Xilinx 20 Special Feature Jerry Gipper VITA Technology Hall of Fame 2016
DEPARTMENTS
6 Editor’s Foreword Jerry Gipper Celebrating VME’s strength and endurance
8 VITA Standards Update Jerry Gipper VITA Standards Organization activity updates Very high-speed sampling and serial ADCs in embedded systems By Thierry Wastiaux, 22 Primetime Choices » p. 14 Interface Concept
24 VITA Technologies Resource Guide FMC ...... 25 Networking ...... 26 OpenVPX ...... 27 Operating Systems and Tools ...... 38 PMC ...... 37 Small Form Factor ...... 40 VME ...... 40 Modular Open Radio Frequency VPX...... 43 Architecture boot camp XMC/PMC ...... 47 By Jerry Gipper, » p. 17 Editorial Director
All registered brands and trademarks within VITA Technologies magazine are the property of their respective owners. ™VPX and its logo is a registered product/trademark of VITA. © 2016 OpenSystems Media © 2016 VITA Technologies
enviroink.indd 1 10/1/08 10:44:38 AM 4 | VITA Technologies Resource Guide Spring/Summer 2016 www.vita-technologies.com Advertiser Index
2 Abaco Systems – We innovate. We deliver. You succeed. 3 Annapolis Micro Systems, Inc. – EDITORIAL DIRECTOR Jerry Gipper [email protected] WILDSTAR OpenVPX Ecosystem MANAGING EDITOR Jennifer Hesse [email protected] 15 Elma Electronic – We take our GROUP EDITORIAL DIRECTOR John McHale [email protected] leadership role seriously E-CAST MANAGER Joy Gilmore [email protected] 7 Excalibur Systems, Inc. – mil-1553.com CREATIVE DIRECTOR Steph Sweet [email protected] 24 Highland Technology, Inc. – DIGITAL MEDIA MANAGER Rachel Wallace [email protected] Continuing our long term commitment SENIOR WEB DEVELOPER Konrad Witte [email protected] to VME WEB DEVELOPER Paul Nelson [email protected] 9 Interface Concept – Build your CONTRIBUTING DESIGNER Joann Toth [email protected] own VPX system 13 LCR Embedded Systems – SALES Rugged chassis, backplanes, and SALES MANAGER Tom Varcie [email protected] integrated systems (586) 415-6500 19 Pentair Electronics Protection – STRATEGIC ACCOUNT MANAGER Rebecca Barker [email protected] VPX & VME systems chassis and front (281) 724-8021 panels express delivery STRATEGIC ACCOUNT MANAGER Bill Barron [email protected] (516) 376-9838 48 Pentek, Inc. – Got tough software radio design challenges? STRATEGIC ACCOUNT MANAGER Eric Henry [email protected] (541) 760-5361 16 Themis Computer – NanoSWITCH STRATEGIC ACCOUNT MANAGER Kathleen Wackowski [email protected] 23 Vector Electronics & Technology, Inc. – (978) 888-7367 VME/VXS/cPCI chassis, backplanes & SOUTHERN CALIFORNIA REGIONAL SALES MANAGER Len Pettek [email protected] accessories (805) 231-9582 18 VEROTEC Electronics Packaging – SOUTHWEST REGIONAL SALES MANAGER Barbara Quinlan [email protected] (480) 236-8818 19" desktop cases, integrated systems, NORTHERN CALIFORNIA REGIONAL SALES MANAGER Twyla Sulesky [email protected] card cages and components (408) 779-0005 ASIA-PACIFIC SALES ACCOUNT MANAGER Elvi Lee [email protected] EUROPE SALES ACCOUNT MANAGER James Rhoades-Brown [email protected]
ECASTS WWW.OPENSYSTEMSMEDIA.COM Space Rovers PUBLISHER Patrick Hopper [email protected] and Surgical Robots: PRESIDENT Rosemary Kristoff [email protected] System Architecture Lessons EXECUTIVE VICE PRESIDENT John McHale [email protected] from Mars EXECUTIVE VICE PRESIDENT Rich Nass [email protected] May 5 CHIEF TECHNICAL OFFICER Wayne Kristoff 2:00 p.m. EDT ASSISTANT MANAGING EDITOR Lisa Daigle [email protected] SENIOR EDITOR Sally Cole [email protected] Solving Aerospace Tech ASSOCIATE EDITOR Mariana Iriarte [email protected] Development Challenges PICMG EDITORIAL DIRECTOR Joe Pavlat [email protected] June 7 EMBEDDED COMPUTING BRAND DIRECTOR Rich Nass [email protected] 2:00 p.m. EDT EMBEDDED COMPUTING EDITORIAL DIRECTOR Curt Schwaderer [email protected] ecast.opensystemsmedia.com TECHNOLOGY EDITOR Brandon Lewis [email protected] TECHNICAL CONTRIBUTOR Rory Dear [email protected] CREATIVE PROJECTS Chris Rassiccia [email protected] FINANCIAL ASSISTANT Emily Verhoeks [email protected] SUBSCRIPTION MANAGER [email protected]
CORPORATE OFFICE EVENTS 16626 E. Avenue of the Fountains, Ste. 201 • Fountain Hills, AZ 85268 • Tel: (480) 967-5581 XPONENTIAL 2016 SALES AND MARKETING OFFICE 30233 Jefferson • St. Clair Shores, MI 48082 May 2-5 New Orleans, Louisiana REPRINTS www.xponential.org WRIGHT’S MEDIA REPRINT COORDINATOR Wyndell Hamilton [email protected] (281) 419-5725 www.vita-technologies.com VITA Technologies Resource Guide Spring/Summer 2016 | 5 Editor’s Foreword By Jerry Gipper, Editorial Director
@VitaTechnology [email protected]
Celebrating VME’s strength and endurance
Embedded Tech Trends 2016 is now in to do so; IOxOS also has an FPGA-based bridge chip that is sold as a stand-alone the books. We had a record number of component and is being used by other VMEbus board suppliers. sponsors and media representatives at the event, which is a business and tech- In 2014 the industry was in a panic that VMEbus as we knew it would end when IBM nology forum focused on the critical and informed IDT that they would no longer build the Tsi148 VMEbus to PCI-X bridge for intelligent embedded systems industry. them, forcing IDT to announce the end-of-life of that popular part. Strong demand for The theme this year was “Houston – We VME incentivized suppliers to look for alternate solutions, from lifetime purchases to have a problem!” All of the presentations custom FPGA implementations. Many are taking the opportunity to make it a VMEbus and associated videos have been posted to PCI Express bus bridge, which is more popular with today’s designs. to the Embedded Tech Trends website at www.embeddedtechtrends.com. The industry lost a giant in January with the passing of Lym Hevle, the founder of the VMEbus International Trade Association (VITA). I was saddened to hear the news. I had Last year was a very busy time at VITA. the fortune of knowing Lym in the early days of VITA and VMEbus. My last contact with Twenty-two new members joined from him was while I was doing research for the 25th anniversary of VMEbus. Read more companies around the world, truly about Lym’s contributions in the Hall of Fame feature. reflecting the international significance of the organization. These memberships I was excited when I got a call from NAVAIR late last year asking if they could attend were driven primarily by the growing a VITA Standards Organization (VSO) meeting to discuss some ideas they had on popularity of VPX and FMC. The activity open architecture platforms. They have been following the work of the U.S. Army’s level is high for standards develop- VICTORY program and have been struggling with many of the same development ment and design-wins for both of these issues. A NAVAIR representative presented the Hardware Open System Technology technologies. (HOST) strategy to VSO meeting attendees. NAVAIR has a vision of creating a hard- ware technical reference framework for developing embedded computing systems At the same time, we are preparing to through successful development of the HOST strategy to maximize platform and celebrate the 35th anniversary of the system “openness,” modularity, interoperability, scalability, sustainability, and reuse. announcement of VMEbus. Looking The VSO decided to form a study group to continue working on this proposal. Formal back, it is hard to imagine the strength release of a document is imminent. and longevity of VME. I had graduated from college and was just getting my Growing a company in the critical embedded computing industry is extremely chal- feet wet in the world of embedded com- lenging. I spent several years of my career at Motorola leading a small strategy puting when it debuted. Please feel free team tasked with that goal. I am always on the watch for news on acquisitions in our to visit our LinkedIn site to add your own industry. The recent announcement by Mercury Systems to acquire the embedded comments to the conversation. I will be security, RF and microwave, and custom microelectronics businesses from Microsemi pulling comments and stories from the Corporation was especially of interest. Mercury Systems has been active in acquisi- LinkedIn conversation to be published in tions for many years, primarily at a system level. This acquisition takes a different our 35th anniversary feature in the Fall/ slant that I am not quite sure I understand yet. While I have observed semiconductor Winter issue. companies purchase board and system companies over the years, I have never seen a computer system company in this space purchase a semiconductor company. This will New products based on VMEbus con- be a fun acquisition to follow in the coming months. It begs me to ask why someone tinue to be introduced today, as evi- wouldn’t be interested in purchasing the IDT VME chip business? denced by some of my Primetime product selections. News from Curtiss- I extend an invitation for everyone to join in the conversations at the VITA Technologies Wright that they have developed an LinkedIn group (www.linkedin.com/groups/2565867). FPGA-based PCI Express to VME64x bridge chip with a 15-year life-cycle If the rest of 2016 is anything like the first quarter, then this year should be a fun time! commitment is mind-boggling to me I look forward to a great 2016. in this age of rapid technology turn- over! And they were not even the first Jerry Gipper, [email protected]
6 | VITA Technologies Resource Guide Spring/Summer 2016 www.vita-technologies.com
VITA Standards Update By Jerry Gipper
VITA Standards Organization activity updates
The March VITA Standards Organization (VSO) meeting was held in Orlando, Florida. This update is based on the results of that meeting. Contact VITA if you are interested in participating in any of these working groups. Visit the VITA website (www.vita.com) for details on upcoming VSO meetings.
ANSI accreditation Status: ANSI/VITA 47-2005 (R2007) has been opened up for revision to improve Accredited as an American National interoperability, create less reliance on individual supplier ruggedization guidelines, Standards Institute (ANSI) developer and make sure environments are concurrent with new VPX updates. The working and a submitter of Industry Trade group is actively scheduling meetings and working on revisions. Participation is Agreements to the IEC, the VSO pro- encouraged. vides its members with the ability to develop and promote open technology VITA 48.4: VPX REDI: standards. The VSO meets every two Mechanical Specification Using Liquid Flow Through (LFT) Applied to VPX months to address embedded bus and Objective: This standard will establish the mechanical design requirements for an board industry standards issues. LFT-cooled electronic VPX module.
VSO study and working group Status: The working group is developing a vibration test plan, as well as designing a activities simplified prototype vibration test module and backplane fixture to further validate Standards within the VSO may be initi- the concept of removing the two outer guide pins. A first draft version of the standard ated through the formation of a study is out for review to establish the content structure, with details filling in as the design group and developed by a working solidifies. The goal is to have testing complete and a draft standard ready for review group. A study group requires the spon- by the end of the year. sorship of one VITA member, and a working group requires sponsorship of VITA 48.8: VPX REDI: at least three VITA members. Mechanical Standard for 3U, 6U Air Flow Through (AFT) Cooling Objective: This standard will develop an AFT standard using VPX connectors without Work in progress need for retainers and uses jackscrews instead of levers. Several working groups have current project work underway; the following Status: The first draft of the standard is under review by the working group. Interested roundup summarizes those projects. parties are invited to join the effort.
VITA 49.2: VITA Radio Transport (VRT) Control Packet Rules ANSI/VITA 42.0: Objective: The VRT standard defines a transport-layer protocol designed to promote XMC Switched Mezzanine Card interoperability between radio frequency receivers and signal processing equip- Base Specification ment in a wide range of applications. The VRT protocol provides a variety of format- Objective: This standard defines a PMC ting options allowing the transport layer to be optimized for each application. The form factor with open-standard switch VITA 49.2 standard specifies the rules governing control packets. fabric interconnects. Status: The working group has developed a draft document for review and discussion. Status: The draft specification has com- Interested parties are invited to join the working group. pleted the ANSI balloting phase, and comments received during the ballot are VITA 57.4: FMC+ under review. Objective: The goal of this project is to develop a next-generation specification calling for a new set of connectors to support higher-speed serial interfaces. ANSI/VITA 47: Environments, Design and Construction, Safety, Status: The working group ballot has passed, and comments are under review before and Quality for Plug-in Units the document will be submitted to ANSI ballot. Objective: Supplying vendors’ certifica- tion of COTS plug-in units to this standard ANSI/VITA 65: OpenVPX Architectural Framework for VPX will facilitate the cost-effective integra- Objective: The OpenVPX architectural framework specification is a living document tion of these items in larger systems. that is continuously being updated with new profile information and corrections.
8 | VITA Technologies Resource Guide Spring/Summer 2016 www.vita-technologies.com Status: The working group is reviewing necessary to take this specification to clocking, keying, and nomenclature pro- ANSI accredited status. Several addi- posals for the next release. tional dot specifications have been intro- duced to expand the capability of VNX. VITA 66: Optical Interconnect on Interested parties are invited to join the VPX – Half Width MT working group. Objective: The VITA 66 base standard defines physical features of a stand- VITA 76: alone compliant blind mate optical High Performance Cable – interconnect for use in VPX systems. This Ruggedized 10 Gbaud Bulkhead standard defines a half width MT style Connector for Cu and AOC Cables contact variant. Objective: Describe the copper interface Build your own of a new generation of ruggedized cir- Status: VITA 66.4 has completed the cular connectors with a MIL-DTL-38999L VPX system ! ANSI public review ballot. The working series III shell. INTERFACE CONCEPT product range of Sin- group is reviewing comments. gle Board Computers, FPGA boards, ADC/ Status: ANSI/VITA 76.0-2016 High Per- DAC FMC and Graphic boards are ideal to VITA 67.3: VPX: formance Cable – Ruggedized 10 Gbaud devise a complete VPX system for compute Coaxial Interconnect, 6U, Bulkhead Connector for Cu and AOC intensive and image processing applica- tions (radar, electronic warfare, electro Four Position SMPM Configuration Cables has been ratified by ANSI. The optical and IR, visualization systems) Objective: This specification details the standard is available for download by configuration and interconnect within VITA members and is posted at the VITA the structure of VITA 67.0, enabling a 6U Store for purchase by the general public. ® TM VPX interface containing multi-position Intel Core i7 SBC blind mate analog connectors with up to VITA 78.1: SpaceVPX Lite Systems four SMPM contacts. Objective: This document leverages the work done on ANSI/VITA 78 to create Status: The working group has com- a specification with an emphasis on 3U pleted working group balloting and is module implementations. The most sig- • Two CorCoreTM i7 Processors (Dual / Quad Core) addressing the open comments. nificant change from SpaceVPX is to shift • One Ethernet switch, XMC slot... the distribution of utility signals from • One KintexTM 7 FPGA & FMC site VITA 68: VPX: Compliance Channel the SpaceUM to the System Controller Objective: This standard defines a VPX to allow a radial distribution of supply Virtex®-7 FPGA Boards compliance channel including common power to up to eight payload modules. backplane performance criteria required to support multiple fabric types across a Status: The working group has developed range of defined baud rates. This allows a draft document of the specification. backplane developers to design a back- plane that supports required Bit Error VITA 84: Hardware Open System Rates (BER) for multiple fabric types. Technology (HOST) Study Group • Two Virtex®-7 690T & FMC sites TM This also allows module developers to Objective: This is a newly formed study • One Freescale QorIQ T1042 (or T2081) design plug-in modules that are interop- group with the vision of creating a hard- erable with other modules when used ware technical reference framework for Graphic Boards with a compliant backplane. developing embedded computing sys- tems through successful development of Status: The working group has approved an overarching HOST strategy to maxi- moving the specification to “VITA mize platform and system “openness,” Draft Standard for Trial Use” status. modularity, interoperability, scalability, Specifications are available for down- sustainability, and reuse. • One AMD RadeonTM E8860 load by VITA members and are posted • One KintexTM-7 325T FPGA • Support for DP, HDMI, VGA, Stanag3350, at the VITA Store for purchase by the Status: The study group was kicked off Arinc8181... general public. in February by NAVAIR. The first public • One PMC/XMC site release of HOST draft specification is VITA 74: VNX awaiting approval. Objective: VNX describes a rugged small form factor subsystem intended to Copies of all standards reaching ANSI be rugged for deployed environments. recognition are available from the VITA website. For a more complete list of Status: The working group has started VITA standards and their status, go to www.interfaceconcept.com +33 (0)2 98 57 30 30 several activities to complete the work www.vita.com/Standards. www.vita-technologies.com VITA Technologies Resource Guide Spring/Summer 2016 | 9
IC-Jan15-exe.indd 1 16/01/2015 16:37 MAIN FEATURE
FMC+ standard propels embedded design to new heights
By Jeremy Banks and Jim Everett
The updated FPGA Mezzanine Card (FMC+) specification has been developed and refined over the past year, promising unparalleled I/O density and backward compatibility. The VITA 57.4 working group has approved the spec and will present it for ANSI balloting in early 2016. The following article takes a closer look at this important new standard to see its implications for advanced embedded design.
A new mezzanine card standard called mezzanine cards can be easily changed. For system designers, this means both con- FMC+, an important development for figuration flexibility and an easier path to technology upgrades. However, this flexibility embedded computing designs using usually comes at the cost of functionality due to either connectivity issues or the extra FPGAs and high-speed I/O, will extend real estate needed to fit on the board. the total number of gigabit trans- ceivers (GTs) in a card from 10 to 32 and For FPGAs, the primary open standard is ANSI/VITA 57.1, otherwise known as the increase the maximum data rate from FPGA Mezzanine Card (FMC) standard. A new version dubbed FMC+ (or, more for- 10 Gbps to 28 Gbps while maintaining mally, VITA 57.4) extends the capabilities of the current FMC standard with a major backward compatibility with the current enhancement to gigabit serial interface functionality. FMC standard. FMC+ addresses many of the drawbacks of mezzanine-based I/O compared to mono- These capabilities mesh nicely with lithic solutions, simultaneously delivering both flexibility and performance. At the new devices such as those using the same time, the FMC+ standard stays true to the FMC history and its installed base by JESD204B serial interface standard, supporting backward compatibility. as well as 10G and 40G fiber optics and high-speed serial memory. FMC+ The FMC standard defines a small-format mezzanine card, similar in width and height addresses the most challenging I/O to the long-established XMCs or PMCs, but about half the length. This means FMCs requirements, offering developers the have less component real estate than open-standard formats. However, FMCs do best of two worlds: the flexibility of a not need bus interfaces such as PCI-X, which often take up a considerable amount mezzanine card with the I/O density of of board real estate. Instead, FMCs have direct I/O to the host FPGA, with simplified a monolithic design. power supply requirements. This means that despite their size, FMCs could have more I/O capacity than their XMC counterparts. As with the PMC and XMC specifications, The mezzanine card advantage FMC and FMC+ define options for both air and conduction cooling, thereby serving Mezzanine cards are an effective and both benign and rugged applications in commercial and defense markets. widely used way to add specialized func- tions to an embedded system. Because The anatomy of the FMC specification is simple. The standard allows for up to they attach to a base or carrier card, rather 160 single-ended or 80 differential parallel I/O signals for high-pin-count (HPC) than plugging directly into a backplane, designs or half that number for low-pin-count (LPC) variants. Up to 10 full-duplex
10 | VITA Technologies Resource Guide Spring/Summer 2016 www.vita-technologies.com GT connections are specified. The GTs are useful for fiber optics or other serial Parallel interface JESD204B Serial interfaces. In addition, the FMC speci- 2x 2 GSps ADC 2x 2 GSps ADC fication defines key clock signals. All of this I/O is optional, though most hosts now support the full connectivity. 10 mm x 10 mm The FMC standard also defines a mix of 27 mm x 27 mm power inputs, though the host supplies the primary power supply as defined Figure 1 | Effect of package shrink on FMC through JESD204B by the mezzanine. This approach works › by partially powering up the mezza- nine such that the host can interrogate 50 Gbps throughput range. This functionality results from a trade-off between physical the FMC, which responds by defining a package sizes and available connectivity to the host FPGA. voltage range for the VADJ. Assuming the host can provide this range, then In addition to the parallel connections, the FMC specification supports up to 10 full- all should be well. Not having the pri- duplex high-speed serial (GT) links. mary regulation on the mezzanine saves space and reduces mezzanine power These interfaces are useful for such functionality as fiber-optic I/O, Ethernet, emerging dissipation. technologies like Hybrid Memory Cube (HMC) and MoSys’ Bandwidth Engine, and newer-generation analog I/O devices that use the JESD204B interface. FMCs for analog I/O Designers can use FMCs for any function Enter JESD204B that you might want to connect to an Although the JESD204 serial interface standard, currently at revision “B,” has been FPGA, such as digital I/O, fiber optics, around for a while, only recently has it has gained wider market penetration and control interfaces, memory, or additional become the serial interface of choice for newer generations of high-sampling data processing. But analog I/O is the most converters. This wide adoption has been stoked by the telecommunications industry’s common use for FMC technology. The thirst for ever-smaller, lower-power, and lower-cost devices. FMC specification affords a great deal of scope for fast, high-resolution I/O, As mentioned earlier, a dual-channel 2 GSps, 12-bit ADC with a parallel interface but there are still trade-offs, especially requires a large number of I/O signals. This requirement directly impacts the package with high-speed parts using parallel size, in this case mandating a 292-pin package measuring roughly 27 mm x 27 mm interfaces. (though newer-generation pin geometry could shrink the package size to something less than 20 mm x 20 mm). For example, Texas Instruments’ ADC12D2000RF dual-channel, 2 GSps A JESD204B-connected equivalent device can be provided in a 68-pin, 10 mm x 12-bit analog-to-digital converters 10 mm package with reduced power. This dramatic reduction in package size marries (ADCs) use a 1:4 multiplexed bus inter- well with evolving FPGAs, which are providing more GT links at higher and higher face, so the bus speed is not too fast for speeds. Figure 1 illustrates an example of package size and FMC/FMC+ board size. the host FPGA. The digital data inter- face alone requires 96 signals (48 LVDS Typical high-speed ADCs and digital-to-analog converters (DACs) using the JESD204B pairs). For a device of this class, FMC interface have between one and eight GT links operating at 3 Gbps to 12 Gbps each, can support only one of these ADCs, depending on the data throughput required based on sample rate, resolution, and even if there is sufficient space for more, number of analog I/O channels. because it is limited to 160 signals. Lower-resolution devices, even at higher The FMC specification defines a relatively small mezzanine card, but with the emer- speeds such as those with 8-bit data gence of JESD204B devices, there is room to fit more parts onto the available real paths, can allow more channels even estate. The maximum of 10 GT links defined by the FMC specification is a useful quan- with the increased requirements of the tity; even this limited number of GT links provides 80 Gbps or more of throughput front-end analog coupling of the baluns while using a fraction of the pins otherwise required for parallel I/O. or amplifiers, clocking, and the like. The emergence of serially connected I/O devices, not just those using JESD204B, The FMC specification starts to run out does have drawbacks for some application segments in electronic warfare, such as of steam with analog interfaces deliv- digital radio frequency memory (DRFM). Serial interfaces invariably introduce addi- ering more than 8 bits of resolution at tional latency due to longer data pipelines. For DRFM applications, latency for data-in around 5 GSps or 6 GSps (throughputs to data-out is a fundamental performance parameter. Although latency is likely to of > 50 Gbps) using parallel interfaces. vary widely between serially connected devices, new generations of devices will push From a market perspective, leading data through the pipelines faster and faster, with some promising the ability to tune FMCs based on channel density, speed, the depth of the pipeline. It remains to be seen how much of an improvement is to and resolution are in the 25 Gbps to be realized. www.vita-technologies.com VITA Technologies Resource Guide Spring/Summer 2016 | 11 MAIN FEATURE
Some standard ADC devices sampling a separate connector, referred to as an HSPCe (HSPC being the main connector). at > 1 GSps today have latency below Table 1 summarizes FMC and FMC+ connectivity. 100 nanoseconds. Other applications can tolerate this latency or do not care Multiple independent signal integrity teams characterized and validated the higher about it, including software-defined 28 Gbps data rate. The maximum full-duplex throughput can now exceed 900 Gbps in radio (SDR), radar warning receivers, each direction when the parallel interface is included. See Figure 2 for an outline of the and other signals intelligence (SIGINT) net throughputs that can be expected for digitizer solutions supporting the different segments. These applications gain large capabilities of FMC and FMC+. advantages by using a new generation of RF ADCs and DACs, a technology Designers can use the increased throughput enabled by FMC+ to take advantage of driven by the mass-market telecommu- new devices that offer huge I/O bandwidth. There will still be trade-offs, such as how nications infrastructure. many devices can fit on the mezzanine’s real estate budget, but for a moderate number of channels, the realizable throughput is a huge leap over today’s FMC specification. Outside the FPGA community, newer DSP devices are also starting to adopt Next-generation ADCs and DACs JESD204B. However, FPGAs are likely In the next few years, it is reasonable to expect high-resolution ADCs and DACs to to remain the stronghold in taking full break through the 10 GSps barrier to support very wideband communications with advantage of the capabilities of wide- direct RF samplings for L-, S-, and even C-band frequencies. Below 10 GSps, con- band analog I/O devices. That’s because verters are emerging with 12-, 14-, and even 16-bit resolutions, with some supporting FPGAs can deal with vast data volumes multiple channels. The majority of these devices will be using JESD204B (or a newer with better parallelization. revision) signaling with 12 Gbps channels until newer generations inevitably boost this speed even further. These fast-moving advances are fueled by the telecommunica- The evolution of FMC+ tions industry, but the military community can take advantage of them to meet size, To move FMC to the next level, the weight, power, and cost (SWAP-C) requirements. VITA 57.4 working group has created a specification with an increased number Connector-limited of GT links operating at increased speed. 8 FMC+ maintains full FMC backward compatibility by adding to the FMC connector’s outer columns for the addi- 6 tional signals and not changing any of Channels the board profiles or mechanics. 4
The additional rows will be part of an enhanced connector that will minimize 2 any impact on available real estate. The FMC+ specification increases the 2 4 121086 14 16 18 20 22 24 maximum number of available GT links from 10 to 24, with the option of Sample rate per channel (GSps) adding another eight links, for a total of Figure 2 | FMC versus FMC+ digitizer throughput capability 32 full duplex. The additional links use ›
Function FMC FMC+ FMC+ with HSPCe extension
Maximum # parallel I/O 80 diff/160 single-ended 80 diff/160 single-ended 80 diff/160 single-ended
Clocks 4 4 4
Maximum # GTs 10 24 32
GT clocks 2 6 8
Miscellaneous JTAG, SYNC, power good, JTAG, SYNC, power good, JTAG, SYNC, power good, geographic address geographic address geographic address
Power supplies VADJ* (4 pins), 3 V3 (4 pins), VADJ* (4 pins), 3 V3 (8 pins), VADJ* (4 pins), 3 V3 (8 pins), 12 V (2 pins), 3 V3 Aux (1 pin) 12 V (4 pins), 3 V3 Aux (1 pin) 12 V (4 pins), 3 V3 Aux (1 pin)
* VADJ: mezzanine defined for voltage level, but provided by host › Table 1 | Summary of FMC and FMC+ connectivity
12 | VITA Technologies Resource Guide Spring/Summer 2016 www.vita-technologies.com is likely where the higher speeds sup- Jeremy Banks is a product manager ported by FMC+ will first be realized. for sensor and I/O processing at Bandwidths of 28 Gbps per fiber will Curtiss-Wright. He has been involved take the throughputs quickly past 100G in the defense embedded computing and 400G speeds on a single mezzanine. industry for more than 25 years holding Optical throughput of 100G is emerging positions in engineering design, today on the current FMC format. marketing, and product management across DSP, multiprocessing, RF I/O, Another emerging area suitable for SBC, and FPGA disciplines. Jeremy FMC+ is serial memory such as HMC and holds a BSc (Hons) in Electronic Bandwidth Engine. These novel devices and Electrical Engineering from the › Figure 3 | Xilinx KCU114 represent an entirely new category of University of Surrey. He can be reached high-performance memory, delivering at [email protected]. Other advantages and uses unprecedented system performance and of FMC+ bandwidth by utilizing GT connectivity. Jim Everett is product marketing Although FMC+, like FMC, will prob- manager for Virtex evaluation, ably be dominated by ADC, DAC, and Alive and kicking GT characterization, and FMC/FMC+ transceiver products, the increased GT A new generation of the FMC specifica- boards and kits at Xilinx. His 35-year density provided by FPGAs makes it tion has been introduced and is adapting career in electronics spans many useful for other functions. Two functions to new technology driven by serial con- years in design, sales, and marketing of note are fiber optics and new serial nected devices. Key players in the FMC of FPGAs. Jim graduated from memories. industry have already begun adopting Michigan State University with a this specification. Figure 3 shows the first BSEE degree. He can be reached As with JESD204B, there are require- Xilinx demonstration board featuring at [email protected]. ments for faster, denser fiber optics. FMC+, the KCU114. The FMC standard, Curtiss-Wright Those based on fiber-optic ribbon cables through its new incarnation FMC+, is www.curtisswright.com offer the smallest parts. Because the alive and kicking and is prepared for the › FMC+ footprint readily supports 24 full- next generation of high-performance, Xilinx duplex fiber-optic links, this application FPGA-driven applications. www.xilinx.com
Rugged Chassis, Backplanes, and Integrated Systems Engineered for Your Application Standards-based and Highly Customizable Whether you have a back-of-the-envelope design idea and seek collaborative development with our engineering team, or provide us with a complete set of build specifications, LCR Embedded Systems will turn your product into reality.
VPX • AdvancedTCA • VME • CompactPCI • Custom (800) 747-5972 • [email protected] • www.lcrembeddedsystems.com www.vita-technologies.com VITA Technologies Resource Guide Spring/Summer 2016 | 13 TECHNOLOGY FEATURE
Very high-speed sampling and serial ADCs in embedded systems
By Thierry Wastiaux
Latest-generation active electronically scaled array (AESA) radar systems can have thousands of TX/RX modules. High bandwidth is needed to connect each array element data converter to the FPGAs that process incoming and generate outgoing data streams. New software-defined radio systems use advanced reconfigurable modulation schemes that increase channel bandwidths and deliver unprecedented wireless data rates. To increase the performance of software radio and electronic warfare systems, it has become critical to use efficient, low-power, low-pin-count, FPGA-connected converter interfaces.
As the performances of analog-to-digital number of trace routes and easier- to baseband. The filtering stages allow converters (ADCs) are quickly improving, to-route board designs. The links use filtering the unwanted part of the spec- the classical approach of transmitting 8b/10b encoding, which incorporates trum. Gain stages allow compensating for samples through low-voltage differential an embedded clock, enabling further mixer and NCO losses. And complex-to- signaling (LVDS) reaches its limits. LVDS pin-count reduction by removing the real conversion enables presenting the lanes connected to last-generation FPGA necessity for routing an additional clock final real signal of interest. I/O are limited to around 1.4 Gbps. As an line and the associated complexity of example, when targeting a four-channel aligning an additional clock signal with These down-converter features dramati- FPGA Mezzanine Card (FMC) with 12-bit the transmitted data at high data rates. cally reduce the complexity of radio and analog to digital sampling at 2.6 GSps, a radar systems, using part of the FPGA minimum of 96 LVDS lanes is required for In addition, trace-to-trace tolerances resources to implement these functions. data only, without taking into account are relaxed relative to synchronous sam- The FPGA capacity is fully used for the the clock and service signals. This is not pling parallel LVDS signals. All these important signal processing part as possible on standard VITA 57.1 connec- simplifications in the design eventu- beamforming for radars, for instance. tors, and it takes too much I/O resource ally lead to cost reduction. Moreover, on the FPGA. this allows reducing the size of the Deterministic latency ADC components, as the output pins It is important to know the timing rela- The insatiable demand for data sampling required for FPGA connection are less tionship between the sampled signal thus has led to the need for the stan- numerous using the low differential and its digital representation. This dardization body JEDEC to introduce swing DC-balanced high-speed current timing relationship is affected by the the JESD204 standard for a high-speed mode logic (CML) standard. Thus, it can latency of the converter, which is defined serial link between data converters and further increase the number of compo- for an ADC as the number of clock cycles logic devices. Serial link data rates have nents on the small FMC footprint. between the instant of the sampling been pushed up to 12.5 Gbps in the last edge of the input signal until the time revision “B” of the standard, released in It must be noted that the last generation that its digital representation is present 2011 for higher-bandwidth requirements. of serial ADCs implements digital down- at the converter’s outputs. This latency This revision also includes provisions for converters with variable decimation is typically in the range of several nano- “deterministic latency” of data transfers. ratios that provide filtering and reduce seconds in classical parallel ADCs. In the output data rate. They might include JESD204B, this latency is increased by Simplification of design frequency translation stages (numerical the process of serialization even if the Compared to the classical parallel controlled oscillators), finite impulse speed of the sampling data transmission approach, the improvements brought by response (FIR) filtering stages, gain lanes is much higher. This latency can JESD204 are many. By moving from high- stages, and complex-to-real conversion typically be several tens of nanoseconds. pin-count, low-speed to low-pin-count, stages. Numerically controlled oscillators high-speed serial interface, the overall (NCOs) and digital mixers allow tuning JESD204B-compliant receivers are out- system design is simplified with a smaller the center of the bandwidth of interest fitted with an elastic buffer that is used
14 | VITA Technologies Resource Guide Spring/Summer 2016 www.vita-technologies.com to compensate for skew across serializer/ The FMC standard defines a small format mezzanine, similar in width and height deserializer (SERDES) lanes, which sim- to XMCs or PMCs, but around half the length. As real estate is limited, some fea- plifies board layout. This elastic buffer tures have been included in the standard. First, to save space, its primary power is stores the data until the data from the supplied by the FPGA carrier board. During the power-up sequence, the host inter- slowest lane arrives. It then releases the rogates the FMC as to what the feeding voltage must be. In addition, FMCs directly data from all lanes simultaneously for connect the I/O devices on the mezzanine to the host FPGA via a high-speed, high- digital processing. This skew manage- density connector as if the device was on the host itself, leading to logic reduction ment is possible because the data clock and saved space. is embedded in the serial data stream. The first generation of the FMC standard allows up to 160 for high-pin-count (HPC) While the JESD204B standard has sim- or 80 for low-pin-count (LPC) “parallel” I/O signals and up to 10 full-duplex high- plified multichannel synchronization speed serial connections (along with some clocks). Figures 1 and 2 shown on page 16 by using deterministic latency, minimal depict an Interface Concept ADC FMC, the IC-ADC-FMC, which can be plugged on latency is needed in some applications a Virtex-7 FPGA carrier board, the IC-FEP-VPX3c, featuring eight high-speed trans- such as electronic warfare (EW) and radar ceivers in front of the mezzanine’s high-speed serial (HSS) links. applications where actions are required immediately after detection. For these applications, the LVDS interface should still be considered, as the JESD204B- compliant data converter’s delay in serial- izing the data is omitted. However, appli- cations such as radar warning receivers (RWR) or COMINT that are receiver-only applications tolerate the latency brought on by the JESD204B serialization. These applications thus can benefit from the last generations of ADCs driven by the mass market of telecommunication infra- structure, allowing very high-speed sam- pling and reducing the complexity of the analog part of the system.
FPGA vendors have developed fully compliant JESD204B intellectual prop- erty (IP) that can be implemented in their products for communication with the serial ADCs. For example, the JESD204B Xilinx IP supports 256 bytes per frame and 32 frames per multiframe. It can be configured to support up to 32 lanes.
Flexible design follows the fast moving market of ADCs In combining the technologies available on ADCs including the new JESD204B standard and FPGAs, EW system archi- tects can dramatically improve data sample processing. FMC (VITA 57 stan- dard), promoted by the VITA FMC Marketing Alliance, allows high data throughput and very low latency response between an ADC or a digital-to-analog converter (DAC) FMC and the FPGA, simplification of the design, and above all, the cost-efficient ability to simply retarget an FPGA carrier card design. All that is required is swapping out the FMC module and adjusting the FPGA firmware. That is why the standard has become the open standard mezzanine of choice. www.vita-technologies.com VITA Technologies Resource Guide Spring/Summer 2016 | 15 TECHNOLOGY FEATURE
At the inception of the FMC standard, the HPC specification appeared as satisfactory in terms of the number of allowed I/O. The evolution of ADC technology, as well as the increasingly demanding requirements of EW system designers, has highlighted the need to go beyond this first version of the FMC standard.
An effort to define suitable FMC enhancements is now underway within the VITA 57.4 working group. The focus is on creating a standard with an increased number of HSS links (increased from 10 to 24) operating at increased speed while keeping the existing connector pinout for I/O. The HSS link throughput is targeted at up to 28 Gbps, extending the aggregate bandwidth to the huge level of 672 Gbps, to which the Figure 1 | IC-ADC-FMCc quad 12-bit 1300 MSPS FMC traditional LVDS links can be added. Backward compatibility is ensured by adding to › the FMC connector’s outer columns for additional signals without changing the form factor, real estate, or mechanics (mounting holes, thermal interface, and so on). The approval of this new standard is currently in process.
Layer 2/3 Enterprise Non-Blocking GigE Smart Switch for Demanding SWAP-C Environments TM NANOSWITCH Figure 2 | IC-FEP-VPX3c Virtex-7
The Themis NanoSWITCH is a Size, Weight, Power and Cost (SWAP-C) optimized › carrier with one VITA 57.1 FMC slot rugged multi-layer Gigabit Ethernet switch with an embedded x86 PC. NanoSWITCH brings enterprise level layer 2/3 switching into demanding environments found in The future of converter military ground, air and sea vehicles. digital interfaces The industry is requiring better per- forming ADCs, leading to huge sample data flows. The big push of the ADC industry has led to the development of the JESD204B standard. Looking to the future, it is clear that JESD204 is poised to become the industry choice for the digital interface to converters. Each revision has answered the demands for improvements on its implementation and has allowed the standard to evolve to meet new requirements brought on by changes in converter technology. As system designs become more complex and converter performances increase, the JESD204 standard should be able to Applications Environmental adapt to meet the new design require- ments necessary. • Vehicle network switching • IP67 environmentally sealed for water, • Distributed architecture vehicle controller dust, and salt fog) • VICTORY compliant switch, router, timing, • Sealed MIL connectors Thierry Wastiaux is senior VP of and control • Operating temperature: -40°C to 71°C • Shock: 50g @25ms sales for Interface Concept. He has • Shared processing and peripheral • Vibration: 5G RMS.10Hz to 2KHz 25 years of experience in the telecom communications • Status LED blanking control and embedded systems market. Prior to joining Interface Concept, he was www.themis.com/nanoswitch responsible for the operations of the Mobile Communication Group and the Wireless Transmission Business Unit at Alcatel-Lucent. He holds an MSc from Ecole Polytechnique France.
47200 Bayside Parkway, Fremont CA 94538 | 510-252-0870 | www.themis.com Interface Concept
©2016 Themis Computer. All rights reserved. Themis and the Themis logo are trademarks or registered [email protected] trademarks of Themis Computer. All other trademarks are the property of their respective owners. › www.interfaceconcept.com
16 | VITA Technologies Resource Guide Spring/Summer 2016 www.vita-technologies.com TECHNOLOGY FEATURE
Modular Open Radio Frequency Architecture boot camp
By Jerry Gipper
Designers creating the next generation of embedded defense systems face several challenges getting their solutions off the ground. The newly launched Modular Open Radio Frequency Architecture (MORA) aims to enable the development of true open standards-based radio frequency and microwave modules and small form factor subsystem designs to reduce costs, foster commonality, and enable new communications capabilities.
Electronics are a key part of many defense platforms and performance and efficiency through reduced cable loss. Use of are becoming more important as the content percentage is software-defined radio technologies allows the same hardware growing. However, the purchasing influence of defense pro- to run different waveform application to support a multitude of grams has become a smaller percentage of the overall world- missions, including EW and communications. wide electronics industry. Complicating the issue is the demand to get new solutions to deployment in much shorter time frames CERDEC is defining a converged open architecture that will to take advantage of the latest technology. This increase in reli- provide open interfaces to enable rapid insertion of new capa- ance on electronics, reduction in purchasing power, and rapid bilities, interoperability, and a reduced SWaP footprint. shortening of time to deployment have created a challenging dynamic for system architects responsible for the design of The MORA architecture, which extends the U.S. Army’s next-generation defense platforms. VICTORY architecture, will:
Over the years, many initiatives have emerged to drive stan- › Enable sharing of hardware and software components dards for open, flexible platforms, with the most recent among C4ISR/EW capabilities. example being the U.S. Army’s VICTORY program. Recently, › Allow technology refresh to keep pace with threats while the U.S. Army’s Communications-Electronics Research, improving reliability and robustness. Development, and Engineering Center (CERDEC) launched a › Support current and future interoperability requirements new initiative, the Modular Open Radio Frequency Architecture and facilitate transition planning. (MORA), which will enable the development of true open › Permit capabilities that are innovative but unplanned to be standards-based RF and microwave modules and small form rapidly implemented for “future-proofing.” factor subsystem designs that address the size, weight, and › Reduce developmental and acquisition costs through power consumption (SWaP) constraints of today’s ground greater commercial competition. vehicles. MORA is intended to leverage the work done under the VICTORY initiative by adding consideration for RF modules Wide embedded industry support of the modular and scalable and subsystems. MORA architecture will help drive the network-based connec- tivity of sensors and peripherals on ground vehicles and help About the MORA architecture speed the deployment of new C4ISR/EW capabilities. Current command, control, communications, computers, intelli- gence, surveillance, and reconnaissance (C4ISR) and electronic MORA is based on the popular OpenVPX module and back- warfare (EW) systems use single-purpose hardware and plane open-standard framework managed by VITA members. software that aren’t shared beyond their defined functions MORA-based hardware and software solutions developed and compete for limited resources on the platform. MORA by VITA member companies will enable enhanced C4ISR/EW decomposes radio systems into high-level components that capabilities to exist within the SWaP constraints of platforms enable sharing of hardware such as amplifiers and antennas. and provide subsystem commonality across the vehicle fleet to Low power distribution of RF signals improves overall system reduce life-cycle costs. www.vita-technologies.com VITA Technologies Resource Guide Spring/Summer 2016 | 17 TECHNOLOGY FEATURE
“One thing we know about the future is that we don’t know to define common standards, a clear picture of which interfaces what the future holds,” said Ben Peddicord, chief of CERDEC are desired must be established across the board. Intelligence and Information Warfare Directorate’s Intel Technology and Architecture Branch. “The interfaces that have “We’ve never been able to tell industry partners exactly been exposed to MORA were chosen based on an analysis of what we want because we never understood standards well the capabilities we’ve wanted to field over the past 15 years.” enough to steer their efforts toward our benefit,” Peddicord said. “Now we have built up enough expertise to actively Compared to a traditional radio solution, MORA provides contribute to standards.” Peddicord presented on overview the system integrator with greater flexibility when addressing of MORA to the audience at Embedded Tech Trends 2015 technical challenges and the ability to insert third-party (www.embeddedtechtrends.com). Figure 1 illustrates how capabilities. MORA extends the VICTORY architecture.
According to Peddicord, nearly all military platforms – to include MORA payoffs include hardware reuse and pooling, rapid soldiers – have RF devices on them, making MORA an impor- third-party technology insertion, reduced dependence on tant element of hardware and software convergence because proprietary hardware and software, and the ability to improve of its ability to share hardware assets across the platform. “It’s compatibility and/or interoperability. The real catch, however, hard to get meaningful improvements, flexibility, and SWaP has been ensuring that industry would build to MORA stan- reduction if you don’t include RF components,” Peddicord said. dards, said Peddicord.
With a continued emphasis on open systems architecture, “Without industry support, it won’t work. If government pro- CERDEC became a sponsor member of VITA, an international grams ask for it, then industry will support, but government is non-profit organization that has championed open system cautious to put out requirements for a standard not supported architectures since 1982. by industry,” he said.
Using common standards ultimately saves money and time, both To define these standards, CERDEC has worked closely with of which are key components from the Better Buying Power 3.0 industry through VITA, conferences, and third-party vendors, initiative, Peddicord said. The challenge, however, is that in order as well as collaborated with companies that build according to